CN106914994A - 保持具接头 - Google Patents

保持具接头 Download PDF

Info

Publication number
CN106914994A
CN106914994A CN201611170308.6A CN201611170308A CN106914994A CN 106914994 A CN106914994 A CN 106914994A CN 201611170308 A CN201611170308 A CN 201611170308A CN 106914994 A CN106914994 A CN 106914994A
Authority
CN
China
Prior art keywords
open pore
tool
holding
tabular surface
tool joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611170308.6A
Other languages
English (en)
Chinese (zh)
Inventor
阪口良太
佐佐木吉也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN106914994A publication Critical patent/CN106914994A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
CN201611170308.6A 2015-12-28 2016-12-16 保持具接头 Pending CN106914994A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-255604 2015-12-28
JP2015255604A JP6668749B2 (ja) 2015-12-28 2015-12-28 ホルダジョイント

Publications (1)

Publication Number Publication Date
CN106914994A true CN106914994A (zh) 2017-07-04

Family

ID=59271589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611170308.6A Pending CN106914994A (zh) 2015-12-28 2016-12-16 保持具接头

Country Status (4)

Country Link
JP (1) JP6668749B2 (ko)
KR (1) KR101895778B1 (ko)
CN (1) CN106914994A (ko)
TW (1) TWI599462B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110405954A (zh) * 2018-04-27 2019-11-05 三星钻石工业股份有限公司 保持器单元及销
CN111376398A (zh) * 2018-12-27 2020-07-07 三星钻石工业股份有限公司 保持器接头、保持器单元、以及刻划装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019188649A (ja) 2018-04-20 2019-10-31 三星ダイヤモンド工業株式会社 ホルダユニット
JP7209349B2 (ja) 2018-04-27 2023-01-20 三星ダイヤモンド工業株式会社 ホルダユニットおよびピン
JP2019209506A (ja) 2018-05-31 2019-12-12 三星ダイヤモンド工業株式会社 ホルダユニットおよびスクライブ方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071789A (ja) * 2001-08-30 2003-03-12 Honda Electronic Co Ltd 超音波カッター
CN1501855A (zh) * 2000-12-05 2004-06-02 ���DZ�ʯ��ҵ��ʽ���� 刀轮夹持器
CN101613179A (zh) * 2008-06-23 2009-12-30 三星钻石工业股份有限公司 保持具接头、保持具单元、划线头及划线装置
CN102463569A (zh) * 2010-11-15 2012-05-23 新韩钻石工业股份有限公司 划线器固定件
KR20140002485A (ko) * 2012-06-29 2014-01-08 미쓰보시 다이야몬도 고교 가부시키가이샤 팁 홀더 수납체
CN104129912A (zh) * 2014-07-29 2014-11-05 北京沃尔德超硬工具有限公司 一种易于拆卸的防尘刀轮
KR101493597B1 (ko) * 2012-06-29 2015-02-13 미쓰보시 다이야몬도 고교 가부시키가이샤 팁 홀더 수납체

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102303373B (zh) * 2005-12-01 2016-06-01 三星钻石工业股份有限公司 划线装置
KR101190649B1 (ko) * 2007-06-06 2012-10-15 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 방법 및 팁 홀더 교환 방법
JP5447994B2 (ja) 2011-07-25 2014-03-19 三星ダイヤモンド工業株式会社 ホルダジョイント、スクライブヘッド及びスクライブ装置
JP2014008711A (ja) * 2012-06-29 2014-01-20 Mitsuboshi Diamond Industrial Co Ltd チップホルダ及びチップホルダ収納セット

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501855A (zh) * 2000-12-05 2004-06-02 ���DZ�ʯ��ҵ��ʽ���� 刀轮夹持器
JP2003071789A (ja) * 2001-08-30 2003-03-12 Honda Electronic Co Ltd 超音波カッター
CN101613179A (zh) * 2008-06-23 2009-12-30 三星钻石工业股份有限公司 保持具接头、保持具单元、划线头及划线装置
CN102463569A (zh) * 2010-11-15 2012-05-23 新韩钻石工业股份有限公司 划线器固定件
KR20140002485A (ko) * 2012-06-29 2014-01-08 미쓰보시 다이야몬도 고교 가부시키가이샤 팁 홀더 수납체
KR101493597B1 (ko) * 2012-06-29 2015-02-13 미쓰보시 다이야몬도 고교 가부시키가이샤 팁 홀더 수납체
CN104129912A (zh) * 2014-07-29 2014-11-05 北京沃尔德超硬工具有限公司 一种易于拆卸的防尘刀轮

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110405954A (zh) * 2018-04-27 2019-11-05 三星钻石工业股份有限公司 保持器单元及销
CN111376398A (zh) * 2018-12-27 2020-07-07 三星钻石工业股份有限公司 保持器接头、保持器单元、以及刻划装置
CN111376398B (zh) * 2018-12-27 2024-03-12 三星钻石工业股份有限公司 保持器接头、保持器单元、以及刻划装置

Also Published As

Publication number Publication date
KR101895778B1 (ko) 2018-09-07
TWI599462B (zh) 2017-09-21
KR20170077789A (ko) 2017-07-06
TW201722667A (zh) 2017-07-01
JP6668749B2 (ja) 2020-03-18
JP2017119348A (ja) 2017-07-06

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170704