JP6082758B2 - Light intensity measuring device - Google Patents

Description

  The present invention relates to a light amount measuring device for a semiconductor light emitting element.

  The manufacturing process of a semiconductor light emitting device has a number of processes, and the amount of light emission is measured at the stage of a chip before the final product for quality assurance. This measurement is performed without affecting the characteristics of the element itself, and accurate measurement is required. In such a light quantity measurement step, an apparatus for measuring the light quantity of a semiconductor light emitting element is, for example, an optical characteristic measurement apparatus for LED chips disclosed in Patent Document 1.

  Patent Document 1 discloses a technique in which an LED chip is placed on a transparent plate via an adhesive sheet, and its optical characteristics are measured by optical detection means provided below the plate.

  Patent Document 2 discloses a technique in which light emitting elements that emit light from both the front and back surfaces are arranged on a transparent stage, and light detection means are provided on both the upper side and the lower side.

JP-A-2005-49131 JP 2007-19237 A

  However, in the technique of Patent Document 1, it is necessary to irradiate the reference light to a place where there is no LED chip in order to consider the influence on the optical characteristics of the adhesive sheet and the transparent plate, and the optical characteristics of the reference light are detected. Requires optical detection means. This complicates the device configuration.

  In Patent Document 2, although the amount of light from the light emitting element is detected by the upper light detection means and the lower detection means, it can be measured with high accuracy. However, in addition to the upper light detection means, the lower detection means is required, and the apparatus configuration is complicated. Become. In addition, the above-described conventional technique has a problem that a probe that applies a voltage via a terminal of a light emitting element such as an LED is brought into contact with the light emitting surface of the light emitting element perpendicularly or obliquely to the terminal. It was.

For example, when contacting the probe from the vertical direction, it is necessary to bring the photodetector close to measure the amount of light emitted from the light emitting surface with high accuracy, and more light must be measured. Therefore, there is a problem that it cannot be measured accurately. Further, in the technique of Patent Document 1, light emission occurs depending on the timing when the probe contacts the terminal and the difference in the pressing force between the plurality of probes, whether in the vertical direction or obliquely above the terminal. There is a problem that the amount of light emitted from the light emitting elements to be inspected cannot be measured efficiently because the elements are turned over, displaced, jumped, and rotated. Further, depending on the contact angle and the pressing force of the probe with respect to the terminal, there is a problem that the tip of the probe is stuck in the terminal and moves together with the light emitting element during the probe operation. There is also a problem that the tip of the probe is welded to the terminal when a voltage is applied, and the light emitting element moves together during the probe operation, thereby hindering efficient measurement.
This problem is likely to occur when the chip is fixed with a weak force. If a pressure-sensitive adhesive sheet having a strong adhesive force is used in order to avoid this, problems such as the chip being difficult to peel off from the pressure-sensitive adhesive sheet occur in the chip sorting step after the inspection.
Ideally, a method of measuring a large amount of light at a wide angle and simultaneously measuring the back surface is also preferable. Furthermore, since the tip is light and easily displaced, it is preferable to apply a load evenly from directly above and touch the stylus.

  The techniques of Patent Document 1 and Patent Document 2 have a complicated apparatus configuration, take time for measurement, and increase cost. In addition, these techniques are not capable of measuring the original characteristics of the device accurately and accurately because they are diffused or attenuated by the pressure-sensitive adhesive sheet in the measurement of light emission. For this reason, it is difficult to measure the light emission characteristics in a state close to the state mounted on the stem or package. Furthermore, inefficiency is caused by the arrangement position, shape, and operation of the probe. These problems can be solved by arranging a chip without using an adhesive sheet and measuring a larger amount of light by using a mechanism that prevents the chip from shifting when the stylus is used.

  The present invention has been made in view of the above problems, and an example of the object thereof is to provide a light quantity measuring device that can realize a highly accurate measurement close to a mounted state efficiently with a simple configuration. is there.

