TWI599462B - Hold the connector - Google Patents

Hold the connector Download PDF

Info

Publication number
TWI599462B
TWI599462B TW105138549A TW105138549A TWI599462B TW I599462 B TWI599462 B TW I599462B TW 105138549 A TW105138549 A TW 105138549A TW 105138549 A TW105138549 A TW 105138549A TW I599462 B TWI599462 B TW I599462B
Authority
TW
Taiwan
Prior art keywords
holder
opening hole
flat surfaces
joint
mounting portion
Prior art date
Application number
TW105138549A
Other languages
English (en)
Chinese (zh)
Other versions
TW201722667A (zh
Inventor
Ryota Sakaguchi
Yoshinari Sasaki
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201722667A publication Critical patent/TW201722667A/zh
Application granted granted Critical
Publication of TWI599462B publication Critical patent/TWI599462B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
TW105138549A 2015-12-28 2016-11-24 Hold the connector TWI599462B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015255604A JP6668749B2 (ja) 2015-12-28 2015-12-28 ホルダジョイント

Publications (2)

Publication Number Publication Date
TW201722667A TW201722667A (zh) 2017-07-01
TWI599462B true TWI599462B (zh) 2017-09-21

Family

ID=59271589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105138549A TWI599462B (zh) 2015-12-28 2016-11-24 Hold the connector

Country Status (4)

Country Link
JP (1) JP6668749B2 (ko)
KR (1) KR101895778B1 (ko)
CN (1) CN106914994A (ko)
TW (1) TWI599462B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019188649A (ja) 2018-04-20 2019-10-31 三星ダイヤモンド工業株式会社 ホルダユニット
JP7209349B2 (ja) 2018-04-27 2023-01-20 三星ダイヤモンド工業株式会社 ホルダユニットおよびピン
CN110405954B (zh) * 2018-04-27 2022-10-21 三星钻石工业股份有限公司 保持器单元及销
JP2019209506A (ja) 2018-05-31 2019-12-12 三星ダイヤモンド工業株式会社 ホルダユニットおよびスクライブ方法
JP7357892B2 (ja) * 2018-12-27 2023-10-10 三星ダイヤモンド工業株式会社 ホルダジョイント、ホルダユニット、およびスクライブ装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4948725B2 (ja) * 2000-12-05 2012-06-06 三星ダイヤモンド工業株式会社 チップホルダー
JP2003071789A (ja) * 2001-08-30 2003-03-12 Honda Electronic Co Ltd 超音波カッター
CN102303373B (zh) * 2005-12-01 2016-06-01 三星钻石工业股份有限公司 划线装置
KR101190649B1 (ko) * 2007-06-06 2012-10-15 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 방법 및 팁 홀더 교환 방법
JP5353085B2 (ja) * 2008-06-23 2013-11-27 三星ダイヤモンド工業株式会社 ホルダジョイント、ホルダユニット、スクライブヘッド及びスクライブ装置
KR20120052007A (ko) * 2010-11-15 2012-05-23 신한다이아몬드공업 주식회사 스크라이버 홀더
JP5447994B2 (ja) 2011-07-25 2014-03-19 三星ダイヤモンド工業株式会社 ホルダジョイント、スクライブヘッド及びスクライブ装置
JP2014008711A (ja) * 2012-06-29 2014-01-20 Mitsuboshi Diamond Industrial Co Ltd チップホルダ及びチップホルダ収納セット
JP2014008714A (ja) * 2012-06-29 2014-01-20 Mitsuboshi Diamond Industrial Co Ltd チップホルダ収納体
JP5906148B2 (ja) * 2012-06-29 2016-04-20 三星ダイヤモンド工業株式会社 チップホルダ収納体
CN104129912A (zh) * 2014-07-29 2014-11-05 北京沃尔德超硬工具有限公司 一种易于拆卸的防尘刀轮

Also Published As

Publication number Publication date
KR101895778B1 (ko) 2018-09-07
CN106914994A (zh) 2017-07-04
KR20170077789A (ko) 2017-07-06
TW201722667A (zh) 2017-07-01
JP6668749B2 (ja) 2020-03-18
JP2017119348A (ja) 2017-07-06

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