TWI587960B - Laser processing method and laser processing device - Google Patents

Laser processing method and laser processing device Download PDF

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Publication number
TWI587960B
TWI587960B TW102123572A TW102123572A TWI587960B TW I587960 B TWI587960 B TW I587960B TW 102123572 A TW102123572 A TW 102123572A TW 102123572 A TW102123572 A TW 102123572A TW I587960 B TWI587960 B TW I587960B
Authority
TW
Taiwan
Prior art keywords
laser light
groove
pulsed laser
irradiation
brittle material
Prior art date
Application number
TW102123572A
Other languages
English (en)
Chinese (zh)
Other versions
TW201420249A (zh
Inventor
Kenji Fukuhara
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201420249A publication Critical patent/TW201420249A/zh
Application granted granted Critical
Publication of TWI587960B publication Critical patent/TWI587960B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW102123572A 2012-11-29 2013-07-02 Laser processing method and laser processing device TWI587960B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012260984A JP6035127B2 (ja) 2012-11-29 2012-11-29 レーザ加工方法及びレーザ加工装置

Publications (2)

Publication Number Publication Date
TW201420249A TW201420249A (zh) 2014-06-01
TWI587960B true TWI587960B (zh) 2017-06-21

Family

ID=50854932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102123572A TWI587960B (zh) 2012-11-29 2013-07-02 Laser processing method and laser processing device

Country Status (4)

Country Link
JP (1) JP6035127B2 (ja)
KR (1) KR101866248B1 (ja)
CN (1) CN103846554B (ja)
TW (1) TWI587960B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108022831B (zh) * 2016-11-03 2021-06-04 无锡华润上华科技有限公司 沟槽制备方法及半导体装置制备方法
JP2019177410A (ja) * 2018-03-30 2019-10-17 Ｄｇｓｈａｐｅ株式会社 加工方法、加工システム、加工プログラム。
JPWO2021009961A1 (ja) * 2019-07-16 2021-01-21

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200610604A (en) * 2004-07-30 2006-04-01 Hamamatsu Photonics Kk Laser processing method
TW200613081A (en) * 2004-08-06 2006-05-01 Hamamatsu Photonics Kk Laser processing method and semiconductor chip
CN1967805A (zh) * 2005-11-16 2007-05-23 株式会社电装 半导体器件和半导体基板切分方法
CN101087678A (zh) * 2004-12-28 2007-12-12 三星钻石工业股份有限公司 脆性材料基板的截断方法及基板截断系统
JP2008153420A (ja) * 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
TW200952061A (en) * 2008-06-13 2009-12-16 Disco Corp Optical device wafer dividing method
JP2010123797A (ja) * 2008-11-20 2010-06-03 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法
JP2012006320A (ja) * 2010-06-28 2012-01-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
TW201210732A (en) * 2010-07-21 2012-03-16 Hamamatsu Photonics Kk Laser processing method
TW201244861A (en) * 2011-03-31 2012-11-16 Electro Scient Ind Inc Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
CN102786214A (zh) * 2011-05-19 2012-11-21 三星钻石工业股份有限公司 脆性材料基板加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370310B2 (ja) * 1999-06-18 2003-01-27 三星ダイヤモンド工業株式会社 レーザーを用いたスクライブ法
JP5495511B2 (ja) * 2008-05-27 2014-05-21 株式会社ディスコ ウエーハの分割方法
JP5122378B2 (ja) * 2008-06-09 2013-01-16 株式会社ディスコ 板状物の分割方法
JP2010274328A (ja) 2009-04-30 2010-12-09 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法及びレーザ加工装置
JP2011233641A (ja) * 2010-04-26 2011-11-17 Disco Abrasive Syst Ltd 板状物のレーザー加工方法
JP5444158B2 (ja) 2010-08-02 2014-03-19 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
JP2012109364A (ja) * 2010-11-17 2012-06-07 Disco Abrasive Syst Ltd 光デバイスユニットの加工方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200610604A (en) * 2004-07-30 2006-04-01 Hamamatsu Photonics Kk Laser processing method
TW200613081A (en) * 2004-08-06 2006-05-01 Hamamatsu Photonics Kk Laser processing method and semiconductor chip
CN101087678A (zh) * 2004-12-28 2007-12-12 三星钻石工业股份有限公司 脆性材料基板的截断方法及基板截断系统
CN1967805A (zh) * 2005-11-16 2007-05-23 株式会社电装 半导体器件和半导体基板切分方法
JP2008153420A (ja) * 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
TW200952061A (en) * 2008-06-13 2009-12-16 Disco Corp Optical device wafer dividing method
JP2010123797A (ja) * 2008-11-20 2010-06-03 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法
JP2012006320A (ja) * 2010-06-28 2012-01-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
TW201210732A (en) * 2010-07-21 2012-03-16 Hamamatsu Photonics Kk Laser processing method
TW201244861A (en) * 2011-03-31 2012-11-16 Electro Scient Ind Inc Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
CN102786214A (zh) * 2011-05-19 2012-11-21 三星钻石工业股份有限公司 脆性材料基板加工方法

Also Published As

Publication number Publication date
KR20140071220A (ko) 2014-06-11
JP6035127B2 (ja) 2016-11-30
TW201420249A (zh) 2014-06-01
CN103846554B (zh) 2018-02-09
KR101866248B1 (ko) 2018-06-11
JP2014105147A (ja) 2014-06-09
CN103846554A (zh) 2014-06-11

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