TWI592079B - 導電性聚醯胺基板 - Google Patents
導電性聚醯胺基板 Download PDFInfo
- Publication number
- TWI592079B TWI592079B TW102115083A TW102115083A TWI592079B TW I592079 B TWI592079 B TW I592079B TW 102115083 A TW102115083 A TW 102115083A TW 102115083 A TW102115083 A TW 102115083A TW I592079 B TWI592079 B TW I592079B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- conductive
- diamine
- aromatic
- conductive track
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 97
- 239000004952 Polyamide Substances 0.000 title description 7
- 229920002647 polyamide Polymers 0.000 title description 7
- 238000000034 method Methods 0.000 claims description 49
- 229920000768 polyamine Polymers 0.000 claims description 43
- 239000000203 mixture Substances 0.000 claims description 24
- -1 diamine carboxylate Chemical class 0.000 claims description 19
- 238000007641 inkjet printing Methods 0.000 claims description 19
- 238000005245 sintering Methods 0.000 claims description 18
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 12
- 239000002243 precursor Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 150000004985 diamines Chemical class 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000000443 aerosol Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 150000004984 aromatic diamines Chemical class 0.000 claims description 4
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 150000002902 organometallic compounds Chemical class 0.000 claims description 2
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 229910001020 Au alloy Inorganic materials 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 150000004696 coordination complex Chemical class 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 239000000976 ink Substances 0.000 description 20
- 229920000642 polymer Polymers 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 239000000835 fiber Substances 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000003086 colorant Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000012744 reinforcing agent Substances 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 229920003189 Nylon 4,6 Polymers 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229920006351 engineering plastic Polymers 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920006119 nylon 10T Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 229920000571 Nylon 11 Polymers 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000001542 size-exclusion chromatography Methods 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- OONPLQJHBJXVBP-UHFFFAOYSA-N 3-(2-phenylethenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=CC=2C=CC=CC=2)=C1C(O)=O OONPLQJHBJXVBP-UHFFFAOYSA-N 0.000 description 1
- JNQYNXFGVRUFNP-JGVFFNPUSA-N 4-amino-1-[(2r,5s)-5-(hydroxymethyl)oxolan-2-yl]-5-methylpyrimidin-2-one Chemical compound O=C1N=C(N)C(C)=CN1[C@@H]1O[C@H](CO)CC1 JNQYNXFGVRUFNP-JGVFFNPUSA-N 0.000 description 1
- 229920006045 Akulon® Polymers 0.000 description 1
- 229910002477 CuCr2O4 Inorganic materials 0.000 description 1
- 229920006060 Grivory® Polymers 0.000 description 1
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 229920000393 Nylon 6/6T Polymers 0.000 description 1
- 229920006153 PA4T Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- 239000004614 Process Aid Substances 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920006374 copolyamide PA6I/6T Polymers 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- WLAADLGJRBYLPH-UHFFFAOYSA-N hydrazine terephthalic acid Chemical compound C(C1=CC=C(C(=O)O)C=C1)(=O)O.NN WLAADLGJRBYLPH-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000009768 microwave sintering Methods 0.000 description 1
- 239000002557 mineral fiber Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- FULFYAFFAGNFJM-UHFFFAOYSA-N oxocopper;oxo(oxochromiooxy)chromium Chemical compound [Cu]=O.O=[Cr]O[Cr]=O FULFYAFFAGNFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 description 1
