TWI584077B - A Silicon Chip Edge Protection Device with Collision Protection - Google Patents

A Silicon Chip Edge Protection Device with Collision Protection Download PDF

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Publication number
TWI584077B
TWI584077B TW103145909A TW103145909A TWI584077B TW I584077 B TWI584077 B TW I584077B TW 103145909 A TW103145909 A TW 103145909A TW 103145909 A TW103145909 A TW 103145909A TW I584077 B TWI584077 B TW I584077B
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Taiwan
Prior art keywords
connecting members
coupling
servo motor
protection device
edge protection
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TW103145909A
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English (en)
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TW201531815A (zh
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Jing-Li Huang
yue-bin Zhu
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
    • F16D7/00—Slip couplings, e.g. slipping on overload, for absorbing shock
    • F16D7/04—Slip couplings, e.g. slipping on overload, for absorbing shock of the ratchet type
    • F16D7/048—Slip couplings, e.g. slipping on overload, for absorbing shock of the ratchet type with parts moving radially between engagement and disengagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
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  • General Engineering & Computer Science (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description

一種具有碰撞保護功能的矽片邊緣保護裝置
本發明係關於半導體製造裝備技術領域，特別地關於一種用於光刻機的具有碰撞保護功能的矽片邊緣保護裝置。
矽片邊緣保護裝置是積體電路製造技術領域中，為提高矽片生產效率，對負膠工藝矽片曝光加工製造的同時對矽片邊緣進行保護的一種裝置，其係實現矽片曝光及邊緣保護同步進行的必備裝置。該裝置需安裝在曝光設備(光刻機)內部，需與工件台保持著正確的相對位置關係，工件台攜帶矽片進行快速運動至交接位置，由該裝置將邊緣保護環放置在欲曝光的矽片上方，從而實現對矽片曝光時的邊緣保護功能。在這種狀況及空間環境工作下的裝置，需具有很高的可靠性，無論什麼原因，產生什麼形式的碰撞，碰撞的衝擊力或大或小，都會造成矽片的報廢，降低光刻機的性能，甚至是損壞光刻機的後果。因此，提供一種更安全、更可靠的邊緣保護裝置顯得尤為重要。
中國發明專利200910055394X公開的一種矽片邊緣保護方法與裝置及中國發明專利201010102423.6矽片邊緣保護裝置及其應用方法所提及的邊緣保護裝置，無論在機械方面還是氣動控制方面，均無碰撞安全保護功能，工作過程中發生碰撞無法對矽片及光刻機進行保護，存在潛在危險。
為克服現有技術中的不足，本發明提出一種矽片邊緣保護裝置，包括電氣控制模組和垂向運動機構，該電氣控制模組包括一伺服電機用於產生一旋轉運動，該矽片邊緣保護裝置還包括一保護機構，其包括：一聯軸器，固定連接於該伺服電機的一電機軸且該聯軸器具有多個第一連接部件；一傳動套，固定連接於該垂向運動機構且具有多個第二連接部件，該多個第一和第二連接部件之間以可活動方式相連，使得：當該伺服電機的電機軸輸出的扭矩未超過一限定值時，該多個第一和第二連接部件相嚙合，進而伺服電機的旋轉運動被傳遞至該垂向運動機構並驅動垂向運動機構產生垂向運動；以及當該伺服電機的電機軸輸出的扭矩超過該限定值時，該多個第一連接部件與該多個第二連接部件斷開連接，從而防止該伺服電機的旋轉運動被傳遞至該垂向運動機構。
較佳地，該聯軸器大致為圓柱形，該傳動套具有沿周向環繞在聯軸器外周的一環形側壁，該多個第一連接部件沿周向設於聯軸器上，且每個第一連接部件具有一端部沿徑向凸出於聯軸器的表面，該多個第二連接部件是沿周向形成於環形側壁的內表面上的多個凹槽，該多個凹槽的形狀和位置與該多個第一連接部件的端部的形狀和位置相匹配。
較佳地，該每個第一連接部件包括：一傳動滑銷，以可滑動方式沿徑向設置於聯軸器內，且具有一端部凸出於聯軸器的表面；以及一壓縮彈簧設於傳動滑銷外周，該壓縮彈簧的一端固定 在一彈簧座上，另一端抵頂在傳動滑銷的該端部上，從而向傳動滑銷的該端部施加一個朝向傳動套上的相應凹槽的力。
較佳地，該壓縮彈簧被配置為當伺服電機的電機軸輸出的扭矩未超過限定值時，將該每個傳動滑銷的端部壓緊在傳動套的對應凹槽內，當伺服電機的電機軸輸出的扭矩超過限定值時，該每個傳動滑銷的端部能夠相對傳動套旋轉從而從傳動套的對應凹槽中脫出。
較佳地，該壓縮彈簧施加在傳動滑銷的該端部上的力的大小由彈簧座在聯軸器內的徑向位置決定。
較佳地，該傳動滑銷的端部為自聯軸器向傳動套直徑逐漸減小的錐形，該凹槽的形狀與傳動滑銷的端部的形狀相匹配。
較佳地，該保護機構還包括一開關裝置，用於當該多個第一連接部件與該多個第二連接部件斷開連接時，控制該伺服電機停止輸出扭矩。
較佳地，該開關裝置包括固定連接在該聯軸器上的一定位銷以及固定連接在該傳動套上的一行程開關，使得當該多個第一連接部件與該多個第二連接部件連接時，該定位銷與行程開關不接觸；以及當該多個第一連接部件與該多個第二連接部件斷開連接時，該定位銷與行程開關接觸，控制該伺服電機停止輸出扭矩。
較佳地，該第一、第二連接部件的數量為3個。
本發明具有碰撞保護功能的矽片邊緣保護裝置具有碰撞超載保護功能，杜絕了事故隱患，提高了光刻機的安全可靠性，消除了矽片的破損率。
1‧‧‧伺服電機
2‧‧‧保護機構
3‧‧‧垂向運動機構
4‧‧‧交接機械手
201‧‧‧電機座
202‧‧‧聯軸器
203‧‧‧傳動套
204‧‧‧傳動滑銷
205‧‧‧彈簧座
206‧‧‧壓縮彈簧
207‧‧‧定位銷
208‧‧‧行程開關
209‧‧‧定位軸承
關於本發明的優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。
圖1為本發明具有碰撞保護功能的矽片邊緣保護裝置結構示意圖。
圖2為本發明矽片邊緣保護裝置的碰撞保護機構的結構示意圖。
圖3為本發明矽片邊緣保護裝置的傳動滑銷脫出傳動套後的狀態圖。
