TWI573990B - Measuring device and control method - Google Patents

Description

Measuring device and control method

The present invention relates to an apparatus for measuring light emitted from a light-emitting element.

A method of illuminating a light-emitting element of an inspection object and inspecting the light-emitting element based on a detection signal of a photon is known. For example, Patent Document 1 discloses a configuration in which a light shielding portion for covering a light-emitting element to be inspected when the light-receiving element is inspected is provided.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-101728

When the light-shielding portion is moved to a position suitable for light-shielding at the time of measurement of the light-emitting element, when the position of the light-shielding portion is shifted due to an error or the like, a gap of light leakage may occur, or the light-shielding portion may be in contact with the substrate or the like. It may cause damage to the substrate.

The present invention has been made in order to solve the above problems, and a main object thereof is to provide a measuring apparatus capable of easily performing position adjustment of a light shielding portion at the time of measurement.

The invention described in the claims is a measuring apparatus comprising: a table for mounting a plurality of light-emitting elements adjacent to a ground; and a probe for supplying electric power to one of the plurality of light-emitting elements; The light-emitting element emits light; the light-shielding portion surrounds the light-emitting element when the probe supplies electric power to the one light-emitting element; the moving portion moves the light-shielding portion in the vertical direction; and the elastic portion is provided on the movement The moving portion presses the light shielding portion in a direction in which the elastic portion contracts in a state between the portion and the light shielding portion before the probe supplies electric power to the one light emitting element.

The invention described in the claims is a control method which is executed by a measuring device, comprising: a table for mounting a plurality of light-emitting elements adjacent to each other; and a probe for the plurality of light-emitting elements One of the light-emitting elements supplies electric power for causing the light-emitting element to emit light; and the light-shielding portion surrounds the light-emitting element when the probe supplies electric power to the one light-emitting element; and the moving portion moves the light-shielding portion in the vertical direction; And an elastic portion provided between the moving portion and the light blocking portion, comprising: a position adjustment step of moving the light shielding portion toward the elastic portion by the moving portion before the probe supplies electric power to the one light emitting element Pressing in the direction of contraction.

1‧‧‧Support

2‧‧‧Light Guide

3‧‧‧ probe

4‧‧‧Workbench

5 (5A, 5B, 5C) ‧‧‧LED chips

6‧‧‧Lighting Department

7 (7A, 7B) ‧ ‧ spring

8‧‧‧ reflector

9‧‧·Integral ball (light sensor)

10‧‧‧ hole

11‧‧‧Protruding

15‧‧‧Control Department

16‧‧‧Measurement Control Department

17‧‧‧ Spectroscope

18‧‧‧ gap

20‧‧‧ Carding Department

21‧‧‧Light Road Department

22‧‧‧above

30‧‧‧ probe stylus

50‧‧‧Substrate

51‧‧‧ electrodes

52‧‧‧LED

60 (60A, 60B) ‧ ‧ gap

61‧‧‧Slots

62A, 62B‧‧‧ recess

63‧‧‧Light Road Department

64‧‧‧above

65‧‧‧Protruding

66‧‧‧ below

100‧‧‧Measurement device

A1‧‧‧Width

W2‧‧‧Width

Fig. 1 shows a schematic configuration of a measuring device.

2 is a side view showing an LED chip.

Fig. 3 is a plan view showing a light shielding portion.

4(A) and 4(B) are cross-sectional views showing the light shielding portion.

5(A) to (C) show the transition of the measuring device when the test needle of the probe is touched to the electrode for measurement.

Fig. 6 is an enlarged view of the measurement target wafer and the adjacent wafer at the time of inspection of the configuration of the modification.

FIG. 7 is an enlarged view of the measurement target wafer and the adjacent wafer at the time of inspection of the configuration of the modification.

According to a preferred embodiment of the present invention, the measuring apparatus includes: a table on which a plurality of light-emitting elements are placed adjacent to each other; and a probe that supplies power to one of the plurality of light-emitting elements to enable the The light-emitting element emits light; the light-shielding portion surrounds the light-emitting element when the probe supplies electric power to the one light-emitting element; the moving portion moves the light-shielding portion in the vertical direction; and the elastic portion is provided on the moving portion and the Before the probes supply electric power to the one light-emitting element, the moving portion presses the light-shielding portion in a direction in which the elastic portion contracts.

