TWI618814B - Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method - Google Patents

Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method Download PDF

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Publication number
TWI618814B
TWI618814B TW105130807A TW105130807A TWI618814B TW I618814 B TWI618814 B TW I618814B TW 105130807 A TW105130807 A TW 105130807A TW 105130807 A TW105130807 A TW 105130807A TW I618814 B TWI618814 B TW I618814B
Authority
TW
Taiwan
Prior art keywords
metal foil
layer
group
resin
treated metal
Prior art date
Application number
TW105130807A
Other languages
English (en)
Chinese (zh)
Other versions
TW201718937A (zh
Inventor
Terumasa Moriyama
Masafumi Ishii
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201718937A publication Critical patent/TW201718937A/zh
Application granted granted Critical
Publication of TWI618814B publication Critical patent/TWI618814B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW105130807A 2015-09-25 2016-09-23 Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method TWI618814B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015187537A JP6498091B2 (ja) 2015-09-25 2015-09-25 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器

Publications (2)

Publication Number Publication Date
TW201718937A TW201718937A (zh) 2017-06-01
TWI618814B true TWI618814B (zh) 2018-03-21

Family

ID=58386090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130807A TWI618814B (zh) 2015-09-25 2016-09-23 Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method

Country Status (5)

Country Link
JP (1) JP6498091B2 (enExample)
KR (1) KR20180051600A (enExample)
CN (1) CN107921749A (enExample)
TW (1) TWI618814B (enExample)
WO (1) WO2017051905A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP7607343B2 (ja) 2022-03-24 2024-12-27 株式会社サーフテクノロジー 固着物剥離性改善表面処理方法及び固着物剥離性改善部材
KR20250080922A (ko) * 2022-03-30 2025-06-05 아티엔스 가부시키가이샤 금속판용 접합제, 프린트 배선판용 보강 부재 및 그 제조 방법, 그리고, 배선판 및 그 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144177A (ja) * 1988-11-26 1990-06-01 Nisshin Steel Co Ltd 金属板への有機薄膜形成方法
JPH08246163A (ja) * 1995-01-11 1996-09-24 Kao Corp 金属表面への撥液性付与方法
JP2008104936A (ja) * 2006-10-25 2008-05-08 National Institute Of Advanced Industrial & Technology 超撥水性アルミ箔及びその製造方法
JP2012169598A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法
JP2014060407A (ja) * 2012-01-17 2014-04-03 Panasonic Corp 配線基板とその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5114355B2 (ja) * 2008-10-08 2013-01-09 株式会社Snt 撥水・撥油性コーティング物品およびその製造
JP4790003B2 (ja) * 2008-12-26 2011-10-12 株式会社カーメイト コーティング膜形成方法およびコーティング液
KR101687462B1 (ko) * 2012-02-24 2016-12-16 제이에프이 스틸 가부시키가이샤 금속 재료, 표면 처리 방법 및 장치
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
CN104334346B (zh) * 2012-06-04 2017-05-03 Jx日矿日石金属株式会社 附载体金属箔
JP2014014752A (ja) * 2012-07-06 2014-01-30 Toyota Motor Corp 撥水撥油性被膜の形成方法、及び当該方法によって形成される撥水撥油性被膜
JP6096787B2 (ja) * 2012-09-24 2017-03-15 Jx金属株式会社 キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途
CA2895091C (en) * 2013-01-07 2017-07-04 Mitsubishi Electric Corporation Coating composition, method for producing same, and coated article
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Jx金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6327840B2 (ja) * 2013-12-04 2018-05-23 Jx金属株式会社 熱硬化性樹脂と離型剤とを含む樹脂組成物
JP6266965B2 (ja) * 2013-12-04 2018-01-24 Jx金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP6306865B2 (ja) * 2013-12-05 2018-04-04 Jx金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体
CN106102935A (zh) * 2014-03-18 2016-11-09 3M创新有限公司 经处理的制品及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144177A (ja) * 1988-11-26 1990-06-01 Nisshin Steel Co Ltd 金属板への有機薄膜形成方法
JPH08246163A (ja) * 1995-01-11 1996-09-24 Kao Corp 金属表面への撥液性付与方法
JP2008104936A (ja) * 2006-10-25 2008-05-08 National Institute Of Advanced Industrial & Technology 超撥水性アルミ箔及びその製造方法
JP2012169598A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法
JP2014060407A (ja) * 2012-01-17 2014-04-03 Panasonic Corp 配線基板とその製造方法

Also Published As

Publication number Publication date
TW201718937A (zh) 2017-06-01
KR20180051600A (ko) 2018-05-16
CN107921749A (zh) 2018-04-17
JP2017061080A (ja) 2017-03-30
JP6498091B2 (ja) 2019-04-10
WO2017051905A1 (ja) 2017-03-30

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