JP5185310B2 - Electrical connection body and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electrical connection body and a manufacturing method thereof.

  The electrical connection body represented by the probe card is used to check whether the internal circuit operates according to the specifications before the wafer is separated into individual chips when the circuit on the wafer is completed in the integrated circuit manufacturing process. This jig is used when performing a wafer test. As such an electrical connection body, a plurality of probes are fixed in a state of vertically passing through an insulating support plate, and one leg of the probe is formed in an elastically deformable shape and protrudes above the support plate, It is known that the other leg of the probe is formed in an elastically deformable shape and protrudes below the support plate. In wafer testing, an electrical connection is placed between the wafer and a test apparatus that tests the chip on the wafer, and one end of the probe is applied to a terminal formed on the chip and the other end is applied to a terminal of the test apparatus. In this state, a voltage is applied to the terminals of the chip according to the test pattern, the output is measured, and compared with the expected value, the quality of the chip is determined. As such an electrical connection body, the support plate has a three-layer structure of an upper plate member, an intermediate plate member, and a lower plate member, and the probe through hole of the intermediate plate member is used as the probe through hole of the upper plate member and the lower plate member. On the other hand, it has been proposed that the three plate members jointly hold the probe by being displaced in the horizontal direction (see Patent Document 1).

JP-A-2004-235591

  However, Patent Document 1 has a problem that the cost increases because the support plate has a three-layer structure. Also, if the probe through hole in the intermediate plate member is displaced in the horizontal direction with respect to the probe through hole in the upper plate member and the lower plate member, the probe will be deformed. In some cases, the alignment direction of the legs of the probe was not aligned.

  The present invention has been made to solve such problems, and has as its main object to provide an electrical connection body that can be manufactured at low cost and in which the alignment directions of the legs of all probes are aligned.

  The present invention adopts the following means in order to achieve the main object described above.

That is, the electrical connection body of the present invention is
A plurality of wire probes are fixed in a state of vertically passing through an insulating support plate, and one leg of the probe is formed in an elastically deformable shape and protrudes above the support plate. The other leg is an electrical connection body formed in an elastically deformable shape and protruding below the support plate,
The support plate includes an upper plate having at least the number of the upper plate through-holes larger than the wire diameter, and a lower plate through-hole having a diameter larger than the wire diameter. The upper plate through hole and the lower plate through hole that form a pair are offset so that the probe is sandwiched between the upper plate and the lower plate. A groove extending along the shifting direction is provided on the surface facing the lower plate, and a part of the probe enters the groove.

  In this electrical connection body, the support plate has a two-layer structure of an upper plate and a lower plate, and the upper plate through hole and the lower plate through hole forming a pair are fixed with their axes shifted so as to sandwich the probe. Yes. For this reason, since the number of parts is small compared with the case where the support plate has a three-layer structure, the cost is reduced. In addition, a groove extending along the shifting direction of the axis of the upper plate through hole and the axis of the lower plate through hole is formed on the opposing surface of the upper plate and the lower plate, and a part of the probe enters the groove, The posture of the probe is regulated by the groove. For example, the groove of the probe can be prevented from rotating about the axis. For this reason, the alignment directions of the legs of all the probes are aligned, and the tips of the probes can be accurately applied to the electrodes formed on the chip on the wafer.

  The groove may be provided only on the surface of the upper plate that faces the lower plate, or may be provided only on the surface of the lower plate that faces the upper plate, or provided on both surfaces. It may be done.

  In the electrical connection body of the present invention, the depth of the groove is preferably 50 to 150% of the wire diameter. If it is less than 50%, it is difficult to bend the probe along the groove, and the gap between the upper plate and the plate becomes too large, which is not preferable. If it exceeds 150%, the probe tends to move up and down in the groove, and the posture of the probe may not be stable. In addition, when the groove | channel is provided in both the upper board and the lower board, it is preferable that the sum total of the depth of both grooves shall be 50 to 150% of a wire diameter.

  In the electrical connection body according to the present invention, the shift amount between the upper plate through hole and the lower plate through hole forming a pair is larger than the value obtained by subtracting the wire diameter from the hole diameter, and the pitch (interval between the through holes) is larger. It is preferable that the value is less than the value obtained by adding the hole diameter and subtracting twice the wire diameter. If it carries out like this, a probe can be pinched | interposed reliably between an upper board through-hole and a lower board through-hole, and it can prevent that adjacent probes contact. In order to prevent contact between adjacent probes more reliably, it is preferable to set the shift amount to be equal to or less than the value obtained by subtracting the hole diameter from the pitch.

