TWI596343B - Electrical test socket and method of manufacturing onductive particles for electric test socket ??????????????????????????????????????????? - Google Patents

Electrical test socket and method of manufacturing onductive particles for electric test socket ??????????????????????????????????????????? Download PDF

Info

Publication number
TWI596343B
TWI596343B TW104143251A TW104143251A TWI596343B TW I596343 B TWI596343 B TW I596343B TW 104143251 A TW104143251 A TW 104143251A TW 104143251 A TW104143251 A TW 104143251A TW I596343 B TWI596343 B TW I596343B
Authority
TW
Taiwan
Prior art keywords
conductive
particles
test socket
electrical test
core
Prior art date
Application number
TW104143251A
Other languages
Chinese (zh)
Other versions
TW201636617A (en
Inventor
鄭永倍
Original Assignee
Isc股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isc股份有限公司 filed Critical Isc股份有限公司
Publication of TW201636617A publication Critical patent/TW201636617A/en
Application granted granted Critical
Publication of TWI596343B publication Critical patent/TWI596343B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

電測試插座以及用於電測試插座的導電粒子的 Electrical test socket and conductive particles for electrical test socket

本發明是有關於一種電測試插座(electric test socket)以及一種用於電測試插座的導電粒子(conductive particle)的製造方法,且更特定言之,是有關於一種即使在高溫條件下亦維持電特性而不劣化的電測試插座以及一種用於電測試插座的導電粒子的製造方法。 The present invention relates to an electric test socket and a method of manufacturing a conductive particle for an electrical test socket, and more particularly to maintaining electrical power even under high temperature conditions. An electrical test socket that does not deteriorate in characteristics and a method of manufacturing conductive particles for an electrical test socket.

一般而言,在檢驗裝置的電特性時,應在裝置與檢驗設備(inspection apparatus)之間進行穩定的電連接。為此目的,通常使用電測試插座將檢驗設備連接至待檢驗的裝置。 In general, when testing the electrical characteristics of the device, a stable electrical connection should be made between the device and the inspection apparatus. For this purpose, an electrical test socket is typically used to connect the inspection device to the device to be inspected.

電測試插座將裝置的端子連接至檢驗設備的襯墊以允許電信號在裝置與檢驗設備之間的雙向傳輸。為此,彈性導電片(elastic conductive sheet)或彈簧式頂針(pogo pin)可包含於電測試插座中作為接觸構件。此彈性導電片包含用於與待檢驗裝置的端子連接的彈性導電部分(conductive part),且彈簧式頂針包 含內部彈簧以便將檢驗設備平滑地連接至待檢驗裝置且減少在連接動作期間機械衝擊的影響。因此,大多數電測試插座使用此等彈性導電片或彈簧式頂針。 An electrical test socket connects the terminals of the device to the pads of the inspection device to allow for bidirectional transmission of electrical signals between the device and the inspection device. To this end, an elastic conductive sheet or a pogo pin may be included in the electrical test socket as a contact member. The elastic conductive sheet comprises an elastic conductive part for connection to a terminal of the device to be inspected, and the spring type thimble package An internal spring is included to smoothly connect the inspection apparatus to the device to be inspected and to reduce the effects of mechanical shock during the joining action. Therefore, most electrical test sockets use such resilient conductive sheets or spring-loaded thimbles.

電測試插座1作為此等電測試插座的實例而說明於圖1中。電測試插座1包含:導電部分8,形成於與半導體裝置2的球狀柵格陣列(ball grid array,BGA)類型端子4接觸的區域中;絕緣矽酮部分6,形成於不與半導體裝置2的端子4接觸的區域中且用作絕緣層。導電部分8是藉由將許多導電粒子8a密集地佈置在矽酮橡膠中而形成。在使用中時,電測試插座1安裝在包含多個襯墊10的檢驗設備9上。詳言之,電測試插座1以如下方式安裝在檢驗設備9上:電測試插座1的導電部分8分別與檢驗設備9的襯墊10接觸。 The electrical test socket 1 is illustrated in Figure 1 as an example of such an electrical test socket. The electrical test socket 1 includes: a conductive portion 8 formed in a region in contact with a ball grid array (BGA) type terminal 4 of the semiconductor device 2; and an insulating fluorenone portion 6 formed not in the semiconductor device 2 The terminal 4 is in contact with the area and serves as an insulating layer. The conductive portion 8 is formed by densely arranging a plurality of conductive particles 8a in the fluorenone rubber. In use, the electrical test socket 1 is mounted on an inspection device 9 comprising a plurality of pads 10. In detail, the electrical test socket 1 is mounted on the inspection device 9 in such a way that the conductive portion 8 of the electrical test socket 1 is in contact with the gasket 10 of the inspection device 9, respectively.

在電測試插座1用於檢驗時,降低待檢驗的半導體裝置2以使半導體裝置2的端子4與導電部分8接觸。接著,進一步降低半導體裝置2以在導電部分8的厚度方向上壓縮導電部分8,且因此使導電部分8的導電粒子8a彼此接觸。若使導電粒子8a如上文所描述而彼此接觸,則導電部分8充當電導體。在此狀態中,若檢驗設備9產生電信號,則所述電信號經由導電部分8傳輸至半導體裝置2,且因此可執行電測試。 When the electrical test socket 1 is used for inspection, the semiconductor device 2 to be inspected is lowered to bring the terminal 4 of the semiconductor device 2 into contact with the conductive portion 8. Next, the semiconductor device 2 is further lowered to compress the conductive portion 8 in the thickness direction of the conductive portion 8, and thus the conductive particles 8a of the conductive portion 8 are brought into contact with each other. If the conductive particles 8a are brought into contact with each other as described above, the conductive portion 8 serves as an electrical conductor. In this state, if the inspection device 9 generates an electrical signal, the electrical signal is transmitted to the semiconductor device 2 via the conductive portion 8, and thus an electrical test can be performed.

通常在室溫下執行此些測試。然而,可在高溫條件下執行一些測試,因為包含半導體裝置的產品可用於極端環境中。一般而言,高溫條件下的測試稱為預燒測試(burn-in test)。然而,預燒測試具有電特性歸因於材料性質而劣化的問題。電特性劣化 的原因之一為導電部分的導電粒子之間的距離的增大(由導電部分的矽酮橡膠在高溫下的膨脹而引起)。 These tests are usually performed at room temperature. However, some tests can be performed under high temperature conditions because products containing semiconductor devices can be used in extreme environments. In general, the test under high temperature conditions is called a burn-in test. However, the burn-in test has a problem that electrical characteristics are deteriorated due to material properties. Electrical characteristic degradation One of the reasons is an increase in the distance between the conductive particles of the conductive portion (caused by the expansion of the conductive portion of the fluorenone rubber at a high temperature).

