KR20100055812A - Apparatus for processing a substrate - Google Patents

Apparatus for processing a substrate Download PDF

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Publication number
KR20100055812A
KR20100055812A KR1020080114689A KR20080114689A KR20100055812A KR 20100055812 A KR20100055812 A KR 20100055812A KR 1020080114689 A KR1020080114689 A KR 1020080114689A KR 20080114689 A KR20080114689 A KR 20080114689A KR 20100055812 A KR20100055812 A KR 20100055812A
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KR
South Korea
Prior art keywords
substrate
processing unit
air
processing
unit
Prior art date
Application number
KR1020080114689A
Other languages
Korean (ko)
Inventor
이상준
Original Assignee
세메스 주식회사
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Publication date
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Priority to KR1020080114689A priority Critical patent/KR20100055812A/en
Publication of KR20100055812A publication Critical patent/KR20100055812A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The substrate processing apparatus includes a first processing unit for wet-processing a substrate using a processing liquid, and a second processing unit for continuously wet-processing a substrate disposed in one direction of the first processing unit and processed by the first processing unit. And angles of inclination with respect to one direction and one opposite direction to prevent mixing of the processing liquid which is disposed between the first processing unit and the second processing unit and used in the first processing unit and the second processing unit to remain on the substrate. It includes an air curtain unit for injecting air to each of the substrate to have a. Therefore, the quantity of the air curtain unit can be reduced to simplify the structure of the substrate processing apparatus.

Description

Apparatus for processing a substrate

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing a wet process on a substrate using a chemical liquid.

Generally, a flat panel display is used to display processed information in an information processing device. Examples of the flat panel display include a liquid crystal display (LCD), a plasma display (PDP), and an organic light emitting diode (OLED). Can be.

The flat panel display is manufactured by performing various unit processes for forming circuit patterns on the glass substrate having a large area. For example, the circuit patterns may be manufactured by depositing a film on a substrate and then performing a photo process, an etching process, a strip process, and the like.

Here, the strip process is a process for removing the photoresist remaining on the substrate, a wet process using a treatment liquid is used. For example, the strip process may be performed by spraying a strip solution (eg, a treating solution) for removing photoresist onto a horizontally transferred substrate.

The apparatus for the strip process may have a structure in which a plurality of processing units are arranged in series to perform a continuous wet process on a substrate, and the processing units may spray strip solution or pure water onto a substrate.

As such, in a configuration in which a plurality of processing units are used to inject a processing liquid such as strip solution or pure water onto the substrate, the substrate is transferred and the processing liquids used between the processing units are mixed with each other as the process proceeds continuously. Occurs. In order to prevent this, an air curtain unit for injecting air to the substrate may be provided at the inlet and outlet sides of each processing unit.

However, as the air curtain unit is provided at the inlet and outlet of each processing unit individually, the structure becomes complicated, and vortices are generated between the air curtain units disposed at the inlet and outlet sides of the processing units adjacent to each other and disposed adjacent to each other. There is a problem in that the inflow of the treatment liquid can not be effectively suppressed to generate a process defect.

Therefore, one problem to be solved through preferred embodiments of the present invention is to simplify the structure of the air curtain unit for injecting air to the substrate for the inlet and outlet sides of each processing unit in a substrate processing apparatus having a plurality of processing units It is to provide a substrate processing apparatus that can improve the efficiency of the installation space and reduce the cost.

In order to achieve the above object of the present invention, the substrate processing apparatus according to the present invention includes a first processing unit, a second processing unit, and a first air curtain unit. The first processing unit wet-processes the substrate using the processing liquid. The second processing unit is disposed in one direction of the first processing unit, receives the substrate processed by the first processing unit, and continuously wets the substrate. The first air curtain unit is disposed between the first processing unit and the second processing unit, and used in the first processing unit and the second processing unit to prevent mixing of the processing liquid remaining on the substrate. And inject air into the substrate so as to have an inclination angle with respect to the opposite direction of the one direction.

Here, according to an embodiment, the air curtain unit may include a body, a first supply flow path, a first supply pipe, a second supply flow path, and a second supply pipe. The first supply flow path is formed in the body, the first slot is provided at the front end to inject air to have an inclination angle with respect to the one direction. The first supply pipe is connected to the first supply flow path and supplies air provided from an external supply source to the first supply flow path. The second supply flow path is formed in the body, the second slot is provided at the front end to inject air to have an inclination angle with respect to the opposite direction of the one direction. The second supply pipe is connected to the second supply flow path and supplies air provided from an external supply source to the second supply flow path.

According to another embodiment, the air curtain unit sprays the air so that the inclination angle of the air injected to the one direction and the inclination angle of the air injected to the opposite direction of the one direction have angles symmetrical to each other based on a vertical line, respectively. can do.

