TWI609917B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI609917B
TWI609917B TW101117404A TW101117404A TWI609917B TW I609917 B TWI609917 B TW I609917B TW 101117404 A TW101117404 A TW 101117404A TW 101117404 A TW101117404 A TW 101117404A TW I609917 B TWI609917 B TW I609917B
Authority
TW
Taiwan
Prior art keywords
resin
resin composition
epoxy resin
mass
insulating layer
Prior art date
Application number
TW101117404A
Other languages
English (en)
Chinese (zh)
Other versions
TW201311810A (zh
Inventor
Shigeo Nakamura
中村茂雄
Kazuhiko Tsurui
鶴井一彥
Original Assignee
Ajinomoto Co., Inc.
味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc., 味之素股份有限公司 filed Critical Ajinomoto Co., Inc.
Publication of TW201311810A publication Critical patent/TW201311810A/zh
Application granted granted Critical
Publication of TWI609917B publication Critical patent/TWI609917B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW101117404A 2011-05-31 2012-05-16 樹脂組成物 TWI609917B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011121519 2011-05-31

Publications (2)

Publication Number Publication Date
TW201311810A TW201311810A (zh) 2013-03-16
TWI609917B true TWI609917B (zh) 2018-01-01

Family

ID=47685076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101117404A TWI609917B (zh) 2011-05-31 2012-05-16 樹脂組成物

Country Status (3)

Country Link
JP (1) JP6069887B2 (ko)
KR (1) KR101888697B1 (ko)
TW (1) TWI609917B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6048193B2 (ja) * 2013-02-13 2016-12-21 味の素株式会社 樹脂組成物
CN105027273B (zh) * 2013-03-07 2019-01-22 住友电木株式会社 粘接膜、叠层体及其固化物、和半导体装置及其制造方法
JP6163803B2 (ja) * 2013-03-14 2017-07-19 味の素株式会社 樹脂組成物
JP6313602B2 (ja) * 2013-03-22 2018-04-18 積水化学工業株式会社 エポキシ樹脂材料及び多層基板
JP6314337B2 (ja) * 2013-03-28 2018-04-25 味の素株式会社 シート材
KR102113738B1 (ko) * 2013-11-29 2020-05-21 엘지디스플레이 주식회사 포토레지스트용 스트리퍼 조성물 및 이를 이용한 표시장치의 제조방법
JP6439960B2 (ja) * 2014-08-07 2018-12-19 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
JP6848187B2 (ja) * 2016-02-25 2021-03-24 住友ベークライト株式会社 半導体装置製造用樹脂シート、半導体装置、半導体装置の製造方法、有機樹脂基板および有機樹脂基板の製造方法
US11930594B2 (en) * 2016-08-15 2024-03-12 Resonac Corporation Adhesive film for multilayer printed-wiring board
JP6217832B2 (ja) * 2016-11-21 2017-10-25 味の素株式会社 樹脂組成物
JP7240085B2 (ja) * 2017-03-31 2023-03-15 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
CN108864653A (zh) * 2017-05-10 2018-11-23 味之素株式会社 树脂组合物
JP2021073328A (ja) * 2020-12-25 2021-05-13 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005298781A (ja) * 2004-04-06 2005-10-27 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板用接着剤組成物および接着フィルム
JP2008112972A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置
CN101313033A (zh) * 2005-11-25 2008-11-26 日本瑞翁株式会社 固化性树脂组合物及其应用
TW201107405A (en) * 2009-04-07 2011-03-01 Three Bond Co Ltd Epoxy resin composition
WO2011058962A1 (ja) * 2009-11-10 2011-05-19 日本化薬株式会社 エポキシ樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261776A (ja) * 2000-03-24 2001-09-26 Matsushita Electric Works Ltd プリント配線板用絶縁材料
JP5133946B2 (ja) * 2009-06-18 2013-01-30 ヤフー株式会社 情報検索装置及び情報検索方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005298781A (ja) * 2004-04-06 2005-10-27 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板用接着剤組成物および接着フィルム
CN101313033A (zh) * 2005-11-25 2008-11-26 日本瑞翁株式会社 固化性树脂组合物及其应用
JP2008112972A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置
TW201107405A (en) * 2009-04-07 2011-03-01 Three Bond Co Ltd Epoxy resin composition
WO2011058962A1 (ja) * 2009-11-10 2011-05-19 日本化薬株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
KR20120134081A (ko) 2012-12-11
JP2013010932A (ja) 2013-01-17
TW201311810A (zh) 2013-03-16
JP6069887B2 (ja) 2017-02-01
KR101888697B1 (ko) 2018-09-20

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