In order to solve such a problem, a light quantity measuring device according to the present invention is configured to contact a terminal on which a semiconductor light emitting element that emits light radially and a terminal of the semiconductor light emitting element and supply power. A probe that emits light from the semiconductor light-emitting element; and a light-receiving unit that receives light emitted from the semiconductor light-emitting element and measures the amount of light; A probe tip that is bent in a direction closer to the table than the probe body, on the tip side of the probe,
And a probe main body portion arranged substantially horizontally connected to the probe tip, and the probe moves in a direction approaching the table so that the probe contacts the terminal, and in the light receiving portion The measurement is performed in a state where the reaction force received by the probe from the terminal is constant with respect to the amount of movement of the probe toward the table .

It is explanatory drawing of the light emission condition of the semiconductor light-emitting element measured with the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is explanatory drawing about the light distribution intensity distribution of the semiconductor light-emitting device measured with the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is a light quantity measuring device concerning one embodiment of the present invention. It is explanatory drawing about the control and the measurement system of the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is a principal part enlarged view of the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is an enlarged view of the probe of the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is a figure which shows the operation | movement at the time of the electric power supply by the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is a figure which shows the operation | movement after the electric power supply by the light quantity measuring apparatus which concerns on one Embodiment of this invention. It is the light quantity measuring apparatus provided with the straight probe. It is the figure shown about the relationship between the load with respect to the terminal of the probe in the light quantity measuring device, and the pushing amount.

<Light emission status of light emitting diode>
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory diagram of a light emission state of a semiconductor light emitting element 101 measured by a light amount measuring apparatus according to an embodiment of the present invention. In the present embodiment, a light emitting diode (hereinafter referred to as “LED (Light Emitting Diode)”) is used as an example of a semiconductor light emitting element.

  As shown to Fig.1 (a), LED101 radiate | emits light radially from the light emission surface 101a. According to the light amount measuring apparatus according to the embodiment of the present invention, even an LED that emits light from both sides can be measured. However, for the sake of explanation, here, the light emitting surface 101a of the LED 101 is the upper surface of the LED 101. An example will be described in the state of being in the state. A normal line of the light emitting surface 101a of the LED 101 is referred to as a light emission central axis LCA.

  When one direction on a plane including the light emitting surface 101a is a reference axis (X axis), the counterclockwise angle from the X axis on the plane is φ. In addition, an angle formed with the light emission center axis LCA when φ is fixed is defined as θ. The intensity of light emitted from the LED 101 and emitted from the light emitting surface 101a varies depending on the angle θ from the light emission central axis LCA and the like.

  The amount of light is the value obtained by accumulating all the intensities of light in the range from 0 ° to 90 ° for θ values from 0 ° to 360 °, and also for the back side of LED 101, and adding both. is there. This light quantity makes it possible to inspect whether the LED 101 is appropriate for various uses.

  The intensity of the light emitted radially from the LED 101 has different values for each θ and φ. In FIG. 1B, the light intensity is visually represented. In FIG. 1B, the intersection of the X axis and the Y axis represents θ = 0 °. Each point on the circle represents the position of each φ at θ = 90 °. FIG. 1C is a cross-sectional view at a position where the value of φ is constant.

  Here, the light intensity at the same distance from the LED 101 and at the position of the angle θ from the light emission center axis LCA is defined as the light distribution intensity E (θ). This light distribution intensity E (θ) corresponding to each θ is illustrated as a light distribution intensity distribution.

  In the description of FIG. 1, it is assumed that the LED 101 can be considered as a point by measuring at a position sufficiently far from the LED 101. This can be assumed because the LED 101 is usually very small compared to a photodetector that detects the emitted light. The same applies to the description after FIG. 2 unless otherwise specified.

  FIG. 2 is an explanatory diagram of the light distribution intensity distribution of the semiconductor light emitting element measured by the light amount measuring apparatus according to the embodiment of the present invention.