The measuring device includes a table, a probe, a light blocking portion, a moving portion, and an elastic portion. A plurality of light-emitting elements are placed adjacent to the ground on the workbench. The probe system supplies electric power to one of the plurality of light-emitting elements to cause the light-emitting element to emit light. The light shielding unit surrounds the light emitting element when the probe supplies electric power to the light emitting element to be measured. Here, the term "around the light-emitting element" means a case in which the entire light-emitting element is not limited, and also includes a portion (for example, the upper surface) surrounding the light-emitting element. The moving portion moves the light shielding portion in the vertical direction. The elastic portion is provided between the moving portion and the light blocking portion. Further, before the probe supplies electric power to the light-emitting element to be measured, the moving portion presses the light-shielding portion in a direction in which the elastic portion contracts. According to this aspect, the measuring device can make the light shielding portion The ground is moved to the position of the light-emitting element surrounding the measurement target, so that leakage of light from the light-emitting element of the measurement target to other light-emitting elements can be appropriately suppressed.

Here, the effect of the above-described measuring device having a light shielding portion will be additionally described. For example, in the case where an analog white LED which is composed of a blue LED and a phosphor and which emits white light together with the yellow color of the phosphor and the blue color of the LED is used as the light-emitting element, the LED leaking from the LED to be measured When the colored light is irradiated to the adjacent LED, the phosphor of the adjacent LED emits yellow light. As a result, it is impossible to accurately measure the optical characteristics of the LED to be measured. In order to accurately measure the optical characteristics, it is necessary to suppress the blue color of the measurement target LED so that the blue color of the measurement target LED does not reach the adjacent LED. Further, when the phosphor of the adjacent LED has light, it is necessary to suppress the light emission so that the light does not enter the optical measurement system of the measurement target LED. In view of the above circumstances, the measuring device of the present invention has a light shielding portion for appropriately performing such suppression.

In one aspect of the measuring device, the one light-emitting element and the corresponding electrode are disposed on the same surface of the substrate, and the light-shielding portion has a hole for allowing light emitted from the one light-emitting element to pass through, and is connected to In the notch of the hole, the probe passes through the notch and exposes the needle tip to the hole, and the movement portion moves in the vertical direction, and the notch is formed so as to be pressed into the light-shielding direction by the direction in which the elastic portion contracts. When the relative position of the probe and the light shielding portion is changed, the light shielding portion is not brought into contact with the probe. According to this aspect, the measuring device can reliably move the light shielding portion to the position of the light-emitting element surrounding the measurement target while the probe needle is touched to the light-emitting element to be measured. In this case, it is preferable that the probe is designed to be bendable (having flexibility) in accordance with the holding mechanism, and the material is selected accordingly.

In one aspect of the measuring device, the one light-emitting element and the corresponding electrode are disposed on different surfaces of the substrate, and the light-shielding portion has a hole for passing light emitted from the one light-emitting element, and the probe system is The electrode is in contact with the electrode from the opposite side of the hole with respect to the substrate. According to this aspect, the measuring device can reliably move the light shielding portion to the position of the light-emitting element surrounding the measurement target while the probe needle is touched to the light-emitting element to be measured.

In another aspect of the measuring device, when the probe supplies electric power to the one light-emitting element, the light-shielding portion is in contact with an upper surface of the light-emitting element adjacent to the one light-emitting element. According to this aspect, the upper surface of the adjacent light-emitting elements can be shielded from light, and the incidence of light toward the adjacent light-emitting elements can be appropriately reduced. Further, this aspect can be suitably utilized even in the case where the light-emitting elements are arranged without a gap.

In still another aspect of the measuring apparatus, the moving portion is provided with an optical path for allowing the light to pass in the direction of the light receiving element, and the optical path is provided with a shape that is tapered toward the one light emitting element. Reflective plate. According to this aspect, high-intensity light can be made to reach the photoreceptor, and the measurement accuracy can be improved. The shape in which the tip is tapered is a case where a reflecting member that reflects the emitted light and is guided toward the light receiving means is disposed between the light emitting element and the light receiving element (light receiving means), and the inner surface thereof is illuminated. The central axis serves as a rotating body of the shaft, and the inner surface thereof is formed to continuously change such that the inner diameter thereof is smaller on the side of the light-emitting element and the inner diameter thereof becomes larger as it approaches the photoreceptor.

In still another aspect of the measuring device, the light shielding portion is white. Thereby, the light shielding portion can reflect the light emitted from the light-emitting element to be measured by the high reflectance, thereby improving the measurement accuracy.

