JP2004275918A - Substrate washing device, substrate washing method, and method for manufacturing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the occurrence of unevenness in processing such as etching and developing, on the surface of a substrate. <P>SOLUTION: The substrate 1 to the surface of which etching liquid, a developer, or the like, is applied is washed while the substrate is moved in a substrate moving direction by means of rollers 2a in a washing tank. A plurality of nozzles 4a are downwardly attached to a nozzle header 3a diagonally in the substrate moving direction. On the other hand, a plurality of nozzles 4b are downwardly attached to a nozzle header 3b diagonally in the direction opposite to the substrate moving direction. The respective nozzles 4b of the nozzle header 3b are arranged in the middle positions of the respective nozzles 4a. Washing liquid 5a discharged from the nozzles 4a and washing liquid 5b discharged from the nozzles 4b are supplied to a same range in the substrate moving direction on the surface of the substrate 1. Nozzle headers 3c and 3d play the same role. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a surface of a substrate coated with a processing liquid such as an etching liquid or a developing liquid, and a method for manufacturing a substrate using the same. The present invention relates to a substrate cleaning apparatus for supplying a cleaning liquid to the surface of a substrate using the nozzle, a substrate cleaning method, and a substrate manufacturing method using the same.
[0002]
[Prior art]
For example, in a manufacturing process of a TFT (Thin Film Transistor) substrate, a color filter substrate, and a plasma display panel substrate of a liquid crystal display device used as a display panel, a processing liquid such as an etching solution or a developing solution is applied to the surface of the substrate. After coating and performing processes such as etching and development, the substrate is washed to remove the processing solution.
[0003]
FIG. 6 is a side view showing a schematic configuration of a conventional substrate cleaning apparatus. After the substrate 1 is coated with an etching solution or a developing solution on a surface thereof in an etching tank or a developing tank (not shown), the substrate 1 is conveyed to a cleaning tank provided with a substrate cleaning device, and the inside of the cleaning tank is indicated by an arrow by a roller 2. The substrate is washed while being moved in the substrate moving direction, and is conveyed to the facility of the next process. Above the substrate 1 mounted on the roller 2, a plurality of nozzle headers 6a, 6b, 6c, 6d, 6e are arranged in the substrate moving direction.
[0004]
A plurality of nozzles 7a are attached to the nozzle header 6a downward in the depth direction of the drawing. Each nozzle 7a discharges a cleaning liquid 8a such as circulating water or pure water toward the surface of the substrate 1 mounted on the roller 2. Similarly, a plurality of nozzles 7b are attached to the nozzle header 6b in the depth direction in the drawing. Each nozzle 7b discharges a cleaning liquid 8b such as circulating water or pure water toward the surface of the substrate 1 mounted on the roller 2. The same applies to the nozzle headers 6c, 6d, 6e.
[0005]
FIG. 7 is a front view showing an example of a nozzle header of a conventional substrate cleaning apparatus. FIG. 7A shows the nozzle headers 6a, 6c and 6e, and FIG. 7B shows the nozzle headers 6b and 6d. In the example shown in FIG. 7, 14 nozzles 7a are attached to the nozzle header 6a at predetermined intervals. The same applies to the nozzle headers 6c and 6e. On the other hand, 13 nozzles 7b are attached to the nozzle header 6b at predetermined intervals. Each of the nozzles 7b of the nozzle header 6b is arranged at an intermediate position between the nozzles 7a of the nozzle header 6a in the horizontal direction of the drawing. The same applies to the nozzle header 6d.
[0006]
FIG. 8 is a top view showing an example of a cleaning liquid supplied to the surface of a substrate from a conventional substrate cleaning apparatus. The cleaning liquids 8a, 8b, 8c, 8d, 8e discharged from the nozzles 7a, 7b, 7c, 7d, 7e spread in an elliptical shape long in a direction perpendicular to the substrate moving direction. Then, they are arranged in a staggered manner on the surface of the substrate 1 as shown in FIG.
