TWI583959B - Contact terminals and probe cards - Google Patents

Description

Contact terminal support and probe card

The present invention relates to a support for a contact terminal and a probe card.

In order to perform inspection of each semiconductor device formed on the wafer, a needle measuring machine is used as the inspection device. The needle measuring machine includes a base on which the wafer is placed, and a probe card that can face the base. The probe card includes a plate-shaped susceptor and a probe that is disposed such that a facing surface facing the base in the susceptor is disposed as a plurality of columnar contact terminals facing the electrode pads in the semiconductor device of the wafer.

In the needle measuring machine, when the wafer placed on the base and the probe card face each other, the probes of the probe card are in contact with the electrode pads in the semiconductor device, and the electrical flows from the probes to the connections. The circuit of the semiconductor device of each electrode pad checks the conduction state of the circuit and the like.

In recent years, from the viewpoint of improving inspection efficiency, a probe card having simultaneously inspected a plurality of semiconductor devices formed on one wafer has been developed. In the probe card, thousands of electrode pads are arranged corresponding to a plurality of semiconductor devices, and tens of thousands of probes are sometimes disposed. Such a probe card has a rectangular parallelepiped casing having a plurality of probe holes, The probe is inserted into each probe hole, and the housing supports each probe. In the case of the case, it is known that a plurality of metal sheets are laminated and the metal sheets are diffusion bonded (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Document]

[Patent Document 1] International Publication WO2009/104589

However, in recent years, in order to inspect, the current value of the probe is increased, and as the circuit of the semiconductor device is miniaturized, the diameter of the probe is increased, for example, a probe having a diameter of 10 μm. Circulating a large current of 1A~2A. In the probe, the resistance of the probe decreases due to the decrease in the conduction of the current, so that when the probe flows a large current, the probe generates a lot of heat and the temperature becomes extremely high. The result is aggravated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a support body and a probe card of a contact terminal which can prevent deterioration of a contact terminal.

In order to achieve the above object, a support for a contact terminal according to the first aspect of the invention is a support for inspecting a plurality of contact terminals of a probe card of a semiconductor device formed on a semiconductor substrate, and is characterized in that: a body formed by laminating a plurality of plate-like members; a plurality of contact terminal holes penetrating the body in a thickness direction; and a refrigerant flow path built in the body, wherein the plurality of contact terminals are inserted into the plurality of contact terminal holes The contact terminal hole is formed by opposing openings in the thickness direction of the plurality of plate-like members that are formed in the thickness direction of the plurality of plate-like members And having a contact portion that is in contact with the contact terminal that is inserted in the above, and the plate member is made of metal.

In the support system of the contact terminal according to the first aspect of the invention, the refrigerant flow path is obtained by removing a plurality of plate shapes of the plurality of plate-shaped members. A part of each of the members is formed by overlapping a plurality of plate-like members from which the portion is removed.

In the contact terminal support according to claim 1, wherein the contact portion is formed by at least one of the plurality of plate-shaped members. The position is formed by shifting the position of the opening of the other plate-like member.

In the contact terminal support according to claim 1, wherein the contact portion is formed by at least one of the plurality of plate-shaped members. The area is smaller than the area of the opening of the other plate-like member.

In order to achieve the above object, a support for a contact terminal according to the fifth aspect of the invention is a support for inspecting a plurality of contact terminals of a probe card of a semiconductor device formed on a semiconductor substrate, and is characterized in that: a pair of plate-like members facing each other; a heat conductor filled between the pair of plate-like members; and a plurality of layers extending in a thickness direction of each of the pair of plate-like members a plurality of contact terminal holes formed by the openings facing each other, wherein the plurality of contact terminals are inserted into the plurality of contact terminal holes to be in contact with the heat conductor, and the heat transfer is performed The conductor is buried in the refrigerant flow path, and the plate-shaped member is made of metal.