In another aspect of the above measuring device, the plurality of light emitting elements, It is an analog white LED which is composed of a blue LED and a phosphor, and which emits white light together with the yellow color of the phosphor and the blue color of the blue LED. As described above, in order to accurately measure the optical characteristics, it is necessary to suppress the blue color of the measurement target LED so that the blue color of the measurement target LED does not reach the adjacent LED. Further, when the phosphor of the adjacent LED has light, it is necessary to suppress the light emission so that the light does not enter the optical measurement system of the measurement target LED. The light shielding portion of the present invention is configured to appropriately perform such suppression. In other words, in order to accurately measure the optical characteristics, it is necessary to suppress so that the blue color of the measurement target LED does not reach the adjacent LED. Further, when the phosphor of the adjacent LED has light, it is necessary to suppress the light emission so that the light does not enter the optical measurement system of the measurement target LED. The light-shielding portion of the present invention is configured to perform such two suppressions as appropriate. Since the two suppressions are performed, accurate optical characteristics can be measured even if the incidence of the adjacent LEDs is blocked and the light from the adjacent LEDs is blocked. Therefore, in this aspect, since the measuring device has the light shielding portion, the incidence of light toward the adjacent light-emitting elements can be appropriately reduced, and the measurement accuracy can be improved.

In a preferred embodiment of the present invention, a control method is performed by a measuring device comprising: a table for placing a plurality of light-emitting elements adjacent to a ground; and a probe for the plurality of light-emitting elements One of the light-emitting elements supplies electric power for causing the light-emitting element to emit light; and the light-shielding portion surrounds the light-emitting element when the probe supplies electric power to the one light-emitting element; and the moving portion moves the light-shielding portion in the vertical direction; And an elastic portion provided between the moving portion and the light shielding portion, wherein the control method includes: a position adjustment step of the first pair of light emitted by the probe Before the component supplies electric power, the light shielding portion is pressed in a direction in which the elastic portion is contracted by the moving portion. By performing this control method, the measuring device can reliably move the light-shielding portion to the position of the light-emitting element surrounding the measurement target, and appropriately suppress the light from leaking from the light-emitting element to be measured toward the other light-emitting element.

[Examples]

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[general composition]

Fig. 1 is a schematic configuration diagram of a measuring apparatus 100 of the present embodiment. The measuring device 100 shown in FIG. 1 is an apparatus for inspecting the optical characteristics of the LED chips 5 arranged on the stage 4, and mainly includes a supporting portion 1, a light guiding portion 2, a probe 3, a light blocking portion 6, and a spring 7. (7A, 7B), the reflector 8, the integrating sphere 9, the control unit 15, the measurement control unit 16, and the spectroscope 17. In addition, FIG. 2 is a side view of the LED chip 5. In the following description, the direction perpendicular to the table 4 is also referred to as "Z-axis direction", and the surface parallel to the table 4 is also referred to as "XY plane".

The support portion 1 supports the light guiding portion 2 and the light blocking portion 6. Specifically, a substantially cylindrical hole 10 is provided in a central portion of the support portion 1, and the light shielding portion 6 is fitted into the hole 10. In this case, the protruding portion 11 formed on the lower portion of the support portion 1 protrudes from the hole 10, and is supported by the end portion of the light-shielding portion 6 which is also protruded to support the light-shielding portion 6. Further, the light guiding portion 2 is fitted into the hole 10 of the support portion 1 from the upper surface of the support portion 1. In this case, the light guide portion 2 is fixed to the support portion 1 by the engagement portion 20 protruding from the outer side of the light guide portion 2 being engaged with the upper surface of the support portion 1. Further, the support portion 1 is provided with a notch 18 for inserting the probe 3 into the hole 10 from the outer side of the support portion 1 toward the support portion 1. The support unit 1 is movable integrally with the light guiding unit 2 in the Z-axis direction and the XY plane based on the control of the control unit 15 .

The light guiding unit 2 has an optical path portion 21 for allowing light emitted from the LED chip 5 to pass through the photo sensor 9. The optical path portion 21 is formed along the Z-axis direction. Further, a reflector 8 is provided along the wall surface of the light guiding portion 2 forming the optical path portion 21. The support unit 1 and the light guide unit 2 are examples of the “moving unit” of the present invention.

The probe 3 has a probe stylus 30 that causes the LED chip 5 to be energized by a needle contacting the electrode of the LED chip 5. The probe 3 is inserted into the notch 18 and the notch 60 from the outside of the support portion 1, and the probe contact pin 30 is exposed to the optical path portion 63 of the light shielding portion 6. Further, the probe 3 is designed to have a flexible structure and has a selected material. Further, the probe stylus 30 is bent in the direction of the table 4 in the optical path portion 63. By making it a bent structure, it is possible to increase the flexibility of the probe itself. When the Z-axis direction is set to 0 degrees, the angle of the bend should be 20 degrees ± 10 degrees, and the tip of the needle should be 70 degrees ± 10 degrees. The probe 3 is fixed to the support portion 1 and moves together with the support portion 1 and the light guide portion 2 in the Z-axis direction and the XY plane.

The table 4 is, for example, a circular table including a motor (not shown), and is movable in a plane parallel to the table 4 and in the vertical direction based on the control of the control unit 15. The LED chips 5 are arranged in a lattice shape at substantially equal intervals on a substantially circular table 4, and have a substrate 50, electrodes 51, and LEDs 52 as shown in FIG. In the example of FIG. 2, electrodes 51 and LEDs 52 are arranged on the upper surface of the substrate 50. The thickness of the electrode 51 is thinner than the thickness of the LED 52.

When the probe stylus 30 is touched on the electrode 51 of the LED chip 5 to be measured to measure the light emission of the LED 52, the light shielding portion 6 is shielded from the adjacent LED chip 5 by the periphery of the LED wafer 5 to be measured. . The light shielding portion 6 is a non-penetrating member such as a white resin having a high light reflectance. The light shielding portion 6 is fitted into the hole 10 of the support portion 1, and an optical path portion 63 which is a cylindrical hole is provided in the central portion in the Z-axis direction. this Further, a notch 60 for inserting the probe 3 is provided in the light shielding portion 6. As will be described later, the light shielding portion 6 is configured to be slidably movable to the lower surface of the light guiding portion 2 with respect to the support portion 1 when the pressing portion 6 is pressed in the direction of the table 4 (see the width A1). The structure of the light shielding portion 6 will be described in detail in one of the columns [configuration of the light shielding portion].

The springs 7 (7A, 7B) are present between the lower surface of the light guiding portion 2 and the upper surface 64 of the light shielding portion 6, and one end is fitted into the light guiding portion 2, and the other end is fitted into the light shielding portion 6. Further, the spring 7 expands and contracts according to the pressure in the Z-axis direction, and adjusts the distance between the lower surface of the light guiding portion 2 and the upper surface 64 of the light shielding portion 6 (see the width A1). The spring 7 has a strength that the LED wafer 5 is not damaged by the pressure when the light shielding portion 6 is pressed in the direction of the table 4 during measurement. Further, although only the springs 7A and 7B are illustrated in Fig. 1 in the spring 7, the number of the springs 7 may be three or more. In the present case, although not shown, four springs are provided in equal division (equal distribution). The spring 7 is an example of the "elastic portion" of the present invention.

When the load of the spring 7 is increased, when the light shielding portion 6 is pushed in the direction of the table 4, discomfort such as breakage of the LED 52 occurs. If the light shielding portion 6 is pressed after being weakened, it is not suitable for returning to the original position or the like. Therefore, the total number of springs x the load is preferably in the range of 30 g (0.3 N) f to 300 gf (3 N) with respect to the designed press-in amount. In this case, the press-in amount was set to 0.3 mm.

The reflector 8 reflects the light emitted from the LED chip 5 to cause the light to reach the integrating sphere 9. The reflector 8 has a conical shape in which the front end portion is cut, and the front end thereof is tapered toward the table 4. Further, the upper end of the reflector 8 is bent along the upper surface 22 of the light guiding portion 2 to lock the upper surface 22, and the lower end of the reflector 8 is restricted by the groove portion 61 formed in the light shielding portion 6. The reflector 8 is an example of the "reflector" of the present invention.

The measurement control unit 16 pairs the LEDs 52 via the probe stylus 30 of the probe 3 A voltage is applied to allow current to flow. Thereby, the LED 52 emits light.

The integrating sphere 9 receives the illumination of the LED chip 5. The integrating sphere 9 uses an optical fiber to direct a portion of the received light toward the beam splitter 17. The optical characteristics of the LED wafer 5 are measured by converting the light received by the spectroscope 17 into an electrical signal for each wavelength. In this case, the light emitted from the LED 52 is the sum of the light that directly reaches the integrating sphere 9 and the light that is reflected by the reflector 8 through the optical path portion 63 and reaches the integrating sphere 9.

