TWI601225B - 發光二極體組件及製造方法 - Google Patents

發光二極體組件及製造方法 Download PDF

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Publication number
TWI601225B
TWI601225B TW102136175A TW102136175A TWI601225B TW I601225 B TWI601225 B TW I601225B TW 102136175 A TW102136175 A TW 102136175A TW 102136175 A TW102136175 A TW 102136175A TW I601225 B TWI601225 B TW I601225B
Authority
TW
Taiwan
Prior art keywords
carrier
led
manufacturing
led chips
wafer
Prior art date
Application number
TW102136175A
Other languages
English (en)
Chinese (zh)
Other versions
TW201515131A (zh
Inventor
鄭子淇
Original Assignee
晶元光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 晶元光電股份有限公司 filed Critical 晶元光電股份有限公司
Priority to TW102136175A priority Critical patent/TWI601225B/zh
Priority to CN201410507456.7A priority patent/CN104518055B/zh
Priority to CN201811167740.9A priority patent/CN109268709A/zh
Priority to US14/506,364 priority patent/US9534747B2/en
Priority to JP2014205344A priority patent/JP6626612B2/ja
Publication of TW201515131A publication Critical patent/TW201515131A/zh
Application granted granted Critical
Publication of TWI601225B publication Critical patent/TWI601225B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H10W72/07307—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating the auxiliary member being a temporary substrate, e.g. a removable substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
TW102136175A 2013-10-07 2013-10-07 發光二極體組件及製造方法 TWI601225B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW102136175A TWI601225B (zh) 2013-10-07 2013-10-07 發光二極體組件及製造方法
CN201410507456.7A CN104518055B (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法
CN201811167740.9A CN109268709A (zh) 2013-10-07 2014-09-28 发光二极管组件及制造方法
US14/506,364 US9534747B2 (en) 2013-10-07 2014-10-03 Light-emitting diode assembly and fabrication method thereof
JP2014205344A JP6626612B2 (ja) 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102136175A TWI601225B (zh) 2013-10-07 2013-10-07 發光二極體組件及製造方法

Publications (2)

Publication Number Publication Date
TW201515131A TW201515131A (zh) 2015-04-16
TWI601225B true TWI601225B (zh) 2017-10-01

Family

ID=52777262

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102136175A TWI601225B (zh) 2013-10-07 2013-10-07 發光二極體組件及製造方法

Country Status (4)

Country Link
US (1) US9534747B2 (https=)
JP (1) JP6626612B2 (https=)
CN (2) CN109268709A (https=)
TW (1) TWI601225B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876286B (zh) * 2017-02-04 2019-08-20 武汉华威科智能技术有限公司 一种极薄柔性电子芯片封装方法及产品
TWI712188B (zh) 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100190280A1 (en) * 2009-01-27 2010-07-29 Citizen Electronics Co., Ltd. Manufacturing method of light-emitting diode
US20120153328A1 (en) * 2010-12-15 2012-06-21 Tsuyoshi Tsutsui Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPS63262259A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd 光プリンタ用書き込みヘツド
JPH03233978A (ja) * 1990-02-08 1991-10-17 Matsushita Electric Ind Co Ltd 発光装置
JPH08330633A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 半導体発光装置
JP3641122B2 (ja) * 1997-12-26 2005-04-20 ローム株式会社 半導体発光素子、半導体発光モジュール、およびこれらの製造方法
JP4715301B2 (ja) * 2005-05-20 2011-07-06 ソニー株式会社 素子転写装置、素子転写方法および表示装置の製造方法
CN200969348Y (zh) * 2006-10-17 2007-10-31 宏齐科技股份有限公司 发光二极管芯片的封装结构
JP2008159937A (ja) * 2006-12-25 2008-07-10 Kyocera Corp 発光素子用集合基板および発光装置集合基板
US7834365B2 (en) * 2007-09-12 2010-11-16 Harvatek Corporation LED chip package structure with high-efficiency light-emitting effect and method of packing the same
TWI411092B (en) * 2009-06-24 2013-10-01 Led package structure with external lateral cutting beveled edges and method for manufacturing the same
US7811843B1 (en) * 2010-01-13 2010-10-12 Hon Hai Precision Industry Co., Ltd. Method of manufacturing light-emitting diode
CN102339925B (zh) * 2010-07-22 2015-11-18 赛恩倍吉科技顾问（深圳）有限公司 发光元件封装方法
US8227271B1 (en) * 2011-01-27 2012-07-24 Himax Technologies Limited Packaging method of wafer level chips
JP2013197236A (ja) * 2012-03-19 2013-09-30 Asahi Glass Co Ltd 発光装置および発光装置の製造方法
CN203339225U (zh) * 2013-06-06 2013-12-11 邱东扬 无封装芯片led发光照明结构

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100190280A1 (en) * 2009-01-27 2010-07-29 Citizen Electronics Co., Ltd. Manufacturing method of light-emitting diode
US20120153328A1 (en) * 2010-12-15 2012-06-21 Tsuyoshi Tsutsui Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device

Also Published As

Publication number Publication date
CN104518055B (zh) 2018-11-02
JP2015076613A (ja) 2015-04-20
CN109268709A (zh) 2019-01-25
CN104518055A (zh) 2015-04-15
US9534747B2 (en) 2017-01-03
JP6626612B2 (ja) 2019-12-25
TW201515131A (zh) 2015-04-16
US20150099320A1 (en) 2015-04-09

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