WO2015096795A1 - 一种具有碰撞保护功能的硅片边缘保护装置 - Google Patents

一种具有碰撞保护功能的硅片边缘保护装置 Download PDF

Info

Publication number
WO2015096795A1
WO2015096795A1 PCT/CN2014/095044 CN2014095044W WO2015096795A1 WO 2015096795 A1 WO2015096795 A1 WO 2015096795A1 CN 2014095044 W CN2014095044 W CN 2014095044W WO 2015096795 A1 WO2015096795 A1 WO 2015096795A1
Authority
WO
WIPO (PCT)
Prior art keywords
connecting members
silicon wafer
servo motor
coupling
protection device
Prior art date
Application number
PCT/CN2014/095044
Other languages
English (en)
French (fr)
Inventor
黄静莉
朱岳彬
Original Assignee
上海微电子装备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海微电子装备有限公司 filed Critical 上海微电子装备有限公司
Priority to KR1020167018798A priority Critical patent/KR20160098379A/ko
Priority to US15/108,083 priority patent/US10041548B2/en
Priority to JP2016542929A priority patent/JP2017504202A/ja
Priority to SG11201605214UA priority patent/SG11201605214UA/en
Priority to EP14873788.5A priority patent/EP3088956A4/en
Publication of WO2015096795A1 publication Critical patent/WO2015096795A1/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
    • F16D7/00—Slip couplings, e.g. slipping on overload, for absorbing shock
    • F16D7/04—Slip couplings, e.g. slipping on overload, for absorbing shock of the ratchet type
    • F16D7/048—Slip couplings, e.g. slipping on overload, for absorbing shock of the ratchet type with parts moving radially between engagement and disengagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Definitions

