TWI610115B - 檢測裝置、雷射光照射裝置及光學組件貼合體之製造裝置 - Google Patents

檢測裝置、雷射光照射裝置及光學組件貼合體之製造裝置 Download PDF

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Publication number
TWI610115B
TWI610115B TW103109738A TW103109738A TWI610115B TW I610115 B TWI610115 B TW I610115B TW 103109738 A TW103109738 A TW 103109738A TW 103109738 A TW103109738 A TW 103109738A TW I610115 B TWI610115 B TW I610115B
Authority
TW
Taiwan
Prior art keywords
laser light
opening
layer
bonding
optical component
Prior art date
Application number
TW103109738A
Other languages
English (en)
Chinese (zh)
Other versions
TW201443521A (zh
Inventor
藤井幹士
蔡盛旭
Original Assignee
住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友化學股份有限公司 filed Critical 住友化學股份有限公司
Publication of TW201443521A publication Critical patent/TW201443521A/zh
Application granted granted Critical
Publication of TWI610115B publication Critical patent/TWI610115B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW103109738A 2013-03-21 2014-03-14 檢測裝置、雷射光照射裝置及光學組件貼合體之製造裝置 TWI610115B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013058978A JP6199585B2 (ja) 2013-03-21 2013-03-21 レーザー光照射装置及び光学部材貼合体の製造装置
JPJP2013-058978 2013-03-21

Publications (2)

Publication Number Publication Date
TW201443521A TW201443521A (zh) 2014-11-16
TWI610115B true TWI610115B (zh) 2018-01-01

Family

ID=51580020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109738A TWI610115B (zh) 2013-03-21 2014-03-14 檢測裝置、雷射光照射裝置及光學組件貼合體之製造裝置

Country Status (3)

Country Link
JP (1) JP6199585B2 (ja)
TW (1) TWI610115B (ja)
WO (1) WO2014148333A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204301688U (zh) * 2014-12-16 2015-04-29 日东电工株式会社 贴合位置检查装置
JP6791665B2 (ja) * 2016-06-30 2020-11-25 日本電産サンキョー株式会社 搬送システム
CN116019944A (zh) * 2023-02-14 2023-04-28 宁波聚睿众邦检测技术有限公司 一种应用光学杀菌的消毒杀菌装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171963A (en) * 1990-05-21 1992-12-15 Ntn Corporation Laser processing device and laser processing method
JP2003107452A (ja) * 2001-09-17 2003-04-09 Internatl Business Mach Corp <Ibm> 液晶表示パネルの製造方法、液晶表示装置の製造方法、および、液晶表示装置の製造装置
JP2003255132A (ja) * 2002-03-05 2003-09-10 Sumitomo Chem Co Ltd 光学フィルムチップの製造方法
US20050098549A1 (en) * 2003-10-21 2005-05-12 Hitachi Via Mechanics, Ltd. Laser beam machining apparatus
TW200644143A (en) * 2005-05-12 2006-12-16 Olympus Corp Substrate inspection apparatus
JP2007203302A (ja) * 2006-01-30 2007-08-16 Sumitomo Heavy Ind Ltd 基板加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832369B2 (ja) * 1990-05-21 1996-03-29 エヌティエヌ株式会社 レーザ加工装置
JP2509595Y2 (ja) * 1991-07-05 1996-09-04 大日本スクリーン製造株式会社 テ―ブル型測長装置
JP2732230B2 (ja) * 1994-10-21 1998-03-25 株式会社篠崎製作所 レーザ光加工における同軸観測装置
JP3523927B2 (ja) * 1995-01-10 2004-04-26 株式会社ソキア 測長装置
JPH1099985A (ja) * 1996-09-30 1998-04-21 Komatsu Ltd 熱切断加工機のワーク切断、回収方法及び切断テーブル装置
JP2001047280A (ja) * 1999-08-03 2001-02-20 Niigata Eng Co Ltd 板材加工機用のワーク搬送装置およびワーク搬送方法
JP2003071581A (ja) * 2001-08-30 2003-03-11 Central Glass Co Ltd 樹脂フィルムの位置決め方法
JP2005014012A (ja) * 2003-06-24 2005-01-20 Pentax Corp 描画装置および描画方法
JP4951271B2 (ja) * 2005-05-12 2012-06-13 オリンパス株式会社 基板検査装置
WO2007077630A1 (ja) * 2006-01-06 2007-07-12 Mitsubishi Denki Kabushiki Kaisha レーザ加工装置、プログラム作成装置およびレーザ加工方法
JP4800114B2 (ja) * 2006-05-31 2011-10-26 ミヤチテクノス株式会社 レーザマーキング方法及び装置
JP5759811B2 (ja) * 2011-07-11 2015-08-05 日本車輌製造株式会社 位置補正装置およびレーザ加工機

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171963A (en) * 1990-05-21 1992-12-15 Ntn Corporation Laser processing device and laser processing method
JP2003107452A (ja) * 2001-09-17 2003-04-09 Internatl Business Mach Corp <Ibm> 液晶表示パネルの製造方法、液晶表示装置の製造方法、および、液晶表示装置の製造装置
JP2003255132A (ja) * 2002-03-05 2003-09-10 Sumitomo Chem Co Ltd 光学フィルムチップの製造方法
US20050098549A1 (en) * 2003-10-21 2005-05-12 Hitachi Via Mechanics, Ltd. Laser beam machining apparatus
TW200644143A (en) * 2005-05-12 2006-12-16 Olympus Corp Substrate inspection apparatus
JP2007203302A (ja) * 2006-01-30 2007-08-16 Sumitomo Heavy Ind Ltd 基板加工装置

Also Published As

Publication number Publication date
WO2014148333A1 (ja) 2014-09-25
TW201443521A (zh) 2014-11-16
JP6199585B2 (ja) 2017-09-20
JP2014186056A (ja) 2014-10-02

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