[Composition of the shading section]

Next, the detailed configuration of the light shielding portion 6 will be specifically described with reference to Figs. 3 and 4 .

FIG. 3 is a plan view of the light shielding portion 6. In the example of FIG. 3, notches 60A and 60B for inserting the probe 3 into the optical path portion 63 from the outside of the light shielding portion 6 are provided on the upper surface 64 of the light shielding portion 6. In this case, the probe 3 passes through either of the notches 60A and 60B (the notch 60A in the present embodiment) or both, so that the needle tip is exposed to the optical path portion 63. Further, in plan view, the groove portion 61 is formed in a circular shape with the optical path portion 63 as a center, and the notches 60A, 60B are partially cut away. As described in the description of Fig. 1, the end portion of the cylindrical reflector 8 whose tip end is tapered is fitted into the groove portion 61 in a floating state. Further, as will be described later, a concave portion 62B for fitting one end of the spring 7B is provided on the upper surface of the light shielding portion 6.

4(A) is a cross-sectional view taken along line A-A showing the light shielding portion 6. As shown in FIG. 4(A), when the light shielding portion 6 is cut in a cross section that does not pass through the notch 60, the cut surface passes through the optical path portion 63 which is a passage provided at the center portion, and the groove portion which has a predetermined depth. 61. Here, the groove portion 61 is preferably designed to have a depth that satisfies the following condition, that is, even if the light shielding portion 6 is pressed in the direction toward the table 4 and slides on the Z axis with respect to the support portion 1, The lower end of the reflector 8 is brought into contact.

4(B) is a cross-sectional view showing the line B-B of the light shielding portion 6. As shown in FIG. 4(B), when the light shielding portion 6 is cut by the cross section of the notch 60A, the portion corresponding to the notch 60A becomes a cavity. Here, the notch 60A is designed to have a width sufficiently larger than the thickness of the inserted probe 3 in the Z-axis direction (for example, the width of the arrow A1 of FIG. 1), so that even if the light shielding portion 6 is directed toward the table 4 When the direction is pushed in with respect to the support portion 1 and slid on the Z axis, the probe 3 does not come into contact with the light shielding portion 6. Further, a recess 62A for inserting one end of the spring 7A is provided in the notch 60A. Similarly, a recess 62B for fitting one end of the spring 7B is provided at a position symmetrical with respect to the optical path portion 63 with respect to the concave portion 62A.

Further, in order to more accurately measure the optical measurement of the LED 52 to be measured, it is preferable to measure the light emission of the LED 52 more. Therefore, the light shielding portion 6 is made of a material having a reflectance of more than 70% in the visible light band. The material of the light shielding portion 6 is a material that has a high reflectance on the surface of the material and a small transmittance. The surface of the light shielding portion 6 is preferably white. The inner wall of the light path portion 63 of the light shielding portion 6 may be either regular reflection or diffuse reflection. Similarly to the reflector 8, the inner wall of the optical path portion 63 may be in a state where the front end is tapered, and the reflected light is guided to the measurement system as much as possible.

[Punching action of the shading section]

Next, the press-fitting operation of the light-shielding portion 6 performed when the probe stylus 30 is touched to the electrode 51 at the time of inspection of the LED wafer 5 will be described.

FIG. 5(A) shows the measuring device 100 in a case where the support portion 1 is moved in the direction of the table 4 and the support portion 1 is brought close to the table 4. Hereinafter, a case of performing inspection of the LED chip 5A (also referred to as "measurement target wafer") adjacent to the LED chips 5B and 5C will be described.

In this case, first, the control unit 15 supports the pair in the XY plane. The position of the portion 1 or the table 4 is adjusted so that the optical path portion 63 overlaps the LED wafer 5A to be measured on the XY plane, and then the support portion 1 is moved in the direction of the table 4. In the example of FIG. 5(A), the support portion 1 is brought close to the table 4, and the lower surface 66 of the light shielding portion 6 is in contact with the LED chips 5B and 5C adjacent to the measurement target wafer 5A (also referred to simply as "adjacent wafer"). ) The top of LED52.

5(B) shows a case where the support portion 1 is moved by a predetermined width "W2" from the state of FIG. 5(A) toward the table 4, and the probe stylus 30 is brought into the electrode 51 of the LED chip 5A. The measuring device 100. In addition, FIG. 5(C) is an enlarged view of the LED chips 5A to 5C in the state of FIG. 5(B).