  • the present invention relates to the field of semiconductor manufacturing equipment, and in particular to a silicon wafer edge protection device for a lithography machine having a collision protection function.
  • the silicon wafer edge protection device is a device for protecting the silicon wafer edge while improving the silicon wafer production efficiency in the field of integrated circuit manufacturing technology, and is capable of protecting the edge of the silicon wafer while performing the exposure and edge protection of the silicon wafer.
  • the device needs to be installed inside the exposure device (lithography machine), and needs to maintain the correct relative position relationship with the workpiece table.
  • the workpiece table carries the silicon wafer for rapid movement to the handover position, and the device protects the edge protection ring from being exposed. Above the silicon wafer to achieve edge protection when exposed to silicon.
  • the device under such working conditions and space environment needs to have high reliability.
  • China's invention patent 200910055394X discloses a silicon wafer edge protection method and device and the edge protection device mentioned in the Chinese invention patent 201010102423.6 silicon wafer edge protection device and its application method, no collision safety in terms of mechanical aspect or pneumatic control The protection function, collision in the working process can not protect the silicon wafer and the lithography machine, and there is a potential danger.
  • the present invention provides a silicon wafer edge protection device including an electrical control module and a vertical motion mechanism, the electrical control module including a servo motor for generating a rotational motion, the silicon wafer
  • the edge protection device further includes a protection mechanism including: a shaft fixedly coupled to a motor shaft of the servo motor and having a plurality of first connecting members; a driving sleeve fixedly coupled to the vertical moving mechanism and having a plurality of second connecting members
  • the plurality of first and second connecting members are movably connected to each other such that when the torque output by the motor shaft of the servo motor does not exceed a limit value, the plurality of first and second connecting members Engaging, whereby the rotational motion of the servo motor is transmitted to the vertical motion mechanism and driving the vertical motion mechanism to generate a vertical motion; and when the torque output by the motor shaft of the servo motor exceeds the limit value, A plurality of first connecting members are disconnected from the plurality of second connecting members, thereby preventing rotational motion of
  • the coupling is substantially cylindrical
  • the transmission sleeve has an annular side wall circumferentially surrounding the outer circumference of the coupling
  • the plurality of first connecting members are circumferentially disposed on the coupling
  • Each of the first connecting members has a surface that protrudes radially from the coupling at one end
  • the plurality of second connecting members are a plurality of grooves formed on the inner surface of the annular side wall in a circumferential direction, The shape and position of the plurality of grooves match the shape and position of the ends of the plurality of first connecting members.
  • each of the first connecting members comprises: a driving slide pin slidably disposed in the coupling in a radial direction, and having a surface with one end protruding from the coupling; and a compression spring setting On the outer circumference of the drive slide pin, one end of the compression spring is fixed on a spring seat, and the other end is abutted on the end of the drive slide pin, so as to apply an orientation to the end of the drive slide pin. The force of the corresponding groove.
  • the compression spring is configured to press the end of each of the drive slide pins into a corresponding groove of the drive sleeve when the torque output by the motor shaft of the servo motor does not exceed a limit value, when the servo motor When the torque output by the motor shaft exceeds a limit value, the end of each of the drive slide pins can be rotated relative to the drive sleeve to escape from the corresponding groove of the drive sleeve.
  • the amount of force exerted by the compression spring on the end of the drive slide pin is determined by the radial position of the spring seat within the coupling.
  • the end of the transmission sliding pin is a cone whose diameter gradually decreases from the coupling to the transmission sleeve.
  • the shape of the groove matches the shape of the end of the drive slide pin.
  • the protection mechanism further includes a switching device for controlling the servo motor to stop outputting torque when the plurality of first connecting members are disconnected from the plurality of second connecting members.
  • the switch device includes a positioning pin fixedly coupled to the coupling and a travel switch fixedly coupled to the driving sleeve, such that when the plurality of first connecting members are When the second connecting members are connected, the positioning pin is not in contact with the travel switch; and when the plurality of first connecting members are disconnected from the plurality of second connecting members, the positioning pin is in contact with the travel switch And controlling the servo motor to stop outputting torque.
  • the vertical movement mechanism includes a screw rod fixedly coupled to the drive sleeve.
  • the number of the first and second connecting members is three.
  • the silicon wafer edge protection device with collision protection function has the function of collision overload protection, eliminates the hidden danger of the accident, improves the safety and reliability of the lithography machine, and eliminates the damage rate of the silicon wafer.
  • FIG. 1 is a schematic structural view of a silicon wafer edge protection device with collision protection function according to the present invention
