TWI605024B - Breaking method of brittle substrate - Google Patents

Breaking method of brittle substrate Download PDF

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Publication number
TWI605024B
TWI605024B TW105120169A TW105120169A TWI605024B TW I605024 B TWI605024 B TW I605024B TW 105120169 A TW105120169 A TW 105120169A TW 105120169 A TW105120169 A TW 105120169A TW I605024 B TWI605024 B TW I605024B
Authority
TW
Taiwan
Prior art keywords
line
brittle substrate
substrate
blade
glass substrate
Prior art date
Application number
TW105120169A
Other languages
English (en)
Chinese (zh)
Other versions
TW201708137A (zh
Inventor
Yuma Iwatsubo
Hiroshi Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201708137A publication Critical patent/TW201708137A/zh
Application granted granted Critical
Publication of TWI605024B publication Critical patent/TWI605024B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW105120169A 2015-08-07 2016-06-27 Breaking method of brittle substrate TWI605024B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015156914 2015-08-07

Publications (2)

Publication Number Publication Date
TW201708137A TW201708137A (zh) 2017-03-01
TWI605024B true TWI605024B (zh) 2017-11-11

Family

ID=57983042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105120169A TWI605024B (zh) 2015-08-07 2016-06-27 Breaking method of brittle substrate

Country Status (5)

Country Link
JP (1) JP6493537B2 (ja)
KR (1) KR102083381B1 (ja)
CN (1) CN107848862B (ja)
TW (1) TWI605024B (ja)
WO (1) WO2017026191A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018131179A1 (de) 2018-12-06 2020-06-10 Schott Ag Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung
JP7311584B2 (ja) * 2019-03-11 2023-07-19 株式会社 オプト・システム 半導体チップの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3095999B2 (ja) * 1996-04-15 2000-10-10 株式会社ベルデックス ガラスのスクライブ方法および装置
JP2002316829A (ja) * 2001-04-17 2002-10-31 Seiko Epson Corp ガラス基板の切断方法、電気光学装置の製造方法、電気光学装置、電子機器、およびスクライブ溝形成装置
JP3602846B2 (ja) 2001-06-14 2004-12-15 三星ダイヤモンド工業株式会社 有機ｅｌディスプレイ製造装置及び有機ｅｌディスプレイの製造方法
TWI226877B (en) 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
WO2005113212A1 (ja) * 2004-05-20 2005-12-01 Mitsuboshi Diamond Industrial Co., Ltd. マザー基板分断方法、マザー基板スクライブ装置、プログラムおよび記録媒体
CN101668712B (zh) * 2007-04-27 2012-09-19 旭硝子株式会社 带状平板玻璃的切割线加工装置及方法以及平板玻璃的制造方法
JP5076662B2 (ja) * 2007-06-13 2012-11-21 澁谷工業株式会社 脆性材料の割断方法およびその装置
JP2011079690A (ja) 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
TWI680106B (zh) * 2014-03-31 2019-12-21 日商三星鑽石工業股份有限公司 脆性材料基板之分斷方法
JP6413693B2 (ja) * 2014-11-25 2018-10-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6413694B2 (ja) * 2014-11-25 2018-10-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法

Also Published As

Publication number Publication date
JPWO2017026191A1 (ja) 2018-04-12
WO2017026191A1 (ja) 2017-02-16
KR20180030082A (ko) 2018-03-21
TW201708137A (zh) 2017-03-01
JP6493537B2 (ja) 2019-04-03
KR102083381B1 (ko) 2020-03-02
CN107848862A (zh) 2018-03-27
CN107848862B (zh) 2020-09-15

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MM4A Annulment or lapse of patent due to non-payment of fees