TWI622113B - 基板處理裝置及基板處理方法 - Google Patents
基板處理裝置及基板處理方法 Download PDFInfo
- Publication number
- TWI622113B TWI622113B TW106108366A TW106108366A TWI622113B TW I622113 B TWI622113 B TW I622113B TW 106108366 A TW106108366 A TW 106108366A TW 106108366 A TW106108366 A TW 106108366A TW I622113 B TWI622113 B TW I622113B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid level
- liquid
- tank
- piping
- pipe
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 170
- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 582
- 238000001514 detection method Methods 0.000 claims abstract description 42
- 230000007423 decrease Effects 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 13
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 238000011282 treatment Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 230000004044 response Effects 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 56
- 239000002244 precipitate Substances 0.000 description 21
- 238000012360 testing method Methods 0.000 description 20
- 239000000654 additive Substances 0.000 description 12
- 230000000996 additive effect Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016069323 | 2016-03-30 | ||
| JP2016-069323 | 2016-03-30 | ||
| JP2017012627A JP6861039B2 (ja) | 2016-03-30 | 2017-01-27 | 基板処理装置及び基板処理方法 |
| JP2017-012627 | 2017-01-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201802988A TW201802988A (zh) | 2018-01-16 |
| TWI622113B true TWI622113B (zh) | 2018-04-21 |
Family
ID=60044253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106108366A TWI622113B (zh) | 2016-03-30 | 2017-03-14 | 基板處理裝置及基板處理方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6861039B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101937017B1 (enrdf_load_stackoverflow) |
| CN (1) | CN107275257B (enrdf_load_stackoverflow) |
| TW (1) | TWI622113B (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831656B (zh) * | 2018-01-04 | 2024-02-01 | 日商東京威力科創股份有限公司 | 基板處理裝置及基板處理方法 |
| JP7142535B2 (ja) * | 2018-01-04 | 2022-09-27 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| CN112178461A (zh) * | 2019-07-01 | 2021-01-05 | 夏普株式会社 | 贮液装置 |
| CN111774249A (zh) * | 2020-07-17 | 2020-10-16 | 常州铭赛机器人科技股份有限公司 | 点胶机 |
| US12272573B2 (en) * | 2021-03-11 | 2025-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Load port and methods of operation |
| CN114446841B (zh) * | 2022-04-12 | 2022-07-29 | 广州粤芯半导体技术有限公司 | 供酸装置及湿刻系统 |
| CN116936421B (zh) * | 2023-09-15 | 2023-12-01 | 上海陛通半导体能源科技股份有限公司 | 晶圆生产设备和晶圆生产工艺 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200704581A (en) * | 2005-04-25 | 2007-02-01 | Advanced Tech Materials | Liner-based liquid storage and dispensing systems with empty detection capability |
| TW200739042A (en) * | 2005-11-30 | 2007-10-16 | Tokyo Electron Ltd | Apparatus for detecting liquid level and liquid processing apparatus including the same |
| TW200844263A (en) * | 2007-01-15 | 2008-11-16 | Shibaura Mechatronics Corp | Electrolysis apparatus and electrolysis method for sulfuric acid, and apparatus for processing substrate |
| TW200941612A (en) * | 2008-03-17 | 2009-10-01 | Acm Research Shanghai Inc | Solution preparation apparatus and method for treating individual semiconductor workpiece processing |
| TW201137958A (en) * | 2009-12-07 | 2011-11-01 | Tokyo Electron Ltd | Liquid replacement method of circulation line in single wafer type liquid processing apparatus |
| TW201530646A (zh) * | 2013-09-30 | 2015-08-01 | Shibaura Mechatronics Corp | 基板處理方法及基板處理裝置 |
| TW201538883A (zh) * | 2014-04-11 | 2015-10-16 | Shenyang Solidtool Co Ltd | 化學液供給裝置及其供給方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034057A (ja) * | 1996-07-25 | 1998-02-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JPH1090038A (ja) * | 1996-09-12 | 1998-04-10 | Sony Corp | 液面検出装置 |
| JP3557354B2 (ja) * | 1998-09-28 | 2004-08-25 | 東京エレクトロン株式会社 | 供給装置及び補充方法 |
| SE515570C2 (sv) * | 1999-10-05 | 2001-09-03 | Abb Ab | Ett datorbaserat förfarande och system för reglering av en industriell process |
| JP2002206957A (ja) * | 2001-01-11 | 2002-07-26 | Dainippon Screen Mfg Co Ltd | 処理液貯留装置 |
| JP2002289571A (ja) * | 2001-03-23 | 2002-10-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| KR101100274B1 (ko) * | 2008-10-28 | 2011-12-30 | 세메스 주식회사 | 약액 공급장치 및 방법 |
-
2017
- 2017-01-27 JP JP2017012627A patent/JP6861039B2/ja active Active
- 2017-03-14 TW TW106108366A patent/TWI622113B/zh active
- 2017-03-23 KR KR1020170036806A patent/KR101937017B1/ko active Active
- 2017-03-30 CN CN201710200801.6A patent/CN107275257B/zh active Active
-
2021
- 2021-03-29 JP JP2021055396A patent/JP7042946B2/ja active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200704581A (en) * | 2005-04-25 | 2007-02-01 | Advanced Tech Materials | Liner-based liquid storage and dispensing systems with empty detection capability |
| TW200739042A (en) * | 2005-11-30 | 2007-10-16 | Tokyo Electron Ltd | Apparatus for detecting liquid level and liquid processing apparatus including the same |
| TW200844263A (en) * | 2007-01-15 | 2008-11-16 | Shibaura Mechatronics Corp | Electrolysis apparatus and electrolysis method for sulfuric acid, and apparatus for processing substrate |
| TW200941612A (en) * | 2008-03-17 | 2009-10-01 | Acm Research Shanghai Inc | Solution preparation apparatus and method for treating individual semiconductor workpiece processing |
| TW201137958A (en) * | 2009-12-07 | 2011-11-01 | Tokyo Electron Ltd | Liquid replacement method of circulation line in single wafer type liquid processing apparatus |
| TW201530646A (zh) * | 2013-09-30 | 2015-08-01 | Shibaura Mechatronics Corp | 基板處理方法及基板處理裝置 |
| TW201538883A (zh) * | 2014-04-11 | 2015-10-16 | Shenyang Solidtool Co Ltd | 化學液供給裝置及其供給方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101937017B1 (ko) | 2019-01-09 |
| JP2021101488A (ja) | 2021-07-08 |
| KR20170113205A (ko) | 2017-10-12 |
| TW201802988A (zh) | 2018-01-16 |
| JP6861039B2 (ja) | 2021-04-21 |
| CN107275257B (zh) | 2020-08-14 |
| JP7042946B2 (ja) | 2022-03-28 |
| CN107275257A (zh) | 2017-10-20 |
| JP2017188658A (ja) | 2017-10-12 |
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