CN107921749A - 表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法 - Google Patents

表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法 Download PDF

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Publication number
CN107921749A
CN107921749A CN201680049528.5A CN201680049528A CN107921749A CN 107921749 A CN107921749 A CN 107921749A CN 201680049528 A CN201680049528 A CN 201680049528A CN 107921749 A CN107921749 A CN 107921749A
Authority
CN
China
Prior art keywords
metal foil
layer
resin
treated metal
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680049528.5A
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English (en)
Chinese (zh)
Inventor
森山晃正
石井雅史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN107921749A publication Critical patent/CN107921749A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
CN201680049528.5A 2015-09-25 2016-09-23 表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法 Pending CN107921749A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015187537A JP6498091B2 (ja) 2015-09-25 2015-09-25 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
JP2015-187537 2015-09-25
PCT/JP2016/078117 WO2017051905A1 (ja) 2015-09-25 2016-09-23 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN107921749A true CN107921749A (zh) 2018-04-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680049528.5A Pending CN107921749A (zh) 2015-09-25 2016-09-23 表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法

Country Status (5)

Country Link
JP (1) JP6498091B2 (enExample)
KR (1) KR20180051600A (enExample)
CN (1) CN107921749A (enExample)
TW (1) TWI618814B (enExample)
WO (1) WO2017051905A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115867626A (zh) * 2022-03-30 2023-03-28 东洋油墨Sc控股株式会社 金属板用接合剂、印刷配线板用增强构件及其制造方法、以及配线板及其制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP7607343B2 (ja) 2022-03-24 2024-12-27 株式会社サーフテクノロジー 固着物剥離性改善表面処理方法及び固着物剥離性改善部材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104335688A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
CN104334346A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
CN104661810A (zh) * 2012-09-24 2015-05-27 Jx日矿日石金属株式会社 附载体金属箔、由树脂制板状载体与金属箔构成的积层体、以及它们的用途

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144177A (ja) * 1988-11-26 1990-06-01 Nisshin Steel Co Ltd 金属板への有機薄膜形成方法
JPH08246163A (ja) * 1995-01-11 1996-09-24 Kao Corp 金属表面への撥液性付与方法
JP2008104936A (ja) * 2006-10-25 2008-05-08 National Institute Of Advanced Industrial & Technology 超撥水性アルミ箔及びその製造方法
JP5114355B2 (ja) * 2008-10-08 2013-01-09 株式会社Ｓｎｔ 撥水・撥油性コーティング物品およびその製造
JP4790003B2 (ja) * 2008-12-26 2011-10-12 株式会社カーメイト コーティング膜形成方法およびコーティング液
KR20140009323A (ko) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법
WO2013108599A1 (ja) * 2012-01-17 2013-07-25 パナソニック株式会社 配線基板とその製造方法
CN104114747A (zh) * 2012-02-24 2014-10-22 杰富意钢铁株式会社 金属材料、表面处理方法及装置
JP2014014752A (ja) * 2012-07-06 2014-01-30 Toyota Motor Corp 撥水撥油性被膜の形成方法、及び当該方法によって形成される撥水撥油性被膜
CN104903415B (zh) * 2013-01-07 2017-02-15 三菱电机株式会社 涂覆组合物、其制造方法及涂覆物品
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6266965B2 (ja) * 2013-12-04 2018-01-24 Ｊｘ金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP6327840B2 (ja) * 2013-12-04 2018-05-23 Ｊｘ金属株式会社 熱硬化性樹脂と離型剤とを含む樹脂組成物
JP6306865B2 (ja) * 2013-12-05 2018-04-04 Ｊｘ金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体
EP3119532B1 (en) * 2014-03-18 2019-07-03 3M Innovative Properties Company Treated article and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104335688A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
CN104334346A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
CN104661810A (zh) * 2012-09-24 2015-05-27 Jx日矿日石金属株式会社 附载体金属箔、由树脂制板状载体与金属箔构成的积层体、以及它们的用途

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115867626A (zh) * 2022-03-30 2023-03-28 东洋油墨Sc控股株式会社 金属板用接合剂、印刷配线板用增强构件及其制造方法、以及配线板及其制造方法

Also Published As

Publication number Publication date
JP6498091B2 (ja) 2019-04-10
JP2017061080A (ja) 2017-03-30
KR20180051600A (ko) 2018-05-16
TW201718937A (zh) 2017-06-01
TWI618814B (zh) 2018-03-21
WO2017051905A1 (ja) 2017-03-30

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Application publication date: 20180417