TWI588957B - 用於表面安置模組之擴散阻障 - Google Patents

用於表面安置模組之擴散阻障 Download PDF

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Publication number
TWI588957B
TWI588957B TW102125294A TW102125294A TWI588957B TW I588957 B TWI588957 B TW I588957B TW 102125294 A TW102125294 A TW 102125294A TW 102125294 A TW102125294 A TW 102125294A TW I588957 B TWI588957 B TW I588957B
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Taiwan
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layer
diffusion barrier
module
semiconductor device
sub
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TW102125294A
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English (en)
Chinese (zh)
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TW201409635A (zh
Inventor
艾朗 維盧派克夏 格達
保羅 艾倫 麥克考奈利
趙日安
夏卡堤 辛夫 喬罕
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奇異電器公司
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Publication of TW201409635A publication Critical patent/TW201409635A/zh
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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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SG196754A1 (en) 2014-02-13
CN103579136A (zh) 2014-02-12
TW201409635A (zh) 2014-03-01
KR102089926B1 (ko) 2020-04-14
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EP2693470A3 (en) 2015-07-22
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