[0007]
[Problems to be solved by the invention]
In the above-described conventional substrate cleaning apparatus, the cleaning liquid supplied from one nozzle header is not supplied to the entire surface of the substrate 1. On the surface of the substrate 1, for example, there is a portion where the cleaning liquid 8a discharged from the nozzle 7a of the nozzle header 6a is not supplied. The cleaning liquid 8b discharged from the nozzle 7b of the next nozzle header 6b is supplied to this portion by the movement of the substrate 1. As described above, by providing a plurality of nozzle headers having different nozzle positions in the substrate movement direction, the cleaning liquid is supplied over the entire surface of the substrate 1.
[0008]
However, for example, the cleaning liquid is supplied in a portion where the cleaning liquid 8a discharged from the nozzle 7a of the nozzle header 6a is supplied and in a portion where the cleaning liquid 8b discharged from the nozzle 7b of the nozzle header 6b is supplied without being supplied. Timing is different. Therefore, the reaction time of the processing liquid until the processing liquid such as the etching liquid or the developing liquid applied in the previous step is removed by the cleaning liquid is different, and unevenness of the processing such as etching and development occurs on the surface of the substrate. was there.
[0009]
On the other hand, if the cleaning liquid supplied from one nozzle header is supplied to the entire surface of the substrate by adjusting the interval between the nozzles and the like, the unevenness of the processing such as etching and development can be reduced to some extent. However, each nozzle does not always discharge the cleaning liquid at the same pressure and flow rate, and the cleaning liquid discharged from each nozzle does not always spread uniformly and is supplied to the surface of the substrate. The pressure distribution and flow rate distribution of the supplied cleaning liquid are not constant. For this reason, unevenness in processing such as etching and development occurs due to a difference in pressure distribution and a difference in flow rate distribution of the cleaning liquid supplied to the substrate.
[0010]
An object of the present invention is to suppress the occurrence of unevenness in processing such as etching and development on the surface of a substrate.
[0011]
Another object of the present invention is to produce a high-quality substrate with less unevenness in processes such as etching and development.
[0012]
[Means for Solving the Problems]
The substrate cleaning apparatus of the present invention includes: a substrate moving unit configured to move a substrate having a surface coated with a processing liquid; a first cleaning liquid supply unit having a plurality of nozzles for supplying a cleaning liquid to the surface of the substrate; A plurality of nozzles at a position different from the position of the nozzle of the cleaning liquid supply means, the second cleaning liquid supply means being provided apart from the first cleaning liquid supply means in the substrate moving direction and supplying the cleaning liquid to the surface of the substrate; Wherein the first cleaning liquid supply means and the second cleaning liquid supply means supply the cleaning liquid to the same area on the surface of the substrate in the substrate moving direction.
[0013]
Further, the substrate cleaning method of the present invention is provided such that the first nozzle group is provided apart from the first nozzle group in the substrate movement direction while moving the substrate having the processing liquid applied to the surface thereof. Using a second nozzle group different from the position of each nozzle of the first nozzle group to supply a cleaning liquid to the surface of the substrate, a range in which the cleaning liquid is supplied from the first nozzle group; The range in which the cleaning liquid is supplied from the second nozzle group is the same range in the substrate moving direction on the surface of the substrate.
[0014]
In the present invention, the cleaning liquid from two nozzle groups provided separately in the substrate movement direction is supplied to the surface of the substrate at different timings by the movement of the substrate. To the same area at the same time. Therefore, the reaction time of the processing solution until the processing solution such as the etching solution or the developing solution applied to the surface of the substrate is removed by the cleaning solution becomes the same, and the unevenness of the processing such as etching or development occurs on the surface of the substrate. Can be suppressed.
[0015]
Further, in the substrate cleaning apparatus of the present invention, the first cleaning liquid supply means and the second cleaning liquid supply means supply the cleaning liquid to a region between the two means on the surface of the substrate. Even if the pressure distribution and flow rate distribution of the cleaning liquid supplied from each cleaning liquid supply means are different, when the cleaning liquid supplied from both means overlaps in the middle range between both means, the difference in pressure distribution and flow rate distribution will be different. Negated and shrunk. Therefore, the cleaning liquid can be uniformly supplied to the surface of the substrate, and the occurrence of uneven processing such as etching and development can be further suppressed.
