TWI583452B - Processing device and processing method - Google Patents
Processing device and processing method Download PDFInfo
- Publication number
- TWI583452B TWI583452B TW102106469A TW102106469A TWI583452B TW I583452 B TWI583452 B TW I583452B TW 102106469 A TW102106469 A TW 102106469A TW 102106469 A TW102106469 A TW 102106469A TW I583452 B TWI583452 B TW I583452B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- liquid
- nozzle
- workpiece
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Description
本申請案係基於在2012年3月14日申請之先行日本專利申請2012-057939號之權利之利益，且謀求其利益，而將其全部內容以引用之形式包含於本文中。 The present application is based on the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of
此處說明之實施形態係關於一種處理裝置及處理方法。 The embodiments described herein relate to a processing apparatus and a processing method.
在半導體裝置或平板顯示器等電子裝置之製造中，對板狀之被處理物(例如，晶圓或玻璃基板等)之表面供給處理液而進行各種處理。 In the manufacture of an electronic device such as a semiconductor device or a flat panel display, various treatments are performed by supplying a processing liquid to the surface of a plate-shaped workpiece (for example, a wafer or a glass substrate).
於此情形時，若被處理物之大小變大則處理液之消耗量增多。因此，提出有回收供給至被處理物表面之處理液，而循環利用回收之處理液之技術。 In this case, if the size of the object to be processed is increased, the consumption of the treatment liquid increases. Therefore, there has been proposed a technique of recycling the treatment liquid supplied to the surface of the object to be treated and recycling the recovered treatment liquid.
然而，回收之處理液中包含有各種物質，且亦存在利用過濾器等無法去除之情形。因此，有因循環利用回收之處理液而導致對被處理物之表面造成污染之虞。 However, the recovered treatment liquid contains various substances, and there are cases where it cannot be removed by a filter or the like. Therefore, there is a problem that the surface of the object to be treated is contaminated by recycling the treated liquid.
於此情形時，亦考慮於利用回收之處理液進行處理後，對被處理物之表面供給純水而去除污染物質，但存在僅藉由對被處理物之表面供給純水無法完全去除污染物質之情形。又，若反覆循環利用處理液，則亦有如下之虞：對處理有效之成分逐漸減少等而產生處理不足或處理不均等。 In this case, it is also considered that after the treatment with the recovered treatment liquid, pure water is supplied to the surface of the treated object to remove the contaminant, but there is a possibility that the contaminant cannot be completely removed only by supplying pure water to the surface of the treated object. The situation. Further, if the treatment liquid is recycled in a reverse manner, there are cases in which the components effective for the treatment are gradually reduced, and the treatment is insufficient or the treatment is uneven.
如此，若藉由回收之處理液進行處理，則有無法進行被處理物之適當之處理之虞。 As described above, if the treatment is carried out by the treatment liquid to be recovered, there is a possibility that the treatment of the object to be treated cannot be performed properly.
本發明所欲解決之問題在於提供一種即便於藉由回收之處理液進行處理之情形時亦可進行適當之處理的處理裝置及處理方法。 The problem to be solved by the present invention is to provide a processing apparatus and a processing method which can perform appropriate processing even in the case of processing by the recovered processing liquid.
根據一實施形態，處理裝置包括：搬送部，其搬送被處理物；回收部，其回收供給至由上述搬送部搬送之上述被處理物之處理面的第1處理液；第1噴嘴，其將由上述回收部回收之上述第1處理液噴出至上述被處理物之處理面；第2噴嘴，其係設置於上述第1噴嘴之搬送方向之下游側，且將第2處理液噴出至上述被處理物之處理面；及第3噴嘴，其係設置於上述第2噴嘴之搬送方向之下游側，且將清洗液噴出至上述被處理物之處理面。 According to one embodiment, the processing apparatus includes: a transport unit that transports the object to be processed; and a recovery unit that collects the first processing liquid supplied to the processing surface of the workpiece to be transported by the transport unit; and the first nozzle The first processing liquid collected by the recovery unit is discharged to the processing surface of the workpiece, and the second nozzle is disposed downstream of the first nozzle in the conveying direction, and ejects the second processing liquid to the processed surface. And a third nozzle that is disposed downstream of the second nozzle in the transport direction and that ejects the cleaning liquid onto the processed surface of the workpiece.
而且，上述第2噴嘴朝向較相對於上述搬送方向垂直之方向更靠上述搬送方向之下游側噴出上述第2處理液，上述第3噴嘴朝向較相對於上述搬送方向垂直之方向更靠上述搬送方向之上游側噴出上述清洗液。 Further, the second nozzle discharges the second processing liquid toward a downstream side in the transport direction in a direction perpendicular to the transport direction, and the third nozzle faces the transport direction in a direction perpendicular to the transport direction. The cleaning liquid is sprayed on the upstream side.
本發明可提供一種即便於藉由回收之處理液進行處理之情形時亦可進行適當之處理的處理裝置及處理方法。 The present invention can provide a processing apparatus and a processing method which can perform appropriate processing even in the case of processing by the recovered processing liquid.
1‧‧‧處理裝置 1‧‧‧Processing device
2‧‧‧第1處理部 2‧‧‧First Processing Department
3‧‧‧第2處理部 3‧‧‧2nd Processing Department
4‧‧‧搬送部 4‧‧‧Transportation Department
4a‧‧‧搬送輥 4a‧‧‧Transport roller
5‧‧‧噴嘴 5‧‧‧ nozzle
5a‧‧‧噴出口 5a‧‧‧Spray outlet
6‧‧‧噴嘴 6‧‧‧ nozzle
6a‧‧‧噴出口 6a‧‧‧Spray outlet
7‧‧‧回收部 7‧‧Recycling Department
8‧‧‧收納部 8‧‧‧ 收纳 department
8a‧‧‧流入口 8a‧‧‧flow entrance
8b‧‧‧廢液口 8b‧‧‧ Waste port
8c‧‧‧排出口 8c‧‧‧Export
9‧‧‧供給部 9‧‧‧Supply Department
10‧‧‧過濾器 10‧‧‧Filter
11‧‧‧配管 11‧‧‧Pipe
12‧‧‧配管 12‧‧‧Pipe
13‧‧‧配管 13‧‧‧Pipe
14‧‧‧配管 14‧‧‧Pipe
15‧‧‧清洗液收納部 15‧‧‧Clean liquid storage unit
16‧‧‧清洗液供給部 16‧‧‧cleaning liquid supply department
17‧‧‧配管 17‧‧‧Pipe
18‧‧‧配管 18‧‧‧Pipe
19‧‧‧噴嘴 19‧‧‧ nozzle
19a‧‧‧噴出口 19a‧‧‧Spray outlet
20‧‧‧噴嘴 20‧‧‧ nozzle
20a‧‧‧噴出口 20a‧‧‧Spray outlet
21‧‧‧收納部 21‧‧‧ Storage Department
22‧‧‧供給部 22‧‧‧Supply Department
23‧‧‧清洗液收納部 23‧‧‧Clean liquid storage unit
24‧‧‧清洗液供給部 24‧‧‧cleaning liquid supply department
25‧‧‧排出部 25‧‧‧Exporting Department
25a‧‧‧排出口 25a‧‧‧Export
26‧‧‧配管 26‧‧‧Pipe
27‧‧‧配管 27‧‧‧Pipe
28‧‧‧配管 28‧‧‧Pipe
29‧‧‧配管 29‧‧‧Pipe
30‧‧‧捕集部 30‧‧‧ Capture Department
30a‧‧‧排出口 30a‧‧‧Export
100‧‧‧被處理物 100‧‧‧Processed objects
100a‧‧‧處理面 100a‧‧‧Processing surface
100b‧‧‧面 100b‧‧‧ face
100c‧‧‧供給位置 100c‧‧‧Supply location
101‧‧‧搬送方向 101‧‧‧Transfer direction
190‧‧‧噴嘴 190‧‧‧ nozzle
200‧‧‧噴嘴 200‧‧‧ nozzle
d‧‧‧距離 D‧‧‧distance
圖1係用以例示第1實施形態之處理裝置之構成之模式圖。 Fig. 1 is a schematic view showing a configuration of a processing apparatus according to a first embodiment.