According to yet another embodiment, a processing unit for spraying the processing liquid into the transfer unit for horizontally transporting the substrate in the one direction and the substrate horizontally transported in the one direction in the first processing unit and the second processing unit; Each injection unit may be provided.

According to yet another embodiment, the substrate processing apparatus may further include a second air curtain unit and a second air curtain unit. The second air curtain unit is disposed at an inlet side of the first processing unit into which the substrate is introduced, and injects air to the substrate to have an inclination angle with respect to the opposite direction of the one direction. The third air curtain unit is disposed at an outlet side of the second processing unit from which the substrate is carried out, and blows air to the substrate to have an inclination angle with respect to the one direction.

In the substrate processing apparatus according to the present invention configured as described above, one air curtain unit includes a first air curtain unit configured to prevent mixing of the processing liquid between the first processing unit and the second processing unit performing the wet process on the substrate using the processing liquid. By injecting air to the substrate in both the processing unit and the second processing unit, the structure can be simplified and the cost can be reduced.

In addition, the air is injected in both the first processing unit and the second processing unit in one air curtain unit, the distance between the injection position of the air is narrowed to suppress the vortices that can occur between the air injected adjacent, the process accordingly By improving defects, process efficiency can be improved.

Hereinafter, a substrate processing apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the invention, and are actually shown in a smaller scale than the actual dimensions in order to explain the schematic configuration. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example

1 is a cross-sectional view schematically showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a substrate processing apparatus 100 according to an embodiment of the present invention includes a first processing unit 110, a second processing unit 120, and a first air curtain unit 130.

The substrate processing apparatus 100 is a device for performing a semiconductor manufacturing process as a flat panel display device manufacturing process or a similar technology, and removes a photoresist used to form a circuit pattern on the substrate G. It may be a device for performing a strip process. In other words, the substrate G may be a substrate G for manufacturing a flat panel display device such as a glass substrate, and may be a substrate G for manufacturing a semiconductor device such as a silicon wafer. Alternatively, the substrate processing apparatus 100 may be various manufacturing apparatuses having a configuration of performing a wet process by spraying the processing liquid onto the substrate G. For example, the substrate processing apparatus 100 may be a cleaning apparatus for cleaning by spraying the cleaning liquid onto the substrate G.

The first processing unit 110 provides a process space for the substrate G, and wets the substrate G using the processing liquid therein. The first processing unit 110 is, for example, a box-shaped container, and at one side thereof is provided with an inlet through which a substrate G to be processed is introduced, and at the opposite side facing the inlet, a substrate G having finished the process is provided. An exit port is provided, and the inlet and the exit are provided on the same horizontal line. Meanwhile, the first processing unit 110 may have a shape other than a box shape.

The second processing unit 120 provides a process space for the substrate G, and wets the substrate G using the processing liquid therein. The second processing unit 120 may have the same structure as the first processing unit 110. That is, the second processing unit 120 is a box-shaped container having an inlet for inputting the substrate G on one side thereof, and an outlet for carrying out the substrate G on the opposite side facing the inlet.

The second processing unit 120 is disposed in one direction of the first processing unit 110 and communicates with the first processing unit 110. The second processing unit 120 receives the substrate G that has been wet-processed from the first processing unit 110, and continuously wets the substrate G. Thus, the second processing unit 120 is arranged such that the inlet faces the outlet of the first processing unit 110.

Meanwhile, the treatment liquids used in the first processing unit 110 and the second processing unit 120 may be different solutions. For example, the processing liquid used in the first processing unit 110 is a strip solution for stripping photoresist on the substrate G, and the processing liquid used in the second processing unit 120 is the strip solution. May be deionized water to rinse off. However, the treatment liquid is not limited to the solutions mentioned. For example, different types of strip solutions may be used in the first processing unit 110 and the second processing unit 120, or the process may be performed under different conditions using the same strip solution. In addition, the first processing unit 110 and the second processing unit 120 may additionally use a brush or the like together with the processing liquid when the substrate G is processed.

The first processing unit 110 and the second processing unit 120 transfer the substrate G in a horizontal direction and supply a processing liquid to the substrate G to proceed with the process.

To this end, inside the first processing unit 110 and the second processing unit 120, first and second transfer units 112 and 122 for horizontally transporting the substrate G in one direction are provided, respectively. First and second processing liquid injection units 114 and 124 may be provided to spray the processing liquid to the substrate G, which is horizontally transferred. For example, each of the first and second transfer units 112 and 122 may be composed of a plurality of transfer rollers and a rotating shaft, and each of the first and second treatment liquid injection units 114 and 124 may be a plurality. May include injection nozzles.