  • FIG. 2 is a schematic structural view of a collision protection mechanism of a silicon wafer edge protection device according to the present invention
  • FIG. 3 is a state diagram of the driving slide pin of the silicon wafer edge protection device after being taken out of the driving sleeve.
  • the present invention provides a silicon wafer edge protection device with collision protection function, which is connected with a handover robot 4, and the silicon wafer edge protection device is composed of an electrical control module (including a servo motor 1), a collision protection mechanism 2, and a vertical It is composed of the motion mechanism 3.
  • an electrical control module including a servo motor 1
  • a collision protection mechanism 2 a collision protection mechanism 2
  • a vertical It is composed of the motion mechanism 3.
  • the collision protection mechanism 2 is composed of a motor base 201, a coupling 202, a transmission sleeve 203, a transmission slide pin 204, a spring seat 205, a compression spring 206, a positioning pin 207, and a positioning bearing 209. And a limit switch 208.
  • the collision protection mechanism 2 is installed between the servo motor 1 and the vertical motion mechanism 3, and the upper end is input by the servo motor to the collision protection mechanism 2, and the lower end outputs the motion and the required torque to the vertical motion mechanism.
  • the screw 301 of 3 automatically separates the input and the output when an accidental collision occurs during the work, that is, the servo motor 1 that is driven is separated from the screw 301 of the vertical motion mechanism 3, and the drive is safely separated and stopped, thereby Protect the lithography machine and protect the silicon wafer.
  • the servo motor 1 is attached to the motor mount 201 of the collision protection mechanism 2 by screws, and the motor mount 201 of the collision protection mechanism 2 is rigidly mounted on the vertical motion mechanism 3.
  • the collision protection mechanism 2 transmits the rotational motion of the servo motor 1 to the vertical motion mechanism 3.
  • the vertical motion mechanism 3 changes the rotational motion of the motor into a linear motion, thereby carrying the transfer robot 4 mounted at the lower end of the vertical motion mechanism 3 into and out of the intersection position of the edge protection ring, and the handover robot 4 completes the placement and grasps the edge protection ring.
  • the action on the upper part of the silicon wafer finally realizes the edge protection function when the silicon wafer is exposed.
  • the servo motor 1 is started, and the motor shaft (not shown) of the servo motor 1 is rotated. Since the coupling 202 of the anti-collision protection mechanism 2 is fixedly coupled to the motor shaft, the rotation of the motor shaft is driven. Coupling 202 rotates at a constant speed.
  • Each drive slide pin 204 are mounted within the coupling 202 and each drive slide pin 204 has a surface that protrudes out of the coupling 202 at one end, the coupling 202 is generally cylindrical, and the compression spring 206 (initial length) L1) is respectively sleeved outside the driving slide pin 204, one end of each of the compression springs 206 is fixed on the spring seat 205, and the other end is abutted on the transmission sliding
  • the end of the pin 204 is applied to the end of the drive slide 204 with a force directed toward a corresponding recess in the drive sleeve 203, under the action of the compression spring 206 (when the compression spring 206 is in compression)
  • the taper of the three drive slide pins 204 (which protrudes radially from the surface of the coupling 202) is always in mesh with the groove of the drive sleeve 203, and the rotation of the motor shaft is performed by the taper of the drive slide pin 204.
  • the movement is transmitted to the drive sleeve 203, wherein the three drive slide pins 204 are slidably disposed radially evenly within the coupling 202, the shape and position of the plurality of grooves of the drive sleeve 203 being slippery with the drive The shape and position of the taper of the pin 204 match.
  • the drive sleeve 203 cooperates with the lead screw 301 of the vertical motion mechanism 3 to further transmit the motion of the motor shaft to the vertical motion mechanism 3, and the vertical motion mechanism 3 moves the handover robot 4 from the initial position to the handover position. After the wafer is exposed, it is returned to the initial position by the transfer position. During the work of feeding in and out, such as sudden collision, the motor load torque increases.
  • the collision protection mechanism 2 further includes a positioning pin 207 fixedly coupled to the coupling 202 and a stroke switch 208 fixedly coupled to the transmission sleeve 203.
  • the coupling 202 and the transmission sleeve 203 are not opposite to each other. Rotating, the positioning pin 207 and the travel switch 208 maintain an initial position (no contact).
  • the coupling 202 and the drive sleeve 203 are rotated relative to each other, and the positioning pin 207 is in contact with the travel switch 208 to send a signal to Control the servo motor 1 to stop.
  • the servo motor 1 is slowly jogged or the rotating sleeve 203 is manually rotated to the tapered portion of the coupling 202 into the next groove of the transmission sleeve 203 to resume normal operation.
  • the transmission of the torque of the motor is achieved by the frictional component acting on the taper of the drive slide pin 204, and the torque is adjusted by adjusting the preload of the compression spring to adjust the friction.
  • Torque limit value corresponding to compressing spring 206 from L1 length to L2 length
  • the amount of frictional force required can be set by adjusting the position of the spring seat 205 within the bore of the coupling 202.
  • the present invention optionally has conventional current overload protection, and when the current is too large, the rotation of the motor can be suspended. This technique is relatively mature and will not be described in detail in the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

一种硅片边缘保护装置，包括具有一伺服电机（1）的电气控制模块、垂向运动机构（3）以及一保护机构（2）。保护机构（2）包括：一联轴器（202），固定连接于伺服电机（1）的一电机轴且具有多个第一连接部件；一传动套（203），固定连接于垂向运动机构（3）且具有多个第二连接部件。多个第一和第二连接部件之间以可活动方式相连，使得：当伺服电机（1）的电机轴输出的扭矩未超过一限定值时，多个第一和第二连接部件相啮合；当伺服电机（1）的电机轴输出的扭矩超过限定值时，多个第一连接部件与多个第二连接部件断开连接，从而防止伺服电机（1）的旋转运动被传递至垂向运动机构（3）。

Description

一种具有碰撞保护功能的硅片边缘保护装置 技术领域
本发明涉及半导体制造装备技术领域，特别地涉及一种用于光刻机的具有碰撞保护功能的硅片边缘保护装置。
背景技术
硅片边缘保护装置是集成电路制造技术领域中，为提高硅片生产效率，对负胶工艺硅片曝光加工制造的同时对硅片边缘进行保护的一种装置，是实现硅片曝光及边缘保护同步进行的必备装置。该装置需安装在曝光设备(光刻机)内部，需与工件台保持着正确的相对位置关系，工件台携带硅片进行快速运动至交接位置，由该装置将边缘保护环放置在欲曝光的硅片上方，从而实现对硅片曝光时的边缘保护功能。在这种工况及空间环境工作下的装置，需具有很高的可靠性，无论什么原因，产生什么形式的碰撞，碰撞的冲击力或大或小，都会造成硅片的报废，降低光刻机的性能，甚至是损坏光刻机的后果。因此，提供一种更安全、更可靠的边缘保护装置显得尤为重要。
中国发明专利200910055394X公开的一种硅片边缘保护方法与装置及中国发明专利201010102423.6硅片边缘保护装置及其应用方法所提及的边缘保护装置，无论在机械方面还是气动控制方面，均无碰撞安全保护功能，工作过程中发生碰撞无法对硅片及光刻机进行保护，存在潜在危险。
发明内容
为克服现有技术中的不足，本发明提出一种硅片边缘保护装置，包括电气控制模块和垂向运动机构，所述电气控制模块包括一伺服电机用于产生一旋转运动，所述硅片边缘保护装置还包括一保护机构，其包括：一联 轴器，固定连接于所述伺服电机的一电机轴且所述联轴器具有多个第一连接部件；一传动套，固定连接于所述垂向运动机构且具有多个第二连接部件，所述多个第一和第二连接部件之间以可活动方式相连，使得：当所述伺服电机的电机轴输出的扭矩未超过一限定值时，所述多个第一和第二连接部件相啮合，进而伺服电机的旋转运动被传递至所述垂向运动机构并驱动垂向运动机构产生垂向运动；以及当所述伺服电机的电机轴输出的扭矩超过所述限定值时，所述多个第一连接部件与所述多个第二连接部件断开连接，从而防止所述伺服电机的旋转运动被传递至所述垂向运动机构。
优选地，所述联轴器大致为圆柱形，所述传动套具有沿周向环绕在联轴器外周的一环形侧壁，所述多个第一连接部件沿周向设于联轴器上，且每个第一连接部件具有一端部沿径向凸出于联轴器的表面，所述多个第二连接部件是沿周向形成于环形侧壁的内表面上的多个凹槽，所述多个凹槽的形状和位置与所述多个第一连接部件的端部的形状和位置相匹配。
优选地，所述每个第一连接部件包括：一传动滑销，以可滑动方式沿径向设置于联轴器内，且具有一端部凸出于联轴器的表面；以及一压缩弹簧设于传动滑销外周，所述压缩弹簧的一端固定在一弹簧座上，另一端抵顶在传动滑销的所述端部上，从而向传动滑销的所述端部施加一个朝向传动套上的相应凹槽的力。
优选地，所述压缩弹簧被配置为当伺服电机的电机轴输出的扭矩未超过限定值时，将所述每个传动滑销的端部压紧在传动套的对应凹槽内，当伺服电机的电机轴输出的扭矩超过限定值时，所述每个传动滑销的端部能够相对传动套旋转从而从传动套的对应凹槽中脱出。
优选地，所述压缩弹簧施加在传动滑销的所述端部上的力的大小由弹簧座在联轴器内的径向位置决定。
优选地，所述传动滑销的端部为自联轴器向传动套直径逐渐减小的锥 形，所述凹槽的形状与传动滑销的端部的形状相匹配。
优选地，所述保护机构还包括一开关装置，用于当所述多个第一连接部件与所述多个第二连接部件断开连接时，控制所述伺服电机停止输出扭矩。
优选地，所述开关装置包括固定连接在所述联轴器上的一定位销以及固定连接在所述传动套上的一行程开关，使得：当所述多个第一连接部件与所述多个第二连接部件连接时，所述定位销与行程开关不接触；以及当所述多个第一连接部件与所述多个第二连接部件断开连接时，所述定位销与行程开关接触，控制所述伺服电机停止输出扭矩。
优选地，所述垂向运动机构包括一丝杆与所述传动套固定连接。
优选地，所述第一、第二连接部件的数量为3个。
本发明具有碰撞保护功能的硅片边缘保护装置具有碰撞过载保护功能，杜绝了事故隐患，提高了光刻机的安全可靠性，消除了硅片的破损率。
附图说明
关于本发明的优点与精神可以通过以下的发明详述及所附图式得到进一步的了解。