圖2係用以例示比較例之噴嘴190及噴嘴200之模式圖。(a)係用以例示噴嘴190及噴嘴200之噴出方向之模式圖，(b)係用以例示被覆性與置換性之模式圖。 2 is a schematic view for illustrating a nozzle 190 and a nozzle 200 of a comparative example. (a) is a schematic diagram illustrating a discharge direction of the nozzle 190 and the nozzle 200, and (b) is a schematic diagram illustrating a coating property and a replacement property.
圖3係用以例示本實施形態之噴嘴19及噴嘴20之模式圖。(a)係用以例示噴嘴19及噴嘴20之噴出方向之模式圖，(b)係用以例示被覆性與置換性之模式圖。 Fig. 3 is a schematic view showing the nozzle 19 and the nozzle 20 of the present embodiment. (a) is a schematic diagram illustrating a discharge direction of the nozzle 19 and the nozzle 20, and (b) is a schematic diagram illustrating a coating property and a replacement property.
圖4之(a)~(e)係用以對處理液及清洗液之供給位置、被處理物100之搬送速度、以及被覆性及置換性之關係進行例示之模式圖。 (a) to (e) of FIG. 4 are schematic diagrams for exemplifying the relationship between the supply position of the treatment liquid and the cleaning liquid, the conveyance speed of the workpiece 100, and the coating property and the replacement property.
圖5係用以對第2實施形態之處理方法進行例示之流程圖。 Fig. 5 is a flow chart for illustrating a processing method of the second embodiment.
以下，一面參照圖式，一面對實施形態進行例示。再者，各圖式中，對相同之構成要素附上相同符號而適當省略詳細說明。 Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and the detailed description is omitted as appropriate.
圖1係用以例示第1實施形態之處理裝置之構成之模式圖。 Fig. 1 is a schematic view showing a configuration of a processing apparatus according to a first embodiment.
如圖1所示，於處理裝置1中設置有第1處理部2、第2處理部3、及搬送部4。 As shown in FIG. 1, the processing device 1 is provided with a first processing unit 2, a second processing unit 3, and a transport unit 4.
第1處理部2回收供給至被處理物100之處理面100a之處理液(相當於第1處理液之一例)，並將回收之處理液再次供給至被處理物100之處理面100a。 The first processing unit 2 collects the processing liquid (corresponding to an example of the first processing liquid) supplied to the processing surface 100 a of the workpiece 100 , and supplies the collected processing liquid to the processing surface 100 a of the workpiece 100 again.
第2處理部3使由第1處理部2進行處理後之被處理物100之處理面100a適當化。例如，藉由循環利用回收之處理液而去除附著於被處理物100之處理面100a之污染物質。又，藉由反覆進行處理液之循環利用而減輕產生之處理不足或處理不均。 The second processing unit 3 optimizes the processing surface 100a of the workpiece 100 processed by the first processing unit 2. For example, the pollutants adhering to the treatment surface 100a of the workpiece 100 are removed by recycling the recovered treatment liquid. Further, by repeating the recycling of the treatment liquid, the insufficient processing or uneven processing is reduced.
搬送部4將被處理物100自第1處理部2側朝向第2處理部3側搬送。例如，搬送部4可設為沿被處理物100之搬送方向101設置有在支撐著被處理物100之狀態下可旋轉之複數個搬送輥4a者。被處理物100係於搬送輥4a上朝向搬送方向101被搬送。 The conveyance unit 4 conveys the workpiece 100 from the first processing unit 2 side toward the second processing unit 3 side. For example, the transport unit 4 may be provided with a plurality of transport rollers 4a that are rotatable in a state in which the workpiece 100 is supported in the transport direction 101 of the workpiece 100. The workpiece 100 is conveyed toward the conveyance direction 101 on the conveyance roller 4a.
於此情形時，藉由控制搬送輥4a之旋轉速度，而可調整被處理物100之搬送速度。又，雖省略了圖示，但亦設置有支撐搬送輥4a之旋 轉軸、控制馬達、驅動力傳達部、框架等。再者，雖例示了包含搬送輥4a之搬送部4，但並不限定於此。例如，可適當選擇搬送機器人或具有支撐被處理物100之皮帶之搬送裝置等可朝向特定方向搬送被處理物100者。 In this case, the conveyance speed of the workpiece 100 can be adjusted by controlling the rotation speed of the conveyance roller 4a. Moreover, although illustration is abbreviate|omitted, the rotation which supports the conveyance roller 4a is also provided. Rotary shaft, control motor, driving force transmission unit, frame, etc. In addition, although the conveyance part 4 containing the conveyance roller 4a is illustrated, it is not limited to this. For example, a person who can transport the workpiece 100 in a specific direction can be appropriately selected by a transfer robot or a conveyance device having a belt that supports the workpiece 100.
其次，對第1處理部2進一步進行例示。 Next, the first processing unit 2 is further exemplified.
於第1處理部2中設置有噴嘴5(相當於第1噴嘴之一例)、噴嘴6、回收部7、清洗液收納部15、清洗液供給部16。 The first processing unit 2 is provided with a nozzle 5 (corresponding to an example of the first nozzle), a nozzle 6, a recovery unit 7, a cleaning liquid storage unit 15, and a cleaning liquid supply unit 16.
噴嘴5將由回收部7回收之處理液噴出至被處理物100之處理面100a。噴嘴5係設置於搬送輥4a之上方。噴嘴5之噴出口5a係面對被處理物100之處理面100a而設置。噴嘴5對被處理物100之處理面100a自正上方噴出處理液。噴出口5a呈孔狀，於搬送方向101及與搬送方向101正交之方向上設置有複數個。噴嘴5對被處理物100之處理面100a之整個區域噴出處理液。 The nozzle 5 ejects the treatment liquid collected by the recovery unit 7 to the treatment surface 100a of the workpiece 100. The nozzle 5 is provided above the conveying roller 4a. The discharge port 5a of the nozzle 5 is provided facing the processing surface 100a of the workpiece 100. The nozzle 5 discharges the treatment liquid from directly above the treatment surface 100a of the workpiece 100. The discharge port 5a has a hole shape, and is provided in plural in the transport direction 101 and the direction orthogonal to the transport direction 101. The nozzle 5 ejects the processing liquid to the entire area of the processing surface 100a of the workpiece 100.
噴嘴5之處理液之噴出形態可根據處理目的或處理液之種類等而適當變更。例如，噴嘴5既可為噴出液狀之處理液者，亦可為噴出霧狀等形態之處理液者。 The discharge form of the treatment liquid of the nozzle 5 can be appropriately changed depending on the purpose of the treatment, the type of the treatment liquid, and the like. For example, the nozzle 5 may be a liquid that ejects liquid or a liquid that ejects a mist or the like.
自噴嘴5噴出之處理液可根據處理之目的或被處理物100之處理面100a之材質等而適當變更。例如，於被處理物100為玻璃基板且要去除附著於處理面100a之金屬污染物之情形時，可使用氫氟酸(hydrofluoric acid)等作為處理液。 The treatment liquid discharged from the nozzle 5 can be appropriately changed depending on the purpose of the treatment or the material of the treatment surface 100a of the workpiece 100. For example, when the object to be treated 100 is a glass substrate and metal contaminants adhering to the treatment surface 100a are to be removed, hydrofluoric acid or the like can be used as the treatment liquid.