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- CUNPJFGIODEJLQ-UHFFFAOYSA-M potassium;2,2,2-trifluoroacetate Chemical compound [K+].[O-]C(=O)C(F)(F)F CUNPJFGIODEJLQ-UHFFFAOYSA-M 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012421 spiking Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical group [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12165949 | 2012-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201349968A TW201349968A (zh) | 2013-12-01 |
| TWI592079B true TWI592079B (zh) | 2017-07-11 |
Family
ID=48227279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102115083A TWI592079B (zh) | 2012-04-27 | 2013-04-26 | 導電性聚醯胺基板 |
Country Status (8)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015059190A1 (en) * | 2013-10-25 | 2015-04-30 | Dsm Ip Assets B.V. | Electrically conductive polyamide substrate |
| US11648731B2 (en) | 2015-10-29 | 2023-05-16 | Hewlett-Packard Development Company, L.P. | Forming three-dimensional (3D) printed electronics |
| DE102017129625B3 (de) * | 2017-12-12 | 2019-05-23 | Mühlbauer Gmbh & Co. Kg | Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement |
| WO2021181362A1 (en) * | 2020-03-13 | 2021-09-16 | Inv Nylon Chemicals Americas, Llc | Thermoplastic resins for network applications |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4355436B2 (ja) * | 2000-10-25 | 2009-11-04 | 森村ケミカル株式会社 | 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法 |
| DE10132092A1 (de) | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
| JP3998993B2 (ja) * | 2002-02-14 | 2007-10-31 | 大日本印刷株式会社 | ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体 |
| CN101003624B (zh) * | 2002-10-31 | 2011-06-08 | 东丽株式会社 | 脂环式或芳族聚酰胺、聚酰胺膜、使用所述聚酰胺或聚酰胺膜的光学部件以及聚酰胺的共聚物 |
| JP4630542B2 (ja) * | 2003-12-22 | 2011-02-09 | キヤノン株式会社 | 配線形成方法 |
| US20060258136A1 (en) * | 2005-05-11 | 2006-11-16 | Guangjin Li | Method of forming a metal trace |
| WO2007038950A1 (en) * | 2005-09-28 | 2007-04-12 | Stichting Dutch Polymer Institute | Method for generation of metal surface structures and apparatus therefor |
| US20070076021A1 (en) * | 2005-09-30 | 2007-04-05 | Stancik Edward J | Processes for inkjet printing |
| US9428612B2 (en) | 2006-01-26 | 2016-08-30 | Dsm Ip Assets B.V. | Semi-crystalline semi-aromatic polyamide |
| EP2591912A1 (en) * | 2006-02-20 | 2013-05-15 | Daicel Chemical Industries, Ltd. | Multilayer assembly and composite material comprising same |
| US9615463B2 (en) * | 2006-09-22 | 2017-04-04 | Oscar Khaselev | Method for producing a high-aspect ratio conductive pattern on a substrate |
| JP5212108B2 (ja) * | 2006-11-02 | 2013-06-19 | 東洋インキＳｃホールディングス株式会社 | 導電性インキ、導電回路および非接触型メディア |
| US20080171181A1 (en) * | 2007-01-11 | 2008-07-17 | Molex Incorporated | High-current traces on plated molded interconnect device |
| KR101576307B1 (ko) * | 2007-07-23 | 2015-12-09 | 디에스엠 아이피 어셋츠 비.브이. | Ｅ/ｅ 커넥터 및 그 안에서 사용되는 중합체 조성물 |
| JP5574110B2 (ja) * | 2007-07-23 | 2014-08-20 | ディーエスエム アイピー アセッツ ビー．ブイ． | 照明装置のためのプラスチック構成要素 |
| JP4706690B2 (ja) * | 2007-11-05 | 2011-06-22 | パナソニック電工株式会社 | 回路基板及びその製造方法 |
| US8278757B2 (en) * | 2008-02-05 | 2012-10-02 | Vorbeck Materials Corporation | Printed electronics |
| JP5129077B2 (ja) * | 2008-09-30 | 2013-01-23 | 富士フイルム株式会社 | 配線形成方法 |
| US20100113669A1 (en) * | 2008-10-30 | 2010-05-06 | E.I. Du Pont De Nemours And Company | Thermoplastic composition including hyperbranched aromatic polyamide |
| CN106928704A (zh) * | 2009-01-16 | 2017-07-07 | 帝斯曼知识产权资产管理有限公司 | 用于柔性印刷电路板的聚酰胺膜 |
| EP2411560A1 (en) * | 2009-03-24 | 2012-02-01 | Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd. | Process for sintering nanoparticles at low temperatures |
| US20110015328A1 (en) * | 2009-07-17 | 2011-01-20 | E.I.Du Pont De Nemours And Company | Semi aromatic polyamide resin compositions, processes for their manufacture, and articles thereof |
