TWI573198B - 在三度空間集積製程中轉移材料層之方法及其相關結構與元件 - Google Patents
在三度空間集積製程中轉移材料層之方法及其相關結構與元件 Download PDFInfo
- Publication number
- TWI573198B TWI573198B TW101127515A TW101127515A TWI573198B TW I573198 B TWI573198 B TW I573198B TW 101127515 A TW101127515 A TW 101127515A TW 101127515 A TW101127515 A TW 101127515A TW I573198 B TWI573198 B TW I573198B
- Authority
- TW
- Taiwan
- Prior art keywords
- donor structure
- ions
- donor
- regions
- implanting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/246,580 US8673733B2 (en) | 2011-09-27 | 2011-09-27 | Methods of transferring layers of material in 3D integration processes and related structures and devices |
FR1159358A FR2981501B1 (fr) | 2011-10-17 | 2011-10-17 | Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201330117A TW201330117A (zh) | 2013-07-16 |
TWI573198B true TWI573198B (zh) | 2017-03-01 |
Family
ID=46889374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101127515A TWI573198B (zh) | 2011-09-27 | 2012-07-30 | 在三度空間集積製程中轉移材料層之方法及其相關結構與元件 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6141853B2 (de) |
KR (1) | KR101955375B1 (de) |
CN (1) | CN103828036B (de) |
DE (1) | DE112012004024T5 (de) |
TW (1) | TWI573198B (de) |
WO (1) | WO2013045985A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8984463B2 (en) | 2012-11-28 | 2015-03-17 | Qualcomm Incorporated | Data transfer across power domains |
US9064077B2 (en) | 2012-11-28 | 2015-06-23 | Qualcomm Incorporated | 3D floorplanning using 2D and 3D blocks |
US20140225218A1 (en) * | 2013-02-12 | 2014-08-14 | Qualcomm Incorporated | Ion reduced, ion cut-formed three-dimensional (3d) integrated circuits (ic) (3dics), and related methods and systems |
US9536840B2 (en) | 2013-02-12 | 2017-01-03 | Qualcomm Incorporated | Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods |
US9041448B2 (en) | 2013-03-05 | 2015-05-26 | Qualcomm Incorporated | Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods |
US9177890B2 (en) | 2013-03-07 | 2015-11-03 | Qualcomm Incorporated | Monolithic three dimensional integration of semiconductor integrated circuits |
US9171608B2 (en) | 2013-03-15 | 2015-10-27 | Qualcomm Incorporated | Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICS), 3DIC processor cores, and methods |
FR3034569B1 (fr) * | 2015-04-02 | 2021-10-22 | Soitec Silicon On Insulator | Electrolyte solide avance et sa methode de fabrication |
FR3041364B1 (fr) * | 2015-09-18 | 2017-10-06 | Soitec Silicon On Insulator | Procede de transfert de paves monocristallins |
FR3073083B1 (fr) * | 2017-10-31 | 2019-10-11 | Soitec | Procede de fabrication d'un film sur un feuillet flexible |
FR3079659B1 (fr) * | 2018-03-29 | 2020-03-13 | Soitec | Procede de fabrication d'un substrat donneur pour la realisation d'une structure integree en trois dimensions et procede de fabrication d'une telle structure integree |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6020252A (en) * | 1996-05-15 | 2000-02-01 | Commissariat A L'energie Atomique | Method of producing a thin layer of semiconductor material |
US20050221583A1 (en) * | 2001-10-11 | 2005-10-06 | Bernard Aspar | Method for making thin layers containing microcomponents |
WO2006039684A1 (en) * | 2004-10-01 | 2006-04-13 | Massachusetts Institute Of Technology | Strained gettering layers for semiconductor processes |
US20070037363A1 (en) * | 2002-11-07 | 2007-02-15 | Bernard Aspar | Method for forming a brittle zone in a substrate by co-implantation |
US20080286941A1 (en) * | 1998-06-22 | 2008-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
FR2747506B1 (fr) * | 1996-04-11 | 1998-05-15 | Commissariat Energie Atomique | Procede d'obtention d'un film mince de materiau semiconducteur comprenant notamment des composants electroniques |
JPH10135147A (ja) * | 1996-11-01 | 1998-05-22 | Nippon Telegr & Teleph Corp <Ntt> | 結晶薄膜の製造方法及び太陽電池の製造方法 |
FR2755537B1 (fr) | 1996-11-05 | 1999-03-05 | Commissariat Energie Atomique | Procede de fabrication d'un film mince sur un support et structure ainsi obtenue |