噴嘴6係設置於搬送輥4a之下方。噴嘴6之噴出口6a係面對與被處理物100之處理面100a對向之面100b而設置。噴嘴6自正下方對被處理物100之面100b噴出清洗液。噴出口6a呈孔狀，於搬送方向101及與搬送方向101正交之方向上設置有複數個。 The nozzle 6 is provided below the conveying roller 4a. The discharge port 6a of the nozzle 6 is provided facing the surface 100b facing the processing surface 100a of the workpiece 100. The nozzle 6 ejects the cleaning liquid to the surface 100b of the workpiece 100 from directly below. The discharge port 6a has a hole shape, and is provided in plural in the transport direction 101 and the direction orthogonal to the transport direction 101.
此處，自噴嘴5噴出至被處理物100之處理面100a之處理液自被處理物100之周緣流出，而由捕集部30捕集。此時，自被處理物100之周 緣流出之已使用過之處理液之一部分可能會附著於搬送輥4a，且附著於搬送輥4a之已使用過之處理液可能會附著於被處理物100之面100b。 Here, the treatment liquid discharged from the nozzle 5 to the treatment surface 100a of the workpiece 100 flows out from the periphery of the workpiece 100, and is collected by the collection unit 30. At this time, from the periphery of the object 100 A part of the used treatment liquid that has flowed out may adhere to the conveyance roller 4a, and the used treatment liquid adhering to the conveyance roller 4a may adhere to the surface 100b of the workpiece 100.
於此情形時，由於已使用過之處理液中含有被去除之物質，故而有被處理物100之面100b被污染之虞。又，由於已使用過之處理液中含有對處理有效之成分，故而亦有對被處理物100之面100b造成損傷之虞。 In this case, since the used treatment liquid contains the removed substance, the surface 100b of the workpiece 100 is contaminated. Further, since the used treatment liquid contains a component effective for the treatment, there is also a risk of damage to the surface 100b of the workpiece 100.
因此，藉由自噴嘴6對被處理物100之面100b噴出清洗液，而將附著於被處理物100之面100b之已使用過之處理液去除。 Therefore, the cleaning liquid is discharged from the surface 100b of the workpiece 100 from the nozzle 6, and the used processing liquid adhering to the surface 100b of the workpiece 100 is removed.
自噴嘴6噴出之清洗液例如可設為純水等。自噴嘴6噴出之清洗液既可為常溫，亦可為經加熱者。若使用經加熱之清洗液，則可使被處理物100之溫度上升，故可提高處理面100a上之處理效率。 The cleaning liquid sprayed from the nozzle 6 can be, for example, pure water or the like. The cleaning liquid sprayed from the nozzle 6 can be either normal temperature or heated. When the heated cleaning liquid is used, the temperature of the workpiece 100 can be increased, so that the processing efficiency on the processing surface 100a can be improved.
藉由噴嘴6之清洗液之噴出形態可適當變更。例如，噴嘴6既可為噴出液狀之清洗液者，亦可為噴出霧狀等形態之清洗液者。 The discharge form of the cleaning liquid by the nozzle 6 can be appropriately changed. For example, the nozzle 6 may be one in which a liquid cleaning liquid is ejected, or may be a cleaning liquid in a form such as a mist.
回收部7回收供給至由搬送部4搬送之被處理物100之處理面100a的處理液。 The collection unit 7 collects the treatment liquid supplied to the treatment surface 100a of the workpiece 100 conveyed by the conveyance unit 4.
於回收部7中設置有捕集部30、收納部8、供給部9、過濾器10。 The collection unit 7 is provided with a collection unit 30, a storage unit 8, a supply unit 9, and a filter 10.
捕集部30捕集自被處理物100之周緣流出之已使用過之處理液。捕集部30係設置於噴嘴6之下方。因此，亦捕集噴出至被處理物100之面100b之已使用過之清洗液。對於捕集部30之形態並無特別限定，例如，可例示具有上端開口之箱狀形態者。又，例如，可將收納第1處理部2之未圖示之殼體等設為捕集部30。 The collecting unit 30 collects the used processing liquid that has flowed out from the periphery of the workpiece 100. The trap portion 30 is provided below the nozzle 6. Therefore, the used cleaning liquid which is ejected to the surface 100b of the workpiece 100 is also collected. The form of the collecting unit 30 is not particularly limited, and for example, a box shape having an open upper end can be exemplified. Further, for example, a casing (not shown) that houses the first treatment unit 2 can be used as the collection unit 30.
於捕集部30中設置有排出口30a，且於排出口30a連接有配管11之一端。而且，配管11之另一端連接於收納部8之流入口8a。即，可將由捕集部30所捕集之已使用過之處理液與已使用過之清洗液之混合液收納於收納部8中。 A discharge port 30a is provided in the collecting portion 30, and one end of the pipe 11 is connected to the discharge port 30a. Further, the other end of the pipe 11 is connected to the inflow port 8a of the accommodating portion 8. In other words, the mixed solution of the used treatment liquid collected by the collection unit 30 and the used cleaning liquid can be stored in the storage unit 8.
收納部8收納由捕集部30所捕集之已使用過之處理液與已使用過之清洗液之混合液。收納部8未必需要，但若設置收納部8則可使供給部9之供給穩定。 The accommodating portion 8 accommodates a mixed liquid of the used treatment liquid collected by the collection unit 30 and the used cleaning liquid. The accommodating portion 8 is not necessarily required, but if the accommodating portion 8 is provided, the supply of the supply portion 9 can be stabilized.
又，因反覆進行處理液之循環利用，故而已使用過之處理液中所含有之對處理有效之成分逐漸減少。又，因混入已使用過之清洗液，故而對處理有效之成分之濃度進一步減少。因此，例如，於對處理有效之成分之濃度為特定值以下之情形時，自廢液口8b排出，或亦可自流入口8a供給用以調整濃度之處理液。 Further, since the treatment liquid is recycled, the components which are effective for the treatment contained in the used treatment liquid are gradually reduced. Further, since the used cleaning liquid is mixed, the concentration of the component effective for the treatment is further reduced. Therefore, for example, when the concentration of the component effective for the treatment is a specific value or less, it is discharged from the waste liquid port 8b, or the treatment liquid for adjusting the concentration may be supplied from the flow inlet 8a.
於收納部8中設置有排出口8c，且於排出口8c連接有配管12之一端。而且，配管12之另一端連接於供給部9。即，可將收納於收納部8中之已使用過之處理液與已使用過之清洗液之混合液供給至供給部9。 A discharge port 8c is provided in the accommodating portion 8, and one end of the pipe 12 is connected to the discharge port 8c. Further, the other end of the pipe 12 is connected to the supply portion 9. In other words, the mixed solution of the used treatment liquid stored in the storage unit 8 and the used cleaning liquid can be supplied to the supply unit 9.
配管13之一端連接於供給部9，另一端連接於過濾器10。配管14之一端連接於過濾器10，另一端連接於噴嘴5。因此，可將收納於收納部8中之已使用過之處理液與已使用過之清洗液之混合液經由過濾器10供給至噴嘴5。 One end of the pipe 13 is connected to the supply portion 9, and the other end is connected to the filter 10. One end of the pipe 14 is connected to the filter 10, and the other end is connected to the nozzle 5. Therefore, the mixed liquid of the used processing liquid accommodated in the accommodating part 8 and the used cleaning liquid can be supplied to the nozzle 5 via the filter 10.
供給部9例如可設為如泵等般能夠搬送處理液者。 The supply unit 9 can be, for example, a person capable of transporting a treatment liquid such as a pump.
過濾器10去除藉由供給部9而供給至噴嘴5之已使用過之處理液與已使用過之清洗液之混合液中所含有之污染物質。藉由過濾器10無法完全去除之污染物質(例如，金屬離子等)之一部分會附著於被處理物100之處理面100a，但可藉由第2處理部3之處理而將其去除。又，若反覆進行處理液之循環利用，則對處理有效之成分會逐漸減少等而產生處理不足或處理不均等，但可藉由第2處理部3之處理而使其減輕。 The filter 10 removes the contaminant contained in the mixed liquid of the used treatment liquid supplied to the nozzle 5 and the used cleaning liquid by the supply unit 9. A portion of the contaminant (for example, metal ions or the like) that cannot be completely removed by the filter 10 adheres to the treatment surface 100a of the workpiece 100, but can be removed by the treatment of the second treatment unit 3. In addition, when the treatment liquid is recycled, the components effective for the treatment are gradually reduced, and the treatment is insufficient or the treatment is uneven. However, the treatment by the second treatment unit 3 can be reduced.