| US8765025B2 (en) * | 2010-06-09 | 2014-07-01 | Xerox Corporation | Silver nanoparticle composition comprising solvents with specific hansen solubility parameters |
| EP2410020B1 (de) * | 2010-07-23 | 2013-01-30 | Ems-Patent Ag | Teilaromatische Polyamid-Formmassen und deren Verwendungen |
| US9597861B2 (en) * | 2010-10-29 | 2017-03-21 | E I Du Pont De Nemours And Company | Composite structures having improved heat aging and interlayer bond strength |
| US8906479B2 (en) * | 2011-12-30 | 2014-12-09 | E I Du Pont De Nemours And Company | Compositions of polyamide and ionomer |
-
2013
- 2013-04-26 CN CN201380021791.XA patent/CN104254572B/zh not_active Expired - Fee Related
- 2013-04-26 JP JP2015507555A patent/JP6146723B2/ja not_active Expired - Fee Related
- 2013-04-26 TW TW102115083A patent/TWI592079B/zh not_active IP Right Cessation
- 2013-04-26 US US14/396,652 patent/US20150107877A1/en not_active Abandoned
- 2013-04-26 IN IN8365DEN2014 patent/IN2014DN08365A/en unknown
- 2013-04-26 EP EP13719532.7A patent/EP2841503B1/en not_active Not-in-force
- 2013-04-26 KR KR1020147029925A patent/KR102066304B1/ko not_active Expired - Fee Related
- 2013-04-26 WO PCT/EP2013/058749 patent/WO2013160454A2/en active Application Filing
-
2018
- 2018-08-30 US US16/118,429 patent/US20180371242A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20150107877A1 (en) | 2015-04-23 |
| JP2015520800A (ja) | 2015-07-23 |
| WO2013160454A3 (en) | 2013-12-19 |
| EP2841503A2 (en) | 2015-03-04 |
| KR20150004354A (ko) | 2015-01-12 |
| EP2841503B1 (en) | 2018-08-29 |
| US20180371242A1 (en) | 2018-12-27 |
| JP6146723B2 (ja) | 2017-06-14 |
| WO2013160454A2 (en) | 2013-10-31 |
| TW201349968A (zh) | 2013-12-01 |
| KR102066304B1 (ko) | 2020-01-14 |
| CN104254572B (zh) | 2017-04-05 |
| CN104254572A (zh) | 2014-12-31 |
| IN2014DN08365A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8207261B2 (en) | Plastic articles, optionally with partial metal coating | |
| TWI797069B (zh) | 熱塑性聚合物組成物、其所製成之物件及其製造方法 | |
| US20180371242A1 (en) | Electrically conductive polyamide substrate | |
| JP7196102B2 (ja) | ポリマー体及び金属めっきを含む物品 | |
| EP3670605B1 (en) | Thermoplastic resin composition, resin molded article, method for manufacturing plated resin molded article, and method for manufacturing portable electronic device component | |
| US9587316B2 (en) | Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer | |
| US8383243B2 (en) | Composite containing polymer, filler and metal plating catalyst, method of making same, and article manufactured therefrom | |
| EP3303477B1 (en) | A thermoplastic polymer composition, an article made thereof and a process for preparing the same | |
| CN106537519B (zh) | 导电性糊剂及使用其的多层基板 | |
| TW201623443A (zh) | 聚醯胺模料及其應用 | |
| CN109311184A (zh) | 预浸料和纤维强化复合材料、以及表面改性强化纤维 | |
| TW200405900A (en) | Polyamide resin composition and molding therefrom | |
| JP6489795B2 (ja) | 繊維強化樹脂材料、樹脂成形品、メッキ層付樹脂成形品、メッキ層付樹脂成形品の製造方法、および繊維強化樹脂材料の製造方法 | |
| Kim et al. | Fabrication of Thermally Stable Silver–Organic Complex (TS‐SOC) Based Conductible Filament Materials for 3D Printing | |
| WO2022136040A1 (en) | Powdered material (p) containing polyamide (pa) polymer and its use for additive manufacturing | |
| JP6363875B2 (ja) | ペレット、ペレットの製造方法、樹脂成形品、および、メッキ層付樹脂成形品の製造方法 | |
| JP6029787B1 (ja) | めっき特性に優れる無電解めっき触媒用分散液 | |
| WO2015059190A1 (en) | Electrically conductive polyamide substrate | |
| JP7716182B2 (ja) | レーザーダイレクトストラクチャリング用ポリアミド樹脂組成物、樹脂成形品、メッキ付樹脂成形品の製造方法およびアンテナを有する携帯電子機器部品の製造方法 | |
| EP3390537B1 (en) | A thermoplastic polymer composition, an article made thereof and a process for preparing the same | |
| WO2023203213A1 (en) | Additive manufacturing method with biobased polyamide composition having high thermal stability | |
| JP2014231217A (ja) | 導電部材、射出成型品、フィルム、繊維、チューブ、中空状成形物、及び導電部材の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |