JP2002113430A - Substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment device, which removes a foreign matter adhered to a substrate W by jetting a liquid, capable of enhancing efficiency of the removal treatment of the foreign mater. SOLUTION: The substrate treatment device is provided with an upstream spray nozzle 21a, 21b, a midstream spray nozzle 22a, 22b and a downstream spray nozzle 23a, 23b. The particle size of pure water L2 jetted from the midstream spray nozzle 22a, 22b is smaller than that of pure water L1 jetted from the upstream spray nozzle 21a, 21b and the particle size of pure water L3 jetted from the downstream spray nozzle 23a, 23b is further smaller than that of the pure water L2 jetted from the midstream spray nozzle 22a, 22b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for removing unnecessary substances adhering to a substrate by jetting a liquid.

[0002]

2. Description of the Related Art In a process of manufacturing a glass substrate (FPD substrate), a semiconductor wafer, a printed circuit board, and the like for a liquid crystal display device or a plasma display device, various substrate treatments are required. Among these substrate treatments, various wet treatments for removing unnecessary substances adhering to the substrate by spraying a liquid are also included. Specific examples of the wet treatment include a cleaning treatment, a development treatment, a resist peeling treatment, and the like.

In such a substrate processing apparatus that performs wet processing, a liquid is often sprayed (sprayed) from a nozzle. The sprayed liquid collides with unnecessary substances attached to the substrate and removes the unnecessary substances from the substrate. What is unnecessary?
Particles in a cleaning process, color resist in a color filter developing process, particles and a resist in a stripping process, and the like.

[0004]

Some conventional substrate processing apparatuses that perform wet processing combine means other than sprays, such as brushes and ultrasonic waves, in order to improve processing efficiency.

However, when a brush is used on a printed circuit board on which a precise pattern is formed, there is a concern that the pattern may be damaged. When an ultrasonic wave is used, the cost is increased.

There is also an apparatus which employs a method of changing the spray pressure of each chamber in order to improve the processing efficiency. For example, in an apparatus for performing a cleaning process, a chemical spray chamber, a low-pressure rinsing chamber, a high-pressure rinsing chamber, an ultrapure water rinsing chamber, and the like are arranged, and some apparatuses change the spray pressure in each chamber. Here, relatively large unnecessary substances can be removed by low-pressure spray, and relatively small unnecessary substances can be removed by high-pressure spray.

However, merely changing the spray pressure does not mean that unnecessary substances are efficiently removed by an optimum method, and it is difficult to drastically reduce the processing time. The object of the present invention is to
It is an object of the present invention to improve the efficiency of unnecessary substance removal processing in a substrate processing apparatus for removing unnecessary substances attached to a substrate by spraying a liquid.

[0008]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for removing unnecessary substances adhering to a substrate by spraying a liquid, the apparatus including a plurality of nozzles. These nozzles differ in the particle diameter of the liquid to be ejected.

Here, a plurality of nozzles eject liquids having different particle sizes, respectively, to remove unnecessary substances from the substrate.
Therefore, if an appropriate particle size is set according to the configuration and type of the unnecessary material attached to the substrate, the unnecessary material can be efficiently removed from the substrate.

For example, for a relatively large undesired substance, a liquid having a large particle diameter suitable for removing the undesired substance is ejected from a certain nozzle, and a relatively small undesired substance or a space between patterns is removed. It is conceivable to eject a liquid having a small particle diameter suitable for removing unnecessary matter in a small gap from a different nozzle.

According to a second aspect of the present invention, there is provided a substrate processing apparatus.
3. The apparatus according to claim 1, further comprising a transport mechanism for transporting the substrate. The plurality of nozzles are arranged so that the particle diameter of the liquid ejected to the substrate as the substrate is transported becomes gradually smaller. Here, the plurality of nozzles eject the liquid to the substrate being transported. I do. Therefore, when viewed from the substrate being transported, each nozzle relatively ejects liquid having a different particle size in order. Then, according to the above configuration, the substrate receives the ejection of the liquid having a large particle diameter first, and gradually receives the ejection of the liquid having a small particle diameter. For this reason, a relatively large one of the unnecessary substances adhering to the substrate is removed first, and a relatively small one is removed later. As a result, it is possible to suppress a problem that a large unnecessary object becomes an obstacle and a small unnecessary object is not removed.

According to a third aspect of the present invention, there is provided a substrate processing apparatus.
Or the apparatus according to 2, wherein the plurality of nozzles are arranged such that the substrate is continuously ejected with the liquid.
With conventional equipment that changes the spray pressure, the distance between each nozzle is large, and the spray is interrupted, especially between chambers. In some cases, such a problem may occur that small undesired substances cannot be removed due to hindrance. If such a phenomenon occurs, the processing time must be increased in order not to degrade the quality of the processing.

In particular, in a printed circuit board on which a pattern is formed, a large unnecessary object hides a small unnecessary object together with a convex portion of the pattern, and when the large unnecessary object is reattached, the small unnecessary object tends to be difficult to be removed. is there.

On the other hand, in the apparatus according to the third aspect, a plurality of nozzles for ejecting liquids having different particle diameters are used to increase the processing efficiency, and each nozzle is provided so that the substrate continuously receives the liquid ejection. Has been arranged. For this reason,
The unnecessary matter once removed is less likely to reattach to the substrate. Therefore, the large unnecessary substances removed before the ejection of the liquid for removing the small unnecessary substances adhere again,
The phenomenon that hinders the removal of small unnecessary substances can be suppressed. Thereby, the processing efficiency is further improved, and the processing time can be shortened.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus.
3. The apparatus according to any one of items 1 to 3, wherein the plurality of nozzles have a mutual distance of 300 mm or less. here,
Since the distance between the adjacent nozzles is set to 300 mm or less, the substrate can be continuously ejected with the liquid almost continuously, and the re-adhesion of the unnecessary matter once removed can be suppressed.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus according to the first aspect.
5. The apparatus according to any one of items 1 to 4, wherein the plurality of nozzles include at least a first nozzle and a second nozzle. The particle size of the liquid ejected by the second nozzle is smaller than the particle size of the liquid ejected by the first nozzle. The particle diameter of the liquid ejected from the first nozzle is at least twice the particle diameter of the liquid ejected from the second nozzle.

As a result of repeating the test to efficiently remove unnecessary substances to be removed in the substrate processing, the particle size of the liquid to be jetted is required to efficiently remove both large and small unnecessary substances. More than twice (more preferably 8
It has been found by the present inventor that it is desirable to provide first and second nozzles having an opening of more than twice. Based on this, in the device according to the present invention, the particle diameter of the liquid ejected from the first nozzle is set to be at least twice the particle diameter of the liquid ejected from the second nozzle.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus according to the first aspect.
6. The apparatus according to any one of items 1 to 5, wherein the plurality of nozzles have different particle diameters of the liquid to be ejected, respectively, depending on the shape and the supply pressure of the liquid.

According to a seventh aspect of the present invention, there is provided the substrate processing apparatus.
3. The apparatus according to claim 1, wherein the plurality of nozzles include a one-fluid nozzle and a two-fluid nozzle. One-fluid nozzle
Inject the liquid alone. The two-fluid nozzle injects a liquid mixed with a gas.

Here, since both a one-fluid nozzle suitable for ejecting a liquid having a relatively large particle diameter and a two-fluid nozzle suitable for ejecting a liquid having a relatively small particle diameter are used,
It is easy to set a large difference between the maximum particle size and the minimum particle size of the liquid to be ejected.

[0021] The substrate processing apparatus according to the eighth aspect is the first aspect of the invention.
8. The apparatus according to any one of items 1 to 7, wherein a plurality of nozzles each having a different particle diameter of the liquid to be ejected are arranged in the same chamber.

According to a ninth aspect of the present invention, there is provided a substrate processing apparatus according to the second aspect.
The transport mechanism transports a substrate in a state where the substrate is inclined with respect to a horizontal plane.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <Overall Configuration> FIG. 1 shows a part of a substrate processing apparatus according to an embodiment of the present invention. This substrate processing apparatus is an apparatus for cleaning while transporting a substrate W having a wiring pattern PT (see FIG. 2) on the surface. This apparatus mainly consists of a series of chambers (introduction chamber 8).
0, washing chamber 10, drying / unloading chamber 90)
And a transport roller 16 that passes through each chamber to form a transport path.

When the substrate W is carried to the substrate processing apparatus,
First, the substrate W is carried into the introduction chamber 80. Thereafter, the substrate W is sent to the washing chamber 10, where foreign substances (unnecessary substances) such as particles attached to the surface are washed away. Then, the substrate W having been subjected to the rinsing process is carried out of the drying and carrying-out chamber 90 adjacent to the rinsing chamber 10 by a blowing process of air, and then carried out of the apparatus.