The manufacturing method of the electrical connection body of the present invention is as follows:
(A) an upper plate in which a plurality of upper plate through-holes having a diameter larger than the wire diameter are formed; In this case, as the upper plate, one having a groove extending in a predetermined direction so as to connect the opening of the upper plate through-hole to the opposing surface of the upper plate and the lower plate is prepared. Or preparing the lower plate having a groove extending in a predetermined direction so as to connect the opening of the lower plate through hole on the opposing surface of the upper plate and the lower plate;
(B) After overlapping the upper plate and the lower plate so that the upper plate through hole and the lower plate through hole forming a pair communicate with each other, a plurality of probes are connected to the upper plate through hole and the lower plate. Inserting into the through hole, and holding one of the probes so that one leg protrudes above the upper plate and the other leg protrudes below the lower plate;
(C) By relatively shifting the upper plate and the lower plate in the extending direction of the groove, the upper plate through hole and the lower plate through hole forming a pair sandwich the probe, and Bending the probe along the groove;
(D) fixing both plates so that the upper plate and the lower plate do not move relatively in the state of the step (c);
Is included.

  In this method of manufacturing an electrical connection body, in step (c), the upper plate and the lower plate are displaced relative to each other in the direction in which the groove extends, so that the upper plate through hole and the lower plate through hole form a pair. Since the probe is sandwiched and bent along the groove, the probe can be fixed even if the support plate has a two-layer structure, and the posture of the probe can be regulated by the groove. Therefore, it is possible to manufacture an electrical connection body that is lower in cost than the case of using a support plate having a three-layer structure and in which the alignment directions of all the probe legs are aligned. This manufacturing method is suitable for manufacturing the electrical connection body of the present invention described above. In step (a), the upper plate may have a groove, the lower plate may have a groove, or the upper plate and the lower plate may have a groove. May be.

  In the manufacturing method of the electrical connection body of the present invention, in the step (a), it is preferable that the depth of the groove formed in the upper plate or the lower plate is 50 to 150% of the wire diameter. If it is less than 50%, it is difficult to bend the probe along the groove, and the gap between the upper plate and the plate becomes too large, which is not preferable. If it exceeds 150%, the probe tends to move up and down in the groove, and the posture of the probe may not be stable. In addition, when the groove | channel is provided in both the upper board and the lower board, it is preferable that the sum total of the depth of both grooves shall be 50 to 150% of a wire diameter.

  In the manufacturing method of the electrical connection body of the present invention, in the step (c), the shift amount between the pair of the upper plate through hole and the lower plate through hole is larger than the value obtained by subtracting the wire diameter from the hole diameter, It is preferable that the pitch is less than the value obtained by adding the hole diameter to the pitch and subtracting twice the wire diameter. If it carries out like this, a probe can be pinched | interposed reliably between an upper board through-hole and a lower board through-hole, and it can prevent that adjacent probes contact. In order to prevent contact between adjacent probes more reliably, it is preferable to set the shift amount to be equal to or less than the value obtained by subtracting the hole diameter from the pitch.

It is a front view of a probe card. It is a top view (with a partial enlarged view) of a probe card. It is AA sectional drawing in the elements on larger scale of FIG. It is BB sectional drawing of FIG. It is explanatory drawing which shows the minimum of the shift amount. It is explanatory drawing which shows the upper limit of shift amount. It is explanatory drawing which shows the preferable upper limit of shift amount. It is explanatory drawing of a process (a), (a) is a partial top view, (b) is CC sectional drawing. It is explanatory drawing of a process (b), (a) is a fragmentary top view, (b) is DD sectional drawing. It is explanatory drawing of a process (c), (a) is a fragmentary top view, (b) is EE sectional drawing. It is a fragmentary sectional view in case a groove depth is 50% of a wire diameter. It is a fragmentary sectional view in case a groove depth is 150% of a wire diameter.

  A preferred embodiment of the present invention will be described below with reference to the drawings. 1 is a front view of the probe card 10, FIG. 2 is a plan view of the probe card 10 (with a partially enlarged view), FIG. 3 is a cross-sectional view taken along the line AA in FIG. It is B sectional drawing.