配管17之一端連接於清洗液收納部15，另一端連接於清洗液供給部16。又，配管18之一端連接於清洗液供給部16，另一端連接於噴 嘴6。因此，可將收納於清洗液收納部15中之清洗液供給至噴嘴6。 One end of the pipe 17 is connected to the cleaning liquid accommodating portion 15 and the other end is connected to the cleaning liquid supply portion 16. Further, one end of the pipe 18 is connected to the cleaning liquid supply portion 16, and the other end is connected to the spray. Mouth 6. Therefore, the cleaning liquid accommodated in the cleaning liquid storage unit 15 can be supplied to the nozzle 6.
清洗液收納部15收納清洗液。 The cleaning liquid storage unit 15 houses the cleaning liquid.
清洗液供給部16例如可設為如泵等般能夠搬送清洗液者。 The cleaning liquid supply unit 16 can be, for example, a pump capable of transporting a cleaning liquid.
又，亦可適當設置控制清洗液之溫度之未圖示之溫度控制部等。 Further, a temperature control unit (not shown) that controls the temperature of the cleaning liquid may be appropriately provided.
其次，對第2處理部3進一步進行例示。 Next, the second processing unit 3 is further exemplified.
於第2處理部3中設置有噴嘴19(相當於第2噴嘴之一例)、噴嘴20(相當於第3噴嘴之一例)、收納部21、供給部22、清洗液收納部23、清洗液供給部24、及排出部25。 The second processing unit 3 is provided with a nozzle 19 (corresponding to one example of the second nozzle), a nozzle 20 (corresponding to one of the third nozzles), the storage unit 21, the supply unit 22, the cleaning liquid storage unit 23, and the cleaning liquid supply. The portion 24 and the discharge portion 25.
噴嘴19係設置於噴嘴5之搬送方向之下游側，將尚未用於處理之新的處理液噴出至被處理物100之處理面100a。噴嘴19係設置於搬送輥4a之上方。噴嘴19之噴出口19a於與搬送方向101正交之方向上呈較長之狹縫狀。因此，噴嘴19可對被處理物100之處理面100a呈線狀噴出處理液(相當於第2處理液之一例)。又，噴嘴19朝向較相對於被處理物100之搬送方向101垂直之方向更靠搬送方向101之下游側噴出處理液。 The nozzle 19 is provided on the downstream side in the transport direction of the nozzle 5, and ejects a new processing liquid that has not been used for processing to the processing surface 100a of the workpiece 100. The nozzle 19 is provided above the conveying roller 4a. The discharge port 19a of the nozzle 19 has a long slit shape in a direction orthogonal to the conveyance direction 101. Therefore, the nozzle 19 can discharge the processing liquid linearly to the processing surface 100a of the workpiece 100 (corresponding to an example of the second processing liquid). Moreover, the nozzle 19 discharges the processing liquid toward the downstream side in the conveying direction 101 in a direction perpendicular to the conveying direction 101 of the workpiece 100.
藉由噴嘴19之處理液之噴出形態可根據處理目的或處理液之種類等而適當變更。例如，噴嘴19既可為噴出液狀之處理液者，亦可為噴出霧狀等形態之處理液者。 The discharge form of the treatment liquid by the nozzle 19 can be appropriately changed depending on the purpose of the treatment, the type of the treatment liquid, and the like. For example, the nozzle 19 may be a liquid that ejects liquid or a liquid that ejects a mist or the like.
自噴嘴19噴出之處理液中所含有之對處理有效之成分可設為與自噴嘴5噴出之處理液中所含有之對處理有效之成分相同者。然而，自噴嘴5噴出之處理液為回收之處理液，但自噴嘴19噴出之處理液為尚未用於處理之新的處理液。又，自噴嘴19噴出之處理液之濃度既可設為與自噴嘴5噴出之處理液之濃度相同，亦可設為不同。作為自噴嘴19噴出之處理液，例如，可例示氫氟酸等。 The component effective for the treatment contained in the treatment liquid discharged from the nozzle 19 can be the same as the component effective for the treatment contained in the treatment liquid discharged from the nozzle 5. However, the treatment liquid discharged from the nozzle 5 is the recovered treatment liquid, but the treatment liquid discharged from the nozzle 19 is a new treatment liquid that has not been used for treatment. Further, the concentration of the treatment liquid discharged from the nozzle 19 may be the same as or different from the concentration of the treatment liquid discharged from the nozzle 5. As the treatment liquid sprayed from the nozzle 19, for example, hydrofluoric acid or the like can be exemplified.
噴嘴20係設置於噴嘴19之搬送方向之下游側，且將清洗液噴出 至被處理物100之處理面100a。噴嘴20係設置於搬送輥4a之上方。噴嘴20之噴出口20a於與搬送方向101正交之方向上呈較長之狹縫狀。因此，噴嘴20可對被處理物100之處理面100a呈線狀噴出清洗液。 The nozzle 20 is disposed on the downstream side of the conveying direction of the nozzle 19, and ejects the cleaning liquid. The processing surface 100a of the workpiece 100 is processed. The nozzle 20 is disposed above the conveying roller 4a. The discharge port 20a of the nozzle 20 has a slit shape that is long in a direction orthogonal to the conveyance direction 101. Therefore, the nozzle 20 can discharge the cleaning liquid linearly to the processing surface 100a of the workpiece 100.
又，噴嘴20朝向較相對於被處理物100之搬送方向101垂直之方向更靠搬送方向之上游側噴出處理液。 Moreover, the nozzle 20 discharges the processing liquid toward the upstream side in the conveying direction in a direction perpendicular to the conveying direction 101 of the workpiece 100.
藉由噴嘴20之清洗液之噴出形態可適當變更。例如，噴嘴20既可為噴出液狀之清洗液者，亦可為噴出霧狀等形態之清洗液者。自噴嘴20噴出之清洗液例如可設為純水等。 The discharge form of the cleaning liquid by the nozzle 20 can be appropriately changed. For example, the nozzle 20 may be one in which a liquid cleaning liquid is ejected, or a cleaning liquid in a form such as a mist. The cleaning liquid sprayed from the nozzle 20 can be, for example, pure water or the like.
配管26之一端連接於噴嘴19，另一端連接於供給部22。配管27之一端連接於供給部22，另一端連接於收納部21。因此，可將收納於收納部21中之尚未用於處理之新的處理液供給至噴嘴19。 One end of the pipe 26 is connected to the nozzle 19, and the other end is connected to the supply portion 22. One end of the pipe 27 is connected to the supply portion 22, and the other end is connected to the storage portion 21. Therefore, a new processing liquid that has not been used for processing stored in the accommodating portion 21 can be supplied to the nozzle 19.
收納部21收納尚未用於處理之新的處理液。 The accommodating portion 21 accommodates a new processing liquid that has not been used for processing.
供給部22例如可設為如泵等般能夠搬送處理液者。 The supply unit 22 can be, for example, a person capable of transporting a treatment liquid such as a pump.
配管28之一端連接於噴嘴20，另一端連接於供給部24。配管29之一端連接於供給部24，另一端連接於收納部23。因此，可將收納於收納部23中之清洗液供給至噴嘴20。收納部23收納清洗液。 One end of the pipe 28 is connected to the nozzle 20, and the other end is connected to the supply portion 24. One end of the pipe 29 is connected to the supply portion 24, and the other end is connected to the storage portion 23. Therefore, the cleaning liquid accommodated in the accommodating portion 23 can be supplied to the nozzle 20. The accommodating portion 23 houses the washing liquid.