  FIG. 2A is a cross-sectional view at a position where the value of φ is constant, as in FIG. As shown in FIG. 2A, the light distribution intensity E (θ) is the intensity of light at each θ at a constant φ angle at a position where the distance r from the LED 101 is constant. The LED 101 usually has a different light distribution intensity distribution for each LED 101 due to a manufacturing error or the like. As the light distribution intensity distribution of the different LEDs 101, there may be a cosine type as shown in FIG. 2B, a donut type as shown in FIG.

  The LED 101 whose light distribution intensity distribution is a cos type or donut type is merely an example, and is not intended to limit the LED 101 having these two characteristics to a measurement target. The normal LED 101 often has a characteristic between a cos type having a peak intensity at θ = 0 ° and a donut type having a peak intensity near θ = 30 °. That is, it is known that the normal LED 101 to be inspected has a peak intensity in the range of θ of 0 ° to 30 ° in most cases.

<About the light quantity measuring device>
Next, the configuration of the light quantity measuring apparatus according to an embodiment of the present invention will be described with reference to FIG. FIG. 3 is a light amount measuring apparatus according to an embodiment of the present invention.

  The light quantity measuring apparatus 1 is an apparatus that can simultaneously measure the light emission quantity and wavelength of the LED 101. The light quantity measuring device 1 includes a table 10, a probe 20, a photodetector 30, and a manipulator section that allows the probe 20 described later to move in a direction that is relatively close to and away from the table 10.

  The probe 20 includes a probe tip portion 21 a, a probe main body portion 21, and a probe holding portion 22. A probe tip 21a bent in a direction closer to the table 10 than the probe main body 21 and a probe main body 21 arranged substantially horizontally connected to the probe tip 21a are provided at the tip of the probe 20. Have. Further, the probe main body portion 21 of the probe 20 is almost parallel to the upper surface of the table 10, i.e., almost horizontal, and is easily bent. Therefore, the probe 20 has flexibility in the vertical direction. The probe 20 has a probe holding portion 22 on the member side that holds the probe 20, and the probe holding portion 22 is bent in a direction away from the table with respect to the probe main body portion 21. That is, in the probe holding unit 22, the angle formed by the horizontal plane of the table 10 and the extension line of the probe holding unit 22 is larger than the angle formed by the horizontal plane of the table 10 and the extension line of the probe main body 21. The probe holding unit 22 is further connected to a manipulator unit that adjusts the probe height.

  In addition, the probe which has a weakness in a part of probe, and has flexibility as a whole probe may be used. Specifically, for example, a part of the probe main body part is formed thin, or a part, for example, a part close to the holding part is formed of a flexible material different from the probe main body part 21. Also good.

  The manipulator unit is connected to the stage 40 provided in parallel to the table 10, the screw unit 41 provided in a direction perpendicular to the stage 40 and changing the height of the stage 40 up and down, and the probe holding unit 22. A probe fixing portion 42 that performs contact, a touch height sensor 43 that detects a height according to a contact state between a contact 42 a provided on the probe fixing portion 42 and a contact 40 a provided on the stage 40, and the probe fixing portion 42 and the stage 40. And a spring 44 for making the probe 20 flexible. By controlling the probe fixing portion 42 by adjusting the spring 44, the height of the probe 20 is strictly controlled.

  The table 10 is a measurement sample stage having a plane on which the LED 101 to be inspected is placed, and is set substantially horizontally. The plane on which the LED 101 of the table 10 is placed has a high reflectivity characteristic and forms a regular reflection surface. Thereby, the light emitted from the back surface of the LED 101 can also be measured by the photodetector 30 which is a light receiving unit disposed on the top surface of the LED 101. Note that the measurement by the photodetector 30 is performed in a region where the reaction force received by the probe 20 from the terminal 102 with respect to the amount of movement of the probe 20 toward the table 10 is saturated. Since the photodetector 30 is provided so that the probe 20 contacts from the side surface side of the LED 101 as described above, the photodetector 30 is likely to be close to the light emitting surface 101 a of the LED 101.

  The plane on which the LED 101 is placed on the table 10 and the LED 101 placed thereon are substantially parallel to each other. The table 10 may be composed of a plurality of parts as well as a single part.

