TWI616040B - 同軸纜線之連接構造 - Google Patents
同軸纜線之連接構造 Download PDFInfo
- Publication number
- TWI616040B TWI616040B TW104135651A TW104135651A TWI616040B TW I616040 B TWI616040 B TW I616040B TW 104135651 A TW104135651 A TW 104135651A TW 104135651 A TW104135651 A TW 104135651A TW I616040 B TWI616040 B TW I616040B
- Authority
- TW
- Taiwan
- Prior art keywords
- core wire
- solder resist
- conductive
- solder
- width
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 173
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 43
- 239000011162 core material Substances 0.000 description 129
- 238000002474 experimental method Methods 0.000 description 20
- 238000013459 approach Methods 0.000 description 7
- 238000005304 joining Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/009—Cables with built-in connecting points or with predetermined areas for making deviations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Insulated Conductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014220864A JP6193835B2 (ja) | 2014-10-29 | 2014-10-29 | 同軸ケーブルの接続構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201626641A TW201626641A (zh) | 2016-07-16 |
| TWI616040B true TWI616040B (zh) | 2018-02-21 |
Family
ID=55857594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104135651A TWI616040B (zh) | 2014-10-29 | 2015-10-29 | 同軸纜線之連接構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9806434B2 (enExample) |
| JP (1) | JP6193835B2 (enExample) |
| KR (1) | KR101937281B1 (enExample) |
| CN (1) | CN107112641B (enExample) |
| TW (1) | TWI616040B (enExample) |
| WO (1) | WO2016068259A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7234188B2 (ja) * | 2020-07-22 | 2023-03-07 | 矢崎総業株式会社 | 電線の製造方法および電線製造装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5797765A (en) * | 1996-11-01 | 1998-08-25 | Hewlett-Packard Company | Coaxial connector for mounting on a circuit substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5139448A (en) * | 1985-05-24 | 1992-08-18 | North American Specialties Corporation | Solder-bearing lead |
| JPH10112580A (ja) * | 1996-10-08 | 1998-04-28 | Sony Corp | プリント配線基板 |
| CN1216420C (zh) * | 2001-12-14 | 2005-08-24 | 矽品精密工业股份有限公司 | 可设置无源元件的芯片承载件 |
| JP5510090B2 (ja) * | 2010-06-10 | 2014-06-04 | 日立金属株式会社 | ケーブル接続構造、及びケーブル接続方法 |
| JP5738623B2 (ja) * | 2011-02-22 | 2015-06-24 | オリンパス株式会社 | ケーブル接続構造およびケーブル接続方法 |
| JP5479432B2 (ja) | 2011-10-24 | 2014-04-23 | 株式会社フジクラ | ケーブルアッセンブリ |
| CN202737148U (zh) * | 2012-07-10 | 2013-02-13 | 贝尔威勒电子股份有限公司 | 缆线连接器的端子焊接结构 |
| JP2014089902A (ja) * | 2012-10-31 | 2014-05-15 | Hitachi Metals Ltd | ケーブル接続体およびケーブル接続方法 |
-
2014
- 2014-10-29 JP JP2014220864A patent/JP6193835B2/ja active Active
-
2015
- 2015-10-29 US US15/521,801 patent/US9806434B2/en active Active
- 2015-10-29 WO PCT/JP2015/080614 patent/WO2016068259A1/ja not_active Ceased
- 2015-10-29 KR KR1020177007462A patent/KR101937281B1/ko active Active
- 2015-10-29 TW TW104135651A patent/TWI616040B/zh active
- 2015-10-29 CN CN201580059173.3A patent/CN107112641B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5797765A (en) * | 1996-11-01 | 1998-08-25 | Hewlett-Packard Company | Coaxial connector for mounting on a circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170250476A1 (en) | 2017-08-31 |
| TW201626641A (zh) | 2016-07-16 |
| CN107112641B (zh) | 2019-03-29 |
| JP6193835B2 (ja) | 2017-09-06 |
| KR20170074854A (ko) | 2017-06-30 |
| CN107112641A (zh) | 2017-08-29 |
| JP2016091610A (ja) | 2016-05-23 |
| WO2016068259A1 (ja) | 2016-05-06 |
| KR101937281B1 (ko) | 2019-01-10 |
| US9806434B2 (en) | 2017-10-31 |
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