[0016]
Further, in the substrate cleaning apparatus of the present invention, the cleaning liquid discharged from two adjacent nozzles in the first cleaning liquid supply unit and the second cleaning liquid supply unit partially overlaps on the surface of the substrate. When the cleaning liquid supplied from the two adjacent nozzles overlaps on the surface of the substrate, the pressure difference and the flow rate difference of the cleaning liquid discharged from each nozzle are canceled out and become small. Therefore, the cleaning liquid can be uniformly supplied to the surface of the substrate, and the occurrence of uneven processing such as etching and development can be further suppressed.
[0017]
According to a method of manufacturing a substrate of the present invention, a substrate is manufactured using any one of the above-described substrate cleaning apparatuses or using the above-described substrate cleaning method. By using the substrate cleaning apparatus or the substrate cleaning method, unevenness of processing such as etching and development is reduced on the substrate, and a high-quality substrate can be manufactured.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a side view showing a schematic configuration of a substrate cleaning apparatus according to one embodiment of the present invention. The substrate cleaning apparatus according to the present embodiment includes a roller 2, nozzle headers 3a, 3b, 3c, 3d, and nozzles 4a, 4b, 4c, 4d.
[0019]
After the substrate 1 is coated with an etching solution or a developing solution on a surface thereof in an etching tank or a developing tank (not shown), the substrate 1 is conveyed to a cleaning tank provided with a substrate cleaning device, and the inside of the cleaning tank is indicated by an arrow by a roller 2. The substrate is washed while being moved in the substrate moving direction, and is conveyed to the facility of the next process. Above the substrate 1 mounted on the roller 2, a plurality of nozzle headers 3a, 3b, 3c, 3d are arranged in the substrate moving direction.
[0020]
A plurality of nozzles 4a are attached to the nozzle header 3a obliquely downward toward the substrate movement direction in the depth direction of the drawing. Each nozzle 4 a discharges a cleaning liquid 5 a such as circulating water or pure water toward the surface of the substrate 1 mounted on the roller 2. On the other hand, a plurality of nozzles 4b are attached to the nozzle header 3b obliquely downward in the depth direction of the drawing toward the side opposite to the substrate moving direction. Each nozzle 4b discharges a cleaning liquid 5b such as circulating water or pure water toward the surface of the substrate 1 mounted on the roller 2. The cleaning liquid 5a discharged from the nozzle 4a and the cleaning liquid 5b discharged from the nozzle 4b are supplied to the same area on the surface of the substrate 1 in the substrate moving direction. In the present embodiment, it is a range just intermediate between the nozzle headers 3a and 3b. The nozzle headers 3c and 3d are the same as the nozzle headers 3a and 3b.
[0021]
FIG. 2 is a top view of the substrate cleaning apparatus according to one embodiment of the present invention. For example, 14 nozzles 4a are attached to the nozzle header 3a at predetermined intervals. On the other hand, for example, thirteen nozzles 4b are attached to the nozzle header 3b at predetermined intervals. Each of the nozzles 4b of the nozzle header 3b is disposed at an intermediate position between the respective nozzles 4a of the nozzle header 3a in the vertical direction of the drawing (a direction perpendicular to the substrate moving direction). The nozzle header 3c is similar to the nozzle header 3a, and the nozzle header 3d is similar to the nozzle header 3b.
[0022]
FIG. 3 is a top view showing an example of the cleaning liquid supplied to the surface of the substrate from the substrate cleaning apparatus according to one embodiment of the present invention. The cleaning liquids 5a, 5b, 5c, 5d discharged from the nozzles 4a, 4b, 4c, 4d spread in a long ellipse in a direction perpendicular to the substrate moving direction. Then, the cleaning liquid 5a discharged from the nozzle 4a and the cleaning liquid 5b discharged from the nozzle 4b are supplied to the same area A in the substrate moving direction on the surface of the substrate 1. The same applies to the cleaning liquid 5c discharged from the nozzle 4c and the cleaning liquid 5d discharged from the nozzle 4d.
