TWI613948B - 多層剛性可撓性基板及其製造方法 - Google Patents
多層剛性可撓性基板及其製造方法 Download PDFInfo
- Publication number
- TWI613948B TWI613948B TW104131143A TW104131143A TWI613948B TW I613948 B TWI613948 B TW I613948B TW 104131143 A TW104131143 A TW 104131143A TW 104131143 A TW104131143 A TW 104131143A TW I613948 B TWI613948 B TW I613948B
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible substrate
- multilayer
- rigid
- low
- prepreg
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015036557A JP6538372B2 (ja) | 2015-02-26 | 2015-02-26 | 多層リジッドフレキシブル基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201705836A TW201705836A (zh) | 2017-02-01 |
TWI613948B true TWI613948B (zh) | 2018-02-01 |
Family
ID=56826491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104131143A TWI613948B (zh) | 2015-02-26 | 2015-09-21 | 多層剛性可撓性基板及其製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6538372B2 (ko) |
KR (1) | KR101853530B1 (ko) |
CN (1) | CN105934109B (ko) |
TW (1) | TWI613948B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021020919A1 (ko) * | 2019-07-30 | 2021-02-04 | 삼성전자 주식회사 | 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI364245B (en) * | 2008-05-12 | 2012-05-11 | Fujitsu Ltd | Multi-layer printed wiring board, electronic device, and fabrication method of electronic device |
TW201503783A (zh) * | 2014-03-07 | 2015-01-16 | Meiko Electronics Co Ltd | 具有可撓部之剛性印刷配線基板之彎回方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5997983A (en) * | 1997-05-30 | 1999-12-07 | Teledyneindustries, Inc. | Rigid/flex printed circuit board using angled prepreg |
JP2002252469A (ja) * | 2001-02-23 | 2002-09-06 | Shin Etsu Chem Co Ltd | 多層フレキシブル印刷配線板 |
JP2006066894A (ja) * | 2004-07-28 | 2006-03-09 | Hitachi Chem Co Ltd | 印刷回路板 |
JP2006324406A (ja) * | 2005-05-18 | 2006-11-30 | Sharp Corp | フレックスリジッド多層配線板 |
JP2007129153A (ja) * | 2005-11-07 | 2007-05-24 | Cmk Corp | リジッドフレックス多層プリント配線板 |
KR200415210Y1 (ko) * | 2006-02-14 | 2006-04-28 | (주)인터플렉스 | 리지드 플렉시블 인쇄회로기판 |
US8188372B2 (en) * | 2006-09-21 | 2012-05-29 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
TW201127228A (en) * | 2010-01-22 | 2011-08-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
US9480148B2 (en) * | 2011-02-21 | 2016-10-25 | Panasonic Intellectual Property Management Co., Ltd. | Metal-clad laminate and printed wiring board |
TW201340807A (zh) * | 2011-12-28 | 2013-10-01 | Panasonic Corp | 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板 |
AT13434U1 (de) * | 2012-02-21 | 2013-12-15 | Austria Tech & System Tech | Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens |
-
2015
- 2015-02-26 JP JP2015036557A patent/JP6538372B2/ja active Active
- 2015-09-21 TW TW104131143A patent/TWI613948B/zh active
- 2015-09-25 KR KR1020150136717A patent/KR101853530B1/ko active IP Right Grant
- 2015-09-30 CN CN201510640100.5A patent/CN105934109B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI364245B (en) * | 2008-05-12 | 2012-05-11 | Fujitsu Ltd | Multi-layer printed wiring board, electronic device, and fabrication method of electronic device |
TW201503783A (zh) * | 2014-03-07 | 2015-01-16 | Meiko Electronics Co Ltd | 具有可撓部之剛性印刷配線基板之彎回方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20160104532A (ko) | 2016-09-05 |
CN105934109B (zh) | 2018-10-12 |
JP6538372B2 (ja) | 2019-07-03 |
KR101853530B1 (ko) | 2018-04-30 |
JP2016157902A (ja) | 2016-09-01 |
CN105934109A (zh) | 2016-09-07 |
TW201705836A (zh) | 2017-02-01 |
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