供給部24例如可設為如泵等般能夠搬送清洗液者。 The supply unit 24 can be, for example, a person capable of transporting a cleaning liquid like a pump.
排出部25係設置於搬送輥4a之下部。排出部25捕集自被處理物100之周緣流出之已使用過之處理液與清洗液，並且將所捕集之已使用過之處理液與清洗液自排出口25a排出。 The discharge portion 25 is provided at a lower portion of the conveyance roller 4a. The discharge unit 25 collects the used treatment liquid and the cleaning liquid that have flowed out from the periphery of the workpiece 100, and discharges the collected treatment liquid and the cleaning liquid from the discharge port 25a.
對於排出部25之形態並無特別限定，例如，可例示具有上端開口之箱狀形態者。 The form of the discharge portion 25 is not particularly limited, and for example, a box shape having an open upper end can be exemplified.
其次，對第2處理部3之作用、效果進一步進行例示。 Next, the action and effect of the second processing unit 3 will be further exemplified.
於第2處理部3中，藉由循環利用經回收之處理液而去除附著於被處理物100之處理面100a之污染物質，或者減輕因反覆進行處理液之循環利用而產生之處理不足或處理不均等。 In the second processing unit 3, the contaminated substance adhering to the treated surface 100a of the workpiece 100 is removed by recycling the recovered processing liquid, or the processing shortage or treatment due to repeated recycling of the processing liquid is reduced. Not equal.
因此，於第2處理部3中，對於自噴嘴19噴出之處理液必需考慮被覆性與置換性。又，為了去除自噴嘴19噴出之處理液，對於自噴嘴20噴出之清洗液必需考慮被覆性與置換性。 Therefore, in the second treatment unit 3, it is necessary to consider the coating property and the displaceability with respect to the treatment liquid discharged from the nozzle 19. Further, in order to remove the treatment liquid discharged from the nozzle 19, it is necessary to consider the coating property and the displaceability with respect to the cleaning liquid discharged from the nozzle 20.
即，必需由自噴嘴19噴出之處理液置換自噴嘴5噴出之處理液(循環利用之處理液)，並且由自噴嘴19噴出之處理液被覆處理面100a。 In other words, it is necessary to replace the treatment liquid (the treatment liquid for recycling) discharged from the nozzle 5 with the treatment liquid discharged from the nozzle 19, and to coat the treatment surface 100a with the treatment liquid discharged from the nozzle 19.
又，必需藉由自噴嘴20噴出之清洗液置換自噴嘴19噴出之處理液，並且由自噴嘴20噴出之清洗液被覆處理面100a。 Further, it is necessary to replace the processing liquid discharged from the nozzle 19 by the cleaning liquid sprayed from the nozzle 20, and the cleaning liquid sprayed from the nozzle 20 covers the processing surface 100a.
此處，被覆性與置換性受處理液或清洗液之黏度或接觸角度之影響。 Here, the coating property and the displacement of the treatment liquid or the cleaning liquid are affected by the viscosity or the contact angle.
若於第1處理部2中使用之處理液(循環利用之處理液)之黏度、於第2處理部3中使用之處理液(新的清洗液)之黏度、於第2處理部3中使用之清洗液之黏度過高，則有在被處理物100之處理面100a上產生未被處理液或清洗液覆蓋之部分之虞。即，處理液或清洗液之被覆性變差。 The viscosity of the treatment liquid (the treatment liquid for recycling) used in the first treatment unit 2 and the viscosity of the treatment liquid (new cleaning liquid) used in the second treatment unit 3 are used in the second treatment unit 3 When the viscosity of the cleaning liquid is too high, there is a portion where the untreated liquid or the cleaning liquid is applied to the treated surface 100a of the workpiece 100. That is, the coating property of the treatment liquid or the cleaning liquid is deteriorated.
因此，於電子裝置之製造中，於如對板狀之被處理物100之處理面100a進行處理之情形時，通常將處理液或清洗液之黏度設為與水之黏度為相同程度。 Therefore, in the manufacture of an electronic device, when the processing surface 100a of the sheet-like workpiece 100 is treated, the viscosity of the treatment liquid or the cleaning liquid is usually set to be the same as the viscosity of water.
又，亦存在於被處理物100之處理面100a上設置微細之凹凸之情況，但大致為平坦面。 Further, there is a case where fine irregularities are provided on the treated surface 100a of the workpiece 100, but they are substantially flat surfaces.
因此，於電子裝置之製造中，於如對板狀之被處理物100之處理面100a進行處理之情形時，處理面100a上之處理液或清洗液之接觸角度通常與水之接觸角度為相同程度。 Therefore, in the manufacture of the electronic device, when the processing surface 100a of the sheet-like object 100 is processed, the contact angle of the treatment liquid or the cleaning liquid on the treatment surface 100a is usually the same as the contact angle with water. degree.
即，於電子裝置之製造中，於如對板狀之被處理物100之處理面100a進行處理之情形時，只要考慮與水為相同程度之黏度或接觸角度而研究被覆性與置換性即可。 In other words, in the case of processing the electronic device, when the processing surface 100a of the sheet-like workpiece 100 is treated, it is only necessary to consider the viscosity or the contact angle with water to study the coating property and the replacement property. .
圖2係用以例示比較例之噴嘴190及噴嘴200之模式圖。再者，圖 2(a)係用以例示噴嘴190及噴嘴200之噴出方向之模式圖，圖2(b)係用以例示被覆性與置換性之模式圖。 2 is a schematic view for illustrating a nozzle 190 and a nozzle 200 of a comparative example. Again, the map 2(a) is a schematic diagram illustrating a discharge direction of the nozzle 190 and the nozzle 200, and FIG. 2(b) is a schematic diagram illustrating a coating property and a replacement property.
圖3係用以例示本實施形態之噴嘴19及噴嘴20之模式圖。再者，圖3(a)係用以例示噴嘴19及噴嘴20之噴出方向之模式圖，圖3(b)係用以例示被覆性與置換性之模式圖。 Fig. 3 is a schematic view showing the nozzle 19 and the nozzle 20 of the present embodiment. 3(a) is a schematic view illustrating a discharge direction of the nozzle 19 and the nozzle 20, and FIG. 3(b) is a schematic view illustrating a coating property and a replacement property.
於圖2(b)、圖3(b)中，以單色調之濃淡表示處理液或清洗液之分佈，且以處理液或清洗液越多則越濃，處理液或清洗液越少則越淡之方式進行表示。 In Fig. 2(b) and Fig. 3(b), the distribution of the treatment liquid or the cleaning liquid is indicated by the shade of a single color, and the more the treatment liquid or the cleaning liquid, the more concentrated, and the smaller the treatment liquid or the cleaning liquid, the more Express the way.
如圖2(a)所示，噴嘴190朝向較相對於被處理物100之搬送方向101垂直之方向更靠搬送方向之上游側噴出處理液。噴嘴200朝向較相對於被處理物100之搬送方向101垂直之方向更靠搬送方向101之下游側噴出清洗液。即，噴出方向與上述噴嘴19及噴嘴20分別相反。 As shown in FIG. 2( a ), the nozzle 190 discharges the processing liquid toward the upstream side in the transport direction in a direction perpendicular to the transport direction 101 of the workpiece 100 . The nozzle 200 discharges the cleaning liquid toward the downstream side in the conveying direction 101 in a direction perpendicular to the conveying direction 101 of the workpiece 100. That is, the discharge direction is opposite to the nozzle 19 and the nozzle 20, respectively.
