TWI597740B - 導電糊、導電圖案之製造方法及觸控面板 - Google Patents
導電糊、導電圖案之製造方法及觸控面板 Download PDFInfo
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- TWI597740B TWI597740B TW102101885A TW102101885A TWI597740B TW I597740 B TWI597740 B TW I597740B TW 102101885 A TW102101885 A TW 102101885A TW 102101885 A TW102101885 A TW 102101885A TW I597740 B TWI597740 B TW I597740B
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- conductive paste
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Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C09D11/00—Inks
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- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09D201/08—Carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- G03F7/004—Photosensitive materials
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
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Description
本發明係關於用以形成導電圖案之導電糊。
近年來,在含樹脂之有機成分中使Ag等導電性填料分散而得的導電糊,被使用在透明性觸控面板之周圍線路、電路基板用之線路、膜開關等(例如參照專利文獻1、2)。但是此等導電糊係藉由網版印刷來形成線路,因此會有易發生滲出、版堵塞等的問題,而遭遇無法形成窄節距線路的課題。因而有人提出以下技術:對於含樹脂之有機成分賦予感光性,並於基板塗布糊劑後經曝光、顯影步驟而能形成窄節距之線路的技術(例如參照專利文獻3、4)。但是當此等感光性糊劑作為觸控面板之周圍線路使用的情形,會遭遇無法獲得與氧化銦錫(以下稱ITO)間的連接可靠性的課題。作為提高導電糊與ITO間的連接可靠性的方法,已有人提出在導電糊中添加摻雜銻之氧化錫微粉末的技術(例如參照專利文獻5)。
但是賦予感光性之鹼可溶性之有機成分,一般而言酸價高所以即使添加摻雜銻之氧化錫微粉末仍會發生氧化錫被腐蝕,無法獲得與ITO間的連接可靠性,密合性下降或出現殘渣此類課題。
[專利文獻1]日本特開2007-207567號公報
[專利文獻2]日本特開2011-246498號公報
[專利文獻3]國際公開第04/061006號
[專利文獻4]日本特開2003-162921號公報
[專利文獻5]日本特開2009-295325號公報
本發明之目的在於解決上述問題,提供即便含有高酸價之化合物仍與ITO間的連接可靠性高、且可微細圖案化的對於獲得導電圖案為理想的導電糊、及導電圖案之製造方法。
本發明係關於一種導電糊,其特徵為包含:以含銻化合物被覆包含無機材料之芯材表面而成之複合粒子(A)、酸價為30~250mgKOH/g之範圍的化合物(B)、及導電性填料(C),並關於一種導電圖案之製造方法,其特徵
為將該導電糊塗布於基板上,進行乾燥、曝光、顯影後於100℃以上300℃以下之溫度實施硬化。
依照本發明,儘管導電糊含有高酸價之化合物,仍能獲得良好的與ITO間的連接可靠性。又,若依本發明之理想構成,不僅是在剛性基板上,在可撓性基板上也能形成窄節距的線路。
A‧‧‧透光部
B、C‧‧‧樣本短邊
D‧‧‧導電圖案
E‧‧‧PET薄膜
第1圖顯示實施例之比電阻率評價所使用之光罩之透光圖案之示意圖。
第2圖顯示實施例之彎曲性試驗所使用之樣本之示意圖。
第3圖顯示實施例之與ITO間之連接可靠性評價所使用之光罩之透光圖案之示意圖。
本發明之導電糊包含:於包含無機材料之芯材表面被覆含銻化合物而成之複合粒子(A)、酸價為30~250mgKOH/g之範圍的化合物(B)、及導電性填料(C)。
將本發明之導電糊塗布於基板上,視需要而使其乾燥並將溶劑除去後,經過曝光、顯影、於100℃以上300℃以下之溫度的硬化步驟,可在基板上獲得所欲之導電圖
案。使用本發明之糊劑獲得之導電圖案為有機成分與無機成分之複合物,藉由導電性填料彼此在硬化時之硬化收縮而互相接觸,以展現導電性。
本發明之導電糊所含之於包含無機材料之芯材表面被覆含銻化合物而成之複合粒子(A),係指於包含無機材料之芯材表面以1nm以上之厚度被覆含銻化合物之粒子。含銻化合物可列舉硫化銻、三氧化銻、五氧化銻、銻酸鉛、銻化銦、摻雜銻之氧化錫等。作為形成芯材之無機材料,可列舉氧化鈦、硫酸鋇、氧化鋁、二氧化矽、氧化鋅、氧化鎂、氧化鈣、氧化鐵、氧化鎳、氧化釕、氧化銦、氧化銅、碳、銀(Ag)、金(Au)、銅(Cu)、鉑(Pt)、鉛(Pb)、錫(Sn)、鎳(Ni)、鋁(Al)、鎢(W)、鉬(Mo)、鉻(Cr)、鈦(Ti)等。