The substrate W is transported in the transport direction D from left to right in FIG. 1. Hereinafter, the left side in FIG. 1 will be referred to as the upstream side, and the right side in FIG. 1 will be referred to as the downstream side. That is, regarding the washing chamber 10, the side where the introduction chamber 80 exists is the upstream side, and the side where the drying / unloading chamber 90 exists is the downstream side.

<Arrangement of Rinse Chamber> The rinse chamber 10 mainly includes a casing 19, upstream spray nozzles 21a and 21b, and middle spray nozzles 22a and 22.
2b and downstream spray nozzles 23a and 23b.

The casing 19 is a frame that surrounds the space between the introduction chamber 80 and the drying / unloading chamber 90, and has openings on the upstream and downstream sides for passing the substrate W through.

The upstream spray nozzles 21a and 21b are arranged in the casing 19 at an upstream portion.
The upstream spray nozzle 21a is disposed above the substrate W transported by the transport roller 16, and the upstream spray nozzle 2a
1b is disposed below the substrate W. These upstream spray nozzles 21a, 21b are mounted on pure water supply pipes 11a, 11b extending in a direction perpendicular to the transport direction D, and spray pure water L1 toward the substrate W.

Also, a plurality of upstream spray nozzles 21a,
Pure water supply pipes 11a and 11b to which 21b is attached
Is a mist cover 31 whose substrate W side is open as shown in FIG. 1 for the purpose of preventing the mist of the sprayed pure water L1 from diffusing.
a, 31b.

The middle spray nozzles 22a, 22b are connected to the upstream spray nozzles 21a, 21
1b is located downstream. Midstream spray nozzle 2
2a is arranged above the substrate W conveyed by the conveyance roller 16, and the midstream spray nozzle 22b is arranged below the substrate W. These midstream spray nozzles 22a, 22
b is attached to pure water supply pipes 12a and 12b extending in a direction orthogonal to the transport direction D, and the pure water L2 is supplied to the substrate W
Inject toward

Further, a plurality of midstream spray nozzles 22a,
Pure water supply pipes 12a and 12b to which 22b is attached
Is a mist cover 32 whose substrate W side is open as shown in FIG. 1 for the purpose of preventing the mist of the sprayed pure water L2 from diffusing.
a, 32b.

The downstream spray nozzles 23a, 23b are connected to the middle spray nozzles 22a, 22
2b is located downstream. Downstream spray nozzle 2
3a is arranged above the substrate W conveyed by the conveyance roller 16, and the downstream spray nozzle 23b is arranged below the substrate W. These downstream spray nozzles 23a, 23
b is attached to pure water supply pipes 13a and 13b extending in a direction orthogonal to the transport direction D, and the pure water L3 is supplied to the substrate W
Inject toward

Further, a plurality of downstream spray nozzles 23a,
Pure water supply pipes 13a and 13b to which 23b is attached
Is a mist cover 33 whose substrate W side is open as shown in FIG. 1 for the purpose of preventing the mist of the sprayed pure water L3 from diffusing.
a, 33b.

<Particle Size of Pure Water Sprayed from Each Spray Nozzle> In the washing chamber 10 of the substrate processing apparatus, pure water L sprayed from the upstream spray nozzles 21a and 21b is used.
1, the size of the pure water L2 injected from the midstream spray nozzles 22a and 22b, and the downstream spray nozzle 23
The particle diameter of pure water L3 injected from a and 23b is changed stepwise. The particle size of the pure water gradually decreases from the upstream side to the downstream side of the apparatus, and the pure water L injected from the middle-stream spray nozzles 22a and 22b
2 is smaller than the particle size of the pure water L1 sprayed from the upstream spray nozzles 21a and 21b, and the particle size of the pure water L3 sprayed from the downstream spray nozzles 23a and 23b is sprayed from the midstream spray nozzles 22a and 22b. Pure water L2
Is even smaller than the particle size.

The specific set particle diameter of the jet pure water in this substrate processing apparatus is about 300 μm for the upstream spray nozzles 21a and 21b, about 100 μm for the middle spray nozzles 22a and 22b, and about 3 μm for the downstream spray nozzles 23a and 23b.
0 μm.

