JP2002179245A - Conveying type substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate retention of treatment liquid in a widthwise central part that becomes a problem when a large substrate is conveyed in a horizontal state. SOLUTION: A plurality of conveying roller units 31 arranging in the conveying direction of the substrate 100 conveys the substrate 100 while supporting it horizontally. A plurality of support rollers 31c, 31b, and 31c for supporting the substrate 100 at three or more positions in the direction rectangular to the conveying direction of the substrate 100 are disposed on each roller unit 31. Diameter of the support roller 31b in the central part is larger than those of the support rollers 31c and 31c in both sides so that the substrate 100 warps upward in the projecting direction rectangularly to the conveying direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer type substrate processing apparatus used for manufacturing a glass substrate for a liquid crystal display device.

[0002]

2. Description of the Related Art A glass substrate used in a liquid crystal display device is manufactured by repeatedly performing chemical treatments such as etching and peeling on the surface of a glass substrate as a material. The processing apparatus is roughly classified into a dry type and a wet type, and the wet type is further divided into a batch type and a single-wafer type. Further, the single wafer type is subdivided into a rotary type and a transport type by roller transport or the like.

[0003] Among these substrate processing apparatuses, the transport type has a basic configuration in which a processing liquid is supplied to the surface of the substrate while the substrate is transported in the horizontal direction. Used for processing and peeling.

In a transfer type substrate processing apparatus used for an etching process, an etching solution is sprayed from a large number of spray nozzles arranged in a matrix above a substrate transfer line, and the substrate is passed through the etching solution. Then, an etchant is supplied to the entire surface of the substrate. By this shower treatment, the surface of the substrate is selectively etched except for the portion where the masking material is applied. After the etching is completed, a cleaning process using a shower is performed. The one for the peeling treatment has basically the same configuration.

[0005]

However, such a shower process has a problem that process unevenness is likely to occur as the size of the substrate increases.

That is, in a glass substrate for a liquid crystal display device, the size of the substrate has been increased along with the increase in the resolution of the circuit. Generally, in the shower process, the etching liquid flows through the surface of the substrate from the front to the rear in the transport direction as the substrate passes through the shower of the etching liquid, and liquid replacement is performed.
There is no problem when the substrate is small, but when the substrate becomes large,
The etchant tends to stagnate at the center compared to both sides of the substrate. As a result, a difference occurs in the etching rate between the width direction center portion and both side portions.

[0007] In order to solve this problem, there has been proposed an inclined conveyance in which the substrate is conveyed while being tilted to the side. According to the inclined conveyance, the processing liquid supplied to the surface of the substrate smoothly flows from one side to the other side, and even in the case of a large substrate, processing unevenness in the width direction is prevented. However, in the case of the inclined transfer, there is a fatal limitation that so-called paddle processing in which a small amount of processing liquid is left standing on the substrate cannot be performed.

[0008] That is, as a wiring material used for a glass substrate for a liquid crystal display device, Cr was often used in the past,
With the recent increase in definition, conversion to Al or Al / Mo having a smaller specific resistance value has been attempted. For this reason, even in the transport type substrate processing apparatus for etching, an etching solution for Al has begun to be used, but the use of this etching solution causes the following problems.

As the etching solution for Al, one containing phosphoric acid as a main component is used. The etching rate of Al by the etching solution for Al is C by etching for Cr.
r, which is higher than the etching rate of r, thereby obtaining a high etching efficiency.
The side edge surface of the layer becomes a shape that is not suitable for laminating the next layer.

FIG. 4 is a sectional view showing the shape of the Al layer after etching. Al layer 2 on glass substrate 1 as a material
And a Mo layer 3 formed thereon, and a masking material 4 is coated thereon. By etching, the Al layer 2 and the Mo layer 3 are removed in a portion not covered with the masking material 4, but the remaining side edge surfaces of the Al layer 2 and the Mo layer 3 are steep as shown by solid lines. It becomes a great inclination. Then, the next layer cannot be stably mounted on the Al layer 2 and the Mo layer 3. In order to mount the next layer stably, it is necessary to make the slope of the side edge surface gentle as shown by the dashed line. The same tendency occurs when the Mo layer 3 is not provided.

