JP2017009391A - Electronic component transportation device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transportation device capable of preventing or suppressing a reduction in temperature of an electronic component when the electronic component is brought into contact with a terminal, and an electronic component inspection device.SOLUTION: An inspection device 1 comprises: placement sections 52 capable of placing IC devices 9; heat conduction sections 59 disposed at opposite sides to the IC devices 9 via the placement sections 52 when the IC devices 9 are placed thereon; probe pins individually brought into contact with the placement sections 52 and the heat conduction sections 59; and heaters 56 capable of heating the probe pins via the heat conduction sections 59.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. In such an electronic component transport apparatus, the IC device is placed on the IC device placement portion and inspected by contacting with the terminal of the IC device placement portion (see, for example, Patent Document 1). Further, such an electronic component conveying apparatus is provided with a heating unit, and the inspection is performed in a state where the IC device is heated.

  The electronic component conveying apparatus described in Patent Document 1 includes a ground plate in which a heating unit is built, and a socket having terminals arranged on the ground plate via a spacer. The heat of the heating unit is transmitted to the terminal and the IC device through the ground plate, the spacer, and the socket.

JP 2003-28920 A

  However, in the electronic component conveying apparatus described in Patent Document 1, since the heat of the heating unit is transmitted to the terminal and the IC device through the ground plate, the spacer, and the socket, the heat tends to escape to the outside on the way. . As a result, heat transfer to the terminal becomes insufficient, and the temperature may decrease when the IC device comes into contact with the terminal.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
An electronic component transport apparatus according to the present invention includes an electronic component placement unit capable of placing an electronic component,
When the electronic component is placed on the electronic component placement portion, a heat conduction portion disposed on the opposite side of the electronic component via the electronic component placement portion;
A terminal portion capable of contacting the electronic component placement portion and the heat conducting portion;
A heating unit capable of heating the heat conducting unit.

  Thereby, the heat of a heating part can be effectively transmitted to a terminal part via a heat conduction part. Therefore, the electronic component placed on the electronic component placement portion can be heated by the heat of the terminal portion. As a result, the temperature of the electronic component can be prevented or suppressed from decreasing.

[Application Example 2]
In the electronic component transport apparatus according to the present invention, it is preferable that the thermal conductivity of the heat conducting unit is larger than the thermal conductivity of the electronic component placing unit.
Thereby, the heat of a heat conduction part is efficiently transmitted to a terminal part.

[Application Example 3]
In the electronic component transport device of the present invention, it is preferable that the terminal portion is disposed inside the heat conducting portion.
Thereby, the heat of a heat conduction part is efficiently transmitted to a terminal part.

[Application Example 4]
In the electronic component transport device of the present invention, it is preferable that the terminal portion is disposed through the heat conducting portion.
Thereby, the heat of a heat conduction part is efficiently transmitted to a terminal part.

[Application Example 5]
In the electronic component transport device according to the present invention, it is preferable that the heat conducting portion and the terminal portion are electrically insulated.
Thereby, it can prevent that a heat conductive part and a terminal part short-circuit.

[Application Example 6]
In the electronic component transport apparatus according to the present invention, it is preferable that a space is interposed between the heat conducting unit and the terminal unit.

  Thereby, it is possible to prevent the heat conducting portion and the terminal portion from being short-circuited with a simple configuration.

[Application Example 7]
In the electronic component transport device of the present invention, it is preferable that an insulating member capable of being electrically insulated is disposed between the heat conducting portion and the terminal portion.
Thereby, it can prevent more effectively that a heat conductive part and a terminal part short-circuit.

[Application Example 8]
In the electronic component conveying apparatus of the present invention, it is preferable that the insulating member contains diamond-like carbon.

  Thereby, while being able to insulate a heat conductive part and a terminal part, since it is excellent in abrasion resistance, the improvement of long-term reliability can be aimed at.

[Application Example 9]
In the electronic component conveying apparatus of the present invention, it is preferable that the insulating member contains a resin.

  Thereby, while being able to insulate a heat conductive part and a terminal part, cost reduction can be achieved.

[Application Example 10]
In the electronic component transport apparatus according to the present invention, it is preferable that the heat conducting unit is made of metal.
Thereby, the comparatively high heat conductivity of a heat conductive part is realizable.

[Application Example 11]
In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component placement unit includes a resin.

  Thereby, even if an electronic component is repeatedly placed on the electronic component placement portion, it is possible to prevent or suppress the generation of scratches due to wear.