In order to inject pure water having a set particle diameter from each spray nozzle, the size of the tip injection port of each spray nozzle is changed and the downstream spray nozzle 23 is sprayed.
In a and 23b, the air supplied from an air pipe (not shown) is drawn into the nozzle, and the pure water and the air are mixed to reduce the particle diameter of the injected pure water L3. That is, here, the downstream spray nozzle 23
As a and 23b, not a one-fluid nozzle for jetting pure water alone but a two-fluid nozzle for mixing and jetting air with pure water is adopted.

Further, the structure of each spray nozzle is made different as described above, and a pure water supply line for supplying pure water to each spray nozzle is provided for each spray nozzle, and pure water is supplied at a pressure suitable for each nozzle structure. Is supplied to each spray nozzle.

<Substrate Cleaning Operation in Rinse Chamber> When the substrate W is conveyed from the introduction chamber 80 to the rinse chamber 10, the substrate W is first moved to the upstream spray nozzle 2
Pure water L1 having a particle size of about 300 μm is injected from 1a and 21b. The injection of the pure water L1 having a particle diameter of about 300 μm mainly removes a large foreign matter adhering to the surface of the substrate W.

When the substrate W is conveyed to the downstream side, next, about 100 centimeters from the midstream spray nozzles 22a and 22b.
Pure water L2 having a particle size of μm is sprayed onto the substrate W (FIG. 2).
(A)). Here, the upstream spray nozzles 21a,
The relatively large foreign matter P1 is removed from the foreign matter that could not be removed by the injection by 21b (see FIG. 2B).

When transported further downstream, the substrate W
Is the downstream spray nozzle 23 as shown in FIG.
a, 23b are injected with pure water L3 having a particle size of about 30 μm. As a result, small foreign matter P2 and stagnant water that have entered between the patterns PT formed on the surface of the substrate W are removed.

In FIG. 2, the cleaning of the lower surface of the substrate W is not shown for easy understanding. <Features of Apparatus> (1) In the substrate processing apparatus of the present embodiment, the upstream spray nozzles 21a and 21b, the middle spray nozzles 22a and 22
b, The downstream spray nozzles 23a and 23b eject pure water L1, L2 and L3 having different particle sizes, respectively, to remove foreign matter from the substrate W. Since the particle size of the pure water sprayed from each spray nozzle is set according to the foreign matter attached to the substrate W, the foreign matter is efficiently removed from the substrate W.

(2) In the substrate processing apparatus of the present embodiment, the upstream spray nozzles 21a and 21b, the middle spray nozzles 22a and 22b, and the downstream spray nozzles 23a and 23b
However, they are arranged so that the particle size of pure water injected onto the substrate W as the substrate W is transported becomes gradually smaller. For this reason, as shown in FIG. 2A, even when the small foreign matter P2 adheres to the space surrounded by the pattern PT and the large foreign matter P1 on the substrate W, the large foreign matter P1 adhering to the substrate W remains. The small foreign matter P2 removed first is removed later by the injection of the pure water L3 from the downstream spray nozzles 23a and 23b. That is, the problem that the large foreign matter P1 becomes an obstacle and the small foreign matter P2 is not removed is reduced.

(3) In the substrate processing apparatus of this embodiment, the upstream spray nozzles 21a and 21b inject pure water L1 having a particle size of about 300 μm, and the downstream spray nozzles 23a and 23b.
b injects pure water L3 having a particle size of about 30 μm. That is, the particle size of the pure water L1 injected from the upstream spray nozzles 21a, 21b is
It is about 10 times the particle size of the pure water L3 injected from. Such a setting of the particle size is obtained as a result of repeating a test in order to efficiently remove general foreign substances (particles and the like) to be removed in the cleaning treatment. As a result of the test, in order to efficiently remove both large foreign matter and small foreign matter, two or more types of spray nozzles having an opening of twice or more (more preferably, eight times or more) the diameter of the pure water to be sprayed are required. It has been found by the present inventor that it is desirable to install

In particular, in this embodiment, the upstream spray nozzles 21a and 21b have a particle size of about 300 μm,
Particle size of the middle stream spray nozzles 22a and 22b (about 100 μm)
m) is about three times. Further, the particle diameter of the middle spray nozzles 22a and 22b is about 100 μm, and the particle diameter of the downstream spray nozzles 23a and 23b (about 30 μm).
It is about three times as large. That is, in this embodiment,
The upstream spray nozzles 21a and 21b and the middle spray nozzles 22a and 22b, and the middle spray nozzle 22a and the downstream spray nozzles 23a and 23b each have a particle size difference of about three times. Therefore, each of the spray nozzles effectively removes foreign matters of different sizes, and foreign matters of various sizes are effectively removed.