In order to solve the problem that the side edge surface of the Al layer rises steeply, a slit nozzle for supplying the processing liquid in a film shape over the entire width in a part of the substrate traveling direction is provided downstream of the shower unit. In addition, it is effective to perform a paddle process in which the processing solution is thinly applied on the surface of the substrate after the shower process. By this paddle processing, a state in which liquid replacement is hardly performed is realized, and the slope of the side edge surface becomes gentle as shown by the dashed line in FIG. 4 in the Al etching.

However, such paddle processing is
This is possible only in the case of horizontal transfer in which the substrate is transferred in a horizontal state, and cannot be performed in the case of inclined transfer in which the substrate is transferred in a state of being tilted to the side.

An object of the present invention is to effectively prevent the processing liquid from staying at the center in the width direction, which is a problem in the shower processing of a large substrate, despite the adoption of a horizontal transport system for transporting the substrate in a horizontal state. SUMMARY OF THE INVENTION It is an object of the present invention to provide a transfer type substrate processing apparatus which can be easily solved.

[0014]

In order to achieve the above object, a transfer type substrate processing apparatus of the present invention supplies a processing liquid to the surface of a substrate while transferring the substrate in a horizontal direction. A plurality of transport rollers arranged in the transport direction of the substrate to horizontally support the substrate and a plurality of support rollers for supporting the substrate at three or more positions in a direction perpendicular to the transport direction of the substrate by each transport roller The support roller at the center is made larger in diameter than the support rollers at both sides so that the substrate is provided in the unit and the substrate warps upward in a direction perpendicular to the transport direction.

In the transport type substrate processing apparatus according to the present invention, the substrate is transported in a horizontal state in which the substrate is warped in a direction perpendicular to the transport direction and in an upwardly convex direction, and undergoes processing. Due to this warpage, the processing liquid supplied to the surface of the substrate is smoothly discharged to both sides.
Depending on the amount of warpage, paddle processing can be performed while the warp remains, and if the paddle processing is difficult, the warpage may be removed. In order to shift the substrate conveyed inclined to the horizontal state during paddle processing and return to the inclined state after paddle processing,
A complicated mechanism is required, and it takes time to operate the substrate. However, the operation of removing the warp or re-applying the warp can be easily and quickly performed by changing the diameter of the support roller.

Among the plurality of support rollers for imparting warp to the substrate, the center support roller is a free roller rotatable with respect to the rotation drive shaft of the transport roller unit, and the support rollers on both sides are connected to the drive shaft. It is preferable to use a driving roller that rotates synchronously. This makes it possible to prevent the slip due to the roller diameter difference while reliably transporting the substrate.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a transfer type substrate processing apparatus showing one embodiment of the present invention, FIG. 2 is a front view of a main part of the substrate processing apparatus, and FIG. 3 is a view taken along line AA in FIG. .

The transport-type substrate processing apparatus of the present embodiment performs an Al etching process on a glass substrate 100 for a liquid crystal display device (hereinafter simply referred to as the substrate 100). As shown in FIG. 1, the substrate processing apparatus includes a first linear line A, a second line B connected to the first line A at right angles, and a first line A connected to the second line B at right angles. And a U-turn layout in which a third line C is arranged in parallel.

The first line A is constituted by connecting the receiving part 10, the liquid-proof part 20, and the etching part 30 in a straight line. The second line B is a washing section 40 and the substrate 10
The shower unit 41 for spraying the washing water from above is provided on the surface of the “0”. The third line C is a transfer device 50,
Spin dryer 60, transfer device 70 and take-out unit 80
Are connected linearly.