[Application Example 12]
In the electronic component transport apparatus according to the present invention, it is preferable that the heating unit is disposed vertically above the heat conducting unit and the electronic component mounting unit.

  Generally, when an electronic component is inspected, since the wiring board is arranged vertically below the heat conducting unit, the above configuration prevents the wiring board from being excessively heated by the heating unit or Can be suppressed.

[Application Example 13]
In the electronic component transport apparatus according to the present invention, it is preferable that a heat insulating member is disposed above the electronic component mounting portion in the vertical direction.

  Thereby, it can prevent or suppress that the heat heated by the heating part escapes.

[Application Example 14]
In the electronic component transport apparatus according to the present invention, it is preferable that a heat insulating member is disposed below the electronic component mounting portion in the vertical direction.

  Thereby, it can prevent or suppress that the heat heated by the heating part escapes below.

[Application Example 15]
In the electronic component transport device of the present invention, the heat conduction portion is disposed on the opposite side of the electronic component, and has a wiring board electrically connected to the terminal portion,
It is preferable that the heat insulating member is disposed between the heat conducting unit and the wiring board.
Thereby, it can prevent that the heat of a heat conductive part is transmitted to a wiring board.

[Application Example 16]
In the electronic component transport device according to the present invention, it is preferable that the electronic component placing portion and the heat conducting portion have a portion overlapping in plan view.
Thereby, an electronic component can be heated effectively.

[Application Example 17]
In the electronic component transport device of the present invention, it is preferable that the heating unit is arranged at a position different from the electronic component mounting unit and the heat conducting unit in plan view.

  Accordingly, the electronic component can be heated while preventing the electronic component from being hindered from being placed on the electronic component placement portion.

[Application Example 18]
In the electronic component transport device of the present invention, the heating unit is provided along a first direction, and a length in the first direction is longer than a length in a second direction orthogonal to the first direction. Long is preferred.
Thereby, an electronic component can be heated efficiently.

[Application Example 19]
In the electronic component transport device of the present invention, a plurality of the heating units are provided,
The heat conducting unit is preferably provided between the plurality of heating units.
Thereby, an electronic component can be heated efficiently.

[Application Example 20]
In the electronic component conveying apparatus of the present invention, it is preferable that the thickness of the heat conducting unit is thinner than the thickness of the electronic component placing unit.

  Thereby, even if it arrange | positions a heat conduction part and an electronic component mounting part, it can prevent that the whole thickness becomes thick too much.

[Application Example 21]
In the electronic component transport device of the present invention, it is preferable that the thickness of the heat conducting unit is 5% or more and 20% or less of the thickness of the electronic component placing unit.

  Thereby, even if it arrange | positions a heat conduction part and an electronic component mounting part, it can prevent that the whole thickness becomes thick too much.

[Application Example 22]
In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component carrying device includes a base material having a recess capable of accommodating the electronic component placement portion.
Thereby, an electronic component mounting part can be accommodated in a recessed part.

[Application Example 23]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat conducting unit is housed in the concave portion.
Thereby, a heat conductive part and an electronic component mounting part can be accommodated collectively in a recessed part.

[Application Example 24]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat conducting unit is arranged at a position different from the concave portion in plan view.

  Thereby, although it is based also on the shape of a heat conductive part, the contact area of a heat conductive part and an electronic component mounting part can be enlarged. Therefore, the heat conduction part can be heated more effectively, and the terminal and the electronic component can be heated.

[Application Example 25]
An electronic component inspection apparatus according to the present invention includes an electronic component placement unit capable of placing an electronic component,
When the electronic component is placed on the electronic component placement portion, a heat conduction portion disposed on the opposite side of the electronic component via the electronic component placement portion;
A terminal portion capable of contacting the electronic component placement portion and the heat conducting portion;
A heating unit capable of heating the heat conducting unit;
An inspection unit for inspecting the electronic component.

  Thereby, the heat of a heating part can be transmitted to a terminal part via a heat conductive part. Therefore, the electronic component placed on the electronic component placement portion can be heated by the heat of the terminal portion. As a result, the temperature of the electronic component can be prevented or suppressed from decreasing.

FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a diagram illustrating a conveyance unit and an inspection unit of the electronic component inspection apparatus illustrated in FIG. 1. FIG. 3 is a cross-sectional view showing an inspection unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is an enlarged cross-sectional view of the placement unit and the heat conduction unit in FIG. 3. 5A is a side view showing the terminal portion, and FIG. 5B is a cross-sectional view showing a state where the terminal portion is in contact with the electronic component. FIG. 6 is an enlarged plan view showing a portion surrounded by a broken line in FIG. FIG. 7 is an enlarged cross-sectional view of an inspection unit provided in the second embodiment of the electronic component inspection apparatus of the present invention. FIG. 8 is an enlarged plan view of an inspection unit provided in the third embodiment of the electronic component inspection apparatus of the present invention.

<First Embodiment>
FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a diagram illustrating a conveyance unit and an inspection unit of the electronic component inspection apparatus illustrated in FIG. 1. FIG. 3 is a cross-sectional view showing an inspection unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is an enlarged cross-sectional view of the placement unit and the heat conduction unit in FIG. 3. 5A is a side view showing the terminal portion, and FIG. 5B is a cross-sectional view showing a state where the terminal portion is in contact with the electronic component. FIG. 6 is an enlarged plan view showing a portion surrounded by a broken line in FIG.

  In the following, for convenience of explanation, as shown in the figure, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball Grid Array) package and an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), and an OLED (Organic Electroluminescence Display). Electronic devices including display devices such as electronic paper, CIS (CMOS Image Sensor), CCD (Charge Coupled Device), various sensors such as acceleration sensors, gyro sensors, pressure sensors, and various vibrators including crystal vibrators This is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of parts. In the following, for convenience of explanation, a case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 9”.

  As shown in FIG. 4, the IC device 9 includes a main body 91 and a plurality of terminals (electrodes) 92 provided outside the main body 91. Each terminal 92 is electrically connected to a circuit unit inside the main body 91. Although the shape of the main body 91 is not particularly limited, in the present embodiment, the main body 91 has a plate shape, and has a square shape when viewed from the Z direction, that is, in plan view. Further, the quadrangle is a square or a rectangle in the present embodiment. Each terminal 92 is provided at the lower part (or side part) of the main body 91 and is spherical.

  As shown in FIG. 1, the inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6, a collection unit 7, and control of these units. And a control unit 8 for performing The inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a conveyance unit 4, an inspection unit 5, a base 11 on which a collection side arrangement unit 6 and a collection unit 7 are arranged, a supply side arrangement unit 3, and a conveyance unit 4. And a cover 12 that covers the base 11 so as to accommodate the inspection unit 5 and the collection side arrangement unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side array unit 3, the transport unit 4, the inspection unit 5, and the collection side array unit 6 are arranged on the base surface 111. ing. In addition, the inspection apparatus 1 may have a heater, a chamber, or the like for heating the IC device 9 as necessary.

  In such an inspection apparatus 1, the supply unit 2 supplies the IC device 9 to the supply side arrangement unit 3, the supplied IC device 9 is arranged in the supply side arrangement unit 3, and the arranged IC device 9 is transferred to the conveyance unit 4. Is transported to the inspection unit 5, the inspection unit 5 inspects the IC device 9 that has been transported, and the transport unit 4 transports / arranges the IC device 9 that has been inspected to the collection side array unit 6. The collection unit 7 collects the arranged IC devices 9. According to such an inspection apparatus 1, supply, inspection, and collection of the IC device 9 can be automatically performed. The inspection apparatus 1 is transported by a configuration excluding the inspection unit 5, that is, by a part of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the collection side arrangement unit 6, the collection unit 7, and the control unit 8. An apparatus (electronic component conveying apparatus) 10 is configured. The transport device 10 transports the IC device 9 and the like.

Hereinafter, configurations of the transport unit 4 and the inspection unit 5 will be described.
≪Transport section≫
As shown in FIG. 2, the transport unit 4 transports the IC device 9 disposed on the mounting stage 341 of the supply side array unit 3 to the inspection unit 5 and finishes the inspection in the inspection unit 5. 9 is a unit that transports 9 to the collection side arrangement unit 6. Such a transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a collection robot 44.