  The table 10 includes, for example, a flat table formed of a material such as glass, metal, resin, ceramic material, sapphire, crystal, fused silica glass, and hard glass, and a reflection plane of a regular reflection surface on the surface of the photodetector 30. And a reflector. The regular reflection surface of the reflection plate may be, for example, a metal mirror finish, or may be formed of a dielectric multilayer film. The LED 101 is preferably placed directly on the regular reflection surface of the reflector. However, as a protection for avoiding scratches on the regular reflection surface, a thin and transparent protective film may be provided on the regular reflection surface, or a transparent glass of about 1 mm may be sandwiched between the LEDs 101.

  In addition, it is possible to use the member which has various reflectance characteristics as a reflecting plate of the table 10. FIG. Examples include members such as an Ag reflector (reflectance 98%), a MIRO (registered trademark) reflector (reflectivity 95%), an Al reflector (reflectance 80%), and a dielectric multilayer mirror. When the reflecting plate is formed of a member having high reflectance characteristics (preferably 95% or more and less than 100%), the light emitted from the LED 101 can be received by the photodetector 30 without leakage.

  The reflection plate includes a plurality of types having different materials and reflectivities, and can be changed as appropriate. The user can appropriately select and replace the type of the reflector depending on the mounting form of the LED that serves as the inspection standard of the inspection process. Specifically, the user can select and convert the type of the reflector to one having a reflectance characteristic that is the same as or substantially equivalent to the reflectance of the mounted object on which the LED serving as the inspection standard is mounted. .

  The probe 20 supplies power to the LED 101 to cause the LED 101 to emit light. The probe tip 21 a contacts the terminal of the light emitting surface 101 a of the LED 101. When measuring the optical characteristics (light quantity and wavelength) of the LED 101, the probe 20 contacts the terminal (electrode) of the LED 101 and supplies power. Moreover, the probe 20 is connected to an electric characteristic meter side portion 50 of the light quantity measuring device 1 described later, and can also measure the electric characteristics of the LED 101 at the same time.

  When the probe 20 is brought into contact with the LED 101, the probe 20 may be moved while the table 10 and the LED 101 are fixed. Conversely, the table 10 and the LED 101 may be moved while the probe 20 is fixed. In the present embodiment, an example in which the probe 20 is moved while the table 10 and the LED 101 are fixed will be described.

  Light emitted from the LED 101 is received by the photodetector 30. The light emitted from the back surface of the LED 101 is specularly reflected by the surface of the reflecting plate of the table 10 and proceeds to the photodetector 30 side. In particular, since the reflecting plate of the table 10 is formed in a substantially uniform flat plate shape, the light emitted from the LED 101 can travel to the photodetector 30 side without leakage. As described above, not only from the front surface of the LED 101 but also light emitted from the back surface has high reflectivity characteristics and can be received by the photodetector 30 by reflection from the plane of the table 10 constituting the regular reflection surface. Measurement accuracy can be improved. In addition, since the measurement can be performed with one photodetector 30, the apparatus configuration can be simplified.

  FIG. 4 is an explanatory diagram of a control / measurement system of the light amount measuring apparatus according to the embodiment of the present invention. The light quantity measuring device 1 includes at least a table 10, a probe 20, a photodetector 30, an electric characteristic meter side unit 50, a calculation unit 60, and an output unit 70. The photodetector 30 receives the light emitted by the light emission of the LED 101, and generates an analog signal according to the amount obtained by integrating all the intensities of the received light.

  The photodetector 30 further outputs the generated analog signal to an amplifier (AMP) 31. This analog signal corresponds to the light quantity information of the received light. The photodetector 30 can also measure the light distribution intensity distribution integrated in the φ direction from the intensity of received light for each θ. The amplifier 31 performs amplification and AD conversion on the analog signal output from the photodetector 30, converts the analog signal into a voltage value that can be detected by the calculation unit, and outputs the voltage value to the calculation unit.

