JP2006245446A - Resist peeling and removing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a resist peeling effect by eliminating a decrease in the density of a peeling liquid. <P>SOLUTION: A resist peeling and removing device is equipped with a processing chamber 1; a substrate carrying device 2 which is installed across the processing chamber 1 and carries in and out a substrate; a nozzle mechanism 3 equipped with a 1st nozzle 4 which is installed in the processing chamber 1 and blows a peeling liquid to the surface of the substrate 13, and a 2nd nozzle 5 which is installed in the processing chamber 1 downstream from the 1st nozzle 1 in the carrying direction of the substrate 13 and blows steam; a peeling liquid heater 10 which heats the peeling liquid supplied to the 1st nozzle 4; a peeling liquid pressurizer 11 which pressurizes the peeling liquid; and a steam generator 12 which supplies the steam to the 2nd nozzle 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resist stripping and removing apparatus used in a lithography process for forming a functional thin film pattern or the like on the surface of a semiconductor wafer, a glass substrate or the like.

  In the manufacture of electronic devices such as semiconductor devices, semiconductor devices, and liquid crystal display panels, it is essential to remove the resist on the semiconductor wafer or glass substrate that is the object to be cleaned during the manufacturing process. In the step of removing the resist, the resist used for forming various patterns such as wirings, electrodes or insulating films in the manufacturing process is removed by using a remover and water vapor.

  However, in the conventional resist stripping and removal, the resist is stripped and removed by adding a stripping solution to water vapor in one nozzle, mixing and spraying the resist on the substrate. There are a large number of documents disclosing known techniques related to this type of resist stripping, and Patent Documents 1 and 2 are particularly cited in terms of using a plurality of nozzles.

Patent Document 1 discloses that a hot water nozzle and a water vapor nozzle are disposed on a substrate on a spin table for cleaning. Patent Document 2 discloses a dishwasher including a water particle generation mechanism (nozzle) and a hot water nozzle. However, neither Patent Document 1 nor Patent Document 2 suggests a problem due to the resist stripping solution being diluted with water vapor.
JP 2001-252550 A JP 2000-189375 A

  In a conventional resist stripping and removing apparatus in which a stripping solution is added to water vapor in one nozzle, mixed and sprayed onto the resist on the substrate, the water vapor is dissolved in the stripping solution in the nozzle, and the stripping solution is in proportion to the water vapor pressure. Since the concentration is lowered, the resist dissolution effect expected for the stripping solution is lowered, and the resist stripping removal ability is reduced. That is, even if the concentration of the stripping solution is set according to the type and film thickness of the resist on the substrate and the conveyance speed of the substrate, the desired effect may not be obtained due to a decrease in the concentration of the stripping solution due to water vapor.

  An object of the present invention is to provide a resist stripping / removing apparatus in which the resist stripping effect does not decrease due to a decrease in the concentration of the stripping solution.

  The present invention relates to a resist stripping / removing apparatus for stripping and removing a resist on a surface of a substrate that is transported at a constant speed in one direction in a lithography process, the stripping solution being heated against the resist on the substrate And steam are sprayed in this order using individual nozzles. In addition, by changing the substrate conveyance direction interval of these individual nozzles according to the resist type and film thickness, and the substrate conveyance speed, it is possible to perform from the spray of the stripping solution to the spray of water vapor at any point on the moving substrate. Control the peeling action time.

  That is, the present invention provides a first nozzle for spraying a resist stripping solution installed in the vicinity of the surface having the resist of the substrate that moves in one direction, and the resist on the substrate downstream of the first nozzle. A second nozzle for spraying water vapor installed in the vicinity of the surface having the surface was provided.

  The present invention also provides a processing chamber, a substrate transfer device installed across the processing chamber, for loading and unloading the substrate, and a first substrate installed in the processing chamber for spraying a stripping solution on the surface of the substrate. A nozzle mechanism including a first nozzle, a second nozzle that is disposed downstream of the first nozzle in the transport direction of the substrate in the processing chamber and blows water vapor, and heats the stripping solution supplied to the first nozzle A stripping solution heater that pressurizes the stripping solution, and a steam generator that supplies steam to the second nozzle.