詳言之,若矽酮橡膠由於熱而膨脹,則存在於導電粒子當中的矽酮橡膠向上以及向下(或向左以及向右)推動導電粒子,且因此導電粒子之間的距離增大。若導電粒子之間的距離如上文所描述而增大,則難以藉由按壓導電粒子而使導電粒子彼此接觸,且導電部分的電阻亦增大。舉例而言,如圖3A中所示的在室溫下彼此接觸的導電粒子在高溫條件下在垂直方向上彼此隔開距離(a)且在水平方向上彼此隔開距離(b),如圖3B中所示。也就是說,導電粒子彼此隔開特定距離。若導電粒子如上文所描述彼此隔開,則可能會出現諸如總電阻增大以及電特性劣化之問題。 In particular, if the fluorenone rubber expands due to heat, the fluorenone rubber present in the conductive particles pushes the conductive particles upward and downward (or left and right), and thus the distance between the conductive particles increases. If the distance between the conductive particles increases as described above, it is difficult to bring the conductive particles into contact with each other by pressing the conductive particles, and the electric resistance of the conductive portion also increases. For example, the conductive particles that are in contact with each other at room temperature as shown in FIG. 3A are separated from each other by a distance (a) in the vertical direction under high temperature conditions and separated from each other by a distance (b) in the horizontal direction, as shown in FIG. Shown in 3B. That is, the conductive particles are separated from each other by a certain distance. If the conductive particles are separated from each other as described above, problems such as an increase in total resistance and deterioration in electrical characteristics may occur.

提供本發明以解決上述問題。詳言之,本發明的目標為提供一種電阻即使在高溫條件下亦不增大且電特性即使在高溫條件下亦不改變或不顯著劣化的電測試插座。 The present invention is provided to solve the above problems. In particular, it is an object of the present invention to provide an electrical test socket in which the resistance does not increase even under high temperature conditions and the electrical characteristics do not change or significantly deteriorate even under high temperature conditions.

此外,為解決上述問題,本發明的目標為提供一種用於電測試插座的導電粒子的製造方法,所述導電粒子的電阻即使在高溫條件下亦不增大且電特性即使在高溫條件下亦不改變或不顯著劣化。 Further, in order to solve the above problems, an object of the present invention is to provide a method for producing conductive particles for an electrical test socket, wherein the electric resistance of the conductive particles does not increase even under high temperature conditions and the electrical characteristics are even under high temperature conditions. No change or no significant deterioration.

額外態樣將部分地在以下描述中得到闡述,並且部分地將自描述中顯而易見,或可藉由實踐所呈現實施例來獲悉。 Additional aspects will be set forth in part in the description which follows, and in part,

為達成上述目的,本發明提供一種電測試插座,所述電 測試插座佈置在檢驗設備的襯墊與待檢驗的目標裝置的端子之間,以便電連接所述襯墊與端子,所述電測試插座包含:多個導電部分,其藉由在絕緣彈性材料中在對應於所述目標裝置的所述端子的位置處在所述絕緣彈性材料的厚度方向上佈置多個導電粒子而形成;以及絕緣支撐件(insulative support),其支撐所述導電部分且使所述導電部分絕緣,其中所述導電粒子中的每一者包含導電芯以及附接至所述導電芯的表面作為所述導電芯的部分且自所述導電芯的所述表面徑向延伸的導電突起,且在所述導電粒子佈置於所述絕緣彈性材料中時,相鄰導電芯的所述導電突起彼此纏結。 To achieve the above object, the present invention provides an electrical test socket, the electric The test socket is disposed between the gasket of the inspection device and the terminal of the target device to be inspected to electrically connect the gasket and the terminal, the electrical test socket comprising: a plurality of conductive portions by being in an insulating elastic material Forming a plurality of conductive particles in a thickness direction of the insulating elastic material at a position corresponding to the terminal of the target device; and an insulating support supporting the conductive portion and causing The electrically conductive portion is insulated, wherein each of the electrically conductive particles comprises a conductive core and a surface attached to the surface of the electrically conductive core as a portion of the electrically conductive core and electrically conductive extending radially from the surface of the electrically conductive core Protrusions, and when the conductive particles are disposed in the insulating elastic material, the conductive protrusions of adjacent conductive cores are entangled with each other.

所述導電突起可具有彈性。 The conductive protrusions may have elasticity.

所述導電突起可包含碳奈米管。 The conductive protrusions may comprise a carbon nanotube.

所述導電突起可在其表面上包含金塗層或銀塗層。 The conductive protrusion may comprise a gold coating or a silver coating on its surface.

所述導電突起可塗佈有奈米粒子。 The conductive protrusions may be coated with nano particles.

所述導電突起可具有直線形狀。 The conductive protrusions may have a linear shape.

為達成上述目的,本發明提供一種用於電測試插座的導電粒子的製造方法,所述方法包含以下步驟:(a)製備導電芯;(b)在所述導電芯的表面上形成絕緣層;(c)將催化劑粒子塗覆至所述絕緣層;以及(d)藉由熱化學氣相沈積方法在所述催化劑粒子上生長導電突起。 In order to achieve the above object, the present invention provides a method for producing conductive particles for an electrical test socket, the method comprising the steps of: (a) preparing a conductive core; (b) forming an insulating layer on a surface of the conductive core; (c) applying catalyst particles to the insulating layer; and (d) growing conductive protrusions on the catalyst particles by a thermal chemical vapor deposition method.

所述步驟(a)可包含在所述導電芯的表面上形成金塗層或銀塗層。 The step (a) may comprise forming a gold coating or a silver coating on the surface of the conductive core.

所述絕緣層可包含氧化鋁(Al2O3)。 The insulating layer may comprise aluminum oxide (Al 2 O 3 ).

所述催化劑粒子可包含鐵、鈷、鎳或其合金。 The catalyst particles may comprise iron, cobalt, nickel or alloys thereof.

在步驟(d)之後,所述方法可進一步包括以下步驟:(e)在所述導電突起的表面上形成金塗層或銀塗層。 After the step (d), the method may further comprise the step of: (e) forming a gold coating or a silver coating on the surface of the conductive protrusion.

為達成上述目的,本發明提供一種用於電測試插座的導電粒子的製造方法,所述方法包含以下步驟:(a)製備導電芯;(b)在於所導電芯的表面上形成絕緣層的同時,將催化劑粒子塗覆至所述導電芯;以及(c)藉由熱化學氣相沈積方法在所述催化劑粒子上生長導電突起。 In order to achieve the above object, the present invention provides a method for producing conductive particles for an electrical test socket, the method comprising the steps of: (a) preparing a conductive core; (b) simultaneously forming an insulating layer on a surface of the conductive core Applying catalyst particles to the conductive core; and (c) growing conductive protrusions on the catalyst particles by a thermal chemical vapor deposition method.