FR2758907B1 (fr) * | 1997-01-27 | 1999-05-07 | Commissariat Energie Atomique | Procede d'obtention d'un film mince, notamment semiconducteur, comportant une zone protegee des ions, et impliquant une etape d'implantation ionique |
FR2767416B1 (fr) | 1997-08-12 | 1999-10-01 | Commissariat Energie Atomique | Procede de fabrication d'un film mince de materiau solide |
JPH1174208A (ja) * | 1997-08-27 | 1999-03-16 | Denso Corp | 半導体基板の製造方法 |
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
FR2774510B1 (fr) | 1998-02-02 | 2001-10-26 | Soitec Silicon On Insulator | Procede de traitement de substrats, notamment semi-conducteurs |
FR2795865B1 (fr) | 1999-06-30 | 2001-08-17 | Commissariat Energie Atomique | Procede de realisation d'un film mince utilisant une mise sous pression |
FR2818010B1 (fr) | 2000-12-08 | 2003-09-05 | Commissariat Energie Atomique | Procede de realisation d'une couche mince impliquant l'introduction d'especes gazeuses |
JP4814498B2 (ja) * | 2004-06-18 | 2011-11-16 | シャープ株式会社 | 半導体基板の製造方法 |
EP1911085B1 (de) * | 2005-07-08 | 2011-10-12 | S.O.I.Tec Silicon on Insulator Technologies | Verfahren zur herstellung eines films |
FR2935537B1 (fr) | 2008-08-28 | 2010-10-22 | Soitec Silicon On Insulator | Procede d'initiation d'adhesion moleculaire |
US7816225B2 (en) * | 2008-10-30 | 2010-10-19 | Corning Incorporated | Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation |
-
2012
- 2012-07-30 TW TW101127515A patent/TWI573198B/zh active
- 2012-08-13 CN CN201280046870.1A patent/CN103828036B/zh active Active
- 2012-08-13 DE DE112012004024.4T patent/DE112012004024T5/de active Pending
- 2012-08-13 KR KR1020147008836A patent/KR101955375B1/ko active IP Right Grant
- 2012-08-13 WO PCT/IB2012/001578 patent/WO2013045985A1/en active Application Filing
- 2012-08-13 JP JP2014532486A patent/JP6141853B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6020252A (en) * | 1996-05-15 | 2000-02-01 | Commissariat A L'energie Atomique | Method of producing a thin layer of semiconductor material |
US20080286941A1 (en) * | 1998-06-22 | 2008-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
US20050221583A1 (en) * | 2001-10-11 | 2005-10-06 | Bernard Aspar | Method for making thin layers containing microcomponents |
US20070037363A1 (en) * | 2002-11-07 | 2007-02-15 | Bernard Aspar | Method for forming a brittle zone in a substrate by co-implantation |
WO2006039684A1 (en) * | 2004-10-01 | 2006-04-13 | Massachusetts Institute Of Technology | Strained gettering layers for semiconductor processes |
Also Published As
Publication number | Publication date |
---|---|
CN103828036A (zh) | 2014-05-28 |
DE112012004024T5 (de) | 2014-07-24 |
KR101955375B1 (ko) | 2019-03-07 |
JP2014531768A (ja) | 2014-11-27 |
CN103828036B (zh) | 2017-02-15 |
JP6141853B2 (ja) | 2017-06-07 |
TW201330117A (zh) | 2013-07-16 |
WO2013045985A1 (en) | 2013-04-04 |
KR20140065435A (ko) | 2014-05-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI573198B (zh) | 在三度空間集積製程中轉移材料層之方法及其相關結構與元件 | |
US9922956B2 (en) | Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration | |
US20200168584A1 (en) | Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods | |
US9704835B2 (en) | Three dimensional integrated circuit | |
JP5636152B2 (ja) | 混合マイクロテクノロジー構造を製造する方法、およびそれによって得られる構造 | |
US20180082989A1 (en) | Three dimensional integrated circuit | |
US8673733B2 (en) | Methods of transferring layers of material in 3D integration processes and related structures and devices | |
KR101372018B1 (ko) | 집적 회로들의 형성 방법들 및 결과적인 구조들 | |
KR101426362B1 (ko) | 접합 반도체 구조 형성 방법 및 그 방법에 의해 형성된 반도체 구조 | |
CN102339769A (zh) | 临时半导体结构键合方法和相关的键合半导体结构 | |
SG188195A1 (en) | Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods | |
TWI588886B (zh) | 製造半導體裝置之方法 | |
US8841742B2 (en) | Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods | |
US9136134B2 (en) | Methods of providing thin layers of crystalline semiconductor material, and related structures and devices | |
TW202004991A (zh) | 用於製造三維整合結構生產用之供體基材的方法以及用於製造該整合結構的方法 | |
FR2981501A1 (fr) | Procédé de transfert de couches matériau dans des processus d'intégration 3d et structures et dispositifs associes |