下面結合附圖詳細說明本發明的具體實施例。
如圖1所示，本發明提出一種具有碰撞保護功能的矽片邊緣保護裝置，與交接機械手4連接，矽片邊緣保護裝置由電氣控制模組(包括伺服電機1)、碰撞保護機構2及垂向運動機構3組成。該電氣控制模組的伺服電機1安裝於碰撞保護機構2之上，伺服電機1的旋轉運動藉由防碰撞保護機構2，傳遞給垂向運動機構3，垂向運動機構3將伺服電機的旋轉運動變為直線運動，從而攜帶交接機械手4運動到預定的交接位置，進行矽片邊緣保護環交接工作，最終實現矽片曝光的邊緣保護。其中，垂向運動機構之「垂向」意旨依序配置伺服電機1、碰撞保護機構2及垂向運動機構3之配置方向的方向。
如圖2所示，根據一實施例，碰撞保護機構2是由電機座201、聯軸器202、傳動套203、傳動滑銷204、彈簧座205、壓縮彈簧206、定位銷207、定位軸承209以及行程開關208組成。碰撞保護機構2安裝在伺服電機1與垂向運動機構3之間，其上端由伺服電機將運動及所需扭矩輸入給碰撞保護機構2，其下端將運動及所需扭矩輸出給垂向運動機構3，當工作過程中發生意外碰撞時，會自 動地將輸入與輸出分離，即將驅動的伺服電機1與垂向運動機構3分開，安全分離並停止驅動，從而起到保護光刻機、保護矽片的作用。
具體實施方式如下：
伺服電機1藉由螺釘安裝於碰撞保護機構2的電機座201之上，碰撞保護機構2的電機座201剛性地安裝於垂向運動機構3之上。碰撞保護機構2，將伺服電機1的旋轉運動，傳遞給垂向運動機構3。垂向運動機構3，將電機的旋轉運動變為直線運動，從而攜帶裝在垂向運動機構3下端的交接機械手4進入、移出邊緣保護環交接位置，交接機械手4完成放置、抓取邊緣保護環於矽片上部的動作，最終實現矽片曝光時的邊緣保護功能。
如圖2所示，工作時，啟動伺服電機1，伺服電機1的電機軸(未圖示)旋轉，由於防碰撞保護機構2的聯軸器202與電機軸固定連接，電機軸的旋轉會帶動聯軸器202等速旋轉。三個傳動滑銷204裝在聯軸器202內且每個傳動滑銷204具有一端部凸出於聯軸器202的表面，該聯軸器202大致為圓柱形，壓縮彈簧206(初始長度為L1)分別套在傳動滑銷204外、該每個壓縮彈簧206的一端固定在彈簧座205上，另一端抵頂在傳動滑銷204的該端部上，從而向傳動滑銷204的該端部施加一個朝向傳動套203上的相應凹槽的力，在壓縮彈簧206作用下(此時壓縮彈簧206處於壓縮狀態)，三個傳動滑銷204的錐部(沿徑向凸出於聯軸器202的表面)與傳動套203的凹槽始終保持相嚙合狀態，藉由傳動滑銷204的錐部將電機軸的旋轉運動傳遞至傳動套203，其中，三個傳動滑銷204以可滑動方式沿徑向均勻設置於聯軸器202內，該傳動套203的多個凹槽的形狀和位置與該傳動滑銷204的錐部的形狀和位置相匹配。傳動套203與 垂向運動機構3相配合，從而進一步將電機軸的運動傳遞至垂向運動機構3，藉由垂向運動機構3，將交接機械手4由初始位置移動到交接位置，矽片曝光完成後，再由交接位置回到初始位置的循環工作。在送入、移出的工作過程中，如突遇碰撞，電機負載扭矩增大，當電機軸所輸出的扭矩超過限定值時，如圖3所示，作用在傳動滑銷204錐部上的力瞬間加大，使傳動滑銷204在超負載力的作用下，進一步擠壓壓縮彈簧206，直至傳動滑銷204的錐部與傳動套203的凹槽中脫開，從而中斷伺服電機1輸出扭矩的傳遞，實現碰撞保護功能。此時壓縮彈簧206的長度為L2，由於壓縮彈簧206被進一步壓縮，因此L1>L2。碰撞保護機構2還包括固定連接在聯軸器202上的一定位銷207以及固定連接在傳動套203上的一行程開關208，在正常工作時，聯軸器202與傳動套203沒有產生相對的轉動，定位銷207與行程開關208保持初始位置(不接觸)，在發生碰撞的過程中，聯軸器202與傳動套203產生了相對的轉動，定位銷207與行程開關208接觸發出信號，以控制伺服電機1停止。當碰撞解除，慢速點動伺服電機1或手動旋轉傳動套203至聯軸器202的錐部進入傳動套203的下一個凹槽內，恢復正常工作。電機扭矩的傳遞是藉由作用在傳動滑銷204錐部上的摩擦分力實現的，藉由調節壓縮彈簧的預緊力達到調節摩擦力的大小，從而調節扭矩。扭矩限定值，即對應於將彈簧206從L1長度壓縮為L2長度所需的摩擦分力大小，可藉由調節彈簧座205在聯軸器202孔內的位置來設定。