為達成上述目的,本發明提供一種用於電測試插座的導電粒子的製造方法,所述方法包含以下步驟:(a)製備導電芯;(b)將催化劑粒子塗覆至所述導電芯;以及(c)藉由熱化學氣相沈積方法在所述催化劑粒子上生長導電突起。 To achieve the above object, the present invention provides a method of producing conductive particles for an electrical test socket, the method comprising the steps of: (a) preparing a conductive core; (b) applying catalyst particles to the conductive core; (c) growing conductive protrusions on the catalyst particles by a thermal chemical vapor deposition method.

在本發明的電測試插座中,導電粒子的導電突起彼此纏結。因此,即使在高溫條件下,電測試插座的電特性亦可能不會劣化,且電測試插座的電阻可能不會增大。 In the electrical test socket of the present invention, the conductive protrusions of the conductive particles are entangled with each other. Therefore, even under high temperature conditions, the electrical characteristics of the electrical test socket may not deteriorate, and the resistance of the electrical test socket may not increase.

1、100‧‧‧電測試插座 1, 100‧‧‧ electrical test socket

2‧‧‧半導體裝置 2‧‧‧Semiconductor device

4、141‧‧‧端子 4, 141‧‧‧ terminals

6‧‧‧絕緣矽酮部分 6‧‧‧Insulating ketones

8、110‧‧‧導電部分 8, 110‧‧‧ conductive parts

8a、111‧‧‧導電粒子 8a, 111‧‧‧ conductive particles

9、150‧‧‧檢驗設備 9, 150‧‧‧ Inspection equipment

10、151‧‧‧襯墊 10, 151‧‧‧ pads

111a‧‧‧導電芯 111a‧‧‧conductive core

111b、111f‧‧‧塗層 111b, 111f‧‧‧ coating

111c‧‧‧絕緣層 111c‧‧‧Insulation

111d‧‧‧催化劑粒子 111d‧‧‧ catalyst particles

111e‧‧‧導電突起 111e‧‧‧Electrical protrusion

120‧‧‧絕緣支撐件 120‧‧‧Insulation support

140‧‧‧目標裝置 140‧‧‧Target device

S100、S200、S300、S400、S500‧‧‧步驟 S100, S200, S300, S400, S500‧‧‧ steps

此等及/或其他態樣自結合附圖進行的實施例的以下描述將變得顯而易見且更易於瞭解,在附圖中:圖1為說明相關技術的電測試插座的視圖。 The following description of the embodiments of the present invention will be apparent from the following description of the accompanying drawings, in which: FIG. 1 is a view illustrating an electrical test socket of the related art.

圖2為說明圖1中描繪的電測試插座的操作的視圖。 2 is a view illustrating the operation of the electrical test socket depicted in FIG. 1.

圖3A以及圖3B為說明圖1中描繪的電測試插座在電測試插座的溫度改變時的視圖。 3A and 3B are views illustrating the electrical test socket depicted in FIG. 1 when the temperature of the electrical test socket changes.

圖4為說明根據本發明的實施例的電測試插座的視圖。 4 is a view illustrating an electrical test socket in accordance with an embodiment of the present invention.

圖5為說明圖4中描繪的電測試插座的操作的視圖。 FIG. 5 is a view illustrating the operation of the electrical test socket depicted in FIG. 4.

圖6A至圖6E為說明圖4中描繪的電測試插座的導電粒子的製造方法的視圖。 6A-6E are views illustrating a method of fabricating conductive particles of the electrical test socket depicted in FIG. 4.

圖7為說明圖6A至圖6E中所描繪的製造方法的流程圖。 FIG. 7 is a flow chart illustrating the manufacturing method depicted in FIGS. 6A-6E.

現將詳細參考實施例,所述實施例的實例在附圖中說明,其中相同參考數字在全文中指代相同元件。就此而言,本發明實施例可具有不同形式且不應被解釋為限於本文中所闡述的描述。因此,下文僅藉由參看諸圖描述實施例以解釋本發明描述的態樣。如本文中所使用,術語「及/或」包含相關聯所列項目中的一或多者中的任一者以及所有組合。 Reference will now be made in detail to the preferred embodiments embodiments In this regard, the embodiments of the invention may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments described herein are merely described by reference to the drawings in the drawings. The term "and/or" as used herein includes any and all of one or more of the associated listed items.

在下文中,將參考附圖詳細地描述根據本發明的實施例的電測試插座100。 Hereinafter, an electrical test socket 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

本發明的電測試插座100可佈置於待檢驗裝置的端子與檢驗設備的襯墊之間以便電連接所述端子與襯墊。電測試插座100包含導電部分110以及絕緣支撐件120。 The electrical test socket 100 of the present invention can be disposed between the terminals of the device to be inspected and the pads of the inspection device to electrically connect the terminals to the pads. The electrical test socket 100 includes a conductive portion 110 and an insulating support 120.

導電部分110是藉由在絕緣彈性材料中在絕緣彈性材料的厚度方向上佈置多個導電粒子111而形成於對應於待檢驗的目標裝置140的端子141的位置處。導電粒子111具有磁性且密集地佈置在導電部分110的厚度方向上。 The conductive portion 110 is formed at a position corresponding to the terminal 141 of the target device 140 to be inspected by arranging a plurality of conductive particles 111 in the thickness direction of the insulating elastic material in the insulating elastic material. The conductive particles 111 are magnetically and densely arranged in the thickness direction of the conductive portion 110.

較佳地,形成導電部分110的絕緣彈性材料可為具有交 聯結構的耐熱聚合物質。各種可固化聚合物形成材料可用以獲得此種交聯聚合物質。可固化聚合物形成材料的特定實例包含:矽酮橡膠(silicone rubber);共軛二烯橡膠(conjugated diene rubber),諸如聚丁二烯橡膠(polybutadiene rubber)、天然橡膠(natural rubber)、聚異戊二烯橡膠(polyisoprene rubber)、苯乙烯-丁二烯共聚物橡膠(styrene-butadiene copolymer rubber)以及丙烯腈-丁二烯共聚物橡膠(acrylonitrile-butadiene copolymer rubber),以及其氫化產物;嵌段共聚物橡膠(block copolymer rubber),諸如苯乙烯-丁二烯-二烯嵌段共聚物橡膠(styrene-butadiene-diene block copolymer rubber)以及苯乙烯-異戊二烯嵌段共聚物(styrene-isoprene block copolymer),以及其氫化產物;以及氯丁二烯(chloroprene)、胺基甲酸酯橡膠(urethane rubber)、聚酯橡膠(polyester rubber)、表氯醇橡膠(epichlorohydrin rubber)、乙烯-丙烯共聚物橡膠(ethylene-propylene copolymer rubber)、乙烯-丙烯-二烯共聚物橡膠(ethylene-propylene-diene copolymer rubber)以及軟液態環氧樹脂橡膠(soft liquid epoxy rubber)。 Preferably, the insulating elastic material forming the conductive portion 110 may have a cross Joint structure of heat resistant polymer. Various curable polymer forming materials can be used to obtain such crosslinked polymeric materials. Specific examples of the curable polymer-forming material include: silicone rubber; conjugated diene rubber, such as polybutadiene rubber, natural rubber, polyiso Polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber, and hydrogenated products thereof; Block copolymer rubber, such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer (styrene-isoprene) Block copolymer), and its hydrogenation product; and chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymerization Ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and soft liquid Soft liquid epoxy rubber.