於包含無機材料之芯材表面被覆含銻化合物而成之複合粒子(A)之體積平均粒徑宜為0.03~10μm較佳,更佳為0.1~6μm。體積平均粒徑若為0.03μm以上,則分散性及分散安定性高、能抑制產生凝集物,故相對添加量能充分獲得與ITO間之連接可靠性之效果,因而較理想。又,體積平均粒徑若為6μm以下,則印刷後之電路圖案之表面平滑度、圖案精度、尺寸精度會提高,故較理想。又,體積平均粒徑可利用庫爾特計數(Coulter Counter)法、光子相關法及雷射繞射法等求得。
於包含無機材料之芯材表面被覆含銻化合物而成之複合粒子(A)之縱橫比(aspect ratio)若為1.5~50之範圍,則敲緊密度(tap density)減低,能以低添加量提高與ITO間的連接可靠性,而縱橫比為10~50之範圍更佳。
於包含無機材料之芯材表面被覆含銻化合物而成之複合粒子(A)的添加量,相對於導電糊中之總固體成分宜為0.1~20重量%之範圍內較佳,更佳為1~10重量%。藉由設定為0.1重量%以上,與ITO的接觸機率提高,與ITO間的連接可靠性會變得特別高,故為理想。又,藉由設定為20重量%以下,能減小對於導電圖案之導電性的影響,故為理想。又,總固體成分係指導電糊除去溶劑者。
本發明之導電糊所含之酸價為30~250mgKOH/g之範圍內的化合物(B),係指分子內具有至少1個以上的羧基的化合物,可使用1種或2種以上。
化合物(B)之具體例可列舉丙烯酸系共聚物、聚酯系樹脂、聚胺甲酸酯系樹脂等。
所謂丙烯酸系共聚物,是指共聚成分中至少包含丙烯酸系單體的共聚物,作為丙烯酸系單體的具體例,可使用具有碳-碳雙鍵的所有化合物,較佳為可列舉丙烯酸
甲酯、丙烯酸、丙烯酸2-乙基己酯、甲基丙烯酸乙酯、丙烯酸正丁酯、丙烯酸異丁酯、異丙烷丙烯酸酯、丙烯酸環氧丙酯、N-甲氧基甲基丙烯醯胺、N-乙氧基甲基丙烯醯胺、N-正丁氧基甲基丙烯醯胺、N-異丁氧基甲基丙烯醯胺、丁氧基三乙二醇丙烯酸酯、丙烯酸二環戊酯、丙烯酸二環戊烯酯、丙烯酸2-羥基乙酯、丙烯酸異莰酯、丙烯酸2-羥基丙酯、丙烯酸異癸酯、丙烯酸異辛酯、丙烯酸月桂酯、丙烯酸2-甲氧基乙酯、甲氧基乙二醇丙烯酸酯、甲氧基二乙二醇丙烯酸酯、丙烯酸八氟戊酯、丙烯酸苯氧基乙酯、丙烯酸硬脂酯、丙烯酸三氟乙酯、丙烯醯胺、丙烯酸胺基乙酯、丙烯酸苯酯、丙烯酸苯氧基乙酯、丙烯酸1-萘酯、丙烯酸2-萘酯、硫酚丙烯酸酯、苄基硫醇丙烯酸酯等丙烯酸系單體及將該等丙烯酸酯替換成甲基丙烯酸酯者,或者苯乙烯、對甲基苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、α-甲基苯乙烯、氯甲基苯乙烯、羥基甲基苯乙烯等苯乙烯類,γ-甲基丙烯醯氧基丙基三甲氧基矽烷、1-乙烯基-2-吡咯啶酮、烯丙基化二丙烯酸環己酯、1,4-丁二醇二丙烯酸酯、1,3-丁二醇二丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、二季戊四醇六丙烯酸酯、二季戊四醇單羥基五丙烯酸酯、二-三羥甲基丙烷四丙烯酸酯、甘油二丙烯酸酯、甲氧基化二丙烯酸環己酯、新戊二醇二丙烯酸酯、丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三甘油二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、雙酚A二丙烯酸酯、雙酚F二丙烯酸酯、
雙酚A-環氧乙烷加成物的二丙烯酸酯、雙酚F-環氧乙烷加成物的二丙烯酸酯、雙酚A-環氧丙烷加成物的二丙烯酸酯,及乙二醇二環氧丙醚之丙烯酸加成物、二乙二醇二環氧丙醚之丙烯酸加成物、新戊二醇二環氧丙醚之丙烯酸加成物、甘油二環氧丙醚之丙烯酸加成物、雙酚A二環氧丙醚之丙烯酸加成物、雙酚F之丙烯酸加成物、甲酚酚醛清漆之丙烯酸加成物等環氧丙烯酸酯單體、或將上述化合物的丙烯酸基的一部分或全部替換成甲基丙烯酸基的化合物等。
對丙烯酸系共聚物賦予鹼可溶性可藉由使用不飽和羧酸等不飽和酸作為單體來達成。作為不飽和酸的具體例,可列舉:丙烯酸、甲基丙烯酸、伊康酸、巴豆酸、馬來酸、富馬酸、乙酸乙烯酯、或此等的酸酐等。藉由將此等賦予至分子鏈上,可調整聚合物的酸價。
又,也可製作將上述不飽和羧酸等不飽和酸作為單體使用而得之丙烯酸系聚合物中之一部分不飽和酸、與具有會與環氧丙基(甲基)丙烯酸酯等不飽和酸反應之基及具不飽和雙鍵之基兩者之化合物反應而得之側鏈具有反應性不飽和雙鍵之鹼可溶性聚合物。
本發明之導電糊所含之化合物(B)之酸價,從鹼可溶性的觀點,須為30~250mgKOH/g,若酸價為30mgKOH/g以上,可溶部分對顯影液之溶解性不下降,若酸價為
250mgKOH/g以下,能增廣顯影容許範圍。又,酸價之測定依JIS-K0070(1992)求取。
本發明之導電糊所含之化合物(B)之玻璃轉移溫度宜為-10~60℃較佳,10~50℃更佳。若Tg為-10℃以上,能抑制乾燥膜的黏性(stickiness),若進一步為10℃以上,特別是對溫度變化之形狀安定性會增高。又,若Tg為60℃以下,在室溫會展現彎曲性,若進一步為50℃以下,能緩和彎曲時之內部應力,尤其能抑制龜裂發生。
本發明之導電糊所含之化合物(B)之玻璃轉移溫度,可利用微差掃描熱量計(DSC)測定求得,亦可藉由使用共聚合成分之單體之共聚合比率及各單體之均聚物之玻璃轉移溫度,依下式(1)計算。本發明中,針對能計算得出者採用此值,針對包含均聚物之玻璃轉移溫度為非已知者的情形,則依DSC測定結果求取。
在此,Tg為聚合物之玻璃轉移溫度(單位:K)