於此種情形時，如圖2(b)所示，自噴嘴190噴出之處理液自被處理物100之周緣流出之量變多。因此，由處理液覆蓋之面積變小，對於處理液之被覆性惡化。於此情形時，若增加處理液之噴出量來改善被覆性，則處理液之消耗量會增多，從而不具有循環利用在第1處理部2中回收之處理液之意義。 In this case, as shown in FIG. 2(b), the amount of the treatment liquid discharged from the nozzle 190 from the periphery of the workpiece 100 increases. Therefore, the area covered by the treatment liquid becomes small, and the coating property to the treatment liquid is deteriorated. In this case, when the discharge amount of the treatment liquid is increased to improve the coating property, the amount of the treatment liquid consumed is increased, and the meaning of recycling the treatment liquid recovered in the first treatment unit 2 is not obtained.
於本實施形態中，如圖3(a)所示，噴嘴19朝向較相對於被處理物100之搬送方向101垂直之方向更靠搬送方向101之下游側噴出處理液。噴嘴20朝向較相對於被處理物100之搬送方向101垂直之方向更靠搬送方向之上游側噴出清洗液。 In the present embodiment, as shown in FIG. 3(a), the nozzle 19 discharges the processing liquid toward the downstream side in the conveying direction 101 in a direction perpendicular to the conveying direction 101 of the workpiece 100. The nozzle 20 discharges the cleaning liquid toward the upstream side in the conveying direction with respect to the direction perpendicular to the conveying direction 101 of the workpiece 100.
於此種情形時，如圖3(b)所示，形成自噴嘴19噴出之處理液與自噴嘴20噴出之清洗液相互衝突之區域，故可減少自噴嘴19噴出之處理液從被處理物100周緣流出之量。因此，由處理液覆蓋之面積擴大，且對於處理液之被覆性提高。又，對於處理液之置換性亦提高。其結果，即便於處理液之噴出量較少之情形時，亦可確保充分之被覆性與 置換性，且可謀求污染物質之去除、及處理不足或處理不均等之減輕。 In this case, as shown in FIG. 3(b), the treatment liquid ejected from the nozzle 19 and the cleaning liquid ejected from the nozzle 20 collide with each other, so that the treatment liquid ejected from the nozzle 19 can be reduced from the object to be treated. The amount of 100 weeks of outflow. Therefore, the area covered by the treatment liquid is enlarged, and the coating property to the treatment liquid is improved. Moreover, the replacement property of the treatment liquid is also improved. As a result, even when the discharge amount of the treatment liquid is small, sufficient coating property can be ensured. It is displaceable, and it can reduce the removal of pollutants, and the reduction of processing or uneven handling.
其次，對被處理物100之搬送速度、處理液及清洗液之供給量、處理液及清洗液之供給位置等進行例示。 Next, the conveyance speed of the workpiece 100, the supply amount of the treatment liquid and the cleaning liquid, the supply position of the treatment liquid and the cleaning liquid, and the like are exemplified.
例如，若使被處理物100之搬送速度過快，則每單位面積之處理液及清洗液之供給量會減少，故而有被覆性或置換性惡化之虞。 For example, when the conveyance speed of the workpiece 100 is too fast, the supply amount of the treatment liquid and the cleaning liquid per unit area is reduced, so that the coating property or the replacement property is deteriorated.
另一方面，若使被處理物100之搬送速度過慢，則會降低生產率。 On the other hand, if the conveyance speed of the workpiece 100 is too slow, productivity will be lowered.
又，例如，若使處理液及清洗液之供給量過多，則消耗量會增加。 Further, for example, if the supply amount of the treatment liquid and the cleaning liquid is too large, the amount of consumption increases.
另一方面，若使處理液及清洗液之供給量過少，則有被覆性或置換性惡化之虞。 On the other hand, if the supply amount of the treatment liquid and the cleaning liquid is too small, the coating property or the replacement property may be deteriorated.
根據本發明者所獲得之見解，例如，若將被處理物100之搬送速度設為50 mm/s以下，將處理液及清洗液之供給量設為16公升/min以上且32公升/min以下，將處理面100a上之處理液之供給位置100b與處理面100a上之清洗液之供給位置100c之間的距離d設為160 mm以上且240 mm以下，則可提高被覆性及置換性。 According to the findings obtained by the inventors, for example, when the conveyance speed of the workpiece 100 is 50 mm/s or less, the supply amount of the treatment liquid and the cleaning liquid is set to be 16 liters/min or more and 32 liters/min or less. When the distance d between the supply position 100b of the treatment liquid on the treatment surface 100a and the supply position 100c of the cleaning liquid on the treatment surface 100a is 160 mm or more and 240 mm or less, the coating property and the replacement property can be improved.
再者，藉由使噴嘴19之噴出口19a及噴嘴20之噴出口20a之與搬送方向101正交之方向上之尺寸大於被處理物100之尺寸，而可消除與搬送方向101正交之方向上之被處理物100之尺寸之影響。即，只要使噴嘴19之噴出口19a及噴嘴20之噴出口20a之與搬送方向101正交之方向上之尺寸大於被處理物100之尺寸即可。 Further, by making the size of the discharge port 19a of the nozzle 19 and the discharge port 20a of the nozzle 20 in the direction orthogonal to the conveyance direction 101 larger than the size of the workpiece 100, the direction orthogonal to the conveyance direction 101 can be eliminated. The influence of the size of the object to be processed 100. In other words, the size of the discharge port 19a of the nozzle 19 and the discharge port 20a of the nozzle 20 in the direction orthogonal to the conveyance direction 101 may be larger than the size of the workpiece 100.
圖4係用以對處理液及清洗液之供給位置、被處理物100之搬送速度、以及被覆性及置換性之關係進行例示之模式圖。 4 is a schematic view for exemplifying a relationship between a supply position of the treatment liquid and the cleaning liquid, a conveyance speed of the workpiece 100, and a coating property and a replacement property.
於圖4(a)~(e)中，以單色調之濃淡表示處理液或清洗液之分佈，且以處理液或清洗液越多則越濃，處理液或清洗液越少則越淡之方式 表示。又，於圖4(a)~(c)中將被處理物100之搬送速度設為50 mm/s，於圖4(d)、(e)中將被處理物100之搬送速度設為167 mm/s。 In Fig. 4 (a) to (e), the distribution of the treatment liquid or the cleaning liquid is indicated by the shade of a single color, and the more the treatment liquid or the cleaning liquid, the more concentrated, and the less the treatment liquid or the cleaning liquid, the lighter the light the way Said. Further, in FIGS. 4(a) to 4(c), the conveyance speed of the workpiece 100 is 50 mm/s, and in FIGS. 4(d) and 4(e), the conveyance speed of the workpiece 100 is 167. Mm/s.
又，於圖4(a)~(e)中，將處理液及清洗液之供給量設為32公升/min。 Further, in Figs. 4(a) to 4(e), the supply amount of the treatment liquid and the cleaning liquid was set to 32 liters/min.
圖4(a)係將處理面100a上之處理液之供給位置100b與處理面100a上之清洗液之供給位置100c之間之距離d(以下，簡稱為距離d)設為80 mm之情形。 4(a) shows a case where the distance d between the supply position 100b of the treatment liquid on the treatment surface 100a and the supply position 100c of the cleaning liquid on the treatment surface 100a (hereinafter, simply referred to as the distance d) is 80 mm.
於此情形時，由於距離d過短，故而所供給之處理液中到達至清洗液所供給之位置之處理液之量過大。因此，變得難以將處理液置換為清洗液。 In this case, since the distance d is too short, the amount of the treatment liquid that reaches the position where the cleaning liquid is supplied in the supplied treatment liquid is excessively large. Therefore, it becomes difficult to replace the treatment liquid with the washing liquid.
圖4(b)係將距離d設為160 mm之情形，圖4(c)係將距離d設為240 mm之情形。 Fig. 4(b) shows the case where the distance d is set to 160 mm, and Fig. 4(c) shows the case where the distance d is set to 240 mm.
