TWI578334B - 糊膏狀組成物 - Google Patents

糊膏狀組成物 Download PDF

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Publication number
TWI578334B
TWI578334B TW102104040A TW102104040A TWI578334B TW I578334 B TWI578334 B TW I578334B TW 102104040 A TW102104040 A TW 102104040A TW 102104040 A TW102104040 A TW 102104040A TW I578334 B TWI578334 B TW I578334B
Authority
TW
Taiwan
Prior art keywords
aluminum
mass
paste
parts
composition
Prior art date
Application number
TW102104040A
Other languages
English (en)
Chinese (zh)
Other versions
TW201337958A (zh
Inventor
中原正博
和辻隆
丸灣 達哈姆林
Original Assignee
東洋鋁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋鋁股份有限公司 filed Critical 東洋鋁股份有限公司
Publication of TW201337958A publication Critical patent/TW201337958A/zh
Application granted granted Critical
Publication of TWI578334B publication Critical patent/TWI578334B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Conductive Materials (AREA)
TW102104040A 2012-02-02 2013-02-01 糊膏狀組成物 TWI578334B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012020537 2012-02-02

Publications (2)

Publication Number Publication Date
TW201337958A TW201337958A (zh) 2013-09-16
TWI578334B true TWI578334B (zh) 2017-04-11

Family

ID=48905116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102104040A TWI578334B (zh) 2012-02-02 2013-02-01 糊膏狀組成物

Country Status (3)

Country Link
JP (1) JP6214400B2 (ja)
TW (1) TWI578334B (ja)
WO (1) WO2013115076A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140158192A1 (en) * 2012-12-06 2014-06-12 Michael Cudzinovic Seed layer for solar cell conductive contact
CN104821190B (zh) * 2015-04-07 2017-06-20 江苏正能电子科技有限公司 一种晶体硅太阳能电池背场铝浆及其制备方法
KR20180059474A (ko) 2015-09-24 2018-06-04 도요 알루미늄 가부시키가이샤 페이스트 조성물 및 실리콘 게르마늄 층의 형성 방법
JP6195597B2 (ja) * 2015-09-29 2017-09-13 東洋アルミニウム株式会社 ペースト組成物
JP6713747B2 (ja) * 2015-10-14 2020-06-24 京都エレックス株式会社 抵抗体ペースト組成物およびこれを用いた発熱抵抗体
JP6762848B2 (ja) * 2016-11-02 2020-09-30 東洋アルミニウム株式会社 ペースト組成物
CN110462845B (zh) * 2017-03-27 2023-01-13 东洋铝株式会社 太阳能电池用膏状组合物
JP7193393B2 (ja) * 2019-03-26 2022-12-20 東洋アルミニウム株式会社 太陽電池の製造方法
JP7303036B2 (ja) * 2019-06-21 2023-07-04 東洋アルミニウム株式会社 導電性ペースト及びTOPCon型太陽電池の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629680A (ja) * 1985-07-08 1987-01-17 Hitachi Ltd 太陽電池の製造方法
TW200905900A (en) * 2007-05-07 2009-02-01 Georgia Tech Res Inst Formation of high quality back contact with screen-printed local back surface field
TW200915581A (en) * 2007-08-29 2009-04-01 Ferro Corp Thick film pastes for fire through applications in solar cells
WO2010125728A1 (ja) * 2009-04-29 2010-11-04 三菱電機株式会社 太陽電池セルおよびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255285A (ja) * 1984-06-01 1985-12-16 Hitachi Ltd アルミニウム部品の接合構造と接合方法
JPH0773731A (ja) * 1993-09-06 1995-03-17 Dai Ichi Kogyo Seiyaku Co Ltd 厚膜導電性ペースト組成物
US5961853A (en) * 1993-11-26 1999-10-05 Ford Global Technologies, Inc. Weld/brazing of light metal alloys
JP2006261621A (ja) * 2005-02-21 2006-09-28 Osaka Univ 太陽電池およびその製造方法
JP2009182290A (ja) * 2008-02-01 2009-08-13 Mitsubishi Electric Corp 太陽電池とその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629680A (ja) * 1985-07-08 1987-01-17 Hitachi Ltd 太陽電池の製造方法
TW200905900A (en) * 2007-05-07 2009-02-01 Georgia Tech Res Inst Formation of high quality back contact with screen-printed local back surface field
TW200915581A (en) * 2007-08-29 2009-04-01 Ferro Corp Thick film pastes for fire through applications in solar cells
WO2010125728A1 (ja) * 2009-04-29 2010-11-04 三菱電機株式会社 太陽電池セルおよびその製造方法

Also Published As

Publication number Publication date
JPWO2013115076A1 (ja) 2015-05-11
JP6214400B2 (ja) 2017-10-18
WO2013115076A1 (ja) 2013-08-08
TW201337958A (zh) 2013-09-16

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