TWI574283B - Organic and inorganic mixed particles, conductive particles, conductive materials and connecting structures - Google Patents

Organic and inorganic mixed particles, conductive particles, conductive materials and connecting structures Download PDF

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Publication number
TWI574283B
TWI574283B TW102148524A TW102148524A TWI574283B TW I574283 B TWI574283 B TW I574283B TW 102148524 A TW102148524 A TW 102148524A TW 102148524 A TW102148524 A TW 102148524A TW I574283 B TWI574283 B TW I574283B
Authority
TW
Taiwan
Prior art keywords
organic
particles
conductive
inorganic hybrid
inorganic
Prior art date
Application number
TW102148524A
Other languages
English (en)
Chinese (zh)
Other versions
TW201430865A (zh
Inventor
Hiroshi Yamauchi
Hiroyuki Morita
Satoshi Haneda
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201430865A publication Critical patent/TW201430865A/zh
Application granted granted Critical
Publication of TWI574283B publication Critical patent/TWI574283B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13398—Spacer materials; Spacer properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Conductive Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Liquid Crystal (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Wire Bonding (AREA)
TW102148524A 2012-12-28 2013-12-26 Organic and inorganic mixed particles, conductive particles, conductive materials and connecting structures TWI574283B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287509 2012-12-28

Publications (2)

Publication Number Publication Date
TW201430865A TW201430865A (zh) 2014-08-01
TWI574283B true TWI574283B (zh) 2017-03-11

Family

ID=51021098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102148524A TWI574283B (zh) 2012-12-28 2013-12-26 Organic and inorganic mixed particles, conductive particles, conductive materials and connecting structures

Country Status (5)

Country Link
JP (1) JP5620608B1 (ja)
KR (1) KR102095290B1 (ja)
CN (1) CN104619754B (ja)
TW (1) TWI574283B (ja)
WO (1) WO2014104017A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6212380B2 (ja) * 2012-12-28 2017-10-11 積水化学工業株式会社 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体
JP6266973B2 (ja) * 2012-12-28 2018-01-24 積水化学工業株式会社 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体
CN105044994B (zh) * 2015-09-18 2018-06-15 京东方科技集团股份有限公司 封框胶、显示面板及显示装置
CN106125410B (zh) * 2016-06-28 2019-08-02 京东方科技集团股份有限公司 导电球及其制备方法、各向异性导电胶、显示装置
WO2018118880A1 (en) * 2016-12-21 2018-06-28 3M Innovative Properties Company Conductive particles, articles, and methods
CN106647051A (zh) * 2017-02-10 2017-05-10 京东方科技集团股份有限公司 隔垫物、其制备方法及封框胶和显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136891A (en) * 1996-03-06 2000-10-24 Rhodia Chimie Composite particles including an organic polymer and an oxide and/or hydroxide
US6454819B1 (en) * 1999-01-18 2002-09-24 Kabushiki Kaisha Toshiba Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
TW201222558A (en) * 2010-09-30 2012-06-01 Sekisui Chemical Co Ltd Conductive particles, anisotropic conductive material and connection structure
TW201239909A (en) * 2011-02-23 2012-10-01 Sekisui Chemical Co Ltd Conductive particle, conductive particle manufacturing method, anisotropic conductive material, and connective structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4163316B2 (ja) 1999-01-14 2008-10-08 株式会社日本触媒 有機質無機質複合体粒子、その製造方法およびその用途
JP4041236B2 (ja) * 1999-01-18 2008-01-30 株式会社東芝 半導体装置の製造に用いる化学機械研磨用複合粒子及びその製造方法並びにそれを用いる化学機械研磨方法
JP3524008B2 (ja) * 1999-01-20 2004-04-26 触媒化成工業株式会社 ポリオルガノシロキサン被覆弾性微粒子の製造方法および液晶表示装置
JP2001011503A (ja) 1999-06-25 2001-01-16 Catalysts & Chem Ind Co Ltd 新規な導電性微粒子、および該微粒子の用途
JP4022177B2 (ja) * 2002-06-19 2007-12-12 株式会社日本触媒 有機質無機質複合体微粒子およびその用途
JP4527495B2 (ja) * 2004-10-22 2010-08-18 株式会社日本触媒 重合体微粒子およびその製造方法、導電性微粒子
JP2006156068A (ja) * 2004-11-29 2006-06-15 Sanyo Chem Ind Ltd 導電性微粒子
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름
JP4860587B2 (ja) 2007-10-01 2012-01-25 日揮触媒化成株式会社 新規な導電性微粒子の製造方法および該微粒子の用途
JP2009091466A (ja) * 2007-10-09 2009-04-30 Nikko Rika Kk 球状コア／シェル型複合微粒子およびその製造方法
KR101309821B1 (ko) * 2010-12-31 2013-09-23 제일모직주식회사 이방 전도성 필름 조성물
KR20150072381A (ko) * 2012-10-15 2015-06-29 세키스이가가쿠 고교가부시키가이샤 유기 무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체
WO2014115468A1 (ja) * 2013-01-24 2014-07-31 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
CN104684970B (zh) * 2013-01-24 2018-01-30 积水化学工业株式会社 基材粒子、导电性粒子、导电材料及连接结构体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136891A (en) * 1996-03-06 2000-10-24 Rhodia Chimie Composite particles including an organic polymer and an oxide and/or hydroxide
US6454819B1 (en) * 1999-01-18 2002-09-24 Kabushiki Kaisha Toshiba Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
TW201222558A (en) * 2010-09-30 2012-06-01 Sekisui Chemical Co Ltd Conductive particles, anisotropic conductive material and connection structure
TW201239909A (en) * 2011-02-23 2012-10-01 Sekisui Chemical Co Ltd Conductive particle, conductive particle manufacturing method, anisotropic conductive material, and connective structure

Also Published As

Publication number Publication date
JPWO2014104017A1 (ja) 2017-01-12
KR20150100601A (ko) 2015-09-02
TW201430865A (zh) 2014-08-01
CN104619754B (zh) 2017-06-09
KR102095290B1 (ko) 2020-03-31
CN104619754A (zh) 2015-05-13
JP5620608B1 (ja) 2014-11-05
WO2014104017A1 (ja) 2014-07-03

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