[0023]
In the embodiment described above, the cleaning liquid 5a discharged from the nozzle 4a and the cleaning liquid 5b discharged from the nozzle 4b are simultaneously supplied to the same area on the surface of the substrate 1 in the substrate moving direction. The same applies to the cleaning liquid 5c discharged from the nozzle 4c and the cleaning liquid 5d discharged from the nozzle 4d. Therefore, according to the embodiment described above, the processing liquid reaction time until the processing liquid such as the etching liquid or the developing liquid applied to the surface of the substrate 1 is removed by the cleaning liquid becomes the same, and the surface of the substrate 1 The occurrence of unevenness in processing such as etching and development can be suppressed.
[0024]
Further, in the above-described embodiment, the cleaning liquid 5a discharged from the nozzle 4a and the cleaning liquid 5b discharged from the nozzle 4b are supplied to a region between the nozzle headers 3a and 3b on the surface of the substrate 1. For this reason, even if the pressure distribution and flow rate distribution of the cleaning liquid supplied from each nozzle header are different, when the cleaning liquid supplied from each nozzle header overlaps in the middle range between both nozzle headers, the difference in pressure distribution and flow rate The difference in distribution is canceled out and becomes smaller. The same applies to the cleaning liquid 5c discharged from the nozzle 4c and the cleaning liquid 5d discharged from the nozzle 4d. Therefore, according to the above-described embodiment, the cleaning liquid can be uniformly supplied to the surface of the substrate 1, and the occurrence of uneven processing such as etching and development can be further suppressed.
[0025]
FIG. 4 is a front view showing a part of a nozzle header of a substrate cleaning apparatus according to another embodiment of the present invention. In the present embodiment, the angle at which each nozzle discharges the cleaning liquid in the embodiment shown in FIG. 1 is expanded. As shown in FIG. 4, the cleaning liquid 5a discharged from the nozzle 4a of the nozzle header 3a spreads in the horizontal direction of the drawing, and a part of the cleaning liquid 5a is discharged from an adjacent nozzle in the nozzle header 3a on the surface of the substrate 1. Overlap with cleaning solution. The same applies to the nozzle 4c, and the same applies to the nozzles 4b and 4d, though not shown.
[0026]
FIG. 5 is a top view showing an example of the cleaning liquid supplied to the surface of the substrate from the substrate cleaning apparatus according to another embodiment of the present invention. When the angle at which each nozzle discharges the cleaning liquid as shown in FIG. 4 is increased, the cleaning liquids 5a, 5b, 5c, 5d discharged from the nozzles 4a, 4b, 4c, 4d become longer ellipses in a direction perpendicular to the substrate moving direction. The cleaning liquid discharged from adjacent nozzles in the same nozzle header partially overlaps. Then, the cleaning liquid 5a discharged from the nozzle 4a and the cleaning liquid 5b discharged from the nozzle 4b are supplied to the same area A in the substrate moving direction on the surface of the substrate 1. The same applies to the cleaning liquid 5c discharged from the nozzle 4c and the cleaning liquid 5d discharged from the nozzle 4d.
[0027]
According to the embodiment shown in FIG. 4, when the cleaning liquids supplied from two adjacent nozzles overlap on the surface of the substrate 1, the pressure difference and the flow rate difference of the cleaning liquid discharged from each nozzle are canceled. Become smaller. Therefore, the cleaning liquid can be more uniformly supplied to the surface of the substrate 1, and the occurrence of unevenness in processing such as etching and development can be further suppressed.
[0028]
In the embodiment shown in FIG. 4, the angle at which each nozzle discharges the cleaning liquid is adjusted. However, by adjusting the distance between each nozzle and the distance to the substrate, the supply of the cleaning liquid from two adjacent nozzles is performed. The applied cleaning liquid may overlap on the surface of the substrate.