-Shuttle-
The shuttle 41 transports the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5, and further transports the inspected IC device 9 inspected by the inspection unit 5 to the vicinity of the collection side array unit 6. It is a shuttle to do. In such a shuttle 41, four pockets 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robot-
The supply robot 42 is a robot that conveys the IC device 9 disposed on the placement stage 341 to the shuttle 41. Such a supply robot 42 is supported by the base 11, a support frame 421 supported by the support frame 421, a movable frame 422 that can reciprocate in the Y direction with respect to the support frame 421, and a movable frame 422. And four hand units (gripping robots) 423. Each hand unit 423 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

-Inspection robot-
The inspection robot 43 is a robot that transports the IC device 9 accommodated in the shuttle 41 to the inspection unit 5 and also transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41. Further, the inspection robot 43 can also press the IC device 9 against the inspection unit 5 and apply a predetermined inspection pressure to the IC device 9 during the inspection. Such an inspection robot 43 is supported by the support frame 431 supported by the base 11, the movable frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431, and the movable frame 432. And four hand units (gripping portions) 433. The arrangement of each hand unit 433 is not particularly limited, and the arrangement shown is an example. Further, each hand unit 433 has an adsorbing portion that adsorbs the IC device 9 and the like.

-Recovery robot-
The collection robot 44 is a robot that conveys the IC device 9 that has been inspected by the inspection unit 5 to the collection side arrangement unit 6. Such a collection robot 44 is supported by the support frame 441 supported by the base 11, the moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441, and the moving frame 442. And four hand units (gripping robots) 443. Each hand unit 443 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

  Such a transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left in the figure, and the supply robot 42 transports the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 transports the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3). Next, the shuttle 41 moves to the right side in the figure, and the recovery robot 44 transports the inspected IC device 9 on the shuttle 41 to the recovery side arrangement unit 6 (STEP 4). By repeating such STEP 1 to STEP 4, the IC device 9 can be transported to the collection side array unit 6 via the inspection unit 5.

  The configuration of the transport unit 4 has been described above. As the configuration of the transport unit 4, the IC device 9 on the mounting stage 341 is transported to the inspection unit 5, and the IC device 9 that has been inspected is collected on the collection side array unit 6. If it can be conveyed to, it will not be specifically limited. For example, the shuttle 41 is omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 is used to transport the placement stage 341 to the inspection unit 5, and from the inspection unit 5 to the collection side arrangement unit 6. You may carry to.

≪Control part≫
The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit, for example, inspects the electrical characteristics of the IC device 9 disposed in the inspection unit 5 based on a program stored in a memory (not shown). The drive control unit controls the driving of each of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the inspection unit 5, the collection side arrangement unit 6, and the collection unit 7, for example, conveyance of the IC device 9 and the like. I do. The control unit 8 also controls the temperature of the IC device 9.

≪Inspection Department≫
The inspection unit 5 is a unit (tester) that inspects and tests the electrical characteristics of the IC device 9. As shown in FIGS. 3 and 4, the inspection unit 5 includes a holding unit (socket) 51 that holds the IC device 9, a frame 53 that is arranged above the holding unit 51, and a lower part of the holding unit 51. The load board 54 (wiring board), a plurality of probe pins 55 arranged inside the holding part 51, and a heater (heating part) 56 provided on the frame 53 are provided.

  The holding unit 51 holds the IC device 9 and can be exchanged depending on the type of the IC device 9. The holding part 51 includes a base material 57, a placement part (electronic component placement part) 52, and a heat conduction part 59.

  As shown in FIG. 3, the base material 57 has a plate shape, and is inserted into a guide pin 571 inserted into the guide hole of the frame 53 and a guide hole (not shown) formed in the hand unit 433. And a plurality of guide pins 572. The guide pin 571 is for positioning the holding portion 51 with respect to the frame 53. On the other hand, the guide pin 572 positions the hand unit 433 that has conveyed the IC device 9 with respect to the holding unit 51.

  The base material 57 has an upper surface side opening 574 that opens to the upper surface 573 and a lower surface side opening (concave portion) 576 that opens to the lower surface 575. The upper surface side opening 574 and the lower surface side opening 576 communicate with each other. Further, the lower surface side opening 576 is larger than the upper surface side opening 574 in plan view of the base material 57. In the present embodiment, four each of the upper surface side opening 574 and the lower surface side opening 576 are provided, and in the present embodiment, they are arranged along the X-axis direction. The placement portion 52 and the heat conduction portion 59 are accommodated in the lower surface side opening 576. Thus, by providing the lower surface side opening 576, the mounting portion 52 and the heat conducting portion 59 can be accommodated together, and when viewed from the entire holding portion 51, the thickness of the base material 57 or more. The thick part is omitted. Therefore, it is possible to prevent the holding part 51 from becoming thicker than necessary.

