TWI602327B - A quartz crystal resonator with a circular wafer structure and a manufacturing method thereof - Google Patents
A quartz crystal resonator with a circular wafer structure and a manufacturing method thereof Download PDFInfo
- Publication number
- TWI602327B TWI602327B TW105134521A TW105134521A TWI602327B TW I602327 B TWI602327 B TW I602327B TW 105134521 A TW105134521 A TW 105134521A TW 105134521 A TW105134521 A TW 105134521A TW I602327 B TWI602327 B TW I602327B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- package
- quartz
- electrode region
- circular
- Prior art date
Links
- 239000010453 quartz Substances 0.000 title claims description 134
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 134
- 239000013078 crystal Substances 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title description 13
- 239000002184 metal Substances 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 63
- 239000010410 layer Substances 0.000 description 56
- 238000013461 design Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 238000001312 dry etching Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 238000012856 packing Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 238000005422 blasting Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510966616.9A CN105634436A (zh) | 2015-12-22 | 2015-12-22 | 一种具有圆形晶片结构的石英晶体谐振器及其制作方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201724587A TW201724587A (zh) | 2017-07-01 |
| TWI602327B true TWI602327B (zh) | 2017-10-11 |
Family
ID=56049057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105134521A TWI602327B (zh) | 2015-12-22 | 2016-10-26 | A quartz crystal resonator with a circular wafer structure and a manufacturing method thereof |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2018504793A (ja) |
| KR (1) | KR20170136967A (ja) |
| CN (1) | CN105634436A (ja) |
| TW (1) | TWI602327B (ja) |
| WO (1) | WO2017107307A1 (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107769750A (zh) * | 2017-11-13 | 2018-03-06 | 成都泰美克晶体技术有限公司 | 一种改进电极连接结构的全石英晶体谐振器及其制备方法 |
| CN110224681B (zh) * | 2019-07-09 | 2024-01-26 | 成都泰美克晶体技术有限公司 | 一种短h型结构的高频抛光石英晶片 |
| CN110224683B (zh) * | 2019-07-09 | 2024-02-02 | 成都泰美克晶体技术有限公司 | 一种长h型结构的高频抛光石英晶片 |
| CN111256673B (zh) * | 2020-01-19 | 2021-09-10 | 北京晨晶电子有限公司 | 一种石英音叉和基座的连接结构、连接方法及其应用 |
| CN111313855B (zh) * | 2020-03-16 | 2023-06-13 | 研创科技（惠州）有限公司 | 一种新型谐振器组装方法 |
| CN113300689B (zh) * | 2021-03-29 | 2023-01-31 | 天津大学 | 具有加固结构的石英谐振器及其形成方法、电子设备 |
| CN113271082A (zh) * | 2021-06-22 | 2021-08-17 | 泰晶科技股份有限公司 | 一种具有高斯型电极结构的压电石英晶片及其制造工艺 |
| CN114351094B (zh) * | 2021-12-20 | 2023-08-04 | 唐山万士和电子有限公司 | 一种增镀石墨层微天平石英晶片的生产方法 |
| CN116455343B (zh) * | 2023-05-15 | 2024-01-23 | 烟台明德亨电子科技有限公司 | 一种晶振用陶瓷基座的加工方法 |
| CN117674764A (zh) * | 2023-12-04 | 2024-03-08 | 泰晶科技股份有限公司 | 晶圆级封装谐振器及其制备方法、电子设备 |
| CN117411457B (zh) * | 2023-12-14 | 2024-03-19 | 西安电子科技大学 | 一种环形类拱形石英谐振器 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3988621A (en) * | 1971-09-16 | 1976-10-26 | Citizen Watch Co., Ltd. | Supporting structure for a thickness-shear type quartz oscillator |
| US20050200240A1 (en) * | 2004-02-05 | 2005-09-15 | Seiko Epson Corporation | Piezoelectric resonator element, piezoelectric resonator, and piezoelectric oscillator |