T1、T2、T3…為單體1、單體2、單體3…之均聚物之玻璃轉移溫度(單位:K)
W1、W2、W3…為單體1、單體2、單體3…之重量基準之共聚合比率。
本發明之導電糊可混合含有一種或二種以上之上述
酸價為30~250mgKOH/g之範圍的化合物(B),又,酸價為30~250mgKOH/g之範圍的化合物(B)以外也可併用酸價小於30mgKOH/g或大於250mgKOH/g的感光性成分。
化合物(B)為具不飽和雙鍵之感光性化合物的情形,由於使用將已塗布於基板上之導電糊進行曝光及顯影之光微影法能更加微細圖案化,故為理想。於此情形,本發明之導電糊宜含有吸收紫外線等短波長的光線而分解並產生自由基之化合物、或發生脫氫反應而產生自由基之光聚合起始劑(D)較佳。作為具體例,可列舉1,2-辛二酮、1-[4-(苯硫基)-2-(O-苯甲醯基肟)]、2,4,6-三甲基苯甲醯基-二苯基-氧化膦、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、乙酮、1-[9-乙基-6-2(2-甲基苯甲醯基)-9H-咔唑-3-基]-1-(O-乙醯基肟)、二苯基酮、鄰苯甲醯基苯甲酸甲酯、4,4'-雙(二甲胺基)二苯基酮、4,4'-雙(二乙胺基)二苯基酮、4,4'-二氯二苯基酮、4-苯甲醯基-4'-甲基二苯基酮、二苄基酮、茀酮、2,2'-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2-羥基-2-甲基苯丙酮、對第三丁基二氯苯乙酮、噻噸酮、2-甲基噻噸酮、2-氯噻噸酮、2-異丙基噻噸酮、二乙基噻噸酮、二苯乙二酮(benzil)、苄基二甲基縮酮、苄基-β-甲氧基乙基縮醛、苯偶因、苯偶因甲醚、苯偶因丁醚、蒽醌、2-第三丁基蒽醌、2-戊基蒽醌、β-氯蒽醌、蒽酮、苯并蒽酮、二苯并環庚酮、亞甲基蒽酮、4-疊氮基苯亞甲基苯乙酮、2,6-雙(對疊氮基亞苄基)環己酮、6-雙(對疊氮基亞苄基)-4-甲基環己
酮、1-苯基-1,2-丁二酮-2-(鄰甲氧基羰基)肟、1-苯基-丙二酮-2-(鄰乙氧基羰基)肟、1-苯基-丙二酮-2-(鄰苯甲醯基)肟、1,3-二苯基-丙三酮-2-(鄰乙氧基羰基)肟、1-苯基-3-乙氧基-丙三酮-2-(鄰苯甲醯基)肟、米其勒酮、2-甲基-[4-(甲硫基)苯基]-2-啉代-1-丙酮、萘磺醯氯、喹啉磺醯氯、N-苯硫基吖啶酮、4,4'-偶氮雙異丁腈、二苯基二硫醚、苯并噻唑二硫醚、三苯基膦、樟腦醌、2,4-二乙基噻噸酮、異丙基噻噸酮、四溴化碳、三溴苯基碸、過氧化苯偶因、以及曙紅(eosin)、亞甲基藍等光還原性色素與抗壞血酸、三乙醇胺等還原劑的組合等,但並不特別限定於此等。
光聚合起始劑(D)之添加量,相對於酸價為30~250mgKOH/g之範圍內化合物(B)100重量份,宜以0.05~30重量份之範圍添加,更佳為5~20重量份。藉由設定光聚合起始劑(D)相對於化合物(B)100重量份之添加量為5重量份以上,尤其能增加曝光部之硬化密度,且能提高顯影後之殘膜率。又,藉由設定光聚合起始劑(D)之添加量相對於化合物(B)100重量份為20重量份以下,尤其能抑制由於光聚合起始劑(D所致之於塗布膜上部的過度吸光,能夠抑制導電圖案成為倒錐形而與基材間之黏著性下降。
本發明之導電糊能在添加光聚合起始劑(D)的同時添加增感劑,以提高感度、或擴大對反應為有效之波長
範圍。
作為增感劑的具體例,可列舉:2,4-二乙基噻噸酮、異丙基噻噸酮、2,3-雙(4-二乙胺基苯亞甲基)環戊酮、2,6-雙(4-二甲胺基苯亞甲基)環己酮、2,6-雙(4-二甲胺基苯亞甲基)-4-甲基環己酮、米其勒酮、4,4-雙(二乙胺基)二苯基酮、4,4-雙(二甲胺基)查酮、4,4-雙(二乙胺基)查酮、對二甲胺基苯亞烯丙基二氫茚酮、對二甲胺基亞苄基二氫茚酮、2-(對二甲胺基苯基伸乙烯基)異萘噻唑、1,3-雙(4-二甲胺基苯基伸乙烯基)異萘噻唑、1,3-雙(4-二甲胺基苯亞甲基)丙酮、1,3-羰基雙(4-二乙胺基苯亞甲基)丙酮、3,3-羰基雙(7-二乙胺基香豆素)、N-苯基-N-乙基乙醇胺、N-苯基乙醇胺、N-甲苯基二乙醇胺、二甲胺基苯甲酸異戊酯、二乙胺基苯甲酸異戊酯、3-苯基-5-苯甲醯硫基四唑、1-苯基-5-乙氧基羰硫基四唑等。於本發明中,可使用1種或2種以上的此等增感劑。當將增感劑添加至本發明的導電糊中時,其添加量相對於酸價為30~250mgKOH/g之範圍內化合物(B)100重量份,通常較佳為0.05~10重量份之範圍內,更佳為0.1~10重量份。藉由將相對於化合物(B)100重量份的添加量設為0.1重量份以上,可易於充分地發揮提昇感光度的效果,藉由將相對於化合物(B)100重量份的添加量設為10重量份以下,尤其可抑制引起在塗布膜上部的過度吸光、導電圖案成為倒錐形、與基材的黏著性下降。
本發明之導電糊所含之導電性填料(C)宜含有Ag、Au、Cu、Pt、Pb、Sn、Ni、Al、W、Mo、氧化釕、Cr、Ti、及銦中之至少1種較佳,該等導電性填料可以單獨、合金、或混合粉末的形式使用。又,也同樣可使用以上述成分覆膜於絕緣性粒子或導電性粒子之表面的導電性粒子。其中從導電性之觀點,Ag、Cu及Au較佳,從成本、安定性之觀點,Ag更佳。
導電性填料(C)之體積平均粒徑宜為0.1~10μm較佳,更佳為0.5~6μm。體積平均粒徑若為0.5μm以上,導電性填料彼此的接觸機率提高,能減低製作的導電圖案之比電阻值、及斷線機率,而且曝光時之紫外線能順利穿透膜,容易微細圖案化。又,若體積平均粒徑為6μm以下,印刷後之電路圖案之表面平滑度、圖案精度、尺寸精度提高。又,體積平均粒徑可藉由庫爾特計數法求取。