在所列材料當中,在模製以及處理能力以及電性質方面,可較佳地使用矽酮橡膠。 Among the listed materials, an anthrone rubber is preferably used in terms of molding and handling ability as well as electrical properties.

此外,對於電測試插座100用於對晶圓的積體電路執行探測測試或預燒測試的情況,加成固化液態矽酮橡膠的固化產物(在下文中稱為「矽酮橡膠固化產物」)可用作絕緣彈性材料,且在150℃測得的矽酮橡膠固化產物的壓縮永久變形(compression set)可較佳地為10%或小於10%,更佳為8%或小於8%,且甚至更佳為6%或小於6%。若矽酮橡膠固化產物的壓縮永久變形大於10%,則電測試插座100的導電部分110可能會容易在使用電測試插座100許多次或在高溫條件下重複使用之後經受永久性變形。在此情況下,導電部分110的導電粒子111的佈置可能變形,且因此可能難以維持所要的導電性水準。 Further, in the case where the electrical test socket 100 is used to perform a probing test or a burn-in test on the integrated circuit of the wafer, the cured product of the addition-curing liquid fluorenone rubber (hereinafter referred to as "anthrone rubber cured product") may be Used as an insulating elastic material, and the compression set of the cured product of the fluorenone rubber measured at 150 ° C The set) may preferably be 10% or less, more preferably 8% or less, and even more preferably 6% or less. If the compression set of the decidone rubber cured product is greater than 10%, the conductive portion 110 of the electrical test socket 100 may be susceptible to permanent deformation after being used many times by the electrical test socket 100 or after repeated use under high temperature conditions. In this case, the arrangement of the conductive particles 111 of the conductive portion 110 may be deformed, and thus it may be difficult to maintain a desired level of conductivity.

此外,在23℃測得的矽酮橡膠固化產物的硬度計A硬度可較佳地為自10至60,更佳為自15至60,且甚至更佳為自20至60。若矽酮橡膠固化產物的硬度計A硬度小於10,則在按壓導電部分110時,使導電部分110彼此絕緣的絕緣支撐件120可能會過度變形,且因此可能難以維持導電部分110之間的絕緣在所要水準。另一方面,若矽酮橡膠固化產物的硬度計A硬度大於60,則可能需要將大量的力施加至導電部分110以使導電部分110變形至所要範圍。在此情況下,例如,待檢驗的目標物件可能會變形或破裂。 Further, the hardness A hardness of the fluorenone rubber cured product measured at 23 ° C may preferably be from 10 to 60, more preferably from 15 to 60, and even more preferably from 20 to 60. If the hardness A hardness of the fluorenone rubber cured product is less than 10, the insulating support 120 which insulates the conductive portions 110 from each other may be excessively deformed when the conductive portion 110 is pressed, and thus it may be difficult to maintain insulation between the conductive portions 110. At the required level. On the other hand, if the hardness of the fluorenone rubber cured product is greater than 60, it may be necessary to apply a large amount of force to the conductive portion 110 to deform the conductive portion 110 to a desired range. In this case, for example, the target object to be inspected may be deformed or broken.

較佳地,含於電測試插座100的導電部分110中的導電粒子111可具有磁性,且在此情況下,導電粒子111可容易地在形成材料中移動。具有磁性的導電粒子111的實例可包含:諸如鐵、鎳或鈷的磁性金屬的粒子;所述金屬的合金的粒子;含有所述金屬中的任一者的粒子;藉由將此些粒子製備為導電芯111a且用諸如金、銀、鈀或銠的高度導電金屬塗佈導電芯111a而形成的粒子;藉由將非磁性金屬粒子、諸如玻璃珠的無機材料粒子或共聚物粒子製備為導電芯111a,且用諸如鎳或鈷的導電磁性材料塗 佈導電芯111a或用導電磁性材料以及高度導電金屬塗佈導電芯111a而形成的粒子。 Preferably, the conductive particles 111 contained in the conductive portion 110 of the electrical test socket 100 may have magnetic properties, and in this case, the conductive particles 111 may easily move in the forming material. Examples of the magnetic conductive particles 111 may include: particles of a magnetic metal such as iron, nickel or cobalt; particles of an alloy of the metal; particles containing any of the metals; by preparing the particles a particle formed by coating the conductive core 111a with the conductive core 111a and a highly conductive metal such as gold, silver, palladium or iridium; by making non-magnetic metal particles, inorganic material particles or copolymer particles such as glass beads as conductive Core 111a and coated with a conductive magnetic material such as nickel or cobalt The conductive core 111a or the particles formed by coating the conductive core 111a with a conductive magnetic material and a highly conductive metal.

較佳地,可藉由將鎳粒子製備為導電芯111a且用諸如金或銀的高度導電金屬塗佈導電芯111a而形成導電粒子111。 Preferably, the conductive particles 111 can be formed by preparing nickel particles as the conductive core 111a and coating the conductive core 111a with a highly conductive metal such as gold or silver.

用於用導電金屬塗佈導電芯111a的手段不受限制。舉例而言,可使用無電極鍍敷(無電極鍍敷)。 The means for coating the conductive core 111a with a conductive metal is not limited. For example, electrodeless plating (electrodeless plating) can be used.

在藉由用導電金屬塗佈導電芯111a而形成導電粒子111的情況下,用導電金屬塗佈導電芯111a的塗佈比率(也就是說,導電芯111a的表面積與塗佈有導電金屬的區域的比率)可較佳為40%或大於40%,更佳為45%或大於45%,且甚至更佳為47%至90%,以便保證高導電性。 In the case where the conductive particles 111 are formed by coating the conductive core 111a with a conductive metal, the coating ratio of the conductive core 111a is coated with the conductive metal (that is, the surface area of the conductive core 111a and the region coated with the conductive metal) The ratio) may preferably be 40% or more, more preferably 45% or more, and even more preferably 47% to 90% in order to ensure high conductivity.