In the support system of the contact terminal according to the sixth aspect of the invention, in the support body of the contact terminal described in claim 5, the position of the opening of one of the pair of plate-shaped members is The other one of the pair of plate-like members is displaced in position such that a contact terminal inserted into the contact terminal hole contacts at least one of the pair of plate-shaped members.

In order to achieve the above object, a probe card according to claim 7 is a probe card for inspecting a semiconductor device formed on a semiconductor substrate, and is characterized in that: a support card having a plurality of contact terminals, wherein the support has a main body formed by laminating a plurality of plate-like members, a plurality of contact terminal holes penetrating the main body in a thickness direction, and a refrigerant flow path built in the main body, wherein the plurality of contact terminals are inserted into the plurality of contact terminal holes, The contact terminal hole is formed by facing the opening portions of the plurality of plate-like members that penetrate the thickness direction of each of the plate-shaped members, and has a contact portion that comes into contact with the inserted contact terminal. The plate member is made of metal.

In order to achieve the above object, a probe card according to claim 8 is a probe card for inspecting a semiconductor device formed on a semiconductor substrate, and is characterized in that: a support card having a plurality of contact terminals, wherein the support has a pair of plate-like members facing each other, and a heat conductor filled between the pair of plate-like members, and a thickness direction of each of the pair of plate-like members penetrating through the respective plate-like members a plurality of contact terminal holes formed by the plurality of openings facing each other, wherein the plurality of contact terminals are inserted The plurality of contact terminal holes are in contact with the heat conductor, and a refrigerant flow path is buried in the heat conductor, and the plate member is made of metal.

According to the present invention, since the heat inserted into the contact terminal of the contact terminal hole penetrating through the main body is transmitted to the body cooled by the refrigerant flow path, the temperature of the contact terminal can be prevented from becoming extremely high and can be prevented. Deterioration of the contact terminals.

Further, according to the present invention, since the plurality of contact terminals are inserted into the plurality of contact terminal holes and come into contact with the heat conductor, the heat of the contact terminals is absorbed by the heat conductor, and the temperature of the contact terminals can be prevented from becoming extremely high. Also, the deterioration of the contact terminals can be prevented.

Hereinafter, the embodiment of the present invention will be described with reference to the drawings.

First, a probe card according to a first embodiment of the present invention will be described.

Fig. 1 is a view schematically showing the configuration of a probe card according to the present embodiment, wherein Fig. 1(A) is a bottom view and Fig. 1(B) is a side view.

In FIGS. 1(A) and 1(B), the probe card 10 includes a disk-shaped susceptor 11 and is disposed on a surface of the susceptor 11 that faces a semiconductor wafer (not shown) ( Most of the round bar probes 12 (contact terminals) in the lower part of Fig. 1 (B). Each probe 12 corresponds to a semiconductor wafer The positions of the electrode pads of the plurality of semiconductor devices are arranged.

In the probe card 10, each probe 12 is not directly attached to the susceptor 11, and is attached to the housing 13 which is a rectangular parallelepiped probe support. The housing 13 is attached to the pedestal via a ST (Space Transformer) substrate 32. 11.

Fig. 2 is an enlarged partial cross-sectional view showing the configuration of a casing in Fig. 1. In Fig. 2, the thickness direction of the casing 13 is along the upper and lower directions in the drawing, and the same applies to the following in the third to eighth drawings.

In Fig. 2, the casing 13 is provided with a plurality of laminated plate-like members, for example, a body 15 composed of a thin metal plate 14, and a plurality of cylindrical probe holes 16 penetrating the body 15 in the thickness direction (contact The terminal hole) and the plurality of refrigerant flow paths 17 built in the body 15. One probe 12 is inserted into each of the probe holes 16. Further, in the second drawing, for the sake of explanation, only one probe hole 16 and the configuration around the one probe hole 16 are shown.

In the casing 13, the metal thin plates 14 are diffusion-bonded to each other, and the diameter of the probe holes 16 is set to be larger than the diameter of the probe 12, for example, the difference between the two diameters is set to be 1 μm to 800 μm. That is, the sides of the probe 12 and the probe hole 16 are in principle not in contact. In each of the refrigerant flow paths 17, a refrigerant such as a gas or a liquid, such as cold air or Galden (registered trademark), is passed through to cool the casing 13. Each of the refrigerant flow paths 17 is disposed in the vicinity of the probe hole 16.

Since the diameter of the probe 12 is several tens of micrometers, since the resistance value is large, when the semiconductor device is inspected, Joule heat is generated in the probe 12 when a large current flows, but the housing 13 is cooled, so it is inserted into the probe. The Joule heat of the probe 12 of the hole 16 is radiated to the side of the probe hole 16, and by being present The gas between the probe 12 and the side surface of the probe hole 16 is, for example, transmitted to the side surface of the probe hole 16 and absorbed by the casing 13 cooled by the respective refrigerant flow paths 17. That is, the casing 13 cools each of the probes 12.

Fig. 3 is a plan view showing a method of manufacturing the casing in Fig. 2;

First, each of the plurality of thin metal sheets 14 is formed by a plurality of openings 13 that are formed in the thickness direction by machining or etching, and a plurality of first thin plates 14a are formed, and the other plurality of thin metal plates 14 are penetrated in the thickness direction. The plurality of openings 18 are formed, and a plurality of portions of the other plurality of thin metal plates 14 are removed to form the removed portion 19, thereby forming a plurality of second thin plates 14b.

Next, the plurality of first thin plates 14a and the plurality of second thin plates 14b are stacked in a specific order. At this time, when the plurality of first thin plates 14a and the plurality of second thin plates 14b are overlapped with each other in the adjacent two thin plates (the first thin plate 14a and/or the second thin plate 14b), the respective probes are formed. Pinhole 16. In addition, when each of the second thin plates 14b is overlapped so that the respective removal portions 19 of the two adjacent second thin plates 14b face each other, each of the refrigerant flow paths 17 is formed (Fig. 3(A)).

Next, the main body 15 is formed by diffusion bonding or mutual bonding of the first thin plates 14a and the second thin plates 14b which are overlapped each other (Fig. 3(B)), and the present process is terminated.

When the casing 13 of the support body according to the present embodiment is used, the heat of the probe 12 inserted in each of the probe holes 16 penetrating the main body 15 is transmitted to the body cooled by the refrigerant flow path 17. 15, it is possible to prevent the temperature of the probe 12 from becoming very high and to prevent deterioration of the probe 12.

In the case of the casing 13, the second thin plate 14b of the removal portion 19 is formed by being partially removed, and the refrigerant flow path 17 is formed. Therefore, the refrigerant flow path 17 can be easily formed. Further, the probe holes 16 are formed by facing the openings 18 penetrating in the thickness direction of the first thin plate 14a or the second thin plate 14b. Therefore, the probe holes 16 can be easily formed.

In the case 13 described above, the metal thin plates 14 are laminated on the main body 15, but the plate members are not made of ceramics. The refrigerant flow path 17 is not limited to the smaller one shown in FIG. 2, and the refrigerant flow path 17 covering most of the thickness direction of the main body 15 may be disposed even if it is arranged as shown in FIG.

Furthermore, in the above-described housing 13, the sides of the probe 12 and the probe hole 16 are not in principle in contact, but even if one of the at least one metal thin plate 14 is partially protruded in the probe hole 16, the contact portion 20 is formed, and The contact portion 20 may be in contact with the probe 12 inserted into the probe hole 16 (Fig. 5(A), Fig. 5(B)). Accordingly, the contact portion 20 can reliably convey the heat of the probe 12 to the body 15 to be cooled.

The contact portion 20 is formed by opening at least one of the plurality of first thin plates 14a and second thin plates 14b (in the figure, one first thin plate 14a) of the plurality of main bodies 15 as shown in Fig. 5(A). The position of the portion 18 is formed by shifting from the position of the opening portion 18 of the other first thin plate 14a or the second thin plate 14b, or as shown in Fig. 5(B), by forming the plural of the main body 15 The diameter of the opening portion 18 of at least one of the thin plate 14a and the second thin plate 14b (one first thin plate 14a in the drawing) is smaller than the diameter of the opening portion 18 of the other first thin plate 14a or the second thin plate 14b. form. Accordingly, the contact portion 20 can be easily formed.

Further, the probe 12 is pressed against the side surface of the probe hole 16 by the contact portion 20 (Fig. 5(A)), or is in contact with the first thin plate 14a (or the second thin plate 14b) over the entire circumference. Therefore, it is easy to determine the probe hole 16 and thus to easily determine the position of the probe 12 to the housing 13, and further, the movement of the probe 12 relative to the housing 13 can be prevented.

Further, at least one of the contact portion 20 and the side surface of the probe 12 that is in contact with the contact portion 20 is covered with an insulating film, and the first thin plate 14a, the second thin plate 14b, and the probe 12 are not electrically connected to each other.

Next, a support body of a contact terminal according to a second embodiment of the present invention will be described.

Fig. 6 is an enlarged partial cross-sectional view schematically showing a configuration of a casing as a support body of a contact terminal according to the present embodiment. The housing of Fig. 6 is also applicable to the probe card 10 of Fig. 1.

In Fig. 6, the casing 21 is provided with a pair of plate-like members facing each other, for example, a pair of thin plates 22, 23, and a heat conductor 24 filled between the pair of thin plates 22, 23, and is housed in The refrigerant flow path 25 of the heat conductor 24.

Each of the thin plates 22 and 23 has a plurality of openings 26 and 27 penetrating in the thickness direction, and a pair of thin plates 22 and 23 are disposed so that the respective openings 26 and the openings 27 face each other, and are partially removed in each opening. The heat conductor 24 between the portion 26 and each of the openings 27 forms a plurality of cylindrical probe holes 28.

In the housing 21, the diameter of the probe hole 28 is set to be the probe 12 The diameter is almost the same. In particular, the diameter of the portion of the probe hole 28 formed by the heat conductor 24 is set to be slightly smaller than the diameter of the probe 12, for example, the difference between the two diameters is 1 μm to 800 μm. In the present embodiment, since the heat conductor 24 is configured by the deformation permitting material as will be described later, even if the diameter of the portion of the probe hole 28 formed by the heat conductor 24 is smaller than the diameter of the probe 12, The probe 12 is inserted into the probe hole 28, and the probe 12 inserted into the probe hole 28 is in contact with the heat conductor 24. The refrigerant or the liquid refrigerant flows through each of the refrigerant flow paths 25 to cool the casing 21. Each of the refrigerant flow paths 25 is disposed in the vicinity of the probe hole 28.

The Joule heat generated when the probe 12 flows a large current is transmitted to the heat conductor 24, and is absorbed by the casing 21 cooled by the respective refrigerant flow paths 25. That is, since the casing 21 cools the respective probes 12, it is possible to prevent the temperature of the probe 12 from becoming extremely high and to prevent deterioration of the probe 12.

The material constituting the heat conductor 24 is preferably a gel-like heat transfer material from the viewpoint of deformation allowance and outflow prevention, and is not particularly limited, but is also an uncured material or a cured product. Less elasticity is better. Specifically, it corresponds to 1~500Pa. s viscosity, 0.1~10W/m. A material having a thermal conductivity of K and a hardness of 1 to 70° (JIS K 6249), such as a mixed oil (manufactured by Shin-Etsu Chemical Co., Ltd.), a condensation-type RTV rubber (manufactured by Shin-Etsu Chemical Co., Ltd.), and a hardened oxygen-containing rubber ( Kneaded, liquid, or uncured silicone rubber (paste, gel), more specifically, an additional liquid silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd.) or a paste-like heat transfer gel (λ GEL (registered trademark)) (manufactured by TAICA Co., Ltd.) as a heat conductor 24 Use for materials.

As described above, in the present embodiment, the probe is not linear, and the probe may have a curved shape in order to improve the contact between the probe and the electrode pad. Since the thermal conductor 24 is configured by the deformation permitting material, the curved probe 12a can be inserted into the probe hole 28 (Fig. 7). At this time, since the contact area between the probe 12a and the heat conductor 24 is increased, the probes 12a can be efficiently cooled.

Further, in the casing 21, the position of each opening portion 26 of the thin plate 22 is displaced from the position of each opening portion 27 of the thin plate 23, so that the probe 12 inserted into the probe hole 28 is positively contacted. It is also possible to use the thin plate 22 and/or the thin plate 23 (Fig. 8). Accordingly, the Joule heat generated at the probe 12 can be transmitted to the thin plate 22 or the thin plate 23, and the cooling efficiency of each of the probes 12 can be further improved. Furthermore, it is easy to determine the position of the probe 12 with respect to the probe hole 28 and further with respect to the casing 21, and further, the movement of the probe 12 with respect to the casing 21 can be prevented.

As described above, the present invention has been described using the above embodiments, but the present invention is not limited to the above embodiments.

For example, in each of the above embodiments, the probe card 10 is provided with the number of probes 12 corresponding to the number of electrode pads of a plurality of semiconductor devices in the semiconductor wafer, but as shown in FIG. 9, even the probe The card 29 may only have a number of probes 12 corresponding to the number of electrode pads of one of the semiconductor wafers. In this case, each probe 12 is supported by a housing 30 to which the present invention is applied. It is mounted on the base 31 of the probe card 29.

Furthermore, it is desirable to use the housings 13 and 21 in the above embodiments. The area is set to be the same as the area of the casing (hereinafter referred to as "conventional casing") in the conventional probe card, and the casings 13 and 21 can be exchanged with the conventional casing. Accordingly, even in the conventional probe card, only the housing is exchanged, and the deterioration of the probe can be prevented.

Further, when the conventional casing is formed of a thin plate and the inside is constituted by a hollow frame, even if the heat conductor 24 is filled inside, the filled heat conductor 24 is subjected to machining or etching. Alternatively, the plurality of probe holes 28 may be formed, or when the heat conductor 24 is filled, even after the jig penetrating through the openings 26 and 27 is inserted, the heat conductor 24 is filled inside, and then the respective electrodes are drawn. It is also possible to form a plurality of probe holes 28. Accordingly, the casing 21 can be formed by applying a chasing process to a conventional casing.

10, 29‧‧ ‧ probe card

12, 12a‧‧‧ probe

13, 21, 30‧‧‧ shell

14‧‧‧Metal sheet

14a‧‧‧1st sheet

14b‧‧‧2nd sheet

15‧‧‧Ontology

16, 28‧‧ ‧ probe hole

17, 25‧‧‧ refrigerant flow path

18, 26, 27‧‧ ‧ openings

19‧‧‧Removal

20‧‧‧Contacts

22,23‧‧‧Sheet

24‧‧‧heat conductor

Fig. 1 is a view schematically showing the configuration of a probe card according to a first embodiment of the present invention.

Fig. 2 is an enlarged partial cross-sectional view showing the configuration of a casing in Fig. 1.

Fig. 3 is a plan view showing a method of manufacturing the casing in Fig. 2;

Fig. 4 is an enlarged partial cross-sectional view showing a configuration of a first modification of the casing of Fig. 2;

Fig. 5 is an enlarged partial cross-sectional view showing a configuration of a modification of the casing of Fig. 2, wherein Fig. 5(A) shows a second modification, and Fig. 5(B) shows a third modification.

Fig. 6 is an enlarged partial cross-sectional view showing a configuration of a casing as a support body of a contact terminal according to a second embodiment of the present invention.

Fig. 7 is an enlarged partial cross-sectional view showing a configuration of a first modification of the casing of Fig. 6.

Fig. 8 is an enlarged partial cross-sectional view showing a configuration of a second modification of the casing of Fig. 6.

Fig. 9 is a perspective view schematically showing a configuration of a modification of the probe card to which the present invention is applied.

12‧‧‧ probe

13‧‧‧Shell

14‧‧‧Metal sheet

15‧‧‧Ontology

16‧‧‧ probe hole

17‧‧‧Refrigerant flow path

Claims (8)

A support body for a contact terminal, which is a support body for inspecting a plurality of contact terminals of a probe card of a semiconductor device formed on a semiconductor substrate, and is characterized in that: a body formed by laminating a plurality of plate-like members; a plurality of contact terminal holes penetrating through the body; and a refrigerant flow path built in the main body, the plurality of contact terminals being inserted into the plurality of contact terminal holes, wherein the contact terminal holes are disposed on the plurality of plates The opening of the member in the thickness direction of each of the plate-like members is formed to face each other, and has a contact portion that comes into contact with the inserted contact terminal, and the plate member is made of metal. The support body of the contact terminal according to the first aspect of the invention, wherein the refrigerant flow path is formed by removing a part of each of the plurality of plate-shaped members and overlapping the part. Formed by a plate member. The contact body of the contact terminal according to the first aspect of the invention, wherein the contact portion is configured such that a position of the opening of at least one of the plurality of plate-shaped members is from a position of the opening of the other plate-shaped member Formed by offset. The support body of the contact terminal described in claim 1 of the patent scope, wherein The contact portion is formed by forming an area of the opening of at least one of the plurality of plate-like members to be smaller than an area of the opening of the other plate-shaped member. A support for a contact terminal, which is a support for inspecting a plurality of contact terminals of a probe card of a semiconductor device formed on a semiconductor substrate, characterized in that: a pair of plate-like members facing each other; a thermal conductor between the pair of plate-like members; and a plurality of contact terminal holes formed by opposing a plurality of openings provided in the thickness direction of the pair of plate-like members in the thickness direction of the pair of plate-like members The plurality of contact terminals are inserted into the plurality of contact terminal holes to be in contact with the heat conductor, and a refrigerant flow path is embedded in the heat conductor, and the plate member is made of metal. The support body of the contact terminal according to claim 5, wherein the position of the opening of one of the pair of plate-shaped members is from the other opening of the pair of plate-shaped members The position is shifted such that the contact terminal inserted into the contact terminal hole contacts at least one of the pair of plate-shaped members. A probe card for inspecting a probe card of a semiconductor device formed on a semiconductor substrate, characterized in that: a support body having a plurality of contact terminals, The support body has a main body formed by laminating a plurality of plate-like members, a plurality of contact terminal holes penetrating the main body in a thickness direction, and a refrigerant flow path built in the main body, and the plurality of contact terminals are inserted in the plural The contact terminal hole is formed by causing the opening portions of the plurality of plate-like members penetrating the thickness direction of the respective plate-like members to face each other, and having contact with the inserted contact terminal In the contact portion, the plate member is made of metal. A probe card for inspecting a probe card of a semiconductor device formed on a semiconductor substrate, comprising: a support body having a plurality of contact terminals, wherein the support body has a pair of plate-like members facing each other, and is filled with a plurality of contact terminal holes formed by the heat conductors between the pair of plate-like members and the plurality of openings provided in the thickness direction of the pair of plate-shaped members facing each other in the thickness direction thereof The plurality of contact terminals are inserted into the plurality of contact terminal holes to be in contact with the heat conductor, and a refrigerant flow path is embedded in the heat conductor, and the plate member is made of metal.