  The probe card 10 is an example of the electrical connection body of the present invention. The overall thickness of the probe card 10 is 2 to 20 mm, and the support plate 12 is electrically insulative. The support plate 12 extends vertically through the support plate 12. And a plurality of probes 18 made of wires having a wire diameter of 80 to 300 μm.

  The support plate 12 is obtained by superposing the upper plate 14 and the lower plate 16 and fastening the periphery with bolts and nuts 20. The upper plate 14 is electrically insulating and has upper plate through holes 14a having a diameter larger than the wire diameter (diameter 0.3 to 0.5 mm) by the number of the probes 18. The lower plate 16 is also electrically insulating, and has the same number of lower plate through holes 16a as the probes 18 having the same diameter as the upper plate through holes 14a. However, the diameter of the upper plate through hole 14a and the diameter of the lower plate through hole 16a are not necessarily the same. Further, the pitch of the upper plate through holes 14a (the interval between the holes) and the pitch of the lower plate through holes 16a are also the same. Further, a groove 16b is formed along a predetermined direction on a surface (that is, an upper surface) of the lower plate 16 facing the upper plate 14. The groove 16b has a rectangular cross section, and the depth and width are substantially the same as or slightly larger than the wire diameter. The groove 16b extends so as to connect the openings of the plurality of lower plate through holes 16a. The material of the upper plate 14 and the lower plate 16 is not particularly limited as long as it is an electrically insulating material. For example, in addition to engineering plastics such as glass fiber-containing epoxy resin and polyether ether ketone (PEEK), various ceramics are listed. It is done.

  The upper plate through hole 14a and the lower plate through hole 16a are provided to make a pair. Specifically, the upper plate through hole 14a and the lower plate through hole 16a through which one probe 18 is inserted form a pair. Of the upper plate through hole 14a and the lower plate through hole 16a forming a pair, the axis of the upper plate through hole 14a is shifted so as to sandwich the vicinity of the center of the probe 18 with respect to the lower plate through hole 16a. The shift amount at this time is set larger than the value obtained by subtracting the wire diameter from the hole diameter of the upper plate through-hole 14a, and is set to be equal to or less than the value obtained by subtracting the hole diameter from the pitch (interval between the through holes). It will be described later. Further, the groove 16b extends along the shifting direction. As a result of shifting the axes of the through holes 14a and 16a in this way, the probe 18 is pressed near the center near the lower side of the lower plate through hole 16a in FIG. The upper side near the center is pressed against the left side of the inner wall of the upper plate through hole 14a.

  Here, the shift amount will be described in detail with reference to FIGS. As shown in FIG. 5, when the shift amount G is a value obtained by subtracting the wire diameter w from the hole diameter h of the upper plate through hole 14a (that is, G = h−w), the probe 18 is connected to the inner wall of the upper plate through hole 14a. It is only in contact with the inner wall of the lower plate through hole 16a and is not subjected to a pressing force. Therefore, in this state, the probe 18 cannot be supported by the upper plate through hole 14a and the lower plate through hole 16a. However, when the shift amount G becomes larger than in the case of FIG. 5, that is, G> h−w, the probe 18 is sandwiched and supported by the upper plate through hole 14a and the lower plate through hole 16a. On the other hand, as shown in FIG. 6, when the shift amount G is a value obtained by adding the hole diameter h to the pitch p and subtracting twice the wire diameter w (that is, G = p + h−2w), the adjacent probes 18 come into contact with each other. As a result, the wafer test is hindered. However, when the shift amount G is smaller than that in the case of FIG. 6, that is, G <p + h−2w, the adjacent probes 18 do not come into contact with each other, so that no inconvenience occurs. In order to prevent the adjacent probes 18 from contacting each other more reliably, it is preferable that the shift amount G is equal to or less than the value obtained by subtracting the hole diameter h from the pitch p, that is, G ≦ p−h, as shown in FIG. In this case, since the upper through hole 14a does not overlap with the unpaired lower through hole 16a, the contact of the adjacent probes 18 can be more reliably prevented.