  The present invention also includes a nozzle interval control mechanism that makes the interval between the first nozzle and the second nozzle in the substrate transport direction variable.

  The present invention also provides the first nozzle and the second nozzle with the parameters of the spraying temperature, spraying flow rate and spraying pressure of the stripping solution, the spraying density of steam and the spraying pressure according to the substrate transport speed and the resist film quality. A nozzle control device for supplying an interval control signal to a nozzle interval control mechanism that makes the interval in the substrate transport direction variable.

  According to the present invention, the resist stripping performance does not change during the process because the set concentration of the stripping solution acting on the resist on the substrate is not diluted with water vapor. Further, the substrate transfer direction of the first nozzle and the second nozzle is determined by using as parameters the spraying temperature, spraying flow rate, spraying pressure, steam spraying density, and spraying pressure of the stripper according to the substrate transport speed and the resist film quality. By making the interval of the variable, it is possible to easily cope with substrates having different resist types, film thicknesses, and the like.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings of the embodiments.

  FIG. 1 is a diagram for explaining Example 1 of a resist stripping and removing apparatus according to the present invention. FIG. 2 is a perspective view for explaining an arrangement example of the nozzles shown in FIG. 1 and 2, the resist stripping / removing apparatus according to the first embodiment is configured such that a substrate to be processed (hereinafter, also simply referred to as a substrate) 13 on which a substrate transfer apparatus 2 crosses the processing chamber 1 and adheres a resist 14 is a resist adhesion surface. Is loaded in the direction of arrow A, and unloaded in the direction of arrow B. The substrate transport device 2 is shown as a roller conveyor, but it also means other known substrate transport devices.

  A nozzle mechanism 3 is installed above the substrate 13 in the processing chamber 1. The nozzle mechanism 3 holds the nozzles and the nozzle interval control mechanism 6 that makes the interval between both nozzles variable. The first nozzle 4 that sprays the stripping solution onto the resist surface of the substrate 1 and the first nozzle 4 are the substrate 1. The second nozzle 5 that is installed at a predetermined interval D on the downstream side in the transport direction and blows water vapor onto the resist surface of the substrate 1 is attached. In this nozzle interval control mechanism 6, the conveyance direction interval D of the substrate 1 between the first nozzle 4 and the second nozzle 5 is varied by a control signal from the nozzle control device 7. The first nozzle 4 and the second nozzle 5 are installed with a length that covers the width direction of the substrate so as to be orthogonal to or intersect with the transport direction of the substrate 13 that is transported together.

  The first nozzle 4 communicates with a stripping liquid pressurizer 11 installed outside the processing chamber 1 by a flexible tube 8, and the second nozzle 5 is a flexible tube 8, and water vapor also installed outside the processing chamber 1. It communicates with the generator 12. The stripping liquid pressurizer 11 is connected to a stripping liquid supply source (not shown) via the stripping liquid heater 10. The steam generator 12 generates pure water by heating pure water supplied from a pure water supply source (not shown).

  When the substrate 13 is loaded into the processing chamber 1 of FIG. 1 and the tip is applied to the processing section, the peeling solution heated and pressurized from the first nozzle 4 is sprayed onto the substrate surface on which the resist 14 is formed. The stripping solution forms holes that reach the substrate surface from the surface of the resist 14. The stripping solution permeates the substrate surface from this hole, so that the resist 14 is in a so-called lift-off state. Next, the resist 14 is exposed to water vapor sprayed from the second nozzle 5 in a state where the stripping solution has permeated the substrate surface, and the resist that has been lifted off is blown off and removed from the substrate 13. The removed resist is discharged from a discharge port provided at the bottom of the processing chamber 1 to a storage device or an appropriate processing device.