  The number of the upper surface side openings 574 and the lower surface side openings 576 is four in the present embodiment, but is not limited thereto, and may be one, two, three, or five or more. . In addition, the arrangement of the upper surface side openings 574 and the lower surface side openings 576 is arranged in one column along the X direction in the present embodiment, but is not limited to this, and a plurality of matrixes are arranged in each of the X direction and the Y direction. It may be arranged in a shape or may be arranged in a line along the Y direction.

  Further, as shown in FIG. 3, a heat insulating member 70 having heat insulating properties is provided on the upper surface 573 of the base material 57. Thereby, it is possible to prevent the heat of the base material 57 heated by the heater 56 from escaping upward.

  The placement part 52 has a plate shape and has a through hole 521 in which the IC device 9 is placed. Further, the side wall portion 523 of the through hole 521 has an inclined taper shape, and the IC device 9 can be easily taken in and out. The constituent material of the mounting portion 52 is not particularly limited, and various resins such as polyvinyl chloride, polyethylene, polypropylene, cyclic polyolefin, polystyrene, and acrylic resin can be used. Thereby, even if the IC device 9 is repeatedly placed on the placement portion 52, it is possible to prevent or suppress the generation of scratches due to wear.

The heat conducting portion 59 has a plate shape, and is disposed in the base material 57 in the lower surface side opening 576 and below the placement portion 52. The thermal conductivity of the heat conducting part 59 is larger than the thermal conductivity of the mounting part 52. Further, the heat conducting portion 59 is provided with an insertion hole 591 that is constituted by a large number of through holes and into which the probe pins 55 are inserted. Each insertion hole 591 has a circular cross-sectional shape. Such a heat conducting part 59 is a metal material having a relatively high thermal conductivity such as various metals such as iron, nickel, stainless steel, copper, brass, aluminum, titanium, magnesium, or alloys containing them. It consists of Among these, copper (thermal conductivity is 386 [W · m ⁻¹ · K ⁻¹ ]) and aluminum (thermal conductivity is 236 [W · m ⁻¹ · K ⁻¹ ]) are particularly preferable. Is relatively high and is easy to obtain.

  As shown in FIGS. 5A and 5B, the probe pin 55 includes a pin main body 551, two contact portions 552 protruding from both end sides of the pin main body 551, and the pin main body 551. The 552 has an urging portion 553 that urges the 552 in directions away from each other. When the IC device 9 is placed on the mounting portion 52 and the hand unit 433 of the inspection robot 43 presses the IC device 9, the contact portions 552 approach each other against the biasing force of the biasing portion 553. Move in the direction you want. In this state, the IC device 9 and the load board 54 are electrically connected via the probe pin 55, and the IC device 9 is inspected. The IC device 9 is inspected based on a program stored in the control unit 8. Such a probe pin 55 is preferably made of, for example, a material having a relatively high thermal conductivity similar to that of the heat conducting portion 59.

  5B, the outer diameter φD of the probe pin 55 is smaller than the inner diameter φd of the insertion hole 591. Thereby, the outer periphery of the probe pin 55 and the inner periphery of the insertion hole 591 can be separated. As a result, the probe pin 55 and the heat conducting portion 59 can be insulated. Therefore, it is possible to prevent the probe pin 55 and the heat conducting unit 59 from being short-circuited.

  In addition, it is preferable that an insulating film is formed on the outer periphery (portion other than the contact portion 552) of the probe pin 55. The material constituting the coating is not particularly limited, and for example, a resin material such as silicone resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, polyphenylene sulfide resin, magnesium phosphate, Examples include inorganic materials such as phosphates such as calcium phosphate, zinc phosphate, manganese phosphate, and cadmium phosphate, silicates (water glass) such as sodium silicate, and diamond-like carbon (DLC: Diamond Like Carbon). It is done.

  Among these, by using diamond-like carbon, it is excellent in insulation properties and wear resistance. Therefore, even if the probe pin 55 comes into contact with the inner peripheral surface of the insertion hole 591 many times during repeated use of the probe pin 55, it is possible to prevent or suppress the coating from peeling off. Therefore, high insulation can be ensured over a long period of time. On the other hand, when the coating is composed of the resin material as described above, the coating can be formed relatively easily.

  Here, when the inspection of the electrical characteristics of the IC device 9 is performed, the IC device 9 may be heated to a predetermined temperature (for example, about 85 ° C.). In the inspection apparatus 1, each of the four hand units 433 of the inspection robot 43 is configured to be capable of heating.

