TWI587191B - A lead wire, a wire substrate, a touch sensor, and a wire body - Google Patents

A lead wire, a wire substrate, a touch sensor, and a wire body Download PDF

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Publication number
TWI587191B
TWI587191B TW104143738A TW104143738A TWI587191B TW I587191 B TWI587191 B TW I587191B TW 104143738 A TW104143738 A TW 104143738A TW 104143738 A TW104143738 A TW 104143738A TW I587191 B TWI587191 B TW I587191B
Authority
TW
Taiwan
Prior art keywords
conductor pattern
lead body
side portion
wire
conductive
Prior art date
Application number
TW104143738A
Other languages
English (en)
Chinese (zh)
Other versions
TW201636797A (zh
Inventor
Takaharu Hondo
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW201636797A publication Critical patent/TW201636797A/zh
Application granted granted Critical
Publication of TWI587191B publication Critical patent/TWI587191B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
TW104143738A 2014-12-26 2015-12-25 A lead wire, a wire substrate, a touch sensor, and a wire body TWI587191B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014264492 2014-12-26

Publications (2)

Publication Number Publication Date
TW201636797A TW201636797A (zh) 2016-10-16
TWI587191B true TWI587191B (zh) 2017-06-11

Family

ID=56150735

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104143738A TWI587191B (zh) 2014-12-26 2015-12-25 A lead wire, a wire substrate, a touch sensor, and a wire body

Country Status (6)

Country Link
US (1) US10379645B2 (cg-RX-API-DMAC10.html)
EP (1) EP3190488B1 (cg-RX-API-DMAC10.html)
JP (2) JP6046867B2 (cg-RX-API-DMAC10.html)
CN (1) CN106687893B (cg-RX-API-DMAC10.html)
TW (1) TWI587191B (cg-RX-API-DMAC10.html)
WO (1) WO2016104723A1 (cg-RX-API-DMAC10.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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JP6027296B1 (ja) * 2015-01-30 2016-11-16 株式会社フジクラ 配線体、配線基板、及びタッチセンサ
CN104820533B (zh) * 2015-05-22 2019-03-12 京东方科技集团股份有限公司 触摸基板及其制备方法、显示装置
JPWO2017110038A1 (ja) * 2015-12-25 2018-10-18 パナソニックＩｐマネジメント株式会社 タッチパネルと、これを用いた表示装置
CN109076696A (zh) * 2016-07-12 2018-12-21 株式会社藤仓 伸缩性基板
GB201613051D0 (en) * 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
US12446160B2 (en) * 2016-07-28 2025-10-14 Landa Labs (2012) Ltd. Application of electrical conductors to an electrically insulating substrate
JP2019046405A (ja) * 2017-09-07 2019-03-22 日本航空電子工業株式会社 タッチセンサデバイス
KR102083184B1 (ko) * 2018-04-17 2020-03-02 울산과학기술원 자가 부착 투명 전극 및 이의 제조방법
CN112771722B (zh) * 2018-09-28 2024-06-25 大日本印刷株式会社 配线基板和配线基板的制造方法
JP7115687B2 (ja) 2019-01-23 2022-08-09 株式会社デンソー カーボンナノチューブパターン配線、それを有する透明導電基板およびヒータ
KR102705615B1 (ko) * 2019-06-25 2024-09-12 삼성디스플레이 주식회사 표시 장치의 제조 방법 및 이에 사용되는 레이저 장치
JP7667960B2 (ja) * 2020-05-01 2025-04-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7374059B2 (ja) 2020-09-25 2023-11-06 コネクテックジャパン株式会社 配線形成方法
TWI784681B (zh) * 2021-08-20 2022-11-21 錼創顯示科技股份有限公司 微型發光二極體顯示裝置

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CN102971806A (zh) * 2010-07-02 2013-03-13 富士胶片株式会社 导电层转印材料及触控式面板
CN103465525A (zh) * 2006-12-27 2013-12-25 日立化成工业株式会社 凹版和使用该凹版的带有导体层图形的基材
TW201407643A (zh) * 2012-07-20 2014-02-16 Dexerials Corp 導電性光學元件、輸入元件及顯示元件
WO2014084112A1 (ja) * 2012-11-30 2014-06-05 富士フイルム株式会社 転写フィルムおよび透明積層体、それらの製造方法、静電容量型入力装置ならびに画像表示装置

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Publication number Priority date Publication date Assignee Title
TW200826770A (en) * 2006-10-25 2008-06-16 Samsung Electro Mech Method for forming transcriptional circuit and method for manufacturing circuit board
CN103465525A (zh) * 2006-12-27 2013-12-25 日立化成工业株式会社 凹版和使用该凹版的带有导体层图形的基材
CN102971806A (zh) * 2010-07-02 2013-03-13 富士胶片株式会社 导电层转印材料及触控式面板
TW201407643A (zh) * 2012-07-20 2014-02-16 Dexerials Corp 導電性光學元件、輸入元件及顯示元件
WO2014084112A1 (ja) * 2012-11-30 2014-06-05 富士フイルム株式会社 転写フィルムおよび透明積層体、それらの製造方法、静電容量型入力装置ならびに画像表示装置

Also Published As

Publication number Publication date
EP3190488A4 (en) 2017-10-25
US10379645B2 (en) 2019-08-13
JP2017041654A (ja) 2017-02-23
EP3190488A1 (en) 2017-07-12
WO2016104723A1 (ja) 2016-06-30
CN106687893A (zh) 2017-05-17
JP6735212B2 (ja) 2020-08-05
US20170285786A1 (en) 2017-10-05
JP6046867B2 (ja) 2016-12-21
JPWO2016104723A1 (ja) 2017-04-27
TW201636797A (zh) 2016-10-16
EP3190488B1 (en) 2019-05-15
CN106687893B (zh) 2020-05-22

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