In this case, since the particle size of pure water injected from the upstream side to the downstream side of the apparatus is changed stepwise from large to small, the size of large foreign matter to small foreign matter is changed stepwise. And the removal efficiency is improved.

<First Modification> FIG. 3 shows a first modification of the above embodiment. Here, the upstream spray nozzle 21
The intervals between the middle spray nozzles 22a and 22b and the middle spray nozzles 22a and 22b, and between the middle spray nozzles 22a and 22b and the downstream spray nozzles 23a and 23b are narrowed so that the substrate W can be reliably and continuously sprayed with pure water. .

More specifically, the interval S between the spray nozzles adjacent to each other in the transport direction D is set to 300 mm or less so that the pure water can be sprayed onto the substrate W without interruption. In this manner, since the spray nozzles are arranged so that the substrate W continuously receives the jet of pure water, the large foreign matter once removed is less likely to adhere to the substrate. Therefore, it is possible to suppress a phenomenon that the large foreign matter removed before the injection of the pure water for removing the small foreign matter is reattached and hinders the removal of the small foreign matter. Thereby, the processing efficiency is further improved and the processing time is shortened.

Also, as shown in FIG. 3, by reducing the interval S between the spray nozzles, the length of the washing chamber 10 can be shortened, and the apparatus can be made more compact. <Second Modification> FIG. 4 shows a second modification of the above embodiment. Here, the internal space of the casing 19 is
Are separated by The partition plate 41 includes upstream spray nozzles 21a and 21b and midstream spray nozzles 22a and 22b.
And between the middle spray nozzles 22a and 22b and the downstream spray nozzles 23a and 23b, and divides the internal space of the casing 19 into three parts.

Accordingly, the upstream spray nozzles 21a,
The mist caused by the injection of the pure water L1 of the spray 21b is substantially diffused only in the space 51 where the upstream spray nozzles 21a and 21b are present, and hardly diffuses downstream. Further, the mist caused by the injection of the pure water L2 from the middle-stream spray nozzles 22a and 22b is also substantially equal to the middle-stream spray nozzles 22a and 22b.
b, and hardly diffuses into the space 53 having the downstream downstream spray nozzles 23a and 23b.

Therefore, the phenomenon that the large foreign matter once removed flows downstream and adheres again to the substrate W is suppressed, and the foreign matter removal efficiency is improved. In FIG. 4,
Although the pure water injection to the substrate W is interrupted at the position of the partition plate 41, it is more preferable to reduce the interval between the spray nozzles or to increase the injection angle so that the pure water injection to the substrate W is not interrupted. .

<Third Modification> FIG. 5 shows a third modification of the above embodiment. Here, each spray nozzle is inclined to the upstream side to suppress the injected pure water from flowing to the downstream side. Thereby, the phenomenon that the foreign matter once removed flows downstream and adheres again to the substrate W is reduced, and the removal efficiency is improved.

<Fourth Modification> FIG. 6 shows a fourth modification of the above embodiment. FIG. 6 is a cross-sectional view of the washing chamber 10.

Here, the transport roller 16 transports the substrate W in a state of being inclined with respect to the horizontal plane. In accordance with this, each spray nozzle is also arranged in an inclined state. In this case, the pure water injected to the substrate W flows sideways along the slope, so that the pure water stays on the upper surface of the substrate W is suppressed. Thereby, the effect of the application of the present invention for finely removing the foreign matter by changing the particle size of the pure water to be injected onto the substrate W in a stepwise manner becomes more apparent.

On the other hand, the pure water hardly collects on the upper surface of the substrate W due to the inclined transfer, and thus there is a possibility that foreign matter may adhere again. Continued spraying can minimize redeposition.

[Other Embodiments] (A) Although the substrate processing apparatus of the above embodiment is an apparatus for cleaning a substrate, the substrate processing apparatus to which the present invention can be applied is not limited to this. . The present invention is also applied to a substrate processing apparatus that performs water washing after a chemical solution process, a resist stripping apparatus that removes resist and particles, a developing apparatus that includes a color resist removing process, or a substrate processing apparatus that performs a plurality of these processes continuously. Can be applied.