作為導電性填料(C)之添加量,相對於導電糊中之總固體成分,宜為70~95重量%之範圍內較佳,更佳為80~90重量%。藉由成為80重量%以上,特別是硬化時之硬化收縮時導電性填料彼此的接觸機率提高,且能減低製作之導電圖案之比電阻值、及斷線機率。又,藉由成為90重量%以下,尤其曝光時之紫外線能順利穿透膜,容易進行微細圖案化。
本發明的導電糊亦可含有溶劑。作為溶劑,可列舉:N,N-二甲基乙醯胺、N,N-二甲基甲醯胺、N-甲基-2-吡咯啶酮、二甲基咪唑烷酮、二甲基亞碸、二乙二醇單乙醚、二乙二醇單乙醚乙酸酯、γ-丁內酯、乳酸乙酯、1-甲氧基-2-丙醇、1-乙氧基-2-丙醇、乙二醇單正丙醚、二丙酮醇、四氫糠醇、丙二醇單甲醚乙酸酯等。溶劑可單獨使用1種、或將2種以上混合使用。溶劑亦可於製作糊劑之後,以調整黏度為目的在之後添加。
本發明之導電糊,只要在不損及其所欲特性之範圍,也可摻合塑化劑、塗平劑、界面活性劑、矽烷偶合劑、消泡劑、顏料等添加劑。
塑化劑之具體例可列舉鄰苯二甲酸二丁酯、鄰苯二甲酸二辛酯、聚乙二醇、甘油等。塗平劑之具體例可列舉特殊乙烯基系聚合物、特殊丙烯酸系聚合物等。
作為矽烷偶合劑,可列舉:甲基三甲氧基矽烷、二甲基二乙氧基矽烷、苯基三乙氧基矽烷、六甲基二矽氮烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷等。
本發明的導電糊係使用分散機、混練機等來製作。此等之具體例,可列舉三輥機、球磨機、行星式球磨機等,但並不限定於此等。
其次針對使用本發明之導電糊之導電圖案之製造方法說明。為了製作導電圖案,將本發明之糊劑塗布於基板上,於導電糊含有溶劑的情形,視需要加熱並使溶劑揮發而乾燥。之後隔著圖案形成用遮罩進行曝光並經過顯影步驟,以在基板上形成所欲圖案。然後,於100℃以上300℃以下的溫度進行硬化而製成導電圖案。
本發明使用之基板,可列舉例如:PET薄膜、聚醯亞胺薄膜、聚酯薄膜、芳香族聚醯胺薄膜、環氧樹脂基板、聚醚醯亞胺樹脂基板、聚醚酮樹脂基板、聚碸系樹脂基板、玻璃基板、矽晶圓、氧化鋁基板、氮化鋁基板、碳化矽基板、裝飾層形成基板、絕緣層形成基板等,但不限定於此等。
作為將本發明的導電糊塗布於基板上的方法,有使用旋轉器的旋轉塗布、噴塗、輥塗、網版印刷、刮刀塗布機、模塗布機、壓延塗布機、彎月形(meniscus)塗布機、棒式塗布機等方法。另外,塗布膜厚根據塗布方法、組成物的固體成分濃度、黏度等而不同,但通常以使乾燥後的膜厚成為0.1μm~50μm的範圍內的方式進行塗布。
其次,於導電糊含有溶劑的情形,視需要從已塗布在基板上的塗布膜去除溶劑。作為去除溶劑之方法,可列舉利用烘箱、加熱板、紅外線等進行加熱乾燥或真空
乾燥等。加熱乾燥宜於50℃至180℃之範圍進行1分鐘至數小時較佳。
視需要而在已去除溶劑後的塗布膜上以光微影法實施圖案加工。作為曝光所使用的光源宜使用水銀燈的i射線(365nm)、h射線(405nm)、g射線(436nm)較理想。
曝光後藉由使用顯影液去除未曝光部可獲得所欲圖案。作為實施鹼顯影時的顯影液,宜為氫氧化四甲基銨、二乙醇胺、二乙胺基乙醇、氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸鉀、三乙胺、二乙胺、甲胺、二甲胺、乙酸二甲胺基乙酯、二甲胺基乙醇、甲基丙烯酸二甲胺基乙酯、環己胺、乙二胺、六亞甲基二胺等化合物的水溶液為較佳。又,依情形而定也可將於該等水溶液添加有1或多種N-甲基-2-吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、γ-丁內酯等極性溶劑、甲醇、乙醇、異丙醇等醇類、乳酸乙酯、丙二醇單甲醚乙酸酯等酯類、環戊酮、環己酮、異丁酮、甲基異丁酮等酮類等者作為顯影液使用。又,也可將於該等鹼水溶液添加有界面活性劑者作為顯影液使用。作為實施有機顯影時的顯影液,可單獨使用N-甲基-2-吡咯啶酮、N-乙醯基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二甲基甲醯胺、二甲基亞碸、六甲基磷酸三醯胺等極性溶劑,或使用將此等極性溶劑與甲醇、乙醇、異丙醇、二甲苯、水、甲基卡必醇、乙基卡必醇等組合而得的混合溶液。
顯影可藉由將基板靜置或邊旋轉基板邊將上述顯影液噴塗於塗布膜面之將基板浸漬於顯影液中、或於浸漬的狀態施以超音波等方法實施。
顯影後,也可實施藉由水之淋洗處理。在此,也可於水中加入乙醇、異丙醇等醇類、乳酸乙酯、丙二醇單甲醚乙酸酯等酯類等並實施淋洗處理。
然後,為了展現導電性,將糊劑組成物膜進行硬化。作為硬化之方法可列舉利用烘箱、鈍性烘箱(inert oven)、加熱板、紅外線等進行加熱乾燥或真空乾燥等。硬化溫度宜為100~300℃之範圍較佳,更佳為120~180℃。藉由設定加熱溫度為120℃以上,能增大樹脂之體積收縮量,減小比電阻率。又,本發明之導電糊由於能在180℃以下之較低溫的硬化獲得高導電性,所以可以與耐熱性低之基板、或低耐熱性的材料併用。以此方式,可經過硬化步驟製成導電圖案。
[實施例]
以下針對本發明之實施例說明,但是本發明不限定於此等實施例。各實施例及比較例使用之材料及評價方法如下。
複合粒子(A)之縱橫比係從SEM或TEM圖像求取100個粒子的縱橫比,作為其平均值。