  However, conventionally, even if the IC device 9 is transported to the inspection unit 5 while being heated by the hand unit 433, when the IC device 9 comes into contact with the probe pin 55, the probe pin 55 is deprived of heat, and the temperature of the IC device 9 is increased. May decrease. As a result, the temperature of the IC device 9 deviates from the inspection temperature, and the IC device 9 is inspected in this temperature lowered state. There is a possibility that the IC device 9 obtained through such an inspection is judged to have low reliability as a product.

  The inspection apparatus 1 is effective in preventing the temperature of the IC device 9 from being lowered when the IC device 9 comes into contact with the probe pin 55. This will be described below.

  As shown in FIGS. 3 and 6, the frame 53 is provided with four heaters 56 having a round bar shape. The temperature of the heater 56 is, for example, about 80 to 120 ° C., although it depends on the constituent material of the probe pin 55 and the heat conducting portion 59.

  The heat Q of the heater 56 is first transmitted to the base material 57 and then transmitted to the heat conduction unit 59. Then, as shown in FIG. 4, the heat Q transmitted to the heat conducting portion 59 is transmitted to the probe pin 55 and the probe pin 55 is heated. In the inspection apparatus 1, since the heat conductivity of the heat conducting unit 59 is relatively high and the heat Q can be efficiently transmitted to the probe pin 55, the probe pin 55 can be efficiently heated. Thereby, when IC device 9 contacts probe pin 55, it can prevent or control that temperature of IC device 9 falls. Therefore, the inspection apparatus 1 can perform an accurate inspection.

  In particular, as shown in FIGS. 4 and 5B, the probe pin 55 is disposed inside the heat conducting portion 59. That is, the probe pin 55 is disposed in the insertion hole 591 of the heat conducting unit 59. For this reason, the probe pin 55 is surrounded by the heat conducting portion 59 over the entire outer periphery. Therefore, the heat Q from the heat conducting portion 59 is uniformly and efficiently transmitted to the probe pin 55.

  As shown in FIG. 6, the four heaters 56 are composed of two long heaters 56a and two short heaters 56b. The heaters 56 a and 56 b are arranged along the shape of the frame 53, that is, the heater 56 a is disposed on the long side portion 531 of the frame 53, and the heater 56 b is embedded in the short side portion 532 of the frame 53. ing. For this reason, the heat conducting portion 59 is surrounded in a plan view of the holding portion 51. Therefore, the heat of the heater 56 is transmitted from four directions to the heat conducting unit 59. Therefore, the heat conduction part 59 can be heated without unevenness.

  Further, the frame body 53 and the heater 56 are arranged at positions away from the placement part 52 and the heat conduction part 59 in a plan view of the holding part 51. Thereby, it can prevent that the heater 56 obstructs that the IC device 9 is mounted in the mounting part 52. FIG.

  Further, as shown in FIG. 3, the heater 56 is disposed vertically above the placement unit 52 and the heat conduction unit 59. For this reason, the load board 54 can be disposed below the mounting portion 52 and the heat conducting portion 59 in the vertical direction.

  Further, as shown in FIGS. 3 and 6, temperature detectors 80 are embedded in the frame 53 in the vicinity of the heaters 56 a and 56 b, respectively. The temperature detection unit 80 is electrically connected to the control unit 8. Thereby, the temperature of the heaters 56a and 56b can be managed by the control unit 8.

  As described above, when the inspection temperature for the IC device 9 is set to “85 ° C.”, the IC device 9 is heated to 85 ° C. if the temperature detected by the temperature detector 80 is within a range of 135 ± 15 ° C., for example. Can be considered.

  As shown in FIG. 4, a heat insulating member 60 is provided between the load board 54 and the base material 57. The heat insulating member 60 has a plate shape (sheet shape), and the upper surface thereof is in close contact with the lower surface of the base material 57 and the lower surface of the heat conducting portion 59. The heat insulating member 60 prevents the heat of the base member 57 and the heat conducting unit 59 heated by the heating unit from being transmitted to the load board 54. Thereby, it can prevent that the heat | fever Q escapes outside and heating of the probe pin 55 becomes inadequate. Further, the load board 54 can be prevented from being heated. Therefore, the inspection can be performed accurately.

  Thus, in the inspection apparatus 1, the heat conduction unit 59 can efficiently transmit the heat of the heater 56 to the probe pin 55. Therefore, even if the IC device 9 comes into contact with the probe pin 55, the temperature of the IC device 9 can be prevented from decreasing. As a result, the IC device 9 can be accurately inspected.