| US20110241491A1 (en) * | 2010-03-31 | 2011-10-06 | Nihon Dempa Kogyo Co., Ltd. | Surface-mountable quartz-crystal devices and methods for manufacturing same |
| US20120032561A1 (en) * | 2010-08-07 | 2012-02-09 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric Device With Tuning-Fork Type Piezoelectric Vibrating Piece |
| US20120074816A1 (en) * | 2010-09-28 | 2012-03-29 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric Device |
| US20130043960A1 (en) * | 2011-08-18 | 2013-02-21 | Seiko Epson Corporation | Resonating element, resonator, electronic device, electronic apparatus, moving vehicle, and method of manufacturing resonating element |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59128812A (ja) * | 1983-01-13 | 1984-07-25 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
| SU1167700A1 (ru) * | 1983-12-26 | 1985-07-15 | Всесоюзный Ордена Трудового Красного Знамени Заочный Политехнический Институт | Перестраиваемый пьезоэлектрический резонатор |
| JPH0429229U (ja) * | 1990-07-04 | 1992-03-09 | ||
| US6590315B2 (en) * | 2000-05-26 | 2003-07-08 | William D. Beaver | Surface mount quartz crystal resonators and methods for making same |
| CN1750393B (zh) * | 2004-09-13 | 2012-10-10 | 威廉·比华 | 一种表面贴装石英晶体谐振器及制造方法 |
| JP2013051512A (ja) * | 2011-08-30 | 2013-03-14 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
| JP5883665B2 (ja) * | 2012-01-31 | 2016-03-15 | 日本電波工業株式会社 | 水晶振動片及び水晶デバイス |
| JP2015019240A (ja) * | 2013-07-11 | 2015-01-29 | 日本電波工業株式会社 | 圧電振動片、圧電振動片の製造方法、圧電デバイス、及び圧電デバイスの製造方法 |
| JP2015173366A (ja) * | 2014-03-12 | 2015-10-01 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
| CN205179003U (zh) * | 2015-12-22 | 2016-04-20 | 成都泰美克晶体技术有限公司 | 一种具有圆形晶片结构的石英晶体谐振器 |
-
2015
- 2015-12-22 CN CN201510966616.9A patent/CN105634436A/zh active Pending
-
2016
- 2016-02-29 WO PCT/CN2016/074957 patent/WO2017107307A1/zh active Application Filing
- 2016-02-29 KR KR1020167032159A patent/KR20170136967A/ko not_active Application Discontinuation
- 2016-02-29 JP JP2016570254A patent/JP2018504793A/ja active Pending
- 2016-10-26 TW TW105134521A patent/TWI602327B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3988621A (en) * | 1971-09-16 | 1976-10-26 | Citizen Watch Co., Ltd. | Supporting structure for a thickness-shear type quartz oscillator |
| US20050200240A1 (en) * | 2004-02-05 | 2005-09-15 | Seiko Epson Corporation | Piezoelectric resonator element, piezoelectric resonator, and piezoelectric oscillator |
| US20110241491A1 (en) * | 2010-03-31 | 2011-10-06 | Nihon Dempa Kogyo Co., Ltd. | Surface-mountable quartz-crystal devices and methods for manufacturing same |
| US20120032561A1 (en) * | 2010-08-07 | 2012-02-09 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric Device With Tuning-Fork Type Piezoelectric Vibrating Piece |
| US20120074816A1 (en) * | 2010-09-28 | 2012-03-29 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric Device |
| US20130043960A1 (en) * | 2011-08-18 | 2013-02-21 | Seiko Epson Corporation | Resonating element, resonator, electronic device, electronic apparatus, moving vehicle, and method of manufacturing resonating element |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017107307A1 (zh) | 2017-06-29 |
| CN105634436A (zh) | 2016-06-01 |
| TW201724587A (zh) | 2017-07-01 |
| KR20170136967A (ko) | 2017-12-12 |
| JP2018504793A (ja) | 2018-02-15 |
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