在PET薄膜上以使乾燥厚度成為10μm的方式塗布導電糊,於90℃之乾燥烘箱進行5分鐘乾燥,將以一定之線與間距(L/S)排列的直線群當作1個單元,隔著具有含L/S之值不同的9種單元的透光圖案的光罩實施曝光、顯影,然後於130℃進行1小時硬化,以獲得導電圖案。各單元之L/S之值定為500/500、250/250、100/100、50/50、40/40、30/30、25/25、20/20、15/15(各代表線寬(μm)/間隔(μm))。以光學顯微鏡觀察圖案,確認圖案間無殘渣且圖案未剝離的帶有最小L/S之值之圖案,將此最小的L/S之值定為可顯影的L/S。
在PET薄膜上以使乾燥厚度成為10μm的方式塗布導電糊,於90℃的乾燥烘箱進行10分鐘乾燥,隔著具有第1圖所示之圖案之透光部A的光罩曝光並顯影,然後於乾燥烘箱進行130℃、1小時硬化,獲得比電阻率測定用導電性圖案。導電性圖案之線寬為0.400mm、線長度為80mm。將獲得之圖案之端部表面以電阻計連接,測定表面電阻值,套入下列計算式而計算比電阻率。又,膜厚之測定係使用觸針式高低差計「SURFCOM(註冊商
標)1400」(商品名、東京精密(股)製)實施。膜厚之測定係隨機於3處測定,以此3點的平均值作為膜厚。測長定為1mm、掃描速度定為0.3mm/s。線寬係以光學顯微鏡隨機於3處觀察圖案,並解析圖像數據,將獲得的3點的平均值作為線寬。
比電阻率=表面電阻值×膜厚×線寬/線長
第2圖係示意性顯示彎曲性試驗所使用之樣本。在縱10mm、橫100mm的長方形的PET薄膜(厚度40μm)上以使乾燥厚度成為10μm的方式塗布導電糊,於90℃的乾燥烘箱進行10分鐘乾燥,並以使透光部成為樣本中央的方式配置具有第1圖所示之圖案之透光部A的光罩,進行曝光並顯影,於乾燥烘箱進行130℃、1小時硬化,形成導電圖案,並使用測試裝置(tester)測定電阻值。之後以使導電圖案交替成為內側、外側的方式彎曲,使樣本短邊B接觸樣本短邊C,並回到原始狀態,重複此彎曲動作100次後,再度以測試裝置測定電阻值。結果電阻值之變化量為20%以下且於導電圖案未出現龜裂、剝離、斷線等者評為○,並非如此者評為×。
於PET薄膜整面濺鍍有ITO的透明導電膜上,以使乾燥厚度成為10μm的方式塗布導電糊,以90℃之乾燥烘箱進行10分鐘乾燥,隔著具有第3圖所示之圖案之透
光部A之光罩進行曝光並顯影,然後於乾燥烘箱進行130℃、1小時硬化,以獲得與ITO間的連接可靠性評價的樣本。導電性圖案之線寬為100μm、線間為5mm,端子部為直徑2mm的圓形。將獲得之樣本之端子部以測試裝置連接,測定初始電阻後,投入85℃、85%RH之恆溫恆濕槽「LU-113」(商品名、ESPEC(股))500小時。之後,將取出的樣本的端子部再度以測試裝置連接,測定電阻值,並使用下式計算電阻變化率,1.3以下者評為○,大於1.3者評為×。
電阻變化率=電阻值(500小時後)/初始電阻值
實施例、比較例使用之材料如下。
‧於無機粒子表面被覆含銻化合物之粒子(A)
ET-300W(商品名、石原產業股份有限公司製,將包含氧化鈦的芯材以摻雜銻之氧化錫被覆的複合粒子、縱橫比1.1、體積平均粒徑0.03~0.06μm)
ET-500W(商品名、石原產業股份有限公司製,將包含氧化鈦的芯材以摻雜銻之氧化錫被覆的複合粒子、縱橫比1.1、體積平均粒徑0.2~0.3μm)
FT-1000(商品名、石原產業股份有限公司製,將包含氧化鈦的芯材以摻雜銻之氧化錫被覆的複合粒子、縱橫比12.9、體積平均粒徑0.18μm)
PASSTRAN(註冊商標)4410(商品名、三井金屬礦業股份有限公司製,將包含硫酸鋇之芯材以摻雜銻之氧化
錫被覆的複合粒子、縱橫比1.2、體積平均粒徑0.1μm)
‧酸價為30~250mgKOH/g之範圍內之化合物(B)
KAYARAD(註冊商標)ASP-010(商品名、日本化藥股份有限公司製,不具不飽和雙鍵之丙烯酸系共聚合物、酸價46mgKOH/g、玻璃轉移溫度60℃(以DSC測定))
Curalite(註冊商標)2300(商品名、Perstorp公司製、聚酯系樹脂、酸價229mgKOH/g、玻璃轉移溫度45℃(DSC測定))
(合成例1)酸價為30~250mgKOH/g之範圍內之化合物B-1
於丙烯酸乙酯(EA)/甲基丙烯酸2-乙基己酯(2-EHMA)/苯乙烯(St)/丙烯酸(AA)之共聚物(共聚合比率:20重量份/40重量份/20重量份/15重量份)使甲基丙烯酸環氧丙酯(GMA)5重量份進行加成反應而得者
於氮氣環境之反應容器中裝入二乙二醇單乙醚乙酸酯150g,使用油浴升溫到80℃。於其中費時1小時滴加包含丙烯酸乙酯20g、甲基丙烯酸2-乙基己酯40g、苯乙烯20g、丙烯酸15g、2,2’-偶氮雙異丁腈0.8g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後,再進行6小時聚合反應。之後,添加氫醌單甲醚1g,停止聚合反應。然後,費時0.5小時滴加包含甲基丙烯酸環氧丙酯5g、三乙基苄基氯化銨1g及二乙二醇單乙醚乙酸酯10g
的混合物。滴加結束後再進行2小時加成反應。將獲得之反應溶液以甲醇精製以去除未反應雜質,再進行24小時真空乾燥,以獲得化合物B-1。獲得之化合物B-1之酸價為103mgKOH/g,依照式(1)求得之玻璃轉移溫度為21.7℃。
(合成例2)酸價為30~250mgKOH/g之範圍之化合物B-2
於環氧乙烷改性雙酚A二丙烯酸酯FA-324A(製品名、日立化成工業股份有限公司製)/EA/AA之共聚物(共聚合比率:50重量份/10重量份/15重量份)使甲基丙烯酸環氧丙酯(GMA)5重量份進行加成反應而得者
