TWI608049B - Supported prepolymer sheet - Google Patents

Supported prepolymer sheet Download PDF

Info

Publication number
TWI608049B
TWI608049B TW102132350A TW102132350A TWI608049B TW I608049 B TWI608049 B TW I608049B TW 102132350 A TW102132350 A TW 102132350A TW 102132350 A TW102132350 A TW 102132350A TW I608049 B TWI608049 B TW I608049B
Authority
TW
Taiwan
Prior art keywords
layer
support
mass
epoxy resin
prepolymer
Prior art date
Application number
TW102132350A
Other languages
English (en)
Chinese (zh)
Other versions
TW201418360A (zh
Inventor
川合賢司
中村茂雄
西村嘉生
Original Assignee
味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 味之素股份有限公司 filed Critical 味之素股份有限公司
Publication of TW201418360A publication Critical patent/TW201418360A/zh
Application granted granted Critical
Publication of TWI608049B publication Critical patent/TWI608049B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW102132350A 2012-09-28 2013-09-09 Supported prepolymer sheet TWI608049B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012216646A JP6098988B2 (ja) 2012-09-28 2012-09-28 支持体含有プレポリマーシート

Publications (2)

Publication Number Publication Date
TW201418360A TW201418360A (zh) 2014-05-16
TWI608049B true TWI608049B (zh) 2017-12-11

Family

ID=50651778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102132350A TWI608049B (zh) 2012-09-28 2013-09-09 Supported prepolymer sheet

Country Status (3)

Country Link
JP (1) JP6098988B2 (ko)
KR (1) KR102122706B1 (ko)
TW (1) TWI608049B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013149186A1 (en) 2012-03-30 2013-10-03 Insulet Corporation Fluid delivery device with transcutaneous access tool, insertion mechansim and blood glucose monitoring for use therewith
WO2016088540A1 (ja) * 2014-12-05 2016-06-09 三井金属鉱業株式会社 導電性組成物並びに配線基板及びその製造方法
JP6728760B2 (ja) * 2016-02-25 2020-07-22 味の素株式会社 支持体付き樹脂シート
WO2018035032A1 (en) 2016-08-14 2018-02-22 Insulet Corporation Automatic drug delivery device with trigger mechanism
US10751478B2 (en) 2016-10-07 2020-08-25 Insulet Corporation Multi-stage delivery system
US10603440B2 (en) 2017-01-19 2020-03-31 Insulet Corporation Cartridge hold-up volume reduction
US10695485B2 (en) 2017-03-07 2020-06-30 Insulet Corporation Very high volume user filled drug delivery device
US11280327B2 (en) 2017-08-03 2022-03-22 Insulet Corporation Micro piston pump
US10973978B2 (en) 2017-08-03 2021-04-13 Insulet Corporation Fluid flow regulation arrangements for drug delivery devices
JP6676593B2 (ja) * 2017-09-08 2020-04-08 リンテック株式会社 樹脂シートおよび半導体装置
US11786668B2 (en) 2017-09-25 2023-10-17 Insulet Corporation Drug delivery devices, systems, and methods with force transfer elements
US10874803B2 (en) 2018-05-31 2020-12-29 Insulet Corporation Drug cartridge with drive system
EP3801682A1 (en) 2018-06-06 2021-04-14 Insulet Corporation Linear shuttle pump for drug delivery
CA3117989C (en) 2018-11-28 2024-02-20 Insulet Corporation Drug delivery shuttle pump system and valve assembly
US11369735B2 (en) 2019-11-05 2022-06-28 Insulet Corporation Component positioning of a linear shuttle pump
JP7512122B2 (ja) 2020-08-06 2024-07-08 新光電気工業株式会社 配線基板の製造方法
JP7494960B1 (ja) 2023-01-31 2024-06-04 味の素株式会社 硬化体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202517A (ja) * 2008-02-29 2009-09-10 Sekisui Chem Co Ltd 多層絶縁フィルムと多層プリント配線板の製造方法
TW201030046A (en) * 2008-10-07 2010-08-16 Ajinomoto Kk Epoxy resin composition
TW201124465A (en) * 2009-11-26 2011-07-16 Ajinomoto Kk Epoxy resin compositions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002355051A1 (en) * 2001-11-30 2003-06-10 Ajinomoto Co., Inc. Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board
JP5016401B2 (ja) * 2007-06-11 2012-09-05 積水化学工業株式会社 多層絶縁フィルム
JP5181769B2 (ja) 2008-03-26 2013-04-10 Ｄｉｃ株式会社 エポキシ樹脂組成物、及びその硬化物
JP4911795B2 (ja) * 2008-09-01 2012-04-04 積水化学工業株式会社 積層体の製造方法
JP5540984B2 (ja) * 2010-08-11 2014-07-02 味の素株式会社 積層板の製造方法
JP6011079B2 (ja) * 2012-07-05 2016-10-19 味の素株式会社 支持体付き樹脂シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202517A (ja) * 2008-02-29 2009-09-10 Sekisui Chem Co Ltd 多層絶縁フィルムと多層プリント配線板の製造方法
TW201030046A (en) * 2008-10-07 2010-08-16 Ajinomoto Kk Epoxy resin composition
TW201124465A (en) * 2009-11-26 2011-07-16 Ajinomoto Kk Epoxy resin compositions

Also Published As

Publication number Publication date
JP6098988B2 (ja) 2017-03-22
JP2014069405A (ja) 2014-04-21
KR102122706B1 (ko) 2020-06-16
TW201418360A (zh) 2014-05-16
KR20140042704A (ko) 2014-04-07

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