图1为本发明具有碰撞保护功能的硅片边缘保护装置结构示意图；
图2为本发明硅片边缘保护装置的碰撞保护机构的结构示意图；
图3为本发明硅片边缘保护装置的传动滑销脱出传动套后的状态图。
具体实施方式
下面结合附图详细说明本发明的具体实施例。
如图1所示，本发明提出一种具有碰撞保护功能的硅片边缘保护装置，与交接机械手4连接，硅片边缘保护装置由电气控制模块(包括伺服电机1)、碰撞保护机构2及垂向运动机构3组成。所述电气控制模块的伺服电机1 安装于碰撞保护机构2之上，伺服电机1的旋转运动通过防碰撞保护机构2，传递给垂向运动机构3，垂向运动机构3将伺服电机的旋转运动变为直线运动，从而携带交接机械手4运动到预定的交接位置，进行硅片边缘保护环交接工作，最终实现硅片曝光的边缘保护。
如图2所示，根据一实施例，碰撞保护机构2是由电机座201、联轴器202、传动套203、传动滑销204、弹簧座205、压缩弹簧206、定位销207、定位轴承209以及行程开关208组成。碰撞保护机构2安装在伺服电机1与垂向运动机构3之间，其上端由伺服电机将运动及所需扭矩输入给碰撞保护机构2，其下端将运动及所需扭矩输出给垂向运动机构3的丝杆301，当工作过程中发生意外碰撞时，会自动地将输入与输出分离，即将驱动的伺服电机1与垂向运动机构3丝杆301分开，安全分离并停止驱动，从而起到保护光刻机、保护硅片的作用。
具体实施方式如下：
伺服电机1通过螺钉安装于碰撞保护机构2的电机座201之上，碰撞保护机构2的电机座201刚性地安装于垂向运动机构3之上。碰撞保护机构2，将伺服电机1的旋转运动，传递给垂向运动机构3。垂向运动机构3，将电机的旋转运动变为直线运动，从而携带装在垂向运动机构3下端的交接机械手4进入、移出边缘保护环交接位置，交接机械手4完成放置、抓取边缘保护环于硅片上部的动作，最终实现硅片曝光时的边缘保护功能。
如图2所示，工作时，启动伺服电机1，伺服电机1的电机轴(未图示)旋转，由于防碰撞保护机构2的联轴器202与电机轴固定连接，电机轴的旋转会带动联轴器202等速旋转。三个传动滑销204装在联轴器202内且每个传动滑销204具有一端部凸出于联轴器202的表面，所述联轴器202大致为圆柱形，压缩弹簧206(初始长度为L1)分别套在传动滑销204外、所述每个压缩弹簧206的一端固定在弹簧座205上，另一端抵顶在传动滑 销204的所述端部上，从而向传动滑销204的所述端部施加一个朝向传动套203上的相应凹槽的力，在压缩弹簧206作用下(此时压缩弹簧206处于压缩状态)，三个传动滑销204的锥部(沿径向凸出于联轴器202的表面)与传动套203的凹槽始终保持相啮合状态，通过传动滑销204的锥部将电机轴的旋转运动传递至传动套203，其中，三个传动滑销204以可滑动方式沿径向均匀设置于联轴器202内，所述传动套203的多个凹槽的形状和位置与所述传动滑销204的锥部的形状和位置相匹配。传动套203与垂向运动机构3的丝杠301相配合，从而进一步将电机轴的运动传递至垂向运动机构3，通过垂向运动机构3，将交接机械手4由初始位置移动到交接位置，硅片曝光完成后，再由交接位置回到初始位置的循环工作。在送入、移出的工作过程中，如突遇碰撞，电机负载扭矩增大，当电机轴所输出的扭矩超过限定值时，如图3所示，作用在传动滑销204锥部上的力瞬间加大，使传动滑销204在超负载力的作用下，进一步挤压压缩弹簧206，直至传动滑销204的锥部与传动套203的凹槽中脱开，从而中断伺服电机1输出扭矩的传递，实现碰撞保护功能。此时压缩弹簧206的长度为L2，由于压缩弹簧206被进一步压缩，因此L1＞L2。碰撞保护机构2还包括固定连接在联轴器202上的一定位销207以及固定连接在传动套203上的一行程开关208，在正常工作时，联轴器202与传动套203没有产生相对的转动，定位销207与行程开关208保持初始位置(不接触)，在发生碰撞的过程中，联轴器202与传动套203产生了相对的转动，定位销207与行程开关208接触发出信号，以控制伺服电机1停止。当碰撞解除，慢速点动伺服电机1或手动旋转传动套203至联轴器202的锥部进入传动套203的下一个凹槽内，恢复正常工作。电机扭矩的传递是通过作用在传动滑销204锥部上的摩擦分力实现的，通过调节压缩弹簧的预紧力达到调节摩擦力的大小，从而调节扭矩。扭矩限定值，即对应于将弹簧206从L1长度压缩为L2长度 所需的摩擦分力大小，可通过调节弹簧座205在联轴器202孔内的位置来设定。
当然，除了机械的碰撞保护外，本发明可选的具有常规电流过载保护，电流过大时，可以中止电机的旋转。该技术相对成熟，在本发明中不作详细说明。
本说明书中所述的只是本发明的较佳具体实施例，以上实施例仅用以说明本发明的技术方案而非对本发明的限制。凡本领域技术人员依本发明的构思通过逻辑分析、推理或者有限的实验可以得到的技术方案，皆应在本发明的范围之内。