Second Embodiment
FIG. 7 is an enlarged cross-sectional view of an inspection unit provided in the second embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Description is omitted.

This embodiment is the same as the first embodiment except that the configuration of the heat conducting unit is different.
As shown in FIG. 7, in the inspection unit 5 </ b> A of the inspection apparatus 1 </ b> A, the placement unit 52 </ b> A is disposed in the lower surface side opening 576 of the base material 57, and the heat conduction unit 59 </ b> A is located outside the lower surface side opening 576. . This will be described in detail below.

  The placement portion 52A has a shape in which the placement portion 52 and the heat conduction portion 59 in the first embodiment are integrally formed. That is, the mounting portion 52A has a recess 524 that opens to the upper surface and the IC device 9 is disposed, and a plurality of insertion holes 526 that open from the bottom 525 of the recess 524 to the lower surface and into which the probe pins 55 are inserted. Have.

  The heat conduction portion 59A has a plate shape, and the thickness is smaller than the thickness of the placement portion 52A. The heat conducting portion 59A is larger than the placement portion 52A in plan view. Further, the heat conducting portion 59A is provided with a through hole 593 that communicates with the insertion hole 526 of the placement portion 52A. The probe pin 55 is inserted into the through hole 593.

  Such a heat conducting portion 59A is arranged below the base material 57 and the mounting portion 52A in the vertical direction so that the upper surface 592 is in close contact with the lower surface 575 of the base material 57 and the lower surface 527 of the mounting portion 52A. Yes. Thereby, it is possible to ensure a larger contact area between the placement portion 52A and the heat conduction portion 59A than in the first embodiment. Therefore, the heat Q of the base material 57 is more effectively transmitted to the heat conducting portion 59A, and the probe pin 55 can be heated.

  Further, since the thickness of the heat conducting portion 59A is thinner than the thickness of the placement portion 52A, it is possible to prevent or suppress the thickness when viewed from the entire holding portion 51 from becoming too thick. The thickness of the heat conducting portion 59A is preferably 5% or more and 20% or less of the thickness of the placement portion 52A, and more preferably 10% or more and 15% or less.

  If the thickness of the heat conducting portion 59A is too thick, the entire holding portion 51 tends to be relatively thick. On the other hand, if the heat conducting portion 59A is too thin, the length of the through hole 593 is too short and the area facing the probe pin 55 is reduced. For this reason, it is difficult to sufficiently heat the probe pin 55.

<Third Embodiment>
FIG. 8 is an enlarged plan view of an inspection unit provided in the third embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Description is omitted.

This embodiment is the same as the first embodiment except that the arrangement of the heating unit is different.
As shown in FIG. 8, in the inspection unit 5 </ b> B of the inspection apparatus 1 </ b> B, four heaters 56 c are provided unevenly on the long side portion 531 of the frame 53. Two heaters 56 c are embedded in one long side portion 531, and two heaters 56 c are embedded in the other long side portion 531.

  In each long side portion 531, the two heaters 56c are embedded so as to be inserted from both end sides of the long side portion 531 toward the central portion. Moreover, in each long side part 531, the edge parts of the two heaters 56c are spaced apart, and the temperature detection part 80 is embedded between them.

  According to such 3rd Embodiment, the one temperature detection part 80 bears the temperature detection of the two heaters 56c. As a result, compared to the case where the dedicated temperature detectors 80 are installed in the vicinity of the four heaters 56, respectively, a simple configuration can be achieved and the cost can be reduced.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 1A ... Inspection apparatus 1B ... Inspection apparatus 2 ... Supply part 3 ... Supply side arrangement | positioning part 341 ... Mounting stage 4 ... Conveyance part 41 ... Shuttle 411 ... Pocket 42 ... Supply Robot 421... Support frame 422... Moving frame 423... Hand unit 43... Inspection robot 431... Support frame 432. Frame 443 ... Hand unit 5 ... Inspection part 5A ... Inspection part 5B ... Inspection part 51 ... Holding part 52 ... Placement part 52A ... Placement part 521 ... Through hole 523 ... Side wall part 524 ... ... concave portion 525 ... bottom 526 ... insertion hole 527 ... lower surface 53 ... frame body 531 ... long side portion 532 ... short side portion 54 ... load board 55 ... probe pin 51 …… Pin body 552 …… Contact portion 553 …… Biasing portion 56 …… Heater 56a …… Heater 56b …… Heater 56c …… Heater 57 …… Base material 571 …… Guide pin 572 …… Guide pin 573 …… Upper surface 574... Upper surface side opening 575... Lower surface 576... Lower surface side opening 59... Thermal conduction portion 59 A. 7 …… Recovery unit 8 …… Control unit 9 …… IC device 91 …… Main body unit 92 …… Terminal 10 …… Conveyor 11 …… Base 111 …… Base surface 12 …… Cover 60 …… Heat insulation member 70 …… Thermal insulation member 80 ... temperature detection part Q ... heat φD ... outer diameter φd ... inner diameter