於該等情形時，所供給之處理液中之適度之量自被處理物100之周緣排出，故可謀求到達至清洗液所供給之位置之處理液之量之適當化。因此，可提高對於處理液及清洗液之被覆性與置換性。 In such a case, an appropriate amount of the supplied treatment liquid is discharged from the periphery of the workpiece 100, so that the amount of the treatment liquid reaching the position where the cleaning liquid is supplied can be made appropriate. Therefore, the coating property and the displaceability to the treatment liquid and the cleaning liquid can be improved.
圖4(d)係將距離d設為160 mm之情形，圖4(e)係將距離d設為240 mm之情形。 Fig. 4(d) shows a case where the distance d is set to 160 mm, and Fig. 4(e) shows a case where the distance d is set to 240 mm.
於該等情形時，由於被處理物100之搬送速度(167 mm/s)過快，故處理液及清洗液擴展之時間減少，從而被處理液及清洗液覆蓋之面積變小。因此，對於處理液及清洗液之被覆性變差。又，由於被處理物100之搬送速度(167 mm/s)過快，故到達至清洗液所供給之位置之處理液之量過大。因此，變得難以將處理液置換為清洗液。 In such a case, since the conveyance speed (167 mm/s) of the workpiece 100 is too fast, the time for the treatment liquid and the cleaning liquid to expand is reduced, and the area covered by the treatment liquid and the cleaning liquid is small. Therefore, the coating properties of the treatment liquid and the cleaning liquid are deteriorated. Further, since the conveyance speed (167 mm/s) of the workpiece 100 is too fast, the amount of the treatment liquid reaching the position where the cleaning liquid is supplied is excessively large. Therefore, it becomes difficult to replace the treatment liquid with the washing liquid.
其次，對第2實施形態之處理方法進行例示。 Next, the processing method of the second embodiment will be exemplified.
圖5係用以對第2實施形態之處理方法進行例示之流程圖。 Fig. 5 is a flow chart for illustrating a processing method of the second embodiment.
第2實施形態之處理方法例如可於上述處理裝置1中執行。 The processing method of the second embodiment can be executed, for example, in the processing device 1.
第2實施形態之處理方法係對所搬送之被處理物100之處理面100a自噴嘴噴出處理液而對被處理物100進行處理之處理方法。 The processing method of the second embodiment is a processing method for processing the workpiece 100 by ejecting the processing liquid from the nozzle on the processing surface 100a of the workpiece 100 to be conveyed.
而且，第2實施形態之處理方法包括如下步驟：回收供給至搬送之被處理物100之處理面100a之處理液的步驟(步驟S1)；將回收之處理液自噴嘴5噴出至被處理物100之處理面100a之步驟(步驟S2)；於噴嘴5之搬送方向之下游側，自噴嘴19對被處理物100之處理面100a噴出尚未用於處理之新的處理液的步驟(步驟S3)；於噴嘴19之搬送方向之下游側，自噴嘴20對被處理物100之處理面100a噴出清洗液之步驟(步驟S4)。 Further, the processing method according to the second embodiment includes a step of recovering the processing liquid supplied to the processing surface 100a of the workpiece 100 to be conveyed (step S1), and discharging the collected processing liquid from the nozzle 5 to the workpiece 100. a step of processing the surface 100a (step S2); a step of discharging a new processing liquid that has not been processed for processing from the processing surface 100a of the workpiece 100 from the nozzle 19 on the downstream side in the conveying direction of the nozzle 5 (step S3); The step of ejecting the cleaning liquid from the nozzle 20 to the processing surface 100a of the workpiece 100 in the downstream side in the conveying direction of the nozzle 19 (step S4).
又，於在噴嘴5之搬送方向之下游側，自噴嘴19對被處理物100之處理面100a噴出尚未用於處理之新的處理液的步驟中，朝向較相對於搬送方向垂直之方向更靠搬送方向之下游側，自噴嘴19噴出尚未用於處理之新的處理液。 In the step of ejecting a new processing liquid that has not been processed from the processing surface 100a of the workpiece 100 from the nozzle 19 on the downstream side in the conveying direction of the nozzle 5, the direction is perpendicular to the direction perpendicular to the conveying direction. On the downstream side in the transport direction, a new processing liquid that has not been used for processing is ejected from the nozzle 19.
又，於在噴嘴19之搬送方向之下游側，自噴嘴20對被處理物100之處理面100a噴出清洗液之步驟中，朝向較相對於搬送方向垂直之方向更靠搬送方向之上游側，自噴嘴20噴出清洗液。 In the step of ejecting the cleaning liquid from the nozzle 20 to the processing surface 100a of the workpiece 100 in the downstream direction of the transport direction of the nozzle 19, the direction is perpendicular to the direction of the transport direction and is further upstream of the transport direction. The nozzle 20 ejects the cleaning liquid.
於此情形時，可將回收之處理液中所含有之對處理有效之成分與尚未用於處理之新的處理液中所含有之對處理有效之成分設為相同者。 In this case, the components effective for the treatment contained in the recovered treatment liquid and the components effective for the treatment contained in the new treatment liquid which has not been used for the treatment can be made the same.
又，處理面100a上之尚未用於處理之新的處理液之供給位置與處理面100a上之清洗液之供給位置之間的距離d可設為160 mm以上、240 mm以下。 Further, the distance d between the supply position of the new processing liquid that has not been used for processing on the processing surface 100a and the supply position of the cleaning liquid on the processing surface 100a can be 160 mm or more and 240 mm or less.
又，被處理物100之搬送速度可設為50 mm/s以下。 Further, the conveyance speed of the workpiece 100 can be set to 50 mm/s or less.
又，尚未用於處理之新的處理液及清洗液之供給量可設為16公 升/min以上、32公升/min以下。 Moreover, the supply amount of the new treatment liquid and the cleaning liquid that have not been used for processing can be set to 16 Above liter/min, below 32 liters/min.
再者，各步驟中之內容可設為於處理裝置1中進行例示者相同，故省略詳細說明。 In addition, the content in each step can be the same as that of the example in the processing apparatus 1, and detailed description is abbreviate|omitted.
根據以上所例示之實施形態，可實現即便於利用回收之處理液進行處理之情形時亦可進行適當之處理之處理裝置及處理方法。 According to the embodiment exemplified above, it is possible to realize a processing apparatus and a processing method which can perform appropriate processing even when the processing is performed by the collected processing liquid.
以上，對本發明之若干個實施形態進行了例示，但該等實施形態係作為例子而提出者，並非意欲限定發明之範圍。該等新穎之實施形態可藉由其他各種形態來實施，且可於不脫離發明主旨之範圍內進行各種省略、置換、變更等。該等實施形態或其變化例包含於發明之範圍或主旨中，並且包含於申請專利範圍所記載之發明與其均等之範圍內。又，上述各實施形態可相互組合而實施。 The embodiments of the present invention have been exemplified above, but the embodiments are presented as examples and are not intended to limit the scope of the invention. The various embodiments of the invention can be embodied in various other forms, and various omissions, substitutions, changes, and the like are possible without departing from the scope of the invention. The embodiments and variations thereof are included in the scope of the invention and the scope of the invention as set forth in the appended claims. Further, each of the above embodiments can be implemented in combination with each other.
