KR20180051600A - 표면 처리 금속박, 적층체, 프린트 배선판, 반도체 패키지, 전자기기 및 프린트 배선판의 제조 방법 - Google Patents

표면 처리 금속박, 적층체, 프린트 배선판, 반도체 패키지, 전자기기 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20180051600A
KR20180051600A KR1020187009978A KR20187009978A KR20180051600A KR 20180051600 A KR20180051600 A KR 20180051600A KR 1020187009978 A KR1020187009978 A KR 1020187009978A KR 20187009978 A KR20187009978 A KR 20187009978A KR 20180051600 A KR20180051600 A KR 20180051600A
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KR
South Korea
Prior art keywords
metal foil
layer
resin
group
treated metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020187009978A
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English (en)
Korean (ko)
Inventor
데루마사 모리야마
마사후미 이시이
Original Assignee
제이엑스금속주식회사
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Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20180051600A publication Critical patent/KR20180051600A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
KR1020187009978A 2015-09-25 2016-09-23 표면 처리 금속박, 적층체, 프린트 배선판, 반도체 패키지, 전자기기 및 프린트 배선판의 제조 방법 Ceased KR20180051600A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015187537A JP6498091B2 (ja) 2015-09-25 2015-09-25 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
JPJP-P-2015-187537 2015-09-25
PCT/JP2016/078117 WO2017051905A1 (ja) 2015-09-25 2016-09-23 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
KR20180051600A true KR20180051600A (ko) 2018-05-16

Family

ID=58386090

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187009978A Ceased KR20180051600A (ko) 2015-09-25 2016-09-23 표면 처리 금속박, 적층체, 프린트 배선판, 반도체 패키지, 전자기기 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP6498091B2 (enExample)
KR (1) KR20180051600A (enExample)
CN (1) CN107921749A (enExample)
TW (1) TWI618814B (enExample)
WO (1) WO2017051905A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP7607343B2 (ja) 2022-03-24 2024-12-27 株式会社サーフテクノロジー 固着物剥離性改善表面処理方法及び固着物剥離性改善部材
KR20250080922A (ko) * 2022-03-30 2025-06-05 아티엔스 가부시키가이샤 금속판용 접합제, 프린트 배선판용 보강 부재 및 그 제조 방법, 그리고, 배선판 및 그 제조 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144177A (ja) * 1988-11-26 1990-06-01 Nisshin Steel Co Ltd 金属板への有機薄膜形成方法
JPH08246163A (ja) * 1995-01-11 1996-09-24 Kao Corp 金属表面への撥液性付与方法
JP2008104936A (ja) * 2006-10-25 2008-05-08 National Institute Of Advanced Industrial & Technology 超撥水性アルミ箔及びその製造方法
JP5114355B2 (ja) * 2008-10-08 2013-01-09 株式会社Ｓｎｔ 撥水・撥油性コーティング物品およびその製造
JP4790003B2 (ja) * 2008-12-26 2011-10-12 株式会社カーメイト コーティング膜形成方法およびコーティング液
JP5929220B2 (ja) * 2011-01-26 2016-06-01 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
CN103314652A (zh) * 2012-01-17 2013-09-18 松下电器产业株式会社 配线基板及其制造方法
KR101687462B1 (ko) * 2012-02-24 2016-12-16 제이에프이 스틸 가부시키가이샤 금속 재료, 표면 처리 방법 및 장치
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
CN104334346B (zh) * 2012-06-04 2017-05-03 Jx日矿日石金属株式会社 附载体金属箔
JP2014014752A (ja) * 2012-07-06 2014-01-30 Toyota Motor Corp 撥水撥油性被膜の形成方法、及び当該方法によって形成される撥水撥油性被膜
JP6096787B2 (ja) * 2012-09-24 2017-03-15 Ｊｘ金属株式会社 キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途
CA2895091C (en) * 2013-01-07 2017-07-04 Mitsubishi Electric Corporation Coating composition, method for producing same, and coated article
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6327840B2 (ja) * 2013-12-04 2018-05-23 Ｊｘ金属株式会社 熱硬化性樹脂と離型剤とを含む樹脂組成物
JP6266965B2 (ja) * 2013-12-04 2018-01-24 Ｊｘ金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP6306865B2 (ja) * 2013-12-05 2018-04-04 Ｊｘ金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体
CN106102935A (zh) * 2014-03-18 2016-11-09 3M创新有限公司 经处理的制品及其制备方法

Also Published As

Publication number Publication date
TW201718937A (zh) 2017-06-01
TWI618814B (zh) 2018-03-21
CN107921749A (zh) 2018-04-17
JP2017061080A (ja) 2017-03-30
JP6498091B2 (ja) 2019-04-10
WO2017051905A1 (ja) 2017-03-30

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