At this time, as the wet process is continuously performed on the substrate G while passing through the first processing unit 110 and the second processing unit 120, the residue remains on the substrate G or is scattered during the spraying process. Through the inlet and the outlet may cause a problem that the processing liquid between the first processing unit 110 and the second processing unit 120 is introduced and mixed. In order to prevent this, in the present embodiment, the first air curtain unit 130 is provided.

The first air curtain unit 130 is disposed between the first processing unit 110 and the second processing unit 120. The first air curtain unit 130 has a structure in which air is sprayed in both directions with respect to the substrate G transferred from the first processing unit 110 to the second processing unit 120. That is, air is injected to the substrate G in the direction toward the first processing unit 110 and the direction toward the second processing unit, respectively. At this time, the air injected from the first air curtain unit 130 is injected to have an inclination angle with respect to the substrate (G).

Accordingly, the process liquid used in the first processing unit 110 is removed from the substrate G, and an air blocking film is formed between the first processing unit 110 and the second processing unit 120 and processed. By suppressing the inflow and outflow of the liquid, it is suppressed from mixing with each other.

Meanwhile, the substrate processing apparatus 100 may further include a second air curtain unit 140 and a third air curtain unit 150 provided for similar purposes and effects to the first air curtain unit 130. Can be.

The second air curtain unit 140 is disposed at the inlet side of the first processing unit 110 and serves to inject air to the substrate G introduced into the first processing unit 110. The second air curtain unit 140 removes the foreign matter or the treatment liquid remaining on the substrate G introduced into the first processing unit 110, forms an air barrier layer, and forms an air blocking film to close the inlet side of the first processing unit 110. Isolate.

The third air curtain unit 150 is disposed at the outlet side of the second processing unit 120 and serves to inject air to the substrate G carried out from the second processing unit 120. The third air curtain unit 150 removes the processing liquid or foreign matter remaining on the substrate G carried out from the second processing unit 120, forms an air barrier layer, and forms an air blocking film on the outlet side of the second processing unit 120. Isolate.

The second air curtain unit 140 and the third air curtain unit 150 have a one-way air blowing structure. However, when the processing unit is added to the front end of the first processing unit 110 and the rear end of the second processing unit 120, the second and third air curtain units 140 and 150 are the first air curtain unit 130. In the same manner, the air blowing structure may have a two-way air injection structure.

As such, the first processing unit 110 and the second processing unit 120 form an independent process space by the first air curtain unit 130 and the second and third air curtain units 140 and 150. In addition, the treatment liquids are prevented from being mixed with each other to improve process efficiency.

Hereinafter, the first air curtain unit 130 will be described in more detail with reference to FIGS. 2 and 3.

2 is a side view illustrating the first air curtain unit of FIG. 1, and FIG. 3 is a cross-sectional view illustrating the first air curtain unit of FIG. 1.

1, 2 and 3, the first air curtain unit 130 includes a body 132, a first supply flow path 134, and a second supply flow path 136.

The body 132 may have various shapes. The body 132 has a structure extending in a direction perpendicular to the transfer direction (for example, one direction) of the substrate (G).

The first supply passage 134 is formed inside the body 132. The first supply flow path 134 has a first slot 134a as a discharge port for injecting air to the discharging substrate G of the first processing unit 110 at the front end thereof. The first slot 134a may extend in a direction perpendicular to the transfer direction of the substrate G.

The second supply passage 136 is formed inside the body 132. The second supply flow passage 136 has a second slot 136a as a discharge port for injecting air to the input substrate G of the second processing unit 120 at the tip thereof. The second slot 136a may also extend in a direction perpendicular to the transfer direction of the substrate G.

In addition, a first supply pipe 162 is connected to the first supply flow path 134 to supply air from an external air supply source, and a second supply flow path 136 is provided to supply air from the air supply source. 2 supply pipe 162 is connected.

As a result, the first supply flow path 134 and the second supply flow path 136 are separately formed in the body 132, and the first supply pipe 162 and the second supply pipe 164 connected to the external air supply source are respectively formed. By being connected to the first supply flow path 134 and the second supply flow path 136, separate air supply lines are formed for injecting air in both directions. As such, since the air supply lines for injecting errors in both directions are individually configured, the injection pressure of the air injected in both directions can be maintained uniformly. That is, when the air is branched into two slots by using one air supply line (for example, a supply flow path and a supply pipe), a variation occurs in the injection pressure, which causes a decrease in process efficiency.

In the present exemplary embodiment, the first supply flow path 134 and the second supply flow path 136 may be formed by the substrate (through the air being injected into the substrate G through the first slot 134a and the second slot 136a). The air jetted to G) has a structure of jetting obliquely to the substrate, respectively. That is, the first supply flow passage 134 and the second supply flow passage 136 have a structure in which the tip end thereof is oblique to the substrate G at a predetermined angle. This is to effectively remove the processing liquid on the substrate G and to prevent the substrate G from shaking due to the injection pressure of the air.