The first line A and the second line B correspond to the substrate 1
In order to convey 00 in the longitudinal direction of the line, a plurality of conveying roller units arranged in parallel at a predetermined interval in the conveying direction are provided. Each transport roller unit transports the substrate 100 in the longitudinal direction of the line while supporting the substrate 100 in a horizontal state, which will be described in detail later. A turning mechanism 4 for changing the traveling direction of the substrate 100 by 90 degrees is provided at the second line B, that is, at the entrance of the washing section 40.
2 are provided.

Substrate 100 subject to Al etching
Is carried into the receiving unit 10 by the transport device 90.
The substrate 100 enters the etching part 30 from the liquid protection part 20 by roller conveyance, and undergoes an etching process while passing through the part. The substrate 100 that has passed through the etching unit 30 continuously enters the washing unit 40 by roller conveyance, moves the washing unit 40 by changing the traveling direction by 90 degrees,
During the transfer, it undergoes a rinsing process.

The substrate 10 moved to the outlet of the washing section 40
0 is transported from the washing section 40 to the spin dryer 60 by the transfer device 50. The substrate 100 that has been dried by the spin dryer 60 is transferred to the spin dryer 6 by the transfer device 70.
0 to a take-out unit 80, and further carried out of the apparatus by a transfer device 90.

In the transport type substrate processing apparatus of the present embodiment, the transport roller unit in the etching section 30 and the washing section 40 has a particularly significant feature.

That is, as shown in FIG. 2, the etching section 30 includes a plurality of transport roller units 31 and a pressing roller unit 32 for horizontally transporting the substrate 100. Above the transfer line of the substrate 100, a first slit nozzle 33, a shower unit 34, and a second slit nozzle 35 are sequentially arranged along the traveling direction of the substrate 10 to supply an etching solution to the surface of the substrate 10. Is provided.

The plurality of transport roller units 31
00 are arranged at predetermined intervals in the conveying direction. As shown in FIG. 3, each transport roller unit 31 includes a horizontal drive shaft 31a perpendicular to the transport direction, a first support roller 31b provided at the center of the drive shaft 31a, and a horizontal drive shaft 31a. The second support rollers 31c provided on both sides,
31c.

The first support roller 31b supports the central portion of the substrate 100 in the width direction at a point, and is a free roller rotatable with respect to the drive shaft 31a. The outer diameter of the support roller 31b is equal to the second support roller 31c,
It is set larger than each outer diameter of 31c. As a result, the substrate 100 warps upward in the width direction. On the other hand, the second support rollers 31c, 31c are flanged rollers that support both side edges of the substrate 100, and the drive shaft 31a
It is a drive roller that rotates in synchronization with the drive roller.

The plurality of pressing roller units 32 are arranged in the transport direction of the substrate 100 at intervals larger than the transport roller unit 31 so as not to interfere with the transport roller unit 31. Each holding roller unit 32 includes a horizontal support shaft 32a perpendicular to the transport direction, and a support shaft 32a.
And pressing rollers 32c, 32c provided on both sides of the roller. The support shaft 32a is a rotatable non-drive shaft. The pressers 32c on both sides press both side edges of the substrate 100 from above, thereby pressing both side edges against the second support rollers 31c, 31c. Thus, the substrate 100 moves forward with the rotation of the second support rollers 31c, 31c.

The first slit nozzle 33 is a horizontal nozzle perpendicular to the direction of travel of the substrate 100. The first slit nozzle 33 flows down in the direction of travel of the surface of the substrate 10 by flowing down the etchant for Al in the form of a film. The section is fed linearly over the entire width.

The shower unit 34 has a large number of spray nozzles 34a arranged in a matrix (including a staggered pattern) at predetermined intervals in a horizontal direction parallel to the direction of travel of the substrate 100 and in a horizontal direction perpendicular to the direction of travel. In this case, the etching liquid for Al is sprayed over a wider area than the surface of the substrate 10.