Claims (10)

  1. 一种硅片边缘保护装置，包括电气控制模块和垂向运动机构，所述电气控制模块包括一伺服电机用于产生一旋转运动，其特征在于，所述硅片边缘保护装置还包括一保护机构，其包括：
    一联轴器，固定连接于所述伺服电机的一电机轴且所述联轴器具有多个第一连接部件；
    一传动套，固定连接于所述垂向运动机构且具有多个第二连接部件，所述多个第一和第二连接部件之间以可活动方式相连，使得：
    当所述伺服电机的电机轴输出的扭矩未超过一限定值时，所述多个第一和第二连接部件相啮合，进而伺服电机的旋转运动被传递至所述垂向运动机构并驱动垂向运动机构产生垂向运动；以及
    当所述伺服电机的电机轴输出的扭矩超过所述限定值时，所述多个第一连接部件与所述多个第二连接部件断开连接，从而防止所述伺服电机的旋转运动被传递至所述垂向运动机构。
  2. 如权利要求1所述的硅片边缘保护装置，其特征在于：所述联轴器大致为圆柱形，所述传动套具有沿周向环绕在联轴器外周的一环形侧壁，所述多个第一连接部件沿周向设于联轴器上，且每个第一连接部件具有一端部沿径向凸出于联轴器的表面，所述多个第二连接部件是沿周向形成于环形侧壁的内表面上的多个凹槽，所述多个凹槽的形状和位置与所述多个第一连接部件的端部的形状和位置相匹配。
  3. 如权利要求2所述的硅片边缘保护装置，其特征在于：所述每个第一连接部件包括：
    一传动滑销，以可滑动方式沿径向设置于联轴器内，且具有一端部凸出于联轴器的表面；以及
    一压缩弹簧设于传动滑销外周，所述压缩弹簧的一端固定在一弹簧座 上，另一端抵顶在传动滑销的所述端部上，从而向传动滑销的所述端部施加一个朝向传动套上的相应凹槽的力。
  4. 如权利要求3所述的硅片边缘保护装置，其特征在于：所述压缩弹簧被配置为当伺服电机的电机轴输出的扭矩未超过限定值时，将所述每个传动滑销的端部压紧在传动套的对应凹槽内，当伺服电机的电机轴输出的扭矩超过限定值时，所述每个传动滑销的端部能够相对传动套旋转从而从传动套的对应凹槽中脱出。
  5. 如权利要求3或4所述的硅片边缘保护装置，其特征在于：所述压缩弹簧施加在传动滑销的所述端部上的力的大小由弹簧座在联轴器内的径向位置决定。
  6. 如权利要求3或4所述的硅片边缘保护装置，其特征在于：所述传动滑销的端部为自联轴器向传动套直径逐渐减小的锥形，所述凹槽的形状与传动滑销的端部的形状相匹配。
  7. 如权利要求1所述的硅片边缘保护装置，其特征在于：所述保护机构还包括一开关装置，用于当所述多个第一连接部件与所述多个第二连接部件断开连接时，控制所述伺服电机停止输出扭矩。
  8. 如权利要求7所述的硅片边缘保护装置，其特征在于：所述开关装置包括固定连接在所述联轴器上的一定位销以及固定连接在所述传动套上的一行程开关，使得：
    当所述多个第一连接部件与所述多个第二连接部件连接时，所述定位销与行程开关不接触；以及
    当所述多个第一连接部件与所述多个第二连接部件断开连接时，所述定位销与行程开关接触，控制所述伺服电机停止输出扭矩。
  9. 如权利要求1所述的硅片边缘保护装置，其特征在于：所述垂向运动机构包括一丝杆与所述传动套固定连接。
  10. 如权利要求1所述的硅片边缘保护装置，其特征在于：所述第一、第二连接部件的数量为3个。
PCT/CN2014/095044 2013-12-27 2014-12-26 一种具有碰撞保护功能的硅片边缘保护装置 WO2015096795A1 (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020167018798A KR20160098379A (ko) 2013-12-27 2014-12-26 충돌 보호 기능을 구비하는 실리콘 웨이퍼 엣지 보호장치
US15/108,083 US10041548B2 (en) 2013-12-27 2014-12-26 Silicon wafer edge protection device with collision protection function
JP2016542929A JP2017504202A (ja) 2013-12-27 2014-12-26 衝突防止機能付きシリコンウエハエッジ保護装置
SG11201605214UA SG11201605214UA (en) 2013-12-27 2014-12-26 Silicon wafer edge protection device with collision protection function
EP14873788.5A EP3088956A4 (en) 2013-12-27 2014-12-26 SILICON WAFER PROTECTION DEVICE WITH COLLISION PROTECTION FUNCTION