當然，除了機械的碰撞保護外，本發明可選的具有常規電流超載保護，電流過大時，可以中止電機的旋轉。該技術相對成熟，在本發明中不作詳細說明。
本說明書中所述的只是本發明的較佳具體實施例，以上實施例僅用以說明本發明的技術方案而非對本發明的限制。凡發明所屬技術領域中具有通常知識者依本發明的構思藉由邏輯分析、推理或者有限的實驗可以得到的技術方案，皆應在本發明的範圍之內。
1‧‧‧伺服電機
2‧‧‧保護機構
3‧‧‧垂向運動機構
4‧‧‧交接機械手

Claims (9)

  1. 一種矽片邊緣保護裝置，包括電氣控制模組和垂向運動機構，該電氣控制模組包括一伺服電機用於產生一旋轉運動，其特徵在於，該矽片邊緣保護裝置還包括一保護機構，其包括：一聯軸器，固定連接於該伺服電機的一電機軸且該聯軸器具有多個第一連接部件；一傳動套，固定連接於該垂向運動機構且具有多個第二連接部件，該多個第一和第二連接部件之間以可活動方式相連，使得：當該伺服電機的該電機軸輸出的扭矩未超過一限定值時，該多個第一和第二連接部件相嚙合，進而該伺服電機的旋轉運動被傳遞至該垂向運動機構並驅動該垂向運動機構產生垂向運動；以及當該伺服電機的該電機軸輸出的扭矩超過該限定值時，該多個第一連接部件與該多個第二連接部件斷開連接，從而防止該伺服電機的旋轉運動被傳遞至該垂向運動機構。
  2. 如申請專利範圍第1項之矽片邊緣保護裝置，其中，該聯軸器大致為圓柱形，該傳動套具有沿周向環繞在該聯軸器外周的一環形側壁，該多個第一連接部件沿周向設於該聯軸器上，且每個第一連接部件具有一端部沿徑向凸出於該聯軸器的表面，該多個第二連接部件是沿周向形成於該環形側壁的內表面上的多個凹槽，該多個凹槽的形狀和位置與該多個第一連接部件的端部的形狀和位置相匹配。
  3. 如申請專利範圍第2項之矽片邊緣保護裝置，其中，該每個第一連接部件包括：一傳動滑銷，以可滑動方式沿徑向設置於該聯軸器內，且具有一 端部凸出於該聯軸器的表面；以及一壓縮彈簧設於該傳動滑銷外周，該壓縮彈簧的一端固定在一彈簧座上，另一端抵頂在該傳動滑銷的該端部上，從而向該傳動滑銷的該端部施加一個朝向該傳動套上的相應凹槽的力。
  4. 如申請專利範圍第3項之矽片邊緣保護裝置，其中，該壓縮彈簧被配置為當該伺服電機的該電機軸輸出的扭矩未超過限定值時，將該每個傳動滑銷的端部壓緊在該傳動套的對應凹槽內，當該伺服電機的該電機軸輸出的扭矩超過限定值時，該每個傳動滑銷的端部能夠相對該傳動套旋轉從而從該傳動套的對應凹槽中脫出。
  5. 如申請專利範圍第3或4項之矽片邊緣保護裝置，其中，該壓縮彈簧施加在該傳動滑銷的該端部上的力的大小由該彈簧座在該聯軸器內的徑向位置決定。
  6. 如申請專利範圍第3或4項之矽片邊緣保護裝置，其中，該傳動滑銷的端部為自該聯軸器向該傳動套直徑逐漸減小的錐形，該凹槽的形狀與該傳動滑銷的端部的形狀相匹配。
  7. 如申請專利範圍第1項之矽片邊緣保護裝置，其中，該保護機構還包括一開關裝置，用於當該多個第一連接部件與該多個第二連接部件斷開連接時，控制該伺服電機停止輸出扭矩。
  8. 如申請專利範圍第7項之矽片邊緣保護裝置，其中，該開關裝置包括固定連接在該聯軸器上的一定位銷以及固定連接在該傳動套上的一行程開關，使得：當該多個第一連接部件與該多個第二連接部件連接時，該定位銷與該行程開關不接觸；以及當該多個第一連接部件與該多個第二連接部件斷開連接時，該定 位銷與該行程開關接觸，控制該伺服電機停止輸出扭矩。
  9. 如申請專利範圍第1項之矽片邊緣保護裝置，其中，該第一、第二連接部件的數量為3個。
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