  The probe 18 is obtained by cutting a beryllium copper wire into a predetermined length. One leg 18a of the probe 18 protrudes above the support plate 12 and can be elastically deformed by a bent portion 18b. The other leg 18c protrudes below the support plate 12 and can be elastically deformed by a bent portion 18d. As described above, the vicinity of the center of the probe 18 is sandwiched between the upper plate through hole 14a and the lower plate through hole 16a, and has a crank shape. The material of the wire used for the probe 18 is not limited to beryllium copper, and may be, for example, Cu, Cu alloy, Ni, Ni alloy, noble metals such as Pd and Pt, Fe, Fe alloy, piano wire, etc. .

  Next, a manufacturing procedure of the probe card 10 will be described with reference to FIGS. 8 to 10 are explanatory views showing the manufacturing process, wherein (a) is a partial plan view, (b) is a sectional view (FIG. 8 is a sectional view taken along the line CC, FIG. 9 is a sectional view taken along the line DD, FIG. Is an EE cross-sectional view). First, an upper plate 14 and a lower plate 16 are prepared (see step (a) and FIG. 8). Here, the lower plate 16 has a groove 16b on the upper surface, but the upper plate 14 does not have such a groove. Subsequently, after overlapping the lower surface of the upper plate 14 and the upper surface of the lower plate 16 so that the paired upper plate through hole 14a and lower plate through hole 16a communicate with each other, the plurality of probes 18 are attached to the upper plate through hole. 14a and the lower plate through hole 16a (see step (b), FIG. 9). At this time, each probe 18 is held so that one leg 18 a of each probe 18 protrudes above the upper plate 14 and the other leg 18 c protrudes below the lower plate 16. The probe 18 is one in which one leg 18a is bent at a predetermined angle at a bent portion 18b in advance. Subsequently, the upper plate 14 and the lower plate 16 are displaced relative to each other in the direction in which the groove 16b extends while the upper plate 14 and the lower plate 16 are in surface contact with each other. (See step (c), FIG. 10). At this time, the vicinity of the center of the probe 18 is bent and fitted into the groove 16b. As a result, the lower side near the center of the probe 18 is pressed against the right side of the inner wall of the lower plate through hole 16a, the middle near the center crawls the groove 16b horizontally, and the upper side near the center is on the left side of the inner wall of the upper plate through hole 14a. Pressed. Subsequently, the four corners are fixed with bolts and nuts 20 so that the upper plate 14 and the lower plate 16 do not move relatively in this state (step (d)). Finally, the other leg 18c is processed to be bent at a predetermined angle by the bent portion 18d, and the probe card 10 is completed.

  According to the probe card 10 of the present embodiment described in detail above, since the support plate 12 has a two-layer structure of the upper plate 14 and the lower plate 16, the number of parts is smaller than in the case where the support plate 12 has a three-layer structure. The cost is reduced. Further, since the probe 18 enters the groove 16b provided in the lower plate 16, the posture of the probe 18 is regulated by the groove 16b. For this reason, the alignment directions of the legs 18a and 18c of all the probes 18 are aligned, and the tip of the probe 18 can be accurately applied to the electrode formed on the chip on the wafer.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the depth of the groove 16b of the lower plate 16 is set to be slightly larger than the wire diameter, but may be appropriately set within a range of 50 to 150% of the wire diameter. FIG. 11 shows an example in which the depth of the groove 216b is 50% of the wire diameter. In this case, a gap is formed between the upper plate 14 and the lower plate 16, but the bolts and nuts 20 (see FIG. 1) may be fastened so that the plates 14 and 16 are parallel to each other. If the depth of the groove 116b is less than 50%, it is difficult to deform the probe 18 along the groove 116b, and the gap between the plates 14 and 16 becomes too large. FIG. 12 shows an example in which the depth of the groove 216b is 150% of the wire diameter. In this case, the upper plate 14 and the lower plate 16 are in surface contact, and the probe 18 is accommodated in the groove 216b with a margin, but the probe 18 is restricted from moving up and down inside the groove 216b. . If the depth of the groove 216b exceeds 150% of the wire diameter, the probe 18 tends to move up and down inside the groove 216b, and the posture of the probe 18 may be unstable, which is not preferable.

  In the embodiment described above, the groove 16b is provided on the surface of the lower plate 16 that faces the upper plate 14, but may be provided on the surface of the upper plate 14 that faces the lower plate 16, or may be provided on both surfaces. May be. In addition, when the groove | channel is provided in both the upper board 14 and the lower board 16, the sum total of the depth of both grooves shall be 50 to 150% of a wire diameter.