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310734687.7 2013-12-27
CN201310734687.7A CN104749892B (zh) 2013-12-27 2013-12-27 一种具有碰撞保护功能的硅片边缘保护装置

Publications (1)

Publication Number Publication Date
WO2015096795A1 true WO2015096795A1 (zh) 2015-07-02

Family

ID=53477584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/095044 WO2015096795A1 (zh) 2013-12-27 2014-12-26 一种具有碰撞保护功能的硅片边缘保护装置

Country Status (8)

Country Link
US (1) US10041548B2 (zh)
EP (1) EP3088956A4 (zh)
JP (1) JP2017504202A (zh)
KR (1) KR20160098379A (zh)
CN (1) CN104749892B (zh)
SG (1) SG11201605214UA (zh)
TW (1) TWI584077B (zh)
WO (1) WO2015096795A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108193386A (zh) * 2018-04-09 2018-06-22 浙江鸿立缝制设备有限公司 一种缝纫机抬压脚的压力调节机构

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105366627B (zh) * 2015-11-24 2017-03-22 中北大学 一种适应高过载环境的mems器件保护机构
CN105937051A (zh) * 2015-11-27 2016-09-14 上海广奕电子科技股份有限公司 一种立式扩散炉的安全防护装置
US10016901B2 (en) * 2016-05-04 2018-07-10 X Development Llc Sprung worm gripper for a robotic device
CN106926511B (zh) * 2017-05-11 2018-06-29 荣成华东锻压机床股份有限公司 机械压力机机电过载保护及拉伸装置及方法
CN111075850A (zh) * 2020-01-11 2020-04-28 沈阳工具标准件制造有限公司 一种抗机械冲击过载保护装置
US11295973B2 (en) * 2020-02-11 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for automated wafer carrier handling

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740009A (en) * 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
CN101487990A (zh) * 2009-02-27 2009-07-22 上海微电子装备有限公司 带边缘曝光保护的工件台
CN102012639A (zh) * 2009-09-04 2011-04-13 上海微电子装备有限公司 一种硅片边缘保护方法与装置
CN102141735A (zh) * 2010-01-28 2011-08-03 上海微电子装备有限公司 硅片边缘保护装置及其应用方法
CN102203930A (zh) * 2008-10-30 2011-09-28 朗姆研究公司 触觉晶片升降器及其操作方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012783C2 (de) * 1980-04-02 1982-03-18 Jean Walterscheid Gmbh, 5204 Lohmar Ausrückkupplung
JPS6392824A (ja) * 1986-10-02 1988-04-23 Mitsubishi Electric Corp トルクリミツタ
JP2523145B2 (ja) * 1987-11-17 1996-08-07 東京エレクトロン東北株式会社 被処理体の押し上げ機
JP3563227B2 (ja) * 1997-03-14 2004-09-08 大日本スクリーン製造株式会社 駆動装置およびそれを用いた基板処理装置
US5916325A (en) * 1997-04-03 1999-06-29 Dresser Industries, Inc. Actuator assembly and torque limiting system for same
JP2000199530A (ja) * 1998-07-24 2000-07-18 Matsushita Electric Ind Co Ltd トルクリミッタ及びトルク伝達装置
JP2000240382A (ja) * 1999-02-24 2000-09-05 Yamato Tape Kk 電動機及び電動シャッター
TW446858B (en) * 1999-04-21 2001-07-21 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using such a lithographic projection apparatus, and device made by such a method of manufacturing
EP1111471B1 (en) * 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographic projection apparatus with collision preventing device
JP2003017430A (ja) * 2001-06-28 2003-01-17 Dainippon Screen Mfg Co Ltd 基板の熱処理装置
EP1457829A1 (en) * 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
JP2008016825A (ja) * 2006-06-09 2008-01-24 Canon Inc 露光装置、除去方法及びデバイス製造方法
FR2931131B1 (fr) * 2008-05-19 2010-08-13 Eurocopter France Dispositif d'accouplement escamotable et verin de trim associe
JP2010203129A (ja) * 2009-03-03 2010-09-16 Nabtesco Corp 自動ドア開閉装置及びトルクリミッタ
CN101609193B (zh) 2009-07-24 2011-05-11 上海微电子装备有限公司 一种可动光学元件调节定位装置
US8672110B2 (en) * 2010-09-29 2014-03-18 Actuant Corporation Automatic torque overload clutch
TWI419778B (zh) * 2011-03-16 2013-12-21 Ind Tech Res Inst 順應性關節
SE1100498A1 (sv) * 2011-06-27 2012-12-28 Curt Gunnar Falk Säkerhetskoppling