A number of spray nozzles 34a
0 in parallel to the direction perpendicular to the traveling direction
It is attached to a plurality of header tubes 34b extending in the direction of travel 0 with its downward direction. Each spray nozzle 34a
The etching liquid for Al is formed into fine droplets and is ejected in a conical shape, and the ejection range of each nozzle overlaps between adjacent nozzles. Here, the supply amount of the etching liquid is set so that sufficient liquid replacement is performed on the surface of the substrate 100.

The second slit nozzles 35 are, similarly to the first slit nozzles 33, horizontal nozzles perpendicular to the direction in which the substrate 100 travels, and are arranged at predetermined intervals in the direction in which the substrate 100 travels. Each slit nozzle 35 is different from the first slit nozzle 33 in that a small amount of the etchant for Al flows down in a film shape perpendicular to the transport direction of the substrate 100 so that the etchant is directed in the traveling direction of the surface of the substrate 10 in one direction. The portion is fed linearly over the entire width and is retained.
That is, the supply amount of the etching solution here is
Is set to such an extent that the etching solution supplied to the surface of the substrate is held on the surface by surface tension.

Reference numeral 36 denotes a second slit nozzle 35 at the last stage.
Is an air nozzle of a slit type disposed further rearward than the above, and by blowing air linearly over the entire width of a part of the surface of the substrate 10 in the traveling direction, the etching liquid is removed from the surface.

In the water washing section 40 following the etching section 30,
The substrate 100 is horizontally conveyed in a state in which the substrate 100 is warped upward in the width direction, and undergoes a cleaning process using cleaning water sprayed from the shower unit 41.

In the transport type substrate processing apparatus according to the present embodiment having the above-described configuration, the liquid blocking section 20 is moved from the etching section 30 to the etching section 30.
First, the substrate 100 that has entered the first slit nozzle 3
3 passes through the film of the etching solution for Al formed below, and the etching solution is sequentially supplied from the tip to the surface thereof. Next, an Al etching solution is supplied to the entire surface of the substrate 100 while passing through a shower of the Al solution formed below the shower unit 34, and predetermined etching is performed.

When the etching liquid for Al is suddenly showered on the surface of the substrate 100, the portion that first receives the droplets remains as processing unevenness. Since the etchant is supplied evenly to the substrate, the process unevenness accompanying the shower process of the etchant is prevented.

An Al layer or an Al layer formed on the surface of the substrate 100 by a shower process using an etchant for Al.
/ Mo layer is selectively etched.

Here, the substrate 100 is transported by the rotation of the transport roller unit 31. In the transport roller unit 31, a first point supporting the central portion in the width direction of the substrate 100 is provided.
The outer diameter of the support roller 31b is larger than the outer diameter of the second support rollers 31c, 31c that support both side edges of the substrate 100. As a result, the substrate 100 warps upward in the width direction. As a result, the etchant supplied to the surface of the substrate 100 is efficiently removed not only from the front in the transport direction to the back but also to both sides. Therefore, the processing rate in the width direction is made uniform, and the processing unevenness is also eliminated from this point.

The side edge surface of the remaining Al layer or Al / Mo layer becomes a steep inclined surface unsuitable for lamination of the next layer. However, in the etching unit 30, following the shower process, an Al etchant flowing down in a film form from the second slit nozzle 35 is supplied to the surface of the substrate 100, and is held in a paddle state on the surface. During this time, the etching process proceeds slowly, and as shown by the dashed line in FIG.
The side edge surface of the remaining Al layer or Al / Mo layer becomes a gentle slope suitable for laminating the next layer.

In the washing section 40 following the etching section 30,
The substrate 100 is subjected to the shower processing of the cleaning water in a warped state, and the retention of the cleaning water at the center in the width direction is eliminated. Therefore, the consumption of the washing water is reduced.