(B) Although the substrate processing apparatus of the above embodiment is intended for processing a substrate having a wiring pattern on the surface, the present invention is also applicable to a substrate processing apparatus for processing a substrate having no uneven surface. Is valid. Furthermore, various substrates such as a silicon wafer for a semiconductor substrate, a glass substrate for a liquid crystal display, and a printed substrate are assumed as substrates to be processed.

(C) In the substrate processing apparatus of the above embodiment, the substrate is cleaned by a method of injecting pure water onto the substrate W.
If necessary, this can be combined with brush or ultrasonic cleaning. However, the substrate processing apparatus of the above-described embodiment to which the present invention is applied has a higher cleaning ability than before, and eliminates the need for cleaning with a brush or ultrasonic waves even when a conventional brush or ultrasonic wave is required. can do.

[0058]

According to the present invention, since a plurality of nozzles are configured to eject liquids having different particle diameters, an appropriate particle diameter is selected in accordance with the structure and type of unnecessary substances attached to the substrate. By setting, unnecessary substances can be efficiently removed from the substrate.

[Brief description of the drawings]

FIG. 1 is a schematic side view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a state in which foreign matter is removed from a substrate.

FIG. 3 is a schematic side view according to a first modification of the substrate processing apparatus.

FIG. 4 is a schematic side view according to a second modification of the substrate processing apparatus.

FIG. 5 is a schematic side view according to a third modification of the substrate processing apparatus.

FIG. 6 is a cross-sectional view according to a fourth modification of the substrate processing apparatus.

[Explanation of symbols]

 Reference Signs List 10 Rinse chamber 16 Conveyance roller (conveyance means) 19 Casing 21a, 21b Upstream spray nozzle (first nozzle) 22a, 22b Midstream spray nozzle 23a, 23b Downstream spray nozzle (second nozzle) L1 Pure water jetted from upstream spray nozzle L2 Pure water sprayed from the midstream spray nozzle L3 Pure water sprayed from the downstream spray nozzle P1 Relatively large foreign matter P2 Small foreign matter PT pattern W Substrate

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (reference) H05K 3/00 H05K 3/00 Z 3/26 3/26 A F term (reference) 2H088 FA17 FA21 FA30 2H090 HC18 JC19 3B201 AA02 AB14 BB22 BB24 BB32 BB33 BB62 CD43 5E343 AA02 AA11 AA12 AA26 EE04 GG11

Claims (9)

[Claims] 1. A substrate processing apparatus for removing unnecessary substances adhering to a substrate by ejecting a liquid, the apparatus comprising a plurality of nozzles each having a different particle diameter of the liquid to be ejected. 2. The apparatus according to claim 1, further comprising a transport mechanism for transporting the substrate, wherein the plurality of nozzles are arranged so that a particle diameter of a liquid ejected to the substrate as the substrate is transported becomes gradually smaller. Substrate processing equipment. 3. The substrate processing apparatus according to claim 1, wherein the plurality of nozzles are arranged so that the substrate is continuously ejected with the liquid. 4. The plurality of nozzles have an interval of 30 from each other.
The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus has a thickness of 0 mm or less. 5. The method according to claim 1, wherein the plurality of nozzles include at least a first
A nozzle that includes a second nozzle having a smaller particle diameter of the liquid ejected than the first nozzle, wherein the particle diameter of the liquid ejected from the first nozzle is smaller than the second nozzle.
The substrate processing apparatus according to any one of claims 1 to 4, wherein the diameter of the liquid is two or more times the particle diameter of the liquid ejected from the nozzle. 6. The substrate processing apparatus according to claim 1, wherein the plurality of nozzles have different particle diameters of the liquid to be ejected depending on the shape and the supply pressure of the liquid. 7. The substrate processing apparatus according to claim 6, wherein the plurality of nozzles include a one-fluid nozzle that ejects a liquid alone and a two-fluid nozzle that ejects a liquid by mixing a gas. apparatus. 8. The plurality of nozzles, each having a different particle diameter of the liquid to be ejected, are arranged in the same chamber.
The substrate processing apparatus according to claim 1. 9. The substrate processing apparatus according to claim 2, wherein the transport mechanism transports the substrate in a state where the substrate is inclined with respect to a horizontal plane.