  Next, the wavelength measuring unit 80 will be described. The wavelength measuring unit 80 includes at least a light guide unit 81, an optical fiber 82, and a spectrometer 83.

  The light guide unit 81 has an incident surface that receives light emitted from the LED 101 and allows light to enter the light guide unit 81. Light incident from the incident surface is guided substantially parallel to the longitudinal direction of the light guide unit 81. The light guide unit 81 is disposed on the outermost peripheral line K of light received by the photodetector 30. The light guide unit 81 is held at an equal distance from the LED 101 to be measured. The light guide unit 81 is held so as to be rotatable in the angle directions of θ and φ. In any case, the light guide unit 81 is held at a position where the light reception by the photodetector 30 is not affected. The light guide unit 81 guides light incident from the incident surface of the light guide unit 81 to the spectroscope 83 via the optical fiber 82. The spectroscope 83 measures the wavelength and intensity (including the light distribution intensity) of the light guided by the light guide unit 81, and outputs it to the calculation unit 60.

  The light quantity measuring device 1 can simultaneously measure the light quantity up to a predetermined angle and the wavelength at the predetermined angle. For this reason, the light quantity measuring apparatus 1 can perform each measurement of the LED 101 continuously and at high speed.

  Next, the electrical characteristic meter side unit 50 will be described. The electrical property meter side unit 50 includes at least an HV unit 51, an ESD unit 52, a switching unit 53, and a positioning unit 54.

  The positioning unit 54 positions and fixes the probe 20. Specifically, if the positioning unit 54 is of a type in which the table 10 moves, it has a function of holding the position of the probe tip 21a at a fixed position. On the other hand, if the positioning unit 54 is of a type in which the probe 20 moves, the position of the probe tip 21a is moved to a predetermined position on the table 10 on which the LED 101 is placed, and then held at that position. It has a function. In this embodiment, the manipulator unit functions as the positioning unit 54.

  The HV unit 51 has a role of detecting various electrical characteristics of the LED 101 with respect to the rated voltage by applying the rated voltage. Normally, the photodetector 30 measures the light emitted from the LED 101 in a state where a voltage is applied from the HV unit 51. Various characteristic information detected by the HV unit 51 is output to the calculation unit 60.

  The ESD unit 52 is a unit that inspects whether or not the LED 101 is electrostatically discharged by applying a large voltage to the LED 101 for a moment to cause electrostatic discharge. The electrostatic breakdown information detected by the ESD unit 52 is output to the calculation unit 60.

  The switching unit 53 performs switching between the HV unit 51 and the ESD unit 52. The voltage applied to the LED 101 via the probe 20 is changed by the switching unit 53. And by this change, the inspection item of LED101 is each changed to the detection of the various characteristics in a rated voltage, or the presence or absence of an electrostatic breakdown.

  The calculation unit 60 includes information on the amount of received light and light distribution intensity output by the amplifier 31, information on the wavelength and light distribution intensity of light from the spectroscope 83, various electrical characteristic information detected by the HV unit 51, and the ESD unit 52 Receives input of detected electrostatic breakdown information. The calculation unit 60 performs classification and analysis of various characteristics of the LED 101 from these inputs. After the analysis of various characteristics, the calculation unit 60 outputs the analysis results from the output unit 70 as necessary, image output, information output, and the like.

  Next, it demonstrates using the partially expanded view of the light quantity measuring apparatus which concerns on this embodiment. FIG. 5 is an enlarged view of a main part of the light amount measuring apparatus according to the embodiment of the present invention. FIG. 6 is an enlarged view of the probe of the light amount measuring apparatus according to the embodiment of the present invention.

  The LED 101 is placed on the plane of the table 10 having a high reflectance characteristic and constituting a regular reflection surface. At least two terminals 102 are formed on the LED 101. The probe tip 21 a of the probe 20 is in contact with the terminal 102. The probe tip 21 a is bent in a direction closer to the table 10 than the probe main body 21. The probe main body 21 further has a probe holding part 22 on the member side holding the probe 20, and the probe holding part 22 is bent in a direction away from the table with respect to the probe main body 21.