  In the embodiment described above, the leg 18c of the probe 18 is bent in the same direction as the leg 18a, but the leg 18c may be bent in the opposite direction to the leg 18a.

  In the embodiment described above, the cross-sectional shapes of the upper plate through hole 14a and the lower plate through hole 16a are circular. However, the sectional shape is not particularly limited to a circle, and may be, for example, an ellipse or a rectangle. The same applies to the cross-sectional shape of the probe 18.

  In the embodiment described above, the probe 18 is inexpensive because the cut wire is used as it is, but the resistance is not so small because the contact area with the terminal of the chip on the wafer is small. When importance is attached to making the resistance smaller than the cost, it is preferable to add a device such as processing the tip of the probe 18 into a flat surface.

  In the above-described embodiment, the four corners of the support plate 12 are fastened with the bolt nuts 20. However, two points on the diagonal line may be fastened with the bolt nuts, and the center of the side is fastened with the bolt nuts in addition to the four corners. Also good. The fastener is not limited to a bolt and nut, and may be a rivet.

  In the embodiment described above, when the probe card 10 is manufactured, in the step (b), the probe 18 in which one leg 18a is bent at a predetermined angle at the bent portion 18b in advance is used. However, a straight probe 18 may be used. . In that case, finally, both the legs 18a and 18c are processed to be bent at a predetermined angle by the bent portions 18b and 18d, respectively, and the probe card 10 is completed.

  The electrical connection body of the present invention can be used for a jig (probe card) used when performing a wafer test.

10 probe card, 12 support plate, 14 upper plate, 14a upper plate through hole, 16 lower plate, 16a lower plate through hole, 16b groove, 18 probe, 18a, 18c leg, 18b, 18d bent part, 20 bolt nut, 116b Groove, 216b groove, G shift amount, h hole diameter, p pitch, w wire diameter

Claims (6)

A plurality of wire probes are fixed in a state of vertically passing through an insulating support plate, and one leg of the probe is formed in an elastically deformable shape and protrudes above the support plate. The other leg is an electrical connection body formed in an elastically deformable shape and protruding below the support plate,
The support plate includes an upper plate having at least the number of the upper plate through-holes larger than the wire diameter, and a lower plate through-hole having a diameter larger than the wire diameter. The upper plate through hole and the lower plate through hole that form a pair are offset so that the probe is sandwiched between the upper plate and the lower plate. A groove extending along the shifting direction is provided on the surface facing the lower plate, and a part of the probe enters the groove.
Electrical connection. The depth of the groove is 50 to 150% of the wire diameter.
The electrical connection body according to claim 1. The shift amount between the pair of upper plate through hole and lower plate through hole is larger than the value obtained by subtracting the wire diameter from the hole diameter, and less than the value obtained by adding the hole diameter to the pitch and subtracting twice the wire diameter. is there,
The electrical connection body according to claim 1 or 2. (A) an upper plate in which a plurality of upper plate through-holes having a diameter larger than the wire diameter are formed; In this case, as the upper plate, one having a groove extending in a predetermined direction so as to connect the opening of the upper plate through-hole to the opposing surface of the upper plate and the lower plate is prepared. Or preparing the lower plate having a groove extending in a predetermined direction so as to connect the opening of the lower plate through hole on the opposing surface of the upper plate and the lower plate;
(B) After overlapping the upper plate and the lower plate so that the upper plate through hole and the lower plate through hole forming a pair communicate with each other, a plurality of probes are connected to the upper plate through hole and the lower plate. Inserting into the through hole, and holding one of the probes so that one leg protrudes above the upper plate and the other leg protrudes below the lower plate;
(C) By relatively shifting the upper plate and the lower plate in the extending direction of the groove, the upper plate through hole and the lower plate through hole forming a pair sandwich the probe, and Bending the probe along the groove;
(D) fixing both plates so that the upper plate and the lower plate do not move relatively in the state of the step (c);
Of electrical connections including In the step (a), the depth of the groove formed in the upper plate or the lower plate is 50 to 150% of the wire diameter.
The manufacturing method of the electrical connection body of Claim 4. In the step (c), the shift amount between the pair of upper plate through hole and lower plate through hole is larger than a value obtained by subtracting the wire diameter from the hole diameter, and the hole diameter is added to the pitch to be 2 of the wire diameter. Less than doubled value,
The manufacturing method of the electrical connection body of Claim 4 or 5.

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