In a state where the lower surface 66 of the light shielding portion 6 is in contact with the upper surface of the LEDs 52 adjacent to the wafers 5B and 5C, when the distance between the support portion 1 and the table 4 is reduced, the light shielding portion 6 is applied by the adjacent wafer 5B, 5C LED52 and push up the pressure. As a result, the light shielding portion 6 slides the width W2 upward with respect to the support portion 1. In this case, the spring 7 is stationary in a state of being contracted by the width W2. Further, it is preferable that the light shielding portion 6 is formed of a resin or the like, and a spring having a suitable strength is used as the spring 7 so that the contact of the lower surface 66 of the light shielding portion 6 toward the LED 52 adjacent to the wafer or press-in The light emitting surface of the LED 52 is not damaged.

In addition, in FIG. 5(B), since the probe stylus 30 is in contact with the electrode 51 of the measurement target wafer 5A, the LED 52 of the measurement target wafer 5A emits light. At this time, as shown in FIGS. 5(B) and (C), the light shielding portion 6 is in surface contact with the upper surface of the LEDs 52 of the adjacent wafers, so that the light of the LEDs 52 of the measurement target wafer 5A does not reach the upper surface of the LEDs 52 of the adjacent wafers, or Even if it arrives, the amount is very small. Thereby, the light shielding portion 6 can appropriately prevent the light emitted from the LED wafer 5A from being incident on the upper surface of the LEDs 52 of the adjacent wafers.

Further, the notch 60A has a width larger than the thickness of the probe 3 in the Z-axis direction, so that even if the light shielding portion 6 slides on the Z-axis with respect to the support portion 1, the probe stylus 30 is not in contact with the light shielding. The portion 6, and by bending the probe stylus 30 to the electrode 51 and being pressed in, causes the probe stylus 30 to bend and does not contact the reflector 8. Thereby, even if the light shielding portion 6 slides on the Z axis with respect to the support portion 1, the probe stylus 30 does not contact the light shielding portion 6, and does not affect the positional adjustment of the probe stylus 30. Further, in the state of FIG. 5(A) in which the light shielding portion 6 does not slide with respect to the support portion 1, the lower end of the reflector 8 fitted in the groove portion 61 is opposed to the groove even if it is pressed into the predetermined width W2. The bottom of the portion 61 floats. Thereby, even in the state shown in FIG. 5(B) which slides with respect to the support part 1 of the light-shielding part 6, the lower end of the reflector 8 does not contact the light-shielding part 6, and does not interfere with the movement of the light-shielding part 6.

Here, a supplementary explanation will be given of the effect of providing the light shielding portion 6.

In general, when the LED chip 5 is a white LED (analog white LED) including a phosphor, if the blue light emitted by the measurement target wafer is incident on the LED 52 of the adjacent wafer, the LED 52 of the adjacent wafer is fluorescent. The body absorbs the incident light and becomes yellow light. In this case, since the yellow light emitted from the LEDs 52 adjacent to the wafer is mixed and incident on the integrating sphere 9, the control unit 15 cannot perform accurate measurement on the wafer to be measured.

In view of the above, in the present embodiment, the measuring device 100 has the light shielding portion 6, and the upper surface of the LED 52 adjacent to the wafer and the lower surface of the light shielding portion 6 are provided in a state where the probe stylus 30 is touched to the LED 52 of the measurement target wafer. 66 face contact. Thereby, it is possible to appropriately suppress the light emitted from the wafer to be measured from being incident on the upper surface of the LED 52 adjacent to the wafer. Further, in the present embodiment, the light emitted from the measurement target wafer may be incident on the side surface of the LED 52 adjacent to the wafer, but the area of the side surface is shielded by the light shielding portion 6. The area above the LED 52 is comparable and can be ignored. As a result, according to the measuring apparatus 100 of the present embodiment, the measurement accuracy of the wafer to be measured can be appropriately increased. In addition, in the case where the upper surface of the LED 52 of the adjacent wafer is in surface contact with the lower surface 66 of the light shielding portion 6, even if the LED wafer 5 is arranged without any gap on the table 4, the light shielding of the LED 52 adjacent to the wafer can be achieved. . Further, according to the measuring apparatus 100 of the present embodiment, even when the phosphor of the LED 52 adjacent to the wafer emits light, the light-shielding portion 6 can suppress the optical measurement system in which the light-emitting portion is not mixed into the LED 52 of the measurement target wafer. As described above, the light shielding portion 6 of the present invention can suppress the light emitted from the wafer to be measured from entering the adjacent wafer, and can suppress the light from the adjacent wafer from entering the optical measurement system. Since the light-shielding portion 6 performs the above-described two suppressions at the same time, the measurement device 100 can perform correct optics even if the light is not completely incident on the wafer from the measurement wafer and the light from the adjacent wafer is mixed into the optical measurement system. Determination of characteristics.