1‧‧‧處理裝置 1‧‧‧Processing device
2‧‧‧第1處理部 2‧‧‧First Processing Department
3‧‧‧第2處理部 3‧‧‧2nd Processing Department
4‧‧‧搬送部 4‧‧‧Transportation Department
4a‧‧‧搬送輥 4a‧‧‧Transport roller
5‧‧‧噴嘴 5‧‧‧ nozzle
5a‧‧‧噴出口 5a‧‧‧Spray outlet
6‧‧‧噴嘴 6‧‧‧ nozzle
6a‧‧‧噴出口 6a‧‧‧Spray outlet
7‧‧‧回收部 7‧‧Recycling Department
8‧‧‧收納部 8‧‧‧ 收纳 department
8a‧‧‧流入口 8a‧‧‧flow entrance
8b‧‧‧廢液口 8b‧‧‧ Waste port
8c‧‧‧排出口 8c‧‧‧Export
9‧‧‧供給部 9‧‧‧Supply Department
10‧‧‧過濾器 10‧‧‧Filter
11‧‧‧配管 11‧‧‧Pipe
12‧‧‧配管 12‧‧‧Pipe
13‧‧‧配管 13‧‧‧Pipe
14‧‧‧配管 14‧‧‧Pipe
15‧‧‧清洗液收納部 15‧‧‧Clean liquid storage unit
16‧‧‧清洗液供給部 16‧‧‧cleaning liquid supply department
17‧‧‧配管 17‧‧‧Pipe
18‧‧‧配管 18‧‧‧Pipe
19‧‧‧噴嘴 19‧‧‧ nozzle
19a‧‧‧噴出口 19a‧‧‧Spray outlet
20‧‧‧噴嘴 20‧‧‧ nozzle
20a‧‧‧噴出口 20a‧‧‧Spray outlet
21‧‧‧收納部 21‧‧‧ Storage Department
22‧‧‧供給部 22‧‧‧Supply Department
23‧‧‧清洗液收納部 23‧‧‧Clean liquid storage unit
24‧‧‧清洗液供給部 24‧‧‧cleaning liquid supply department
25‧‧‧排出部 25‧‧‧Exporting Department
25a‧‧‧排出口 25a‧‧‧Export
26‧‧‧配管 26‧‧‧Pipe
27‧‧‧配管 27‧‧‧Pipe
28‧‧‧配管 28‧‧‧Pipe
29‧‧‧配管 29‧‧‧Pipe
30‧‧‧捕集部 30‧‧‧ Capture Department
30a‧‧‧排出口 30a‧‧‧Export
100‧‧‧被處理物 100‧‧‧Processed objects
100a‧‧‧處理面 100a‧‧‧Processing surface
100b‧‧‧面 100b‧‧‧ face
101‧‧‧搬送方向 101‧‧‧Transfer direction
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012057939A JP2013191779A (en) | 2012-03-14 | 2012-03-14 | Processor and processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201347857A TW201347857A (en) | 2013-12-01 |
| TWI583452B true TWI583452B (en) | 2017-05-21 |
Family
ID=49127965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102106469A TWI583452B (en) | 2012-03-14 | 2013-02-23 | Processing device and processing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013191779A (en) |
| KR (1) | KR101433622B1 (en) |
| CN (1) | CN103301992B (en) |
| TW (1) | TWI583452B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111308856A (en) * | 2014-03-11 | 2020-06-19 | 芝浦机械电子株式会社 | Cleaning device for reflection type mask and cleaning method for reflection type mask |
| CN104056798B (en) * | 2014-05-21 | 2016-02-03 | 上海和辉光电有限公司 | The recovery of cleaning fluid and supply arrangement and method |
| CN104014500B (en) * | 2014-06-09 | 2016-04-27 | 福州宝井钢材有限公司 | A kind of cleaning device of electrogalvanizing material |
| KR101994961B1 (en) | 2018-07-04 | 2019-07-02 | 주식회사 엠에스이엔씨 | Composition for grout mortar using porous feldspar and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09213669A (en) * | 1996-02-05 | 1997-08-15 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| TW200911395A (en) * | 2007-01-15 | 2009-03-16 | Shibaura Mechatronics Corp | Apparatus and method for processing substrate |
| TW200916199A (en) * | 2007-08-28 | 2009-04-16 | Dainippon Screen Mfg | Substrate processing apparatus |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1147665A (en) * | 1997-07-29 | 1999-02-23 | Dainippon Screen Mfg Co Ltd | Replacement mechanism of treating liquid and substrate treating device having this replacement mechanism |
| CN1327888A (en) * | 2000-06-09 | 2001-12-26 | 株式会社平间理化研究所 | Treater for substrate surface |
| KR100593709B1 (en) * | 2002-03-27 | 2006-06-28 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate Processing Equipment |
| JP2004074021A (en) * | 2002-08-19 | 2004-03-11 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate cleaning unit |
| JP2004273984A (en) * | 2003-03-12 | 2004-09-30 | Dainippon Screen Mfg Co Ltd | Method and device for substrate processing |
| JP2004275918A (en) * | 2003-03-17 | 2004-10-07 | Hitachi High-Tech Electronics Engineering Co Ltd | Substrate washing device, substrate washing method, and method for manufacturing substrate |
| KR20060000009A (en) * | 2004-06-28 | 2006-01-06 | 엘지.필립스 엘시디 주식회사 | Cleaning equipment |
| JP2006130484A (en) * | 2004-11-09 | 2006-05-25 | Dainippon Screen Mfg Co Ltd | Device for treating substrate |
| KR20070034888A (en) * | 2005-09-26 | 2007-03-29 | 세메스 주식회사 | Substrate Cleaning Equipment |
| JP2009004728A (en) * | 2007-05-24 | 2009-01-08 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| KR101020676B1 (en) | 2008-11-26 | 2011-03-09 | 세메스 주식회사 | Apparatus for cleaning a substrate |
| JP4812847B2 (en) * | 2009-02-23 | 2011-11-09 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
-
2012
- 2012-03-14 JP JP2012057939A patent/JP2013191779A/en active Pending
-
2013
- 2013-02-23 TW TW102106469A patent/TWI583452B/en active
- 2013-03-04 KR KR1020130022745A patent/KR101433622B1/en active IP Right Grant
- 2013-03-06 CN CN201310070532.8A patent/CN103301992B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09213669A (en) * | 1996-02-05 | 1997-08-15 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| TW200911395A (en) * | 2007-01-15 | 2009-03-16 | Shibaura Mechatronics Corp | Apparatus and method for processing substrate |
| TW200916199A (en) * | 2007-08-28 | 2009-04-16 | Dainippon Screen Mfg | Substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101433622B1 (en) | 2014-08-26 |
| JP2013191779A (en) | 2013-09-26 |
| CN103301992B (en) | 2016-12-28 |
| TW201347857A (en) | 2013-12-01 |
| KR20130105376A (en) | 2013-09-25 |
| CN103301992A (en) | 2013-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI428969B (en) | Substrate cleaning treatment device | |
| TWI583452B (en) | Processing device and processing method | |
| TWI320009B (en) | Apparatus and method for edge processing of a glass sheet | |
| US20070240642A1 (en) | Substrate processing apparatus | |
| JP2006278606A (en) | Apparatus and method for processing substrate | |
| TWI546131B (en) | Substrate processing apparatus, nozzle and substrate processing method | |
| TWI527631B (en) | Spray device | |
| JP2009178672A (en) | Substrate treatment apparatus and substrate treatment method | |
| JP2007300129A (en) | Substrate processing device | |
| TWI607977B (en) | Chemical polishing device | |
| JP2006332481A (en) | Etching processing method and etching apparatus | |
| TWI343842B (en) | ||
| TWI583648B (en) | Chemical grinding equipment | |
| JP2006019525A (en) | Substrate processing device | |
| KR20090108857A (en) | Apparatus for cleaning substrate and cleaning system having thereof | |
| JP2019162748A (en) | Plate washing device and plate washing method | |
| TW201802877A (en) | Apparatus for treating substrate | |
| JP2009032868A (en) | Substrate processing apparatus | |
| JP3863086B2 (en) | Substrate processing equipment | |
| JP2010131485A (en) | Device and method for draining liquid on substrate | |
| JP4324517B2 (en) | Substrate processing equipment | |
| US20170100753A1 (en) | Sheet material surface treatment method and system | |
| TW201429570A (en) | Cleaning device of plate and cleaning method of plate glass | |
| KR20230141345A (en) | Exhaust system with improved assembly) and substrate cleaning apparatus with the system | |
| CN103029042A (en) | Monitoring method and monitoring system for glass plate polishing apparatus |