用於塗佈的導電金屬的量可較佳為導電芯111a的2.5wt%至50wt%,更佳為導電芯111a的3wt%至30wt%,甚至更佳為導電芯111a的3.5wt%至25wt%,且再更佳為導電芯111a的4wt%至20wt%。若導電金屬為金,則用於塗佈的導電金屬的量可較佳為導電芯111a的3wt%至30wt%,更佳為導電芯111a的3.5wt%至25wt%,甚至更佳為導電芯111a的4wt%至20wt%,且再更佳為導電芯111a的4.5wt%至10wt%。此外,若導電金屬為銀,則用於塗佈的導電金屬的量可較佳為導電芯111a的3wt%至30wt%,更佳為導電芯111a的4wt%至25wt%,甚至更佳為導電芯111a的5wt%至23wt%,且再更佳為導電芯111a的6wt%至20wt%。 The amount of the conductive metal used for coating may preferably be from 2.5 wt% to 50 wt% of the conductive core 111a, more preferably from 3 wt% to 30 wt% of the conductive core 111a, even more preferably from 3.5 wt% to 25 wt% of the conductive core 111a %, and more preferably 4% to 20% by weight of the conductive core 111a. If the conductive metal is gold, the amount of the conductive metal used for coating may preferably be 3 wt% to 30 wt% of the conductive core 111a, more preferably 3.5 wt% to 25 wt% of the conductive core 111a, and even more preferably a conductive core. 4 to 20% by weight of 111a, and still more preferably 4.5 to 10% by weight of the conductive core 111a. Further, if the conductive metal is silver, the amount of the conductive metal used for coating may preferably be 3 wt% to 30 wt% of the conductive core 111a, more preferably 4 wt% to 25 wt% of the conductive core 111a, and even more preferably conductive. The core 111a is 5 wt% to 23 wt%, and more preferably 6 wt% to 20 wt% of the conductive core 111a.

此外,導電粒子111的直徑可較佳為1μm至500μm,更 佳為2μm至400μm,甚至更佳為5μm至300μm,且再更佳為10μm至150μm。 Further, the diameter of the conductive particles 111 may preferably be from 1 μm to 500 μm, more It is preferably 2 μm to 400 μm, even more preferably 5 μm to 300 μm, and still more preferably 10 μm to 150 μm.

導電粒子111包含附接為導電芯111a的部分且自導電芯111a的表面徑向延伸的導電突起111e。 The conductive particles 111 include a conductive protrusion 111e attached to a portion of the conductive core 111a and extending radially from the surface of the conductive core 111a.

特定言之,具有直線形狀的多個導電突起111e佈置於導電芯111a中的每一者的表面上。導電突起111e附接至導電芯111a作為導電芯111a的部分,且在導電粒子111佈置在絕緣彈性材料中時,相鄰導電粒子111的導電突起111e彼此纏結可為較佳的。 Specifically, a plurality of conductive protrusions 111e having a linear shape are disposed on the surface of each of the conductive cores 111a. The conductive protrusions 111e are attached to the conductive core 111a as a portion of the conductive core 111a, and when the conductive particles 111 are disposed in the insulating elastic material, the conductive protrusions 111e of the adjacent conductive particles 111 may be entangled with each other.

較佳地,導電突起111e可為彈性碳奈米管。導電突起111e可僅由碳奈米管形成,或可塗佈有金、銀或奈米粒子。 Preferably, the conductive protrusions 111e may be elastic carbon nanotubes. The conductive protrusions 111e may be formed only of carbon nanotubes or may be coated with gold, silver or nano particles.

絕緣支撐件120圍繞導電部分110佈置以支撐導電部分110且使導電部分110彼此絕緣。絕緣支撐件120由絕緣彈性材料形成,而不含或幾乎不含導電粒子111。較佳地,絕緣支撐件120可由與用以形成導電部分110的絕緣彈性材料相同的絕緣彈性材料形成。舉例而言,絕緣支撐件120可由矽酮橡膠形成。然而,絕緣支撐件120不限於此。也就是說,絕緣支撐件120可由選自各種材料的材料形成。 The insulating support 120 is disposed around the conductive portion 110 to support the conductive portions 110 and to insulate the conductive portions 110 from each other. The insulating support 120 is formed of an insulating elastic material and contains no or almost no conductive particles 111. Preferably, the insulating support member 120 may be formed of the same insulating elastic material as the insulating elastic material used to form the conductive portion 110. For example, the insulating support 120 may be formed of an anthrone rubber. However, the insulating support 120 is not limited thereto. That is, the insulating support 120 may be formed of a material selected from various materials.

可藉由下文描述的方法製造電測試插座100的導電粒子111。 The conductive particles 111 of the electrical test socket 100 can be fabricated by the method described below.

首先,如圖6A中所示,製備包含金塗層或銀塗層111b的導電芯111a(S100)。 First, as shown in FIG. 6A, a conductive core 111a (S100) containing a gold coating or a silver coating 111b is prepared.

接下來,如圖6B中所示,在導電芯111a上形成絕緣層111c(S200)。絕緣層111c防止導電芯111a與催化劑粒子111d之 間的反應,且因此防止形成矽化物層。較佳地,絕緣層111c可由氧化鋁(Al2O3)形成。然而,絕緣層111c不限於此。舉例而言,絕緣層111c可為氧化矽層。 Next, as shown in FIG. 6B, an insulating layer 111c is formed on the conductive core 111a (S200). The insulating layer 111c prevents the reaction between the conductive core 111a and the catalyst particles 111d, and thus prevents the formation of the vaporized layer. Preferably, the insulating layer 111c may be formed of aluminum oxide (Al 2 O 3 ). However, the insulating layer 111c is not limited thereto. For example, the insulating layer 111c may be a ruthenium oxide layer.

接下來,如圖6C中所示,將催化劑粒子111d塗覆至絕緣層111c(S300)。催化劑粒子111d可為鈷、鎳、鐵或其合金(諸如鈷-鎳、鈷-鐵,或鎳-鐵合金)的粒子。可藉由熱沈積方法(thermal deposition method)、電子束沈積方法(electron beam deposition method)、濺鍍方法(sputtering method)或任何其他方法來用催化劑粒子111d塗佈絕緣層111c。較佳地,催化劑粒子111d可為奈米大小粒子。 Next, as shown in FIG. 6C, the catalyst particles 111d are applied to the insulating layer 111c (S300). The catalyst particles 111d may be particles of cobalt, nickel, iron or an alloy thereof such as cobalt-nickel, cobalt-iron, or nickel-iron alloy. The insulating layer 111c may be coated with the catalyst particles 111d by a thermal deposition method, an electron beam deposition method, a sputtering method, or any other method. Preferably, the catalyst particles 111d may be nanosized particles.