Further, a plurality of springs 7 that are expandable and contractible are provided between the light shielding portion 6 and the light guiding portion 2, and the measuring device 100 is configured to adjust the relative relationship between the light shielding portion 2 and the support portion 1 and the light guiding portion 2 in the Z-axis direction. position. As a result, the measurement device 100 can contact the probe stylus 30 with the electrode 51 of the measurement target wafer in a state where the light-receiving portion 6 is pressed into contact with the upper surface of the LED 52 of the adjacent wafer. Further, when the support portion 1 is moved in the Z-axis direction after the measurement is completed and the support portion 1 is separated from the table 4, the light-shielding portion 6 slides downward with respect to the support portion 1 by the restoring force of the spring 7, and It is again stationary at a position in contact with the projection 11 of the support portion 1.

As described above, the measurement device 100 of the present embodiment includes the support portion 1, the light guide portion 2, the probe 3, the table 4, the light shielding portion 6, and the spring 7. A plurality of LED chips 5 are placed adjacent to the ground on the stage 4. The probe 3 supplies electric power to the measurement target wafer in the plurality of LED chips 5, and causes the LED 52 of the measurement target wafer. Glowing. When the probe 3 supplies electric power to the measurement target wafer, the light shielding portion 6 surrounds the measurement target wafer. The support portion 1 and the light guiding portion 2 move the light shielding portion 6 in the Z-axis direction. The spring 7 is provided between the light guiding portion 2 and the light shielding portion 6. Further, before the probe 3 supplies electric power to the measurement target wafer, the support portion 1 presses the light shielding portion 6 in the direction in which the spring 7 contracts. In this way, the measuring device 100 can reliably move the light shielding portion 6 toward the position around the measurement target wafer, and can appropriately suppress leakage of light from the measurement target wafer to the adjacent wafer.

[Modification]

Hereinafter, each modification suitable for the above embodiment will be described. Furthermore, each of these modifications can be applied to the above embodiment arbitrarily in combination.

(Modification 1)

The LED chip 5 shown in FIG. 2 is provided with electrodes 51 and LEDs 52 arranged in parallel on the substrate 50. Instead of this, the electrode 51 and the LED 52 may be formed on the front and back surfaces of the substrate 50.

Fig. 6 is an enlarged view showing a wafer to be measured and an adjacent wafer in the measurement of the present modification. In the example of FIG. 6, the electrode 51 is formed on the back surface of the substrate 50 of each LED wafer 5, and the probe contact 30 is in contact with the electrode 51 from below the LED wafer 5. In this case, for example, the table 4 (not shown) supports the LED chips 5 so that the electrodes 51 of the LED chips 5 are partially exposed.

In the example of FIG. 6, the probe 3 is disposed below the LED chip 5, and is guided from the LED wafer 5 to the electrode 51. Therefore, in this case, since the probe 3 does not pass through the inside of the light shielding portion 6, the light shielding portion 6 does not have the notch 60.

Further, at the time of measurement, the lower surface 66 of the light shielding portion 6 is between the LED 52 of the measurement target wafer and the LED 52 of the adjacent wafer, and is in contact with the upper surface of the substrate 50. In this case, the light path of the light emitted from the LED 52 of the target wafer is determined by the light shielding portion 6 The light path portion 63 is limited so that the light emitted from the LED 52 does not reach the LED 52 adjacent to the wafer. Therefore, in the present modification, the light shielding portion 6 can appropriately suppress the light emitted from the measurement target wafer 5A from being incident on the LEDs 52 adjacent to the wafer. Alternatively, instead of the above-described embodiment, the upper surface of the LED 52 adjacent to the wafer may be opposed to the lower surface 66 of the light shielding portion 6, and these portions may be brought into surface contact during measurement.

(Modification 2)

The light-shielding portion 6 to which the present invention is applicable is not limited to the contact with the upper surface of the LED 52 of the adjacent wafer when the measurement target wafer is measured.