At this time, it is preferable that the injection directions of the air injected in both directions from the first air curtain unit 130 are symmetric with each other based on the vertical line. To this end, the front end portions of the first supply passage 134 and the second supply passage 136 may have angles symmetrical with each other. This is because even if the air is jetted at the same injection pressure, if the angles are different from each other, variation in the pressure applied to the substrate G is not preferable. As such, when the jet directions of the air jetted in both directions are symmetrical with each other, the first air curtain unit 130 may be disposed to be positioned at the center of the first and second processing units 110 and 120. have.

Although not shown, the first air curtain unit 130 is fixed to the first air curtain unit 130 so that the first air curtain unit 130 may be disposed between the first processing unit 110 and the second processing unit 120. Brackets may be provided.

As described above, the substrate processing apparatus according to the preferred embodiment of the present invention includes a first processing unit and a first processing unit in a structure in which a first processing unit and a second processing unit are arranged in succession to continuously perform a wet process using a processing liquid on a substrate. One air curtain unit disposed between the second processing units injects air to the substrate in both directions of the first processing unit and the second processing unit, thereby simplifying the structure of the air curtain unit. Therefore, the efficiency of the installation space can be improved and the cost can be reduced.

In addition, by injecting air in both directions in one air curtain unit by reducing the distance between the adjacent air injection position to suppress the vortices that can occur when injecting the air, improve the defects caused by the vortex process The efficiency can be improved.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Explanation of symbols on the main parts of the drawings

100: substrate processing apparatus 110: first processing unit

112: first transfer unit 114: first treatment liquid injection unit

120: second processing unit 122: second transfer unit

124: second processing liquid injection unit 130: first air curtain unit

132: body 134: first supply flow path

134a: first slot 136: second supply flow path

136a: second slot 140: second air curtain unit

150: third air curtain unit 162: first supply pipe

164: second supply pipe

Claims (5)

A first processing unit for wet treating a substrate using the processing liquid; A second processing unit disposed in one direction of the first processing unit and configured to continuously receive and wet process the substrate processed by the first processing unit; And Disposed between the first processing unit and the second processing unit and used in the first processing unit and the second processing unit to prevent mixing of the processing liquid remaining on the substrate; And an air curtain unit for respectively injecting air into the substrate to have respective inclination angles relative to the substrate. The method of claim 1, wherein the air curtain unit Body; A first supply flow path formed in the body and provided with a first slot at a tip thereof to inject air to have an inclination angle with respect to the one direction; A first supply pipe connected to the first supply flow path for supplying air provided from an external supply source to the first supply flow path; A second supply flow path formed in the body and provided with a second slot at a tip thereof to inject air to have an inclination angle with respect to an opposite direction of the one direction; And And a first supply pipe connected to the second supply flow path for supplying air provided from an external supply source to the second supply flow path. The air curtain unit of claim 1, wherein the air curtain unit injects air so that the inclination angle of the air injected with respect to the one direction and the inclination angle of the air injected with respect to the opposite direction of the one direction have angles symmetrical with each other with respect to a vertical line. The substrate processing apparatus characterized by the above-mentioned. The treatment liquid injection of claim 1, wherein the first processing unit and the second processing unit have a transfer unit for horizontally transferring the substrate in the one direction and a treatment liquid spray for spraying the processing liquid onto the substrate horizontally transferred in the one direction. The substrate processing apparatus characterized by the above-mentioned. The display apparatus of claim 1, further comprising: a second air curtain unit disposed at an inlet side of the first processing unit into which the substrate is introduced, and injecting air to the substrate to have an inclination angle with respect to an opposite direction of the one direction; And And a third air curtain unit disposed at an outlet side of the second processing unit from which the substrate is carried out, and spraying air to the substrate to have an inclination angle with respect to the one direction.
KR1020080114689A 2008-11-18 2008-11-18 Apparatus for processing a substrate KR20100055812A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101373417B1 (en) * 2013-08-07 2014-03-14 손용진 Coated glass cleaning device
KR101394391B1 (en) * 2010-09-16 2014-05-14 세메스 주식회사 Substrate processing device
CN110575987A (en) * 2018-06-07 2019-12-17 佳宸科技有限公司 Low water spray flushing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101394391B1 (en) * 2010-09-16 2014-05-14 세메스 주식회사 Substrate processing device
KR101373417B1 (en) * 2013-08-07 2014-03-14 손용진 Coated glass cleaning device
CN110575987A (en) * 2018-06-07 2019-12-17 佳宸科技有限公司 Low water spray flushing device

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