TWI592232B - Metal powder injection molding - Google Patents

Metal powder injection molding Download PDF

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Publication number
TWI592232B
TWI592232B TW102110758A TW102110758A TWI592232B TW I592232 B TWI592232 B TW I592232B TW 102110758 A TW102110758 A TW 102110758A TW 102110758 A TW102110758 A TW 102110758A TW I592232 B TWI592232 B TW I592232B
Authority
TW
Taiwan
Prior art keywords
metal powder
powder injection
injection molding
molding die
cavity
Prior art date
Application number
TW102110758A
Other languages
English (en)
Chinese (zh)
Other versions
TW201345631A (zh
Inventor
Hidefumi Nakamura
Shigeharu Yamahata
Tomo Takahashi
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201345631A publication Critical patent/TW201345631A/zh
Application granted granted Critical
Publication of TWI592232B publication Critical patent/TWI592232B/zh

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Powder Metallurgy (AREA)
TW102110758A 2012-03-29 2013-03-26 Metal powder injection molding TWI592232B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076161A JP5942536B2 (ja) 2012-03-29 2012-03-29 金属粉末射出成形用成形型

Publications (2)

Publication Number Publication Date
TW201345631A TW201345631A (zh) 2013-11-16
TWI592232B true TWI592232B (zh) 2017-07-21

Family

ID=49360607

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102110758A TWI592232B (zh) 2012-03-29 2013-03-26 Metal powder injection molding

Country Status (3)

Country Link
JP (1) JP5942536B2 (ja)
CN (1) CN103357871B (ja)
TW (1) TWI592232B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614113B (zh) * 2014-09-30 2018-02-11 Panasonic Intellectual Property Management Co., Ltd. 射出成型用模具與濾網成型品
JP6314866B2 (ja) * 2015-02-09 2018-04-25 セイコーエプソン株式会社 粉末冶金用金属粉末、コンパウンド、造粒粉末および焼結体の製造方法
KR20170089356A (ko) 2016-01-26 2017-08-03 엘지전자 주식회사 사출성형을 위한 금형조립체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262667A (ja) * 1984-06-11 1985-12-26 Matsushita Electric Works Ltd ドツトプリンタの印字ワイヤの案内部材およびその製造方法
JPS62275756A (ja) * 1986-05-24 1987-11-30 Brother Ind Ltd 印字ヘツドにおけるヘツド本体の製造方法
JPH08132651A (ja) * 1994-11-09 1996-05-28 Seiko Epson Corp インパクトドットヘッド
JP2002292678A (ja) * 2001-03-29 2002-10-09 Calsonic Kansei Corp 円筒形状の樹脂部品の成形装置ならびに円筒形状の樹脂部品の成形方法および円筒形状の樹脂部品
JP4110158B2 (ja) * 2005-08-09 2008-07-02 セイコープレシジョン株式会社 プリンタ装置の印字ヘッド
CN201308993Y (zh) * 2008-11-10 2009-09-16 王明喜 信号隔离器壳体粉末注射成型模具

Also Published As

Publication number Publication date
CN103357871B (zh) 2016-08-10
JP5942536B2 (ja) 2016-06-29
CN103357871A (zh) 2013-10-23
TW201345631A (zh) 2013-11-16
JP2013204120A (ja) 2013-10-07

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