  Next, the operation at the time of power supply by the light amount measuring apparatus according to the present embodiment will be described. FIG. 7 is a diagram illustrating an operation at the time of power supply by the light amount measurement apparatus according to the embodiment of the present invention.

  The probe 20 approaches the LED 101 placed on the plane of the hard table 10 (A to B in FIG. 7). The probe 20 is controlled by the positioning unit 54 described above, and the probe tip 21 a of the probe 20 approaches the terminal 102 of the LED 101. Since the terminal 102 is very small and the LED 101 is thin and the LED 101 is light, the height of the probe tip 21a is strictly set for the LED 101 that is not fixed on the table without using an adhesive sheet or the like. Need to control. If the height of the probe tip 21a is not strictly controlled, the table 10 may be hard due to the timing when the left and right probes 20 contact the terminals and the difference in pressing force between the left and right probes. It turns, shifts, jumps and rotates.

  Therefore, in the present embodiment, a plurality of probes are provided, and a contact position adjustment unit that adjusts the amount of displacement of the height positions of the tips of the probes that come into contact with the LEDs 101 to be included in a predetermined range ( (See FIG. 3). The contact position adjusting unit includes a touch height sensor 43 that detects the height according to a contact state between the contact 42 a provided on the probe fixing unit 42 and the contact 40 a provided on the stage 40, and the probe fixing unit 42 and the stage 40. The spring 44 is used for minute height adjustment and for making the probe 20 flexible. Strict control of the height of the probe tip 21a is performed by this contact position adjustment unit. Specifically, strict control of the height of the probe tip 21 a is realized by the detection signal from the touch height sensor 43 and the control of the spring 44. Thereby, the timing and pressing force at which a plurality of probes contact the LED can also be controlled.

  As described above, as shown in FIG. 7B, the probe tip 21 a of the probe 20 contacts the terminal 102 of the LED 101. In this state, power is supplied and the LED 101 emits light. FIG. 7C is a view of the state of FIG. 7B as viewed from above. The two terminals 102 are provided at positions that are separated from each other by the left and right sides of the LED 101 and are also separated in the depth direction. As a result, the probe tip 21a of the probe 20 is difficult to contact the mutual terminals 102.

  Next, the operation after power supply by the light quantity measuring apparatus according to the present embodiment will be described. FIG. 8 is a diagram illustrating an operation after power supply by the light amount measurement apparatus according to the embodiment of the present invention.

  FIG. 8A shows a state in which the probe tip 21a of the probe 20 is in contact with the LED 101 placed on the plane of the table 10 and the supply of electric power is finished. Here, depending on the contact angle and the pressing force of the probe 20 with respect to the terminal 102, the probe tip 21a may be stuck in the terminal 102, or the probe tip 21a may be welded to the terminal 102 when power is supplied. In such a case, when the probe 20 is operated, the LED 101 moves together, and the measurement efficiency decreases.

  Therefore, the probe 20 comes into contact with the LED 101 to supply power, and after the measurement, further pressing operation is performed before the probe 20 is separated from the LED 101. As a result, the probe tip 21a slides on the surface of the terminal 102 and there is no welded portion, and the pierced portion is easily removed by the pressing operation. Accordingly, the probe 20 can be completely separated from the LED 101.

  FIG. 8B shows the pressing operation. By performing the operation of pushing the probe 20, the probe tip 21 a is in contact with the terminal 102 due to the flexibility of the probe 20 or the flexibility of the probe main body 21 and the probe tip 21 a. It moves inward of the LED 101 by Δx.

  FIG. 8C shows the LED 101 as viewed from above after the pressing operation. As shown here, a small trace of the portion where the probe tip 21a is stuck or the portion where the probe tip 21a is welded to the terminal 102 spreads inward of the LED 101 by the pressing operation. As a result, the welded portion disappears, and the pierced portion is easily detached by the pressing operation.