FIG. 7 is an enlarged view showing the measurement target wafer and the adjacent wafer in the measurement of the present modification. In the example of Fig. 7, the light shielding portion 6 is provided with a projection portion 65 that surrounds the measurement target wafer during measurement. The protruding portion 65 protrudes from the lower surface 66 of the light shielding portion 6, and is formed at a position facing the gap between the measurement target wafer and the adjacent wafer. When the protrusion 65 is attached to the probe stylus 30, the gap between the measurement target wafer and the adjacent wafer is inserted, and the light emitted from the LED 52 of the measurement target wafer is blocked from the side surface of the LED 52 of the adjacent wafer. As described above, in the example of FIG. 6, since the light shielding portion 6 has the projection portion 65, the incidence of light from the LED 52 of the measurement target wafer toward the LED 52 adjacent to the wafer can be more appropriately shielded. In addition, in FIG. 6, the LED 52 is divided, and a gap is formed between the measurement target wafer and the adjacent wafer, but it is not limited to being divided. Instead of this, a plurality of LEDs 52 may be arranged on one substrate 50.

1‧‧‧Support

2‧‧‧Light Guide

3‧‧‧ probe

4‧‧‧Workbench

5‧‧‧LED chip

6‧‧‧Lighting Department

7 (7A, 7B) ‧ ‧ spring

8‧‧‧ reflector

9‧‧·Integral ball (light sensor)

10‧‧‧ hole

11‧‧‧Protruding

15‧‧‧Control Department

16‧‧‧Measurement Control Department

17‧‧‧ Spectroscope

18‧‧‧ gap

20‧‧‧ Carding Department

21‧‧‧Light Road Department

22‧‧‧above

30‧‧‧ probe stylus

60‧‧‧ gap

61‧‧‧Slots

63‧‧‧Light Road Department

100‧‧‧Measurement device

A1‧‧‧Width

Claims (8)

A measuring device comprising: a table for placing a plurality of light-emitting elements adjacent to a ground; and a probe for supplying power to one of the plurality of light-emitting elements for causing the light-emitting element to emit light; a light blocking portion that surrounds the light emitting element when the probe supplies electric power to the one light emitting element; a moving portion that moves the light blocking portion in a vertical direction; and an elastic portion that is provided between the moving portion and the light blocking portion Before the probe supplies electric power to the one light-emitting element, the moving portion presses the light-shielding portion in a direction in which the elastic portion contracts. The measuring device according to claim 1, wherein the one of the light-emitting elements and the corresponding electrode are disposed on the same surface of the substrate, and the light-shielding portion has a hole for passing light emitted from the one light-emitting element, and is connected to In the notch of the hole, the probe exposes the needle tip to the hole through the notch, and the movement portion moves in the vertical direction, and the notch is formed so as to be pressed into the direction of contracting the elastic portion. When the light shielding portion changes the relative position of the probe and the light shielding portion, the light shielding portion does not contact the probe. The measuring device according to claim 1, wherein the one light-emitting element and the corresponding electrode are provided on different surfaces of the substrate, and the light-shielding portion has a hole for passing light emitted from the one light-emitting element, the probe The structure is configured to be in contact with the opposite side of the hole from the substrate On the above electrodes. The measuring device according to any one of claims 1 to 3, wherein, when the probe supplies electric power to the one light-emitting element, the light-shielding portion is in contact with an upper surface of the light-emitting element adjacent to the one light-emitting element. The measuring device according to any one of claims 1 to 3, wherein the moving portion is provided with an optical path for passing the light toward the light receiving element, and the optical path is provided at the front end toward the one light emitting element. A reflective plate of a tapered shape. The measuring device according to any one of claims 1 to 3, wherein the light shielding portion is white. The measuring device according to any one of claims 1 to 3, wherein the plurality of light-emitting elements are composed of a blue LED and a phosphor, and the yellow color of the phosphor is combined with the blue color of the blue LED. An analog white LED that emits white light. A control method is provided by a measuring device, the measuring device comprising: a table for mounting a plurality of light-emitting elements adjacent to a ground; and a probe for supplying one of the plurality of light-emitting elements Electric power for causing the light-emitting element to emit light; the light-shielding portion surrounding the light-emitting element when the probe supplies electric power to the one light-emitting element; the moving portion moving the light-shielding portion in the vertical direction; and the elastic portion Between the moving portion and the light blocking portion; the control method is characterized by: a position adjustment step, before the probe supplies power to the one light-emitting element, The light shielding portion is pressed in a direction in which the elastic portion is contracted by the moving portion.