此後,如圖6D中所示,藉由熱化學氣相沈積(CVD)方法在催化劑粒子111d上生長導電突起111e(S400)。詳言之,將塗佈有絕緣層111c以及催化劑粒子111d的導電芯111a安置於熱CVD反應器中,且將碳源氣體(carbon source gas)供應至熱CVD反應器,同時維持熱CVD反應器的溫度在400℃至1000℃的範圍內。在此情況下,C1到C3烴氣體可用作碳源氣體。較佳地,乙炔(acetylene)、乙烯(ethylene)、乙烷(ethane)、丙烯(propylene)、丙烷(propane)或甲烷(methane)氣體可用作碳源氣體。在高溫條件下供應的碳源氣體經歷熱分解,且因此碳奈米管分別生長於奈米大小催化劑粒子111d上。也就是說,生長出導電突起111e(碳奈米管)。 Thereafter, as shown in FIG. 6D, the conductive protrusions 111e are grown on the catalyst particles 111d by a thermal chemical vapor deposition (CVD) method (S400). In detail, the conductive core 111a coated with the insulating layer 111c and the catalyst particles 111d is placed in a thermal CVD reactor, and a carbon source gas is supplied to the thermal CVD reactor while maintaining the thermal CVD reactor. The temperature is in the range of 400 ° C to 1000 ° C. In this case, a C1 to C3 hydrocarbon gas can be used as the carbon source gas. Preferably, acetylene, ethylene, ethane, propylene, propane or methane gas can be used as the carbon source gas. The carbon source gas supplied under high temperature conditions undergoes thermal decomposition, and thus the carbon nanotubes are respectively grown on the nanosized catalyst particles 111d. That is, the conductive protrusions 111e (carbon nanotubes) are grown.

現將更詳細地描述此操作。在碳源氣體分解時,產生碳單元以及自由氫,且碳單元吸附至催化劑粒子111d上且在擴散至 催化劑粒子111d中的同時溶解。結果,催化劑粒子111d的碳單元過飽和,且接著碳奈米管的生長開始。若持續供應碳單元,則碳奈米管以如圖6D中所示的線形式生長。 This operation will now be described in more detail. When the carbon source gas is decomposed, carbon units and free hydrogen are generated, and the carbon units are adsorbed onto the catalyst particles 111d and diffused to Simultaneous dissolution in the catalyst particles 111d. As a result, the carbon unit of the catalyst particle 111d is supersaturated, and then the growth of the carbon nanotube is started. If the carbon unit is continuously supplied, the carbon nanotubes are grown in the form of a line as shown in Fig. 6D.

此後,如圖6E中所示,用金塗層或銀塗層111f或奈米粒子塗佈導電突起111e(S500)。以此方式,可完成製造導電粒子111。 Thereafter, as shown in FIG. 6E, the conductive protrusions 111e are coated with a gold coating or a silver coating 111f or nanoparticle (S500). In this way, the fabrication of the conductive particles 111 can be completed.

在本發明的申請人所申請的韓國專利(註冊號1204939)中揭露一種用於使用如上文所描述而製造的導電粒子111製造電測試插座的技術。 A technique for manufacturing an electrical test socket using conductive particles 111 fabricated as described above is disclosed in Korean Patent Application No. 1204939 filed by the present applicant.

本發明的電測試插座100可提供以下操作效果。 The electrical test socket 100 of the present invention can provide the following operational effects.

首先,電測試插座100以使得導電部分110與檢驗設備150的襯墊151接觸的方式安裝在檢驗設備150上,且在此狀態下,朝向電測試插座100移動待檢驗的目標裝置140。此後,降低電測試插座100以便使目標裝置140的端子141與導電部分110的上表面接觸,如圖5中所示。接下來,若檢驗設備150產生電信號,則電信號經由導電部分110傳輸至目標裝置140,且因此執行電測試。 First, the electrical test socket 100 is mounted on the inspection device 150 in such a manner that the conductive portion 110 is in contact with the gasket 151 of the inspection device 150, and in this state, the target device 140 to be inspected is moved toward the electrical test socket 100. Thereafter, the electrical test socket 100 is lowered to bring the terminal 141 of the target device 140 into contact with the upper surface of the conductive portion 110, as shown in FIG. Next, if the inspection device 150 generates an electrical signal, the electrical signal is transmitted to the target device 140 via the conductive portion 110, and thus an electrical test is performed.

儘管此測試是在高溫(150℃或高於150℃)下執行或用作絕緣彈性材料的矽酮橡膠過度膨脹,但由於自導電部分110的導電粒子111突出的導電突起111e彼此纏結(如圖4中所示),因此可維持導電粒子111之間的導電率。也就是說,儘管導電粒子111彼此隔開,但可由於導電突起111e彼此接觸地彼此纏結而維持導電粒子111之間的導電率。換言之,即使導電粒子111因為 矽酮橡膠在高溫下膨脹而彼此隔開,但由於形成於導電粒子111上的導電突起彼此接觸地彼此纏結,因此導電部分110的電阻可能不會增大或可最低限度地增大。 Although this test is an over-expansion of the fluorenone rubber which is performed at a high temperature (150 ° C or higher than 150 ° C) or used as an insulating elastic material, the conductive protrusions 111 e protruding from the conductive particles 111 of the conductive portion 110 are entangled with each other (for example) As shown in FIG. 4, the electrical conductivity between the conductive particles 111 can thus be maintained. That is, although the conductive particles 111 are spaced apart from each other, the conductivity between the conductive particles 111 may be maintained because the conductive protrusions 111e are entangled with each other in contact with each other. In other words, even if the conductive particles 111 The fluorenone rubbers are expanded at a high temperature to be spaced apart from each other, but since the conductive protrusions formed on the conductive particles 111 are entangled with each other in contact with each other, the electric resistance of the conductive portion 110 may not increase or may be minimally increased.

此外,由於導電突起111e彼此接觸具有增大導電粒子111的總表面積的效果,因此電測試插座100可長期使用,即使電測試插座100重複地變形亦如此。 Further, since the conductive protrusions 111e are in contact with each other with an effect of increasing the total surface area of the conductive particles 111, the electrical test socket 100 can be used for a long period of time even if the electrical test socket 100 is repeatedly deformed.

此外,由於導電突起111e彼此纏結,導電粒子111之間的距離可能不會過度增大。 Further, since the conductive protrusions 111e are entangled with each other, the distance between the conductive particles 111 may not excessively increase.

可如下修改本發明的電測試插座100。 The electrical test socket 100 of the present invention can be modified as follows.

在上述實施例中,導電突起111e是由碳奈米管形成。然而,導電突起111e不限於此。舉例而言,可藉由任何方法或材料形成導電突起111e,只要導電突起111e具有奈米大小線形狀即可。 In the above embodiment, the conductive protrusions 111e are formed of carbon nanotubes. However, the conductive protrusions 111e are not limited thereto. For example, the conductive protrusions 111e may be formed by any method or material as long as the conductive protrusions 111e have a nano-sized line shape.

此外,將導電突起111e形成為導電芯111a的部分的方法不限於在上述實施例中描述的技術。也就是說,各種其它技術可用以將導電突起111e形成為導電芯111a的部分。儘管在上述實施例中催化劑粒子111d是藉由熱CVD而生長,但生長催化劑粒子111d的方法不限於此。舉例而言,電漿增強式化學氣相沈積(plasma enhanced chemical vapor deposition,PECVD)方法可用以生長催化劑粒子111d。 Further, the method of forming the conductive protrusions 111e as a part of the conductive core 111a is not limited to the technique described in the above embodiments. That is, various other techniques can be used to form the conductive bumps 111e as part of the conductive core 111a. Although the catalyst particles 111d are grown by thermal CVD in the above embodiment, the method of growing the catalyst particles 111d is not limited thereto. For example, a plasma enhanced chemical vapor deposition (PECVD) method can be used to grow catalyst particles 111d.