[0029]
In the embodiment described above, two sets of two nozzle headers for supplying the cleaning liquid to the same area in the substrate moving direction on the surface of the substrate are provided, but the present invention is not limited to this. Further, the number of nozzles attached to each nozzle header is not limited to the above example.
[0030]
By manufacturing a substrate using the above-described substrate cleaning apparatus or a substrate cleaning method using the same, unevenness of processing such as etching and development is reduced, and a high-quality substrate can be manufactured.
[0031]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, a washing | cleaning liquid can be supplied to the surface of the board | substrate with which the processing liquids, such as an etching liquid and a developing liquid, were applied without a time difference. Further, according to the present invention, the cleaning liquid can be uniformly supplied to the surface of the substrate on which the processing liquid such as the etching liquid or the developing liquid is applied. Therefore, it is possible to suppress the occurrence of uneven processing such as etching and development on the surface of the substrate.
[0032]
ADVANTAGE OF THE INVENTION According to the manufacturing method of the board | substrate of this invention, the unevenness | corrugation of processes, such as etching and development, is few and a high quality board | substrate can be manufactured.
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic configuration of a substrate cleaning apparatus according to an embodiment of the present invention.
FIG. 2 is a top view of the substrate cleaning apparatus according to one embodiment of the present invention.
FIG. 3 is a top view showing an example of a cleaning liquid supplied to the surface of the substrate from the substrate cleaning apparatus according to one embodiment of the present invention.
FIG. 4 is a front view showing a part of a nozzle header of a substrate cleaning apparatus according to another embodiment of the present invention.
FIG. 5 is a top view illustrating an example of a cleaning liquid supplied to a surface of a substrate from a substrate cleaning apparatus according to another embodiment of the present invention.
FIG. 6 is a side view showing a schematic configuration of a conventional substrate cleaning apparatus.
FIG. 7 is a front view showing an example of a nozzle header of a conventional substrate cleaning apparatus.
FIG. 8 is a top view showing an example of a cleaning liquid supplied to the surface of a substrate from a conventional substrate cleaning apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Rollers 3a, 3b, 3c, 3d ... Nozzle headers 4a, 4b, 4c, 4d ... Nozzles 5a, 5b, 5c, 5d ... Cleaning liquid

Claims (5)

Substrate cleaning means for moving a substrate having a surface coated with a processing liquid, first cleaning liquid supply means having a plurality of nozzles and supplying a cleaning liquid to the surface of the substrate,
A second nozzle having a plurality of nozzles at a position different from the position of the nozzle of the first cleaning liquid supply means and being provided apart from the first cleaning liquid supply means in a substrate moving direction to supply a cleaning liquid to the surface of the substrate; Cleaning liquid supply means,
The substrate cleaning apparatus, wherein the first cleaning liquid supply unit and the second cleaning liquid supply unit supply the cleaning liquid to the same area on the surface of the substrate in the substrate moving direction. 2. The substrate cleaning apparatus according to claim 1, wherein the first cleaning liquid supply unit and the second cleaning liquid supply unit supply a cleaning liquid on a surface of the substrate to a range between the two units. 2. The substrate according to claim 1, wherein the cleaning liquid discharged from two adjacent nozzles in the first cleaning liquid supply unit and the second cleaning liquid supply unit partially overlaps on the surface of the substrate. Cleaning equipment. The first nozzle group and the first nozzle group are provided apart from each other in the substrate moving direction while moving the substrate on which the processing liquid is applied, and the position of each nozzle is determined by the position of each nozzle of the first nozzle group. In a substrate cleaning method for supplying a cleaning liquid to a surface of a substrate by using a second nozzle group different from the position,
A substrate cleaning method, wherein a range in which the cleaning liquid is supplied from the first nozzle group and a range in which the cleaning liquid is supplied from the second nozzle group are the same in the substrate moving direction on the surface of the substrate. . A method for manufacturing a substrate, comprising: manufacturing a substrate using the apparatus for cleaning a substrate according to any one of claims 1 to 3 or using the method for cleaning a substrate according to claim 4.

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