TWI605024B - Breaking method of brittle substrate - Google Patents
Breaking method of brittle substrate Download PDFInfo
- Publication number
- TWI605024B TWI605024B TW105120169A TW105120169A TWI605024B TW I605024 B TWI605024 B TW I605024B TW 105120169 A TW105120169 A TW 105120169A TW 105120169 A TW105120169 A TW 105120169A TW I605024 B TWI605024 B TW I605024B
- Authority
- TW
- Taiwan
- Prior art keywords
- line
- brittle substrate
- substrate
- blade
- glass substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015156914 | 2015-08-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201708137A TW201708137A (zh) | 2017-03-01 |
TWI605024B true TWI605024B (zh) | 2017-11-11 |
Family
ID=57983042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105120169A TWI605024B (zh) | 2015-08-07 | 2016-06-27 | Breaking method of brittle substrate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6493537B2 (ja) |
KR (1) | KR102083381B1 (ja) |
CN (1) | CN107848862B (ja) |
TW (1) | TWI605024B (ja) |
WO (1) | WO2017026191A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018131179A1 (de) | 2018-12-06 | 2020-06-10 | Schott Ag | Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung |
WO2020183580A1 (ja) * | 2019-03-11 | 2020-09-17 | 株式会社オプト・システム | 半導体チップの製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3095999B2 (ja) * | 1996-04-15 | 2000-10-10 | 株式会社ベルデックス | ガラスのスクライブ方法および装置 |
JP2002316829A (ja) * | 2001-04-17 | 2002-10-31 | Seiko Epson Corp | ガラス基板の切断方法、電気光学装置の製造方法、電気光学装置、電子機器、およびスクライブ溝形成装置 |
JP3602846B2 (ja) | 2001-06-14 | 2004-12-15 | 三星ダイヤモンド工業株式会社 | 有機elディスプレイ製造装置及び有機elディスプレイの製造方法 |
TWI226877B (en) | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
KR101181707B1 (ko) * | 2004-05-20 | 2012-09-19 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 머더 기판 절단방법, 머더 기판 스크라이브 장치,프로그램 및 기록매체 |
KR101445890B1 (ko) * | 2007-04-27 | 2014-09-29 | 아사히 가라스 가부시키가이샤 | 띠 형상 판유리의 절선 가공 장치 및 방법, 그리고 판유리의 제조 방법 |
JP5076662B2 (ja) * | 2007-06-13 | 2012-11-21 | 澁谷工業株式会社 | 脆性材料の割断方法およびその装置 |
JP2011079690A (ja) | 2009-10-06 | 2011-04-21 | Leo:Kk | 回折格子を用いた厚板ガラスのレーザ熱応力割断 |
TWI680106B (zh) * | 2014-03-31 | 2019-12-21 | 日商三星鑽石工業股份有限公司 | 脆性材料基板之分斷方法 |
JP6413694B2 (ja) * | 2014-11-25 | 2018-10-31 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
JP6413693B2 (ja) * | 2014-11-25 | 2018-10-31 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
-
2016
- 2016-06-27 TW TW105120169A patent/TWI605024B/zh not_active IP Right Cessation
- 2016-06-30 CN CN201680045817.8A patent/CN107848862B/zh not_active Expired - Fee Related
- 2016-06-30 WO PCT/JP2016/069424 patent/WO2017026191A1/ja active Application Filing
- 2016-06-30 KR KR1020187003638A patent/KR102083381B1/ko active IP Right Grant
- 2016-06-30 JP JP2017534133A patent/JP6493537B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2017026191A1 (ja) | 2017-02-16 |
CN107848862A (zh) | 2018-03-27 |
JPWO2017026191A1 (ja) | 2018-04-12 |
TW201708137A (zh) | 2017-03-01 |
KR102083381B1 (ko) | 2020-03-02 |
KR20180030082A (ko) | 2018-03-21 |
JP6493537B2 (ja) | 2019-04-03 |
CN107848862B (zh) | 2020-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |