CN1261993C - Detection card for testing semiconductor - Google Patents
Detection card for testing semiconductor Download PDFInfo
- Publication number
- CN1261993C CN1261993C CN 03109153 CN03109153A CN1261993C CN 1261993 C CN1261993 C CN 1261993C CN 03109153 CN03109153 CN 03109153 CN 03109153 A CN03109153 A CN 03109153A CN 1261993 C CN1261993 C CN 1261993C
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- Prior art keywords
- test card
- circuit board
- card according
- above support
- plane
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention discloses a test card for testing semiconductors. The present invention comprises a channel board, a supporter, at least one probe, at least one flow channel, and a cover, wherein the supporter is arranged on the surface of the channel board. The probe is fixed on the supporter by an adhesive object. The flow channel is arranged on the channel board. The cover is fixedly arranged on the channel board. The present invention leads fluid, such as compressed air or nitrogen gas, to the flow channel in order to form a flow loop, and therefore, heat is carried in or carried out of the test card in order to achieve the function of temperature regulation.
Description
Technical field
The invention relates to the test card that a kind of semiconductor test is used, especially about a kind of test card that can be applicable to ultralow temperature and high temperature (120 ℃ to 450 ℃) semiconductor test.
Technical background
Fig. 1 is the existing vertical view that is applied to semiconductor test test card 10.As shown in Figure 1, test card 10 comprises circuit board 12 with central opening 22, be arranged on ring-shaped support 14 on the circuit board 12, be fixed on the probe 16 on the ring-shaped support 14, and is electrically connected on the lead 26 of probe 16 ends.
Fig. 2 is applied to the cutaway view of measuring semiconductor chip 30 for existing semiconductor test card 10.As shown in Figure 2, semiconductor chip 30 is placed on the chip base 32, and it comprises several chip 36, and chip base 32 has heater 34.Probe 16 is electrically connected via the lead 26 of passage 20 with circuit board 12 back sides.When testing, chip base 32 will rise and make the tip of probe 16 contact with the packing ring 38 of chip 36.Yet in test process, heater 34 will heat semiconductor chip 30, and heat will conduct to test card 10 via thermal radiation, or via probe 16 most advanced and sophisticated heat conduction to test card 10.
Fig. 3 is the partial enlarged drawing of Fig. 2.As shown in Figure 3, ring-shaped support 14 has inclined-plane 28, and angle theta=7 on inclined-plane 28 and the surface of circuit board 12 °.In addition, probe 16 is to be fixed on the inclined-plane 28 of ring-shaped support 14 with epoxy resin 24.
In order to ensure the horizontal level of the test card probe of finishing 16, can be because of the increase of service time, and produce the biased situation of moving of pin, must probe 16 be fixed on ring-shaped support 14 with epoxy resin 24.In existing test card 10 employed materials, the material of probe 16 and supporter 14 mostly is tungsten (or tungsten-rhenium alloy) and pottery greatly.Because tungsten (or tungsten-rhenium alloy) and ceramic material itself all have the characteristic of high temperature resistant and low temperature, therefore be the cooperation high temperature measurement, present test card 10 employed materials, its major technique bottleneck mostly is circuit board 12 and epoxy resin 24.In addition, in the time of also can causing low temperature and high temperature measurement owing to characteristics such as expanding with heat and contract with cold of material, the structure of the material of test card 10 and probe 16 produces physics and chemical change, so that measuring process can't be carried out smoothly.
Existing test card has following shortcoming when being applied in ultralow temperature and superhigh temperature measurement:
Circuit board can't bear high temperature: the used circuit board of test card is called pcb board again at present, and major part is polyimides (polyimide) or the FR-4 with glass fibre.Its general serviceability temperature is between 25 ℃ to 85 ℃ scopes.When temperature surpasses 85 ℃, can't guarantee test card itself electrically still maintain as room temperature the time.In addition, these high fine plastics will produce toxin under long term high temperature is measured, except meeting endangers the physical and mental health of survey crew, also can Yin Gaowen and produce distortion, and can't measure.
Pin is biased to be moved: test card is the interface of testboard and chip to be measured, and it makes principle is according to the pin position of the chip position on the chip to be measured as test card, is beneficial to measure at one time a large amount of assemblies.Therefore, the pin bit position accurately whether will directly influence the measurement level, because the employed material of test card is only applicable to room temperature (25 ℃ to 85 ℃) mostly at present, and every kind of material all has the coefficient of expansion of itself, when temperature raises or be reduced to outside the scope that material can bear, the coefficient of expansion will make various material production change, and cause original pin position level seriously to be offset.What is more, probe will be peeled off or bend, test card can't be used.In addition, for meeting its tool restriction (θ=7 °), the angle of traditional employed probe mostly is 103 ° greatly now.When temperature raise or reduce, this angle will cause that pin biasedly moves, probe is impaired more serious.
Summary of the invention
For overcoming weak point of the prior art, the purpose of this invention is to provide a kind of test card that can be applicable to ultralow temperature and high temperature (120 ℃ to 450 ℃) semiconductor test, it utilizes the forced air regulation technology heat to be imported or derives test card, to realize regulating the function of temperature.
For reaching above-mentioned purpose, the invention provides a kind of test card that can be applicable to ultralow temperature and high temperature (120 ℃ to 450 ℃) semiconductor test, it comprises a circuit board, a supporter, it is arranged at this circuit board surface, at least one probe, with an adhesion be fixed on this supporter, a lid, it is fixedly arranged on this circuit board, reaches at least one flow circuits, and it is arranged in the space of this circuit board and the formation of this lid.By being imported, a fluid forms flow circuits in this flow circuits to reach the adjusting temperature function.The present invention utilizes forced air (or nitrogen) circulating technology heat to be imported or derives test card, to reach the function of regulating temperature, and then guarantee that the physical property of test card assembly and chemical property can excessive variation, use in the measurement of ultralow temperature and superhigh temperature (120 ℃ to 450 ℃) to realize test card.
Compared with prior art, the present invention has following characteristics and advantage:
Pressure fluid adjusted design of the present invention utilizes pressure fluid to be imported in the air loop that has designed the temperature of regulating circuit board, ring-shaped support, epoxy resin adhesion and the probe of test card by the circulation of air.Except with the temperature maintenance of test card in the scope that material itself can bear, the present invention reduces material and changes because of physical property or the chemical property that is caused of expanding with heat and contract with cold that variations in temperature produces further by temperature controlling.
The present invention adds greatly 135 to 180 ° of scopes with the angle of probe itself, and the angle of ring-shaped support is changed into 11 ° to 75 ° scopes.Not only increase the distance of chip base and ring-shaped support,, more effectively solved when high temperature or low-temperature measurement, the most normal sliding pin problem that runs into of test card, the i.e. phenomenon of pin position horizontal-shift to alleviate influence of temperature variation.
Description of drawings
The present invention will describe according to accompanying drawing, wherein:
Shown in Figure 1 is the vertical view of existing semiconductor test card;
Shown in Figure 2 is the cutaway view that existing semiconductor test card is applied to semiconductor die testing;
Shown in Figure 3 is the partial enlarged drawing of Fig. 2;
Shown in Figure 4 is the vertical view of semiconductor test card of the present invention;
Shown in Figure 5 is the cutaway view that semiconductor test card of the present invention is applied to semiconductor die testing; And
Shown in Figure 6 is the partial enlarged drawing of test card of the present invention.
Among the figure:
10 existing test card
12 circuit boards
14 supporters
16 probes
20 passages
22 openings
24 adhesions
26 leads
28 inclined-planes
30 semiconductor chips
32 chip bases
34 heaters
36 chips
38 packing rings
40 test card
42 circuit boards
44 ring-shaped supports
46 probes
50 flow circuits
52 openings
54 fluid intakes
56 passages
58 leads
60 adhesions
70 lids
72 openings
74 gaps
76 inclined-planes
78 cantilevers
80 tips
82 angles
84 angles
86 semiconductor chips
88 chip bases
90 heaters
92 chips
94 packing rings
Embodiment
To illustrate in further detail with reference to the accompanying drawings that in this present invention wherein preferred embodiment will appear in the following narration.Yet the present invention can be according to many multi-form specialize, and should be not limited to that preferred embodiment discloses.Or rather, providing of these preferred embodiments only is to be used to make announcement of the present invention more complete and thorough, and fully scope of the present invention expressed to the personnel that are familiar with this technology.In the accompanying drawings, the thickness of assembly is exaggerative especially for clear the expression.Please understand when talking about an assembly (for example a circuit board, conduit or probe) " on another assembly ", it can be directly on this another assembly, and the assembly that also can have between the centre exists.Correspondingly, be on " directly existing " another assembly the time when talking about an assembly, then exist without any assembly between the centre.
Fig. 4 is the vertical view of test card 40 of the present invention.As shown in Figure 4, test card 40 comprises circuit board 42, be arranged on ring-shaped support 44 on the circuit board 42, be fixed on probe 46 on the ring-shaped support, be electrically connected on the lead 58 of probe 46 ends, and be arranged on air flows circuit 50 (for example conduit) on the circuit board 42, wherein circuit board 42 and ring-shaped support 44 are can resistant to elevated temperatures ceramic material.Flow circuits 50 comprises two fluid intakes 54 and several openings 52 towards ring-shaped support 44, and flow circuits 50 is around supporter 44, probe 46 and lead 58.
Fig. 5 is the cutaway view of test card 40 of the present invention when being applied to measuring semiconductor chip 86.As shown in Figure 5, circuit board 42 has central opening 54, for the probe 46 of operator's visual detection card 40 and the relative position of semiconductor chip 86.Probe 46 is to be fixed on the ring-shaped support 44 with adhesion 60 (for example epoxy resin), and is electrically connected on the lead 58 at circuit board 42 back sides via passage 56.Test card 40 of the present invention also can comprise lid 70, and air flows circuit 50 also can be arranged in circuit board 42 and the lid 70 formed spaces (for example be arranged on the circuit board 42 or be arranged on the lid 70).Lid 70 has opening 72, contacts with semiconductor chip 86 for probe 46.Semiconductor chip 86 is placed on the chip base 88, and semiconductor chip 86 comprises several chip 92, and chip base 88 has heater 90.When testing, chip base 88 will rise and make the tip of probe 46 contact with the packing ring 94 of chip 92.
The present invention utilizes the forced air regulation technology that heat is derived test card 40, finishes the function of regulating temperature and realizes that test card 40 is applied to semi-conductive high temperature test.By air pressurized is imported test card 40 via fluid intake 54, and air will blow to ring-shaped support 44 along the opening of flow circuits 50, and test card 40 is derived with heat in the gap 74 that is formed by lid 70 and adhesion 60 again.So, in the process of measuring semiconductor chip 80, even heater 90 is heated to 450 ℃ with chip base 88, the present invention is by adjusting the flow velocity and the temperature of air, just can make the temperature of test card 40 remain in the specific scope, and then guarantee that the physical property (for example thermal expansion phenomenon of probe) of assembly on the test card 40 and chemical property (for example epoxy resin is aging) excessive variation can not take place, to realize the application of test card in the Measurement of Semiconductors of 450 ℃ of superhigh temperature.Typically, the air themperature that imports test card 40 is about 25 ℃, and pressure is between 0 to 70kpa scope.In addition, when test card 40 was used for ultralow temperature survey, the fluid that imports test card 40 was a drying nitrogen (nitrogen) Celsius 0 ℃, to regulate the temperature of test card 40.So, the measurement temperature of test card 40 can reach-120 ℃.
Fig. 6 is the partial enlarged drawing of test card 40 of the present invention.As shown in Figure 6, the fluid that imports test card 40 flows (as shown by arrows) in the space that lid 70 and circuit board 42 form via opening 52, fluid and lead 48, adhesion 60, probe 46, ring-shaped support 44 and circuit board 42 carry out heat exchange, test card 40 is flowed out in the gap 74 that forms via lid 70 and adhesion 60 again, finishes the adjustment of test card 40.In addition, ring-shaped support 44 has inclined-plane 76, and probe is to be fixed on the inclined-plane 76 with adhesion 60.The angle 84 on the surface of inclined-plane 60 and circuit board 42 is between 11 ° to 75 °, and preferable angle 84 is 45 °.Probe 46 can be made of cantilever 78 and most advanced and sophisticated 80, and cantilever 78 forms an angle 82 with most advanced and sophisticated 80, and angle is between 135 ° to 180 ° scopes.Detecting card of the present invention in addition also can adopt integrally formed, and promptly the cantilever of probe is 180 ° with the angle at tip.By the angle of inclination of the ring-shaped support 44 of stationary probe 46 is changed into 11 ° to 75 °, the angles with probe 46 itself also are adjusted into 135 to 180 ° again, cause the reason of sliding pin phenomenon to be controlled.So, material efficiently solves in the biased phenomenon of moving of high temperature measurement hour hands because of the displacement that the thermal expansion phenomenon is caused has reduced by 1/2.
Technology contents of the present invention and technical characterstic disclose as above, yet the personage who is familiar with this technology still may be based on teaching of the present invention and announcement and done all replacement and modifications that does not deviate from spirit of the present invention.Therefore, protection scope of the present invention should not be limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by present patent application claims.
Claims (20)
1. test card that semiconductor test is used is characterized in that: comprise:
One circuit board;
One supporter is arranged at described circuit board surface;
At least one probe is fixed on the above support; And
At least one gas flow circuit is arranged on the described circuit board, and wherein gas can blow to this detection card via this gas flow circuit, is in the scope that its material itself can bear with the temperature that keeps this detection card.
2. test card according to claim 1 it is characterized in that described gas flow circuit is a conduit, and described conduit comprises at least one opening towards above support.
3. test card according to claim 2 is characterized in that described conduit around above support, and comprises several openings towards above support.
4. test card according to claim 1 is characterized in that above support has an inclined-plane, and the angle of described inclined-plane and described circuit board surface is greater than 11 degree.
5. test card according to claim 1 is characterized in that above support has an inclined-plane, and the angle of described inclined-plane and described circuit board surface is less than 75 degree.
6. test card according to claim 1 is characterized in that above support has an inclined-plane, and the angle of described inclined-plane and described circuit board surface is 45 degree.
7. test card according to claim 1 is characterized in that described test card comprises a lid in addition, be fixedly arranged on the described circuit board, and described lid has at least one opening and contacts with a chip to be measured for described probe.
8. test card according to claim 7 is characterized in that described circuit board and described ring-shaped support are ceramic material.
9. test card according to claim 1 it is characterized in that described probe comprises a cantilever and a tip, and the angle at described cantilever and described tip is between 180 ° to 135 °.
10. test card that semiconductor test is used is characterized in that: comprise:
One circuit board;
One supporter is arranged at described circuit board surface;
At least one probe is fixed on the above support;
One lid is fixedly arranged on the described circuit board; And
At least one flow circuits is arranged in the space that described circuit board and described lid form, and described flow circuits can import a fluid, thereby keeps the temperature of this detection card to be in the scope that its material itself can bear to form the loop of flowing.
11. test card according to claim 10, the pressure that it is characterized in that described fluid is less than 70kpa.
12. test card according to claim 10 it is characterized in that described fluid is an air, and its temperature is 25 ℃.
13. test card according to claim 10 it is characterized in that described fluid is a nitrogen, and its temperature is 0 ℃.
14. test card according to claim 10 it is characterized in that described flow circuits is a conduit, and described conduit comprises at least one opening towards above support.
15. test card according to claim 14 is characterized in that described conduit around above support, and comprises several openings towards above support.
16. test card according to claim 10 is characterized in that above support has an inclined-plane, and the angle of described inclined-plane and described circuit board surface is greater than 11 degree.
17. test card according to claim 10 is characterized in that above support has an inclined-plane, and the angle of described inclined-plane and described circuit board surface is less than 75 degree.
18. test card according to claim 10 is characterized in that above support has an inclined-plane, and the angle of described inclined-plane and described circuit board surface is 45 degree.
19. test card according to claim 10 is characterized in that described circuit board, above support are ceramic material.
20. test card according to claim 10 it is characterized in that described probe comprises a cantilever and a tip, and the angle at described cantilever and described tip is between 180 ° to 135 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03109153 CN1261993C (en) | 2003-04-03 | 2003-04-03 | Detection card for testing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03109153 CN1261993C (en) | 2003-04-03 | 2003-04-03 | Detection card for testing semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1536635A CN1536635A (en) | 2004-10-13 |
| CN1261993C true CN1261993C (en) | 2006-06-28 |
Family
ID=34319211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03109153 Expired - Lifetime CN1261993C (en) | 2003-04-03 | 2003-04-03 | Detection card for testing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1261993C (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010532473A (en) * | 2007-07-02 | 2010-10-07 | イ・チェハ | Probe assembly and manufacturing method thereof |
| CN101629971B (en) * | 2008-07-17 | 2013-07-24 | 思达科技股份有限公司 | Probe station, probe socket, probe card and combination thereof |
| JP6092509B2 (en) * | 2011-10-17 | 2017-03-08 | 東京エレクトロン株式会社 | Contact terminal support and probe card |
| TWI591352B (en) * | 2013-06-07 | 2017-07-11 | 金士頓數位股份有限公司 | Testing device |
| CN105182208A (en) * | 2015-08-13 | 2015-12-23 | 山东浪潮华光光电子股份有限公司 | LED chip test method |
| TWI603088B (en) * | 2016-07-25 | 2017-10-21 | Mpi Inc | Probe module with cantilever MEMS probe and its manufacturing method |
| CN106483343A (en) * | 2016-11-03 | 2017-03-08 | 苏州创瑞机电科技有限公司 | Manual staight needle test jack with heating function |
| US11002761B2 (en) * | 2017-07-25 | 2021-05-11 | Keithley Instruments, Llc | Probe card system for testing an integrated circuit |
| CN111624375B (en) * | 2020-07-01 | 2020-12-25 | 强一半导体（苏州）有限公司 | Probe card for high-temperature and high-pressure test of power device |
-
2003
- 2003-04-03 CN CN 03109153 patent/CN1261993C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1536635A (en) | 2004-10-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181218 Address after: Room 1106, 11F Comet Valley Space-time Building, No. 4 Luyu East Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Starr Technology (Wuhan) Co.,Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: STAR TECHNOLOGIES INC. |
|
| TR01 | Transfer of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20041013 Assignee: Decott Testing Technology (Suzhou) Co.,Ltd. Assignor: Starr Technology (Wuhan) Co.,Ltd. Contract record no.: X2020980003101 Denomination of invention: Detection card for testing semiconductor Granted publication date: 20060628 License type: Exclusive License Record date: 20200616 |
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| EE01 | Entry into force of recordation of patent licensing contract | ||
| CX01 | Expiry of patent term |
Granted publication date: 20060628 |
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| CX01 | Expiry of patent term |