  Therefore, as shown in FIG. 8D, the probe 20 can be completely separated from the LED 101.

  Next, the relationship between the load on the probe terminal and the push-in amount in the light amount measuring apparatus according to the present embodiment will be described. FIG. 9 shows a light quantity measuring device provided with a straight probe. FIG. 10 is a diagram showing the relationship between the load on the probe terminal and the push-in amount in the light amount measuring apparatus.

  FIG. 9 shows a light quantity measuring device in which the probe 20 is replaced with a straight probe 25. The same components as those in FIG. 3 are denoted by the same reference numerals, and description thereof is omitted. A state in which the straight probe 25 is in contact with the terminal 102 of the LED 101 obliquely from above with respect to the LED 101 is shown.

  When the straight probe 25 as shown in FIG. 9 is used, as shown in FIG. 10, the weight (gf) increases linearly according to the pushing amount. On the other hand, when the probe tip 21a is bent as in the present embodiment, and the probe main body 21 is in a state of being nearly horizontal, the probe 20 is flexible and flexible. That is, the weight, that is, the reaction force received by the probe 20 from the terminal 102, is saturated with respect to the movement amount of the probe 20 moved toward the table 10. In this saturated region, the probe 20 is brought into contact with the terminal 102. In the embodiment, the pressing amount from the stylus is 50 μm, and the load is in contact in a saturated region of about 5 gf. By supplying power in this state, the deformation of the terminal 102 can be suppressed and the weight can be minimized. As a result, the probe tip 21a can be prevented from being stuck and measurement can be performed efficiently. When removing from the chip, a further 50 μm push-in operation is performed, so that it can be completely released without causing a positional shift and even if there is welding that occurs during power supply. The maximum load at the time of removal was 5.5 gf or less.

DESCRIPTION OF SYMBOLS 1 Light quantity measuring apparatus 10 Table 20 Probe 21 Probe main-body part 21a Probe tip part 22 Probe holding part 25 Straight probe 30 Photo detector 31 Amplifier 40 Stage 41 Screw part 42 Probe fixing part 43 Touch height sensor 44 Spring 50 Electrical characteristic meter side part 60 Calculation Unit 70 output unit 80 wavelength measuring unit 101 LED
101a Light emitting surface 102 Terminal

Claims (7)

A table on which semiconductor light-emitting elements that emit light radially are placed;
A probe that is in contact with a terminal of the semiconductor light emitting element and supplies power to cause the semiconductor light emitting element to emit light;
A light receiving unit that receives light emitted from the semiconductor light emitting element and measures the amount of light;
Have
The probe is formed to be movable in a direction approaching and separating from the table,
On the tip side of the probe, it has a probe tip part bent in a direction closer to the table than the probe body part, and a probe body part arranged substantially horizontally connected to the probe tip part,
By moving the probe in a direction approaching the table, the probe contacts the terminal;
The measurement in the light receiving unit is a light quantity measuring apparatus in which a reaction force received by the probe from the terminal is constant with respect to an amount of movement of the probe toward the table.   The light quantity measuring device according to claim 1, wherein the probe has flexibility. The probe has a holding portion on the member side holding the probe,
The light quantity measuring device according to claim 1, wherein the holding portion is bent in a direction away from the table from the probe main body portion.   The light quantity measuring device according to claim 1, wherein the table has a plane having a reflectance characteristic of 80% or more, and the semiconductor light emitting element is placed on the plane.   The light quantity measuring device according to any one of claims 1 to 4, wherein a part of the probe is brittle and the probe as a whole has flexibility.   The light quantity measuring device according to claim 1, wherein the probe contacts the semiconductor light emitting element, and further performs a pressing operation after measurement and before being separated from the semiconductor light emitting element.   A contact position adjusting unit that includes a plurality of probes, and that adjusts the amount of displacement of the height positions of the tips of the probes that come into contact with the semiconductor light emitting element to be included in a predetermined range. The light quantity measuring device according to any one of 6.

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