TWI587477B - 可靠表面安裝積體功率模組 - Google Patents

可靠表面安裝積體功率模組 Download PDF

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Publication number
TWI587477B
TWI587477B TW102125293A TW102125293A TWI587477B TW I587477 B TWI587477 B TW I587477B TW 102125293 A TW102125293 A TW 102125293A TW 102125293 A TW102125293 A TW 102125293A TW I587477 B TWI587477 B TW I587477B
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Taiwan
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layer
dielectric
dbc
surface mount
semiconductor device
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TW102125293A
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English (en)
Chinese (zh)
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TW201413916A (zh
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艾朗 維盧派克夏 格達
保羅 艾倫 麥克考奈利
夏卡堤 辛夫 喬罕
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奇異電器公司
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Publication of TW201413916A publication Critical patent/TW201413916A/zh
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
TW102125293A 2012-07-30 2013-07-15 可靠表面安裝積體功率模組 TWI587477B (zh)

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US20150069612A1 (en) 2015-03-12
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EP2693472B1 (en) 2022-12-14
US20140029234A1 (en) 2014-01-30
CN110060962B (zh) 2023-09-26
KR20140016204A (ko) 2014-02-07
CN103579137A (zh) 2014-02-12
US8941208B2 (en) 2015-01-27
CN111508909B (zh) 2024-12-17
US9184124B2 (en) 2015-11-10
SG196753A1 (en) 2014-02-13
CN110060962A (zh) 2019-07-26
CN103579137B (zh) 2020-03-13
TW201413916A (zh) 2014-04-01
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EP2693472A2 (en) 2014-02-05
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