The glass substrate 100 for a liquid crystal display device has a small thickness compared to the area, is basically easily warped, and has a tendency to become thinner as the size increases, and the width is 600 mm.
In the case of exceeding 30 mm, warpage occurs due to its own weight of 30 mm or more. In the transport type substrate processing apparatus of the present embodiment, by actively utilizing the warpage, the discharge of the processing liquid to the side while the substrate 100 is kept in a horizontal state is promoted. Further, the first support roller for supporting the central portion in the width direction of the substrate 100 as a free roller and the second support roller for supporting both side edges of the substrate 100 as a drive roller are provided. 31b is prevented from slipping.

The amount of warpage of the substrate 100 in the shower process is preferably 0.5 to 5% of the plate width, particularly preferably 1 to 3%. If the amount of warpage is too small, the replacement of the processing solution in the width direction does not proceed sufficiently. If it is too large, there are problems such as the lifting of the substrate 100 from the transport roller unit and the application of an external force (bending force) to the substrate 100. In the paddle processing, warpage of the substrate 100 is basically unnecessary. If warpage is a problem, the substrate 100 may be supported flat.

The first supporting the central portion in the width direction of the substrate 100
In the above embodiment, one support roller is provided, but two or more support rollers may be provided. In cooperation with the second support rollers supporting both sides of the substrate 100, the substrate 100 is moved upward in the direction of convexity. Any configuration that can be warped may be used.

The paddle processing section constituted by the plurality of second slit nozzles 35 is, in a word, replaced by a paddle processing section in the latter part of the shower processing section constituted by the shower unit 34. The paddle processing time is 10 to 45 of the total processing time by the etching solution.
% Is preferable, and 20 to 40% is particularly preferable. If the paddle processing time is too short, the inclination of the side edge surface is not sufficiently alleviated, but if the paddle processing time is too long, the effect is adverse, and there is a problem that the processing efficiency is reduced and the liquid is unnecessarily consumed. In the paddle processing section, the substrate 100 can be reciprocated.

[0044]

As described above, the transfer type substrate processing apparatus according to the present invention has a problem in shower processing of a large substrate by transporting the substrate in a state of being warped upward in the width direction. The stagnation of the processing liquid at the center in the width direction can be eliminated. As a result, in chemical treatment such as etching treatment,
Non-uniformity of the processing rate in the width direction can be eliminated, and in the water washing processing, the consumption of the washing water can be reduced. Further, it is easy to use the paddle process together with the shower process.

[Brief description of the drawings]

FIG. 1 is a plan view of a transfer type substrate processing apparatus showing one embodiment of the present invention.

FIG. 2 is a side view of a main part of the substrate processing apparatus.

FIG. 3 is a diagram showing an arrow AA in FIG. 2;

FIG. 4 is a sectional view showing a shape of an Al layer after etching.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Receiving part 20 Liquid-repelling part 30 Etching part 31 Transport roller unit 31a Drive shaft 31b, 31c Supporting roller 32 Pressing roller unit 33 1st slit nozzle 34 Shower unit 34a Spray nozzle 34b Header pipe 35 2nd slit nozzle 40 Rinse part 41 Shower unit 50, 70 transfer device 60 spin dryer 80 take-out unit 90 transfer device 100 substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F042 AA02 AA06 BA08 BA10 CC04 CC09 DA01 DA03 DF19 DF21 DF25 DF26 ED05 5F031 CA05 GA35 GA53 MA23 PA13

Claims (2)

[Claims] In a transport type substrate processing apparatus for supplying a processing liquid to the surface of a substrate while transporting the substrate in a horizontal direction, the substrate is horizontally supported by a plurality of transport roller units arranged in the transport direction of the substrate. And a plurality of support rollers for supporting the substrate at three or more positions in a direction perpendicular to the transport direction of the substrate are provided on each transport roller unit, so that the substrate warps upward in a direction perpendicular to the transport direction. A transfer type substrate processing apparatus characterized in that a center supporting roller has a larger diameter than both side supporting rollers. 2. The apparatus according to claim 1, wherein the support roller at the center is a free roller rotatable with respect to the rotary drive shaft of the transport roller unit, and the support rollers at both sides are drive rollers that rotate synchronously. A transfer type substrate processing apparatus as described in the above.