FR2981501B1 - Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes - Google Patents

Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes

Info

Publication number
FR2981501B1
FR2981501B1 FR1159358A FR1159358A FR2981501B1 FR 2981501 B1 FR2981501 B1 FR 2981501B1 FR 1159358 A FR1159358 A FR 1159358A FR 1159358 A FR1159358 A FR 1159358A FR 2981501 B1 FR2981501 B1 FR 2981501B1
Authority
FR
France
Prior art keywords
devices
material layers
transferring material
related structures
integration processes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1159358A
Other languages
English (en)
Other versions
FR2981501A1 (fr
Inventor
Mariam Sadaka
Ionut Radu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1159358A priority Critical patent/FR2981501B1/fr
Priority to TW101127515A priority patent/TWI573198B/zh
Priority to DE112012004024.4T priority patent/DE112012004024T5/de
Priority to JP2014532486A priority patent/JP6141853B2/ja
Priority to CN201280046870.1A priority patent/CN103828036B/zh
Priority to PCT/IB2012/001578 priority patent/WO2013045985A1/fr
Priority to KR1020147008836A priority patent/KR101955375B1/ko
Publication of FR2981501A1 publication Critical patent/FR2981501A1/fr
Application granted granted Critical
Publication of FR2981501B1 publication Critical patent/FR2981501B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
FR1159358A 2011-09-27 2011-10-17 Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes Active FR2981501B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1159358A FR2981501B1 (fr) 2011-10-17 2011-10-17 Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes
TW101127515A TWI573198B (zh) 2011-09-27 2012-07-30 在三度空間集積製程中轉移材料層之方法及其相關結構與元件
JP2014532486A JP6141853B2 (ja) 2011-09-27 2012-08-13 ３ｄ集積化プロセスにおいて材料の層を転写する方法ならびに関連する構造体およびデバイス
CN201280046870.1A CN103828036B (zh) 2011-09-27 2012-08-13 在3d集成处理中转移材料层的方法以及相关结构和装置
DE112012004024.4T DE112012004024T5 (de) 2011-09-27 2012-08-13 Verfahren zum Übertragen von Materialschichten in 3D-Integrationsprozessen und damit zusammenhängende Strukturen und Vorrichtungen
PCT/IB2012/001578 WO2013045985A1 (fr) 2011-09-27 2012-08-13 Procédés pour transférer des couches de matériau dans des processus d'intégration 3d et structures et dispositifs associés
KR1020147008836A KR101955375B1 (ko) 2011-09-27 2012-08-13 3d 통합 프로세스들로 재료의 층들을 이동시키는 방법들 및 관련 구조들 및 디바이스들

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1159358A FR2981501B1 (fr) 2011-10-17 2011-10-17 Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes

Publications (2)

Publication Number Publication Date
FR2981501A1 FR2981501A1 (fr) 2013-04-19
FR2981501B1 true FR2981501B1 (fr) 2016-05-13

Family

ID=45558144

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1159358A Active FR2981501B1 (fr) 2011-09-27 2011-10-17 Procédé de transfert de couches matériau dans des processus d’intégration 3d et structures et dispositifs associes

Country Status (1)

Country Link
FR (1) FR2981501B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2747506B1 (fr) * 1996-04-11 1998-05-15 Commissariat Energie Atomique Procede d'obtention d'un film mince de materiau semiconducteur comprenant notamment des composants electroniques
FR2847075B1 (fr) * 2002-11-07 2005-02-18 Commissariat Energie Atomique Procede de formation d'une zone fragile dans un substrat par co-implantation
WO2007017763A2 (fr) * 2005-07-08 2007-02-15 S.O.I. Tec Silicon On Insulator Technologies Procede servant a produire une couche
US7816225B2 (en) * 2008-10-30 2010-10-19 Corning Incorporated Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation

Also Published As

Publication number Publication date
FR2981501A1 (fr) 2013-04-19

Similar Documents

Publication Publication Date Title
SG10201601160XA (en) Semiconductor device and method of forming dual-sidedinterconnect structures in fo-wlcsp
FR2978604B1 (fr) Procede de guerison de defauts dans une couche semi-conductrice
PL2532328T3 (pl) Sposób i urządzenie do wytworzenia struktur chłonnych z materiałem chłonnym
SG10201605237SA (en) Display device and method for manufacturing same
HK1189193A1 (zh) 液體材料的塗布方法及塗布裝置
EP2691993A4 (fr) Matériaux actifs pour dispositifs électro-optiques et dispositifs électro-optiques
EP2707917A4 (fr) Matériaux à base de graphène comportant des défauts structuraux bidimensionnels distribués de façon aléatoire
PL2707705T3 (pl) Urządzenie do badania właściwości powierzchni i sposób badania właściwości powierzchni
GB2504783A8 (en) Method and apparatus for the manufacturing of sandwich structures with free flowing materials and such structures
EP2662910A4 (fr) Matériau piézoélectrique polymère et son procédé de fabrication
TWI560527B (en) Method of slimming radiation-sensitive material lines in lithographic applications
FI20115982A0 (fi) Detektorirakenne kuvantamissovelluksiin ja tähän liittyvä valmistusmenetelmä
GB2498072B (en) Display device and method for manufacturing of the same
BR112013020105A2 (pt) método e aparelho para dispor material granular
BR112013020104A2 (pt) método e aparelho para dispor material granular
BR112014000309A2 (pt) aparelho de fornecimento de partícula e fabricação de artigo de folha
EP2795692A4 (fr) Procédés et matériaux pour la fabrication de couches confinées, et dispositifs fabriqués à l'aide de ceux-ci
EP2769839A4 (fr) Film multicouche et procédé de fabrication de celui-ci
BR112013029674A2 (pt) dispositivo para manuseio e método
BR112013023787A2 (pt) método de tratamento de um distúrbio inflamatório gastrointestinal em um paciente, artigo de manufatura e método para induzir a remissão prolongada em um paciente sofrendo de colite ulcerativa
EP2690782A4 (fr) Dispositif piézoélectrique et son procédé de fabrication
BR112013023415A2 (pt) método e dispositivo para embalar grupos de artigos combinados para formar unidades de embalagem
BR112014000312A2 (pt) aparelho de fornecimento de partícula e fabricação de artigo de folha
BR112013032135A2 (pt) método e embalagem para artigos planos
HK1194129A1 (zh) 裝載裝置及裝載管道融合機方法

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13