  FIG. 3 is a schematic diagram for explaining how the resist is stripped and removed in the present invention. FIG. 3A shows a state in which the peeling liquid heated and pressurized from the first nozzle 4 is sprayed onto the substrate surface on which the resist 14 is formed, and a hole 15 reaching the substrate surface 13A is formed in the resist 14. . The holes 15 penetrate at random from the surface of the resist 14 to reach the substrate surface 13A, spread the substrate surface 13A in the surface direction, and pull the resist 14 away from the substrate surface 13A (lift off). FIG. 3B shows a state in which the lifted-off resist 14 is exposed to water vapor sprayed from the second nozzle 5 and removed from the substrate surface 13A.

  In the present invention, the substrate of the first nozzle and the second nozzle is used with the parameters of the spraying temperature, spraying flow rate and spraying pressure of the stripper, and the spraying density and spraying pressure of water vapor according to the substrate transport speed and the resist film quality. A nozzle control device for supplying an interval control signal to a nozzle interval control mechanism that makes the interval in the transport direction variable.

  In the present invention, the resist stripping performance does not change during the process because the set concentration of the stripping solution acting on the resist on the substrate is not diluted with water vapor. Also, the substrate transfer direction of the first nozzle and the second nozzle using the substrate transfer speed and the spraying temperature, spraying flow rate, and spraying pressure of the stripper, and the spraying density and spraying pressure of water vapor as parameters. By making the interval of the variable, it is possible to easily cope with substrates having different resist types, film thicknesses, and the like.

It is a figure explaining Example 1 of the resist peeling removal apparatus by this invention. It is a perspective view explaining the example of arrangement | positioning of the nozzle shown in FIG. It is a mimetic diagram explaining a situation of exfoliation and removal of a resist in the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Processing chamber, 2 ... Substrate conveyance apparatus, 3 ... Nozzle mechanism, 4 ... 1st nozzle, 5 ... 2nd nozzle, 6 ... Nozzle space | interval control mechanism, 7 ... Nozzle control device, 8, 9 ... Flexible tube, 10 ... Stripping solution heater, 11 ... Stripping solution pressurizer, 12 ... Steam generator, 13 ... Substrate ( Substrate), 13A ... substrate surface, 14 ... resist, 15 ... hole.

Claims (4)

A resist stripping / removing apparatus that strips and removes a resist on a surface of a substrate transported at a constant speed in one direction in a lithography process,
A first nozzle for spraying a resist stripping solution installed in the vicinity of the resist-bearing surface of the substrate that moves in one direction, and in proximity to the resist-bearing surface of the substrate downstream of the first nozzle. A resist stripping apparatus comprising a second nozzle for spraying the installed water vapor. A resist stripping / removing apparatus that strips and removes a resist on a surface of a substrate transported at a constant speed in one direction in a lithography process,
A processing chamber;
A substrate transfer device installed across the processing chamber, for loading and unloading the substrate; and
A first nozzle that is installed in the processing chamber and sprays a stripping solution on the surface of the substrate; and a second nozzle that is installed downstream of the first nozzle in the transport direction of the substrate and sprays water vapor in the processing chamber. A nozzle mechanism comprising:
A stripper heater for heating the stripper supplied to the first nozzle and a stripper pressurizer for pressurizing the stripper;
A steam generator for supplying steam to the second nozzle;
A resist stripping and removing apparatus.   The resist stripping / removing apparatus according to claim 2, further comprising a nozzle interval control mechanism configured to vary an interval between the first nozzle and the second nozzle in the transport direction of the substrate. The spraying temperature and spraying flow rate and spraying pressure of the stripping solution according to the transport speed of the substrate and the film quality of the resist, the spraying density and spraying pressure of the water vapor as parameters, and the first nozzle and the second nozzle. The resist stripping / removing apparatus according to claim 3, further comprising a nozzle control device that provides an interval control signal to a nozzle interval control mechanism that makes the interval in the substrate transport direction variable.

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