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740009A (en) * 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
CN102203930A (zh) * 2008-10-30 2011-09-28 朗姆研究公司 触觉晶片升降器及其操作方法
CN101487990A (zh) * 2009-02-27 2009-07-22 上海微电子装备有限公司 带边缘曝光保护的工件台
CN102012639A (zh) * 2009-09-04 2011-04-13 上海微电子装备有限公司 一种硅片边缘保护方法与装置
CN102141735A (zh) * 2010-01-28 2011-08-03 上海微电子装备有限公司 硅片边缘保护装置及其应用方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3088956A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108193386A (zh) * 2018-04-09 2018-06-22 浙江鸿立缝制设备有限公司 一种缝纫机抬压脚的压力调节机构
CN108193386B (zh) * 2018-04-09 2023-12-15 浙江鸿立缝制设备有限公司 一种缝纫机抬压脚的压力调节机构

Also Published As

Publication number Publication date
EP3088956A4 (en) 2016-12-28
US20160341256A1 (en) 2016-11-24
EP3088956A1 (en) 2016-11-02
TWI584077B (zh) 2017-05-21
US10041548B2 (en) 2018-08-07
KR20160098379A (ko) 2016-08-18
JP2017504202A (ja) 2017-02-02
SG11201605214UA (en) 2016-08-30
CN104749892B (zh) 2017-02-01
TW201531815A (zh) 2015-08-16
CN104749892A (zh) 2015-07-01

Similar Documents

Publication Publication Date Title
WO2015096795A1 (zh) 一种具有碰撞保护功能的硅片边缘保护装置
EP3141316B1 (en) Blind riveting apparatus and method
US10018258B2 (en) Actuator having an associated locking device and torque limiter
US11135729B2 (en) Method and system for automatically changing shafts
CN204572851U (zh) 扭矩离合器
CN106984995B (zh) 数控刀架切削过载保护装置
US3325837A (en) Screw thread cutting apparatus with yieldable clutch drive means
TW201726334A (zh) 機器手臂解除剎車的方法（一）
US2367863A (en) Centrifugal chuck
CN106032234A (zh) 一种自动复位防坠安全器
CN102889352A (zh) 一种用于丝杠和丝母传动限位的逆止器
CN117124216B (zh) 一种非制冷型红外探测器封壳加工装置
CN204493501U (zh) 新型钢球限扭矩装置
EP3514336A1 (en) Steam turbine overspeed protection system, and steam turbine
CN105822742A (zh) 旋转轴系的限位与自动解锁机构
CN107387588A (zh) 具有自锁功能的丝杠传动齿啮合式离合器
CN105794092A (zh) 具有手动驱动装置的电气致动器
CN106704408A (zh) 可控型机械式软启动系统及方法
CN103170545A (zh) 一种用于旋压机的离心夹紧机构
CN103644213B (zh) 一种力矩限制器
CN106514623B (zh) 一种用于套索的微型可控夹头机构
SE532395C2 (sv) Kraftverktyg för åtdragning av skruvförband samt frikoppling
CN204628345U (zh) 带有过载保护的联轴器
CN104669291A (zh) 一种仿生四指形封闭机械手
CN204471397U (zh) 一种仿生四指形封闭机械手

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14873788

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016542929

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 15108083

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20167018798

Country of ref document: KR

Kind code of ref document: A

REEP Request for entry into the european phase

Ref document number: 2014873788

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2014873788

Country of ref document: EP