於氮氣環境之反應容器中加入二乙二醇單乙醚乙酸酯150g,使用油浴升溫到80℃。於其中費時1小時滴加包含環氧乙烷改性雙酚A二丙烯酸酯FA-324A 50g、丙烯酸乙酯20g、丙烯酸15g、2,2’-偶氮雙異丁腈0.8g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後再進行6小時聚合反應。之後,添加氫醌單甲醚1g,停止聚合反應。然後,費時0.5小時滴加包含甲基丙烯酸環氧丙酯5g、三乙基苄基氯化銨1g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後,再進行2小時加成反應。將獲得之反應溶液以甲醇精製,以去除未反應雜質,再進行24小時真空乾燥,獲得化合物B-2。獲得之化合物B-2之酸價為96mgKOH/g,依照式(1)求得之玻璃轉移溫
度為19.9℃。
(合成例3)於環氧酯3000A(共榮社化學(股)製、分子量:476.7、具有雙酚A骨架)/甲基丙烯酸2-乙基己酯(2-EHMA)/苯乙烯(St)/丙烯酸(AA)之共聚物(共聚合比率:20重量份/40重量份/20重量份/15重量份)使甲基丙烯酸環氧丙酯(GMA)5重量份進行加成反應而得者
於氮氣環境之反應容器中裝入二乙二醇單乙醚乙酸酯150g,使用油浴升溫到80℃。於其中費時1小時滴加包含環氧酯3000A20g、甲基丙烯酸2-乙基己酯40g、苯乙烯20g、丙烯酸15g、2,2’-偶氮雙異丁腈0.8g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後再進行6小時聚合反應。之後添加氫醌單甲醚1g,停止聚合反應。然後費時0.5小時滴加包含甲基丙烯酸環氧丙酯5g、三乙基苄基氯化銨1g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後再進行2小時加成反應。將獲得之反應溶液以甲醇精製,以去除未反應雜質,再進行24小時真空乾燥,獲得化合物B-3。獲得之化合物B-3之酸價為98mgKOH/g、由DSC測定所得的玻璃轉移溫度為43.2℃。
(合成例4)於環氧酯70PA(共榮社化學(股)製、分子量:332.4、脂肪鏈型環氧丙烯酸酯)/甲基丙烯酸2-乙基己酯(2-EHMA)/苯乙烯(St)/丙烯酸(AA)之共聚物(共聚合比率:20重量份/40重量份/20重量份/15重量份)將甲基
丙烯酸環氧丙酯(GMA)5重量份進行加成反應而得者
於氮氣環境之反應容器中裝入二乙二醇單乙醚乙酸酯150g,使用油浴升溫到80℃。於其中費時1小時滴加包含環氧酯70PA20g、甲基丙烯酸2-乙基己酯40g、苯乙烯20g、丙烯酸15g、2,2’-偶氮雙異丁腈0.8g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後再進行6小時聚合反應。之後添加氫醌單甲醚1g,停止聚合反應。然後,費時0.5小時滴加包含甲基丙烯酸環氧丙酯5g、三乙基苄基氯化銨1g及二乙二醇單乙醚乙酸酯10g的混合物。滴加結束後再進行2小時加成反應。將獲得之反應溶液以甲醇精製以去除未反應雜質,再進行24小時真空乾燥,獲得化合物B-4。獲得之化合物B-4之酸價為96mgKOH/g,由DSC測定所得之玻璃轉移溫度為23.5℃。
(合成例5)於反應容器加入環氧酯3000A(共榮社化學(股)製、分子量:476.7、具有雙酚A骨架)200g、作為反應用溶劑之二乙二醇單乙醚乙酸酯500g、作為熱聚合抑制劑之2-甲基氫醌0.5g、作為具有羧基之二醇化合物的二羥基丙酸(分子量:106.1)75g,升溫到45℃。於此溶液加入六亞甲基二異氰酸酯(分子量:168.2)84.1g,以不使反應溫度超過50℃的方式緩慢滴加。滴加結束後,升溫到80℃,進行6小時反應直到紅外線吸收光譜測定法之2250cm-1附近之吸收消失。於此溶液添加甲基丙烯酸環氧丙酯(分子量:142.2)165g後,升溫到95℃並使其
反應6小時,以獲得化合物B-5。獲得之化合物B-5之51.2重量%之樹脂溶液。獲得之化合物B-5之酸價為89mgKOH/g、由DSC測定所得之玻璃轉移溫度為27.2℃。
使用表1記載之材料、體積平均粒徑者。又,體積平均粒徑依照以下方法求得。
IRGACURE(註冊商標)369(商品名、CIBA JAPAN股份有限公司製)
利用HORIBA公司製動態光散射式粒度分布計,測定導電性填料(C)之體積平均粒徑。
‧單體:LIGHT ACRYLATE BP-4EA(共榮社化學股份有限公司製)
‧溶劑:二乙二醇單乙醚乙酸酯(東京化成工業股份有限公司製)
‧不含無機粒子之含銻化合物及導電性氧化錫粒子
SN-100P(商品名、石原產業股份有限公司製)
FS-10P(商品名、石原產業股份有限公司製)
T-1(商品名、三菱材料電子化成股份有限公司製)
於100mL的乾淨瓶中放入10.0g的化合物B-1、光聚合起始劑IRGACURE(註冊商標)369(CIBA JAPAN股份有限公司製)0.50g、二乙二醇單乙醚乙酸酯5.0g,以「除泡練太郎」(註冊商標;商品名、ARE-310、THINKY股份有限公司製)混合,獲得樹脂溶液15.5g(固體成分67.7重量%)。
將獲得之樹脂溶液10.7g與平均粒徑2μm之Ag粒子50.0g、ET-300W(石原產業股份有限公司製)0.87g混合,並使用三輥機「EXAKT M-50」(商品名、EXAKT公司製)混練,獲得61.6g的導電糊。