Claims (25)

An electronic component placement section capable of placing electronic components;
When the electronic component is placed on the electronic component placement portion, a heat conduction portion disposed on the opposite side of the electronic component via the electronic component placement portion;
A terminal portion capable of contacting the electronic component placement portion and the heat conducting portion;
And a heating unit capable of heating the heat conducting unit.   The electronic component transport apparatus according to claim 1, wherein a thermal conductivity of the heat conducting unit is larger than a thermal conductivity of the electronic component placing unit.   The electronic component carrying device according to claim 1, wherein the terminal portion is disposed inside the heat conducting portion.   The electronic component conveying apparatus according to claim 3, wherein the terminal portion is disposed through the heat conducting portion.   The electronic component conveying apparatus according to claim 1, wherein the heat conducting unit and the terminal unit are electrically insulated.   The electronic component conveying apparatus according to claim 5, wherein a space is interposed between the heat conducting unit and the terminal unit.   The electronic component carrying apparatus according to claim 5, wherein an insulating member capable of being electrically insulated is disposed between the heat conducting unit and the terminal unit.   The electronic component conveying apparatus according to claim 7, wherein the insulating member includes diamond-like carbon.   The electronic component conveying apparatus according to claim 7, wherein the insulating member includes a resin.   The electronic component carrying device according to claim 1, wherein the heat conducting unit is made of metal.   The electronic component carrying device according to any one of claims 1 to 10, wherein the electronic component placing portion includes a resin.   The electronic component transport apparatus according to any one of claims 1 to 11, wherein the heating unit is disposed vertically above the heat conducting unit and the electronic component placement unit.   The electronic component transport apparatus according to any one of claims 1 to 12, wherein a heat insulating member is disposed above the electronic component mounting portion in a vertical direction.   The electronic component conveying apparatus according to any one of claims 1 to 13, wherein a heat insulating member is disposed below the electronic component mounting portion in the vertical direction. The wiring board is disposed on the opposite side of the heat conducting part from the electronic component and electrically connected to the terminal part,
The electronic component conveying apparatus according to claim 14, wherein the heat insulating member is disposed between the heat conducting unit and the wiring board.   The electronic component carrying device according to any one of claims 1 to 15, wherein the electronic component placing portion and the heat conducting portion have a portion overlapping in a plan view.   The electronic component transport apparatus according to claim 1, wherein the heating unit is disposed at a position different from the electronic component placement unit and the heat conduction unit in a plan view.   The heating unit is provided along a first direction, and a length in the first direction is longer than a length in a second direction orthogonal to the first direction. The electronic component conveying apparatus according to item 1. A plurality of the heating units are provided,
The electronic component carrying device according to claim 1, wherein the heat conducting unit is provided between the plurality of heating units.   20. The electronic component carrying apparatus according to claim 1, wherein a thickness of the heat conducting unit is thinner than a thickness of the electronic component placing unit.   21. The electronic component carrying device according to claim 20, wherein a thickness of the heat conducting unit is not less than 5% and not more than 20% of a thickness of the electronic component placing unit.   The electronic component transport apparatus according to claim 1, further comprising a base material having a concave portion capable of accommodating the electronic component placement portion.   The electronic component carrying device according to claim 22, wherein the heat conducting unit is housed in the recess.   The electronic component carrying device according to claim 22, wherein the heat conducting unit is disposed at a position different from the concave portion in plan view. An electronic component placement section capable of placing electronic components;
When the electronic component is placed on the electronic component placement portion, a heat conduction portion disposed on the opposite side of the electronic component via the electronic component placement portion;
A terminal portion capable of contacting the electronic component placement portion and the heat conducting portion;
A heating unit capable of heating the heat conducting unit;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

Images