應理解,本文中所描述的實施例應僅按描述性意義來考慮,而非出於限制目的。每個實施例內的特徵或態樣的描述應通常視為可用於其他實施例中的其他類似特徵或態樣。 It is to be understood that the embodiments described herein are to be considered in a Descriptions of features or aspects within each embodiment should generally be considered as other similar features or aspects that may be used in other embodiments.

儘管已根據參考諸圖的實施例描述本發明的電測試插 座,但本發明不限於此,且可在其中作出形式以及細節上的各種改變而不脫離本發明的精神以及範疇。 Although the electrical test plug of the present invention has been described in accordance with an embodiment with reference to the figures The present invention is not limited thereto, and various changes in form and details may be made therein without departing from the spirit and scope of the invention.

100‧‧‧電測試插座 100‧‧‧Electric test socket

110‧‧‧導電部分 110‧‧‧Electrical part

111‧‧‧導電粒子 111‧‧‧ conductive particles

120‧‧‧絕緣支撐件 120‧‧‧Insulation support

140‧‧‧目標裝置 140‧‧‧Target device

141‧‧‧端子 141‧‧‧ terminals

150‧‧‧檢驗設備 150‧‧‧Inspection equipment

151‧‧‧襯墊 151‧‧‧ cushion

Claims (13)

一種電測試插座,其佈置在檢驗設備的襯墊與待檢驗的目標裝置的端子之間,以便電連接所述襯墊與所述端子,所述電測試插座包括:多個導電部分,其中所述多個導電部分中的每一個是藉由在絕緣彈性材料中在對應於所述目標裝置的所述端子的位置處在所述絕緣彈性材料的厚度方向上佈置多個導電粒子而形成;以及絕緣支撐件,其支撐所述導電部分且使所述多個導電部分中的每一個絕緣,其中所述導電粒子中的每一者包括導電芯以及附接至所述導電芯的表面作為所述導電芯的部分且自所述導電芯的所述表面徑向延伸的多個導電突起,且在所述導電粒子佈置於所述絕緣彈性材料中時,相鄰導電芯的所述導電突起彼此纏結。 An electrical test socket disposed between a gasket of an inspection device and a terminal of a target device to be inspected to electrically connect the gasket and the terminal, the electrical test socket comprising: a plurality of conductive portions, wherein Each of the plurality of conductive portions is formed by arranging a plurality of conductive particles in a thickness direction of the insulating elastic material at a position corresponding to the terminal of the target device in an insulating elastic material; An insulating support supporting the conductive portion and insulating each of the plurality of conductive portions, wherein each of the conductive particles includes a conductive core and a surface attached to the conductive core as the a portion of the conductive core and a plurality of conductive protrusions extending radially from the surface of the conductive core, and when the conductive particles are disposed in the insulating elastic material, the conductive protrusions of adjacent conductive cores are wrapped around each other Knot. 如申請專利範圍第1項所述的電測試插座,其中所述導電突起具有彈性。 The electrical test socket of claim 1, wherein the conductive protrusion has elasticity. 如申請專利範圍第2項所述的電測試插座,其中所述導電突起包括碳奈米管。 The electrical test socket of claim 2, wherein the conductive protrusion comprises a carbon nanotube. 如申請專利範圍第1項所述的電測試插座,其中所述導電突起在其表面上包括金塗層或銀塗層。 The electrical test socket of claim 1, wherein the conductive protrusion comprises a gold coating or a silver coating on a surface thereof. 如申請專利範圍第1項所述的電測試插座,其中所述導電突起塗佈有奈米粒子。 The electrical test socket of claim 1, wherein the conductive protrusion is coated with nano particles. 如申請專利範圍第1項所述的電測試插座,其中所述導 電突起具有直線形狀。 An electrical test socket according to claim 1, wherein the guide The electric protrusion has a linear shape. 一種導電粒子的製造方法,所述導電粒子用於如申請專利範圍第1項所述的電測試插座,所述導電粒子的製造方法包括以下步驟:(a)製備導電芯;(b)在所述導電芯的表面上形成絕緣層;(c)將多個催化劑粒子塗覆至所述絕緣層;以及(d)藉由熱化學氣相沈積方法在所述多個催化劑粒子中的每一個上生長導電突起。 A method for producing conductive particles, the conductive particles being used in an electrical test socket according to claim 1, wherein the method for manufacturing the conductive particles comprises the steps of: (a) preparing a conductive core; (b) Forming an insulating layer on a surface of the conductive core; (c) applying a plurality of catalyst particles to the insulating layer; and (d) applying a thermal chemical vapor deposition method to each of the plurality of catalyst particles The conductive protrusions are grown. 如申請專利範圍第7項所述的導電粒子的製造方法,其中所述步驟(a)包括在所述導電芯的表面上形成金塗層或銀塗層。 The method of producing conductive particles according to claim 7, wherein the step (a) comprises forming a gold coating or a silver coating on the surface of the conductive core. 如申請專利範圍第7項所述的導電粒子的製造方法,其中所述絕緣層包括氧化鋁(Al2O3)。 The method for producing conductive particles according to claim 7, wherein the insulating layer comprises aluminum oxide (Al 2 O 3 ). 如申請專利範圍第7項所述的導電粒子的製造方法,其中所述催化劑粒子包括鐵、鈷、鎳或其合金。 The method for producing conductive particles according to claim 7, wherein the catalyst particles comprise iron, cobalt, nickel or an alloy thereof. 如申請專利範圍第7項所述的導電粒子的製造方法,其中在所述步驟(d)之後,所述導電粒子的製造方法進一步包括以下步驟:(e)在所述導電突起的表面上形成金塗層或銀塗層。 The method for producing conductive particles according to claim 7, wherein after the step (d), the method for producing the conductive particles further comprises the step of: (e) forming on the surface of the conductive protrusions Gold coated or silver coated. 一種導電粒子的製造方法,所述導電粒子用於如申請專利範圍第1項所述的電測試插座,所述導電粒子的製造方法包括:(a)製備導電芯; (b)在於所述導電芯的表面上形成絕緣層的同時,將多個催化劑粒子塗覆至所述導電芯;以及(c)藉由熱化學氣相沈積方法在所述多個催化劑粒子中的每一個上生長導電突起。 A method for producing conductive particles, the conductive particles being used in an electrical test socket according to claim 1, wherein the method for manufacturing the conductive particles comprises: (a) preparing a conductive core; (b) applying a plurality of catalyst particles to the conductive core while forming an insulating layer on the surface of the conductive core; and (c) in the plurality of catalyst particles by a thermal chemical vapor deposition method Conductive protrusions are grown on each of them. 一種導電粒子的製造方法,所述導電粒子用於如申請專利範圍第1項所述的電測試插座,所述導電粒子的製造方法包括:(a)製備導電芯;(b)將多個催化劑粒子塗覆至所述導電芯;以及(c)藉由熱化學氣相沈積方法在所述多個催化劑粒子中的每一個上生長導電突起。 A method for producing conductive particles, the conductive particles being used in an electrical test socket according to claim 1, wherein the method for manufacturing the conductive particles comprises: (a) preparing a conductive core; (b) using a plurality of catalysts Coating particles to the conductive core; and (c) growing conductive protrusions on each of the plurality of catalyst particles by a thermal chemical vapor deposition method.
TW104143251A 2014-12-26 2015-12-23 Electrical test socket and method of manufacturing onductive particles for electric test socket ??????????????????????????????????????????? TWI596343B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140191117A KR101586340B1 (en) 2014-12-26 2014-12-26 Electrical test socket and fabrication method of conductive powder for electrical test socket