將獲得的糊劑以網版印刷塗布在膜厚100μm的PET薄膜上,以乾燥烘箱於90℃、10分鐘之條件進行乾燥。之後,使用曝光裝置「PEM-6M」(商品名、UNION OPTICAL股份有限公司製)以曝光量200mJ/cm2(波長365nm換算)進行全光線曝光,以0.25%Na2CO3溶液進行50秒浸漬顯影,並以超純水淋洗後,於乾燥烘箱進行140℃、30分鐘硬化。經圖案加工之導電圖案之膜厚為10μm。以光學顯微鏡確認導電圖案之線與間距(L/S)圖案時,確認L/S至20/20μm為止能無圖案間殘渣、圖案剝離而良好地進行圖案加工。並且,測定導電圖案之比電阻率,結果為6.7×10-5Ωcm。又,關於彎曲性,也得到於試驗後不產生龜裂或斷線等之良好結果。與ITO間的連接可靠性評價的初始電阻為38.4Ω,於85℃85%RH環境
下經過500小時後之電阻為39.4Ω,變化率為1.03。
以與實施例1同樣的方法製造表1所示組成之導電糊,評價結果如表2。
以與實施例1同樣的方法製造表1所示組成之導電糊,評價結果如表2。
實施例1~11之導電糊均為圖案化性、連接可靠性優異者,但比較例1~3之導電糊均為即使於線/間距為500μm/500μm之圖案也發生殘渣,圖案化性差且電阻變化率高、連接可靠性差者。
A‧‧‧透光部
Claims (9)
- 一種導電糊,其特徵為包含:以含銻化合物被覆包含無機材料之芯材表面而成之複合粒子(A)、酸價為30~250mgKOH/g之範圍的化合物(B)、導電性填料(C),該複合粒子(A)之芯材係包含選自由氧化鈦、硫酸鋇構成的群組中之金屬化合物,該含銻化合物係摻雜銻之氧化錫,導電性填料(C)係以單獨、合金、或混合粉末的形式包含Ag、Au、Cu、Pt、Pb、Sn、Ni、Al、W、Mo、氧化釕、Cr、Ti、及銦中之至少1種,作為導電性填料(C)之添加量,係相對於導電糊中之總固體成分為70~95重量%之範圍內。
- 如申請專利範圍第1項之導電糊,其中該化合物(B)具有不飽和雙鍵。
- 如申請專利範圍第1項之導電糊,其包含光聚合起始劑(D)。
- 如申請專利範圍第1項之導電糊,其中該複合粒子(A)之縱橫比為1.5~50。
- 如申請專利範圍第1項之導電糊,其中該複合粒子(A)之縱橫比為10~50。
- 如申請專利範圍第1項之導電糊,其包含該複合粒子(A)0.5~2重量%及導電性填料(C)70~90重量%。
- 如申請專利範圍第1至6項中任一項之導電糊,其中該化合物(B)之玻璃轉移溫度為-10~60℃之範圍內。
- 一種導電圖案之製造方法,其特徵為;於基板上塗布如申請專利範圍第1至7項中任一項之導電糊,進行 曝光並顯影後,於100℃以上300℃以下之溫度進行硬化。
- 一種觸控面板,其特徵為具備:如申請專利範圍第8項之導電圖案、以及與ITO接觸的周圍線路。
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JP6150021B2 (ja) | 2015-04-21 | 2017-06-21 | 東レ株式会社 | 導電パターン形成部材の製造方法 |
KR102370118B1 (ko) * | 2015-07-10 | 2022-03-04 | 도레이 카부시키가이샤 | 도전 페이스트, 터치 센서 부재 및 도전 패턴의 제조 방법 |
CN107624174B (zh) * | 2016-09-26 | 2020-11-24 | 深圳市柔宇科技有限公司 | 触摸传感器及其制作方法 |
CN106971789A (zh) * | 2017-03-18 | 2017-07-21 | 苏州思创源博电子科技有限公司 | 一种透明金属导电薄膜的制备方法 |
JP6860200B2 (ja) * | 2017-03-27 | 2021-04-14 | オート化学工業株式会社 | 硬化性組成物 |
CN107623765B (zh) * | 2017-08-21 | 2020-10-23 | 东莞华晶粉末冶金有限公司 | 一种具有无线充电功能的电子产品陶瓷后盖及制造方法 |
JP7418944B2 (ja) * | 2017-09-11 | 2024-01-22 | 日東電工株式会社 | 導電性組成物および生体センサ |
CN108503355B (zh) * | 2018-04-18 | 2020-08-04 | 昆山卡德姆新材料科技有限公司 | 一种3d打印用料、其制备方法和用途 |
JP6662491B1 (ja) * | 2018-04-19 | 2020-03-11 | 東レ株式会社 | 感光性導電ペーストおよびそれを用いたパターン形成グリーンシートの製造方法 |
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DE102019114806A1 (de) * | 2019-06-03 | 2020-12-03 | Value & Intellectual Properties Management Gmbh | Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0267535B1 (en) * | 1986-11-11 | 1990-08-08 | Ishihara Sangyo Kaisha, Ltd. | Acicular electroconductive titanium oxide and process for producing same |
TWI233769B (en) * | 1998-11-26 | 2005-06-01 | Kansai Paint Co Ltd | Method of forming conductive pattern |
US7157507B2 (en) * | 1999-04-14 | 2007-01-02 | Allied Photochemical, Inc. | Ultraviolet curable silver composition and related method |
TW583503B (en) * | 2000-12-01 | 2004-04-11 | Kansai Paint Co Ltd | Method of forming conductive pattern |
JP2002323756A (ja) * | 2001-04-25 | 2002-11-08 | Kansai Paint Co Ltd | ネガ型感エネルギー線性ペースト及びそれを使用したパターン形成方法 |
US20030151028A1 (en) * | 2002-02-14 | 2003-08-14 | Lawrence Daniel P. | Conductive flexographic and gravure ink |
JP4290918B2 (ja) * | 2002-02-15 | 2009-07-08 | 太陽インキ製造株式会社 | 光硬化性組成物及びそれを用いて黒色パターンを形成したプラズマディスプレイパネル |
JP2004031203A (ja) * | 2002-06-27 | 2004-01-29 | Shin Etsu Polymer Co Ltd | 導電接点素子及び電気コネクタ |
JP2005171024A (ja) * | 2003-12-09 | 2005-06-30 | Kansai Paint Co Ltd | 白色導電性プライマー塗料 |
JP2006143809A (ja) * | 2004-11-17 | 2006-06-08 | Kansai Paint Co Ltd | 水性塗料及び塗膜形成方法 |
JP4983150B2 (ja) * | 2006-04-28 | 2012-07-25 | 東洋インキScホールディングス株式会社 | 導電性被膜の製造方法 |
US7678296B2 (en) * | 2006-05-04 | 2010-03-16 | E. I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
JP5272349B2 (ja) * | 2007-02-26 | 2013-08-28 | 東レ株式会社 | 電子放出源用ペースト及び電子放出素子 |
CN100552859C (zh) * | 2007-12-26 | 2009-10-21 | 彩虹集团公司 | 一种感光性导电浆料的制备方法 |
JP5169501B2 (ja) * | 2008-06-03 | 2013-03-27 | 藤倉化成株式会社 | 電極用導電性ペーストおよび透明タッチパネル |
JP5515466B2 (ja) * | 2008-07-10 | 2014-06-11 | 東レ株式会社 | 電子放出源用ペーストおよびこれを用いた電子放出源ならびに電子放出素子 |
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2013
- 2013-01-10 KR KR20147019643A patent/KR20140115316A/ko not_active Application Discontinuation
- 2013-01-10 US US14/372,566 patent/US20140360763A1/en not_active Abandoned
- 2013-01-10 JP JP2013509328A patent/JP5967079B2/ja not_active Expired - Fee Related
- 2013-01-10 WO PCT/JP2013/050250 patent/WO2013108696A1/ja active Application Filing
- 2013-01-10 CN CN201380005985.0A patent/CN104040640B/zh not_active Expired - Fee Related
- 2013-01-18 TW TW102101885A patent/TWI597740B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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JPWO2013108696A1 (ja) | 2015-05-11 |
KR20140115316A (ko) | 2014-09-30 |
CN104040640B (zh) | 2017-03-29 |
JP5967079B2 (ja) | 2016-08-10 |
TW201340123A (zh) | 2013-10-01 |
CN104040640A (zh) | 2014-09-10 |
US20140360763A1 (en) | 2014-12-11 |
WO2013108696A1 (ja) | 2013-07-25 |
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