Publications (2)

Publication Number Publication Date
TW201636617A TW201636617A (en) 2016-10-16
TWI596343B true TWI596343B (en) 2017-08-21

Family

ID=55305853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104143251A TWI596343B (en) 2014-12-26 2015-12-23 Electrical test socket and method of manufacturing onductive particles for electric test socket ???????????????????????????????????????????

Country Status (3)

Country Link
KR (1) KR101586340B1 (en)
TW (1) TWI596343B (en)
WO (1) WO2016105031A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101830935B1 (en) 2016-03-18 2018-02-22 주식회사 오킨스전자 Device and method for manufacturing conductive particle of test socket using wire bonding and press
KR101959536B1 (en) * 2016-04-05 2019-03-18 주식회사 아이에스시 Anisotropic sheet comprising conductive particles mixed different kind of particles
KR101739536B1 (en) * 2016-05-11 2017-05-24 주식회사 아이에스시 Test socket and conductive particle
KR101739537B1 (en) * 2016-05-11 2017-05-25 주식회사 아이에스시 Test socket and conductive particle
KR101901982B1 (en) 2017-07-19 2018-09-27 주식회사 아이에스시 Test socket and conductive particle
KR101976703B1 (en) * 2017-08-31 2019-05-09 주식회사 아이에스시 Test socket and conductive particle
KR102617481B1 (en) * 2018-06-07 2023-12-26 광주과학기술원 a Magnetic field fiber sensor
KR102103747B1 (en) * 2018-10-25 2020-04-23 주식회사 오킨스전자 Device for test socket having Metal-CNT composites and/or Polymer-CNT composites
KR102444643B1 (en) 2018-11-06 2022-09-19 (주)티에스이 Conductive particle and data signal transmission connector having the same
KR102211358B1 (en) * 2020-03-19 2021-02-03 (주)티에스이 Test socket and test apparatus having the same, manufacturing method for the test socket
KR102410156B1 (en) * 2020-06-02 2022-06-17 (주)티에스이 Test apparatus for semiconductor package
KR102393083B1 (en) 2020-08-21 2022-05-03 주식회사 스노우 Conductive particle and testing socket comprsing the same
KR102499394B1 (en) * 2020-12-29 2023-02-14 주식회사 아이에스시 Pusher apparatus for electrical test and electrical test apparatus
KR20230088965A (en) * 2021-12-13 2023-06-20 주식회사 티에프이 Method for manufacturing conductive member for rubber socket

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1095683C (en) * 1997-01-08 2002-12-11 郑方胜 Conductive sacculus electrode catheter through esophagus for ventricular pacemaking
TW200940994A (en) * 2008-03-31 2009-10-01 Leeno Ind Inc Socket for testing semiconductor chip
US20110267791A1 (en) * 2007-08-02 2011-11-03 Hitachi Chemical Company, Ltd. Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
TW201447324A (en) * 2013-02-19 2014-12-16 Isc Co Ltd Test socket with high density conduction section

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101299197B1 (en) * 2009-12-02 2013-08-23 주식회사 오킨스전자 Contact for semiconductor chip package test
KR101378505B1 (en) * 2009-12-02 2014-03-31 주식회사 오킨스전자 Contact for semiconductor chip package test
KR101246301B1 (en) * 2012-01-18 2013-03-22 이재학 Socket for electrical test with micro-line
KR101393601B1 (en) * 2013-07-24 2014-05-13 주식회사 아이에스시 Conductive connector and manufacturing method of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1095683C (en) * 1997-01-08 2002-12-11 郑方胜 Conductive sacculus electrode catheter through esophagus for ventricular pacemaking
US20110267791A1 (en) * 2007-08-02 2011-11-03 Hitachi Chemical Company, Ltd. Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
TW200940994A (en) * 2008-03-31 2009-10-01 Leeno Ind Inc Socket for testing semiconductor chip
TW201447324A (en) * 2013-02-19 2014-12-16 Isc Co Ltd Test socket with high density conduction section

Also Published As

Publication number Publication date
TW201636617A (en) 2016-10-16
WO2016105031A1 (en) 2016-06-30
KR101586340B1 (en) 2016-01-18

Similar Documents

Publication Publication Date Title
TWI596343B (en) Electrical test socket and method of manufacturing onductive particles for electric test socket ???????????????????????????????????????????
KR101588844B1 (en) Test connector with coil type Carbon Nano Tube
TWI588493B (en) Test socket
TWI555984B (en) Test socket
CN105527472B (en) Test bench
JP2015501427A (en) Test socket having high-density conductive portion and method of manufacturing the same
TWI692642B (en) Conductive contact and anisotropic conductive sheet with the same
TW201447324A (en) Test socket with high density conduction section
KR20100028800A (en) Test socket for semiconductor ic test
KR101173191B1 (en) Test socket
US8350160B2 (en) Structure, electronic device, and method for fabricating a structure
TWI738629B (en) Test socket and test apparatus having the same, manufacturing method for the test socket
US20240012023A1 (en) Contactor and method of manufacturing the same
JP5465516B2 (en) Probe and probe manufacturing method
KR101825095B1 (en) Probe pin coated with carbon layer for semiconductor test device and method of fabricating the same
TW201920962A (en) Test socket with carbon nanotubes
KR102310726B1 (en) Flexible contactor and method for manufacturing the same
TW201611448A (en) Connection connector and method of manufacturing the same
JP3879464B2 (en) Anisotropic conductive sheet for circuit device inspection, manufacturing method thereof, and applied product thereof
Liu et al. A finite element based electrical resistance study for rough surfaces: Applied to a bi-layered Au/MWCNT composite for micro-switching applications
TW201714360A (en) Test connector
JP2006284418A (en) Wafer inspection probe card and wafer inspection device
WO2018173884A1 (en) Probe structure and method for producing probe structure
JP3815571B2 (en) Manufacturing method of sheet-like probe
JP3801195B1 (en) Circuit device inspection electrode device, manufacturing method thereof, and circuit device inspection device