TWI570750B - 導電性粒子及含有其的導電材料 - Google Patents

導電性粒子及含有其的導電材料 Download PDF

Info

Publication number
TWI570750B
TWI570750B TW102111798A TW102111798A TWI570750B TW I570750 B TWI570750 B TW I570750B TW 102111798 A TW102111798 A TW 102111798A TW 102111798 A TW102111798 A TW 102111798A TW I570750 B TWI570750 B TW I570750B
Authority
TW
Taiwan
Prior art keywords
film
nickel
conductive
base film
particles
Prior art date
Application number
TW102111798A
Other languages
English (en)
Chinese (zh)
Other versions
TW201344713A (zh
Inventor
松浦寛人
小山田雅明
Original Assignee
日本化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本化學工業股份有限公司 filed Critical 日本化學工業股份有限公司
Publication of TW201344713A publication Critical patent/TW201344713A/zh
Application granted granted Critical
Publication of TWI570750B publication Critical patent/TWI570750B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
TW102111798A 2012-04-10 2013-04-02 導電性粒子及含有其的導電材料 TWI570750B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012089128A JP5941328B2 (ja) 2012-04-10 2012-04-10 導電性粒子及びそれを含む導電性材料

Publications (2)

Publication Number Publication Date
TW201344713A TW201344713A (zh) 2013-11-01
TWI570750B true TWI570750B (zh) 2017-02-11

Family

ID=49368012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102111798A TWI570750B (zh) 2012-04-10 2013-04-02 導電性粒子及含有其的導電材料

Country Status (4)

Country Link
JP (1) JP5941328B2 (ja)
KR (2) KR101995595B1 (ja)
CN (1) CN103366855B (ja)
TW (1) TWI570750B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6423687B2 (ja) * 2013-11-01 2018-11-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6460803B2 (ja) * 2014-01-10 2019-01-30 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6646366B2 (ja) * 2014-06-24 2020-02-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6507552B2 (ja) * 2014-10-03 2019-05-08 日立化成株式会社 導電粒子
JP6668075B2 (ja) * 2014-11-17 2020-03-18 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR101718158B1 (ko) 2016-03-10 2017-03-21 마이크로컴퍼지트 주식회사 저비중 전도성 입자, 이의 제조방법, 및 이를 포함하는 복합구조체
JP6474860B2 (ja) * 2017-06-28 2019-02-27 小島化学薬品株式会社 無電解ニッケルストライクめっき液及びニッケルめっき皮膜の成膜方法
KR20230012496A (ko) * 2020-05-20 2023-01-26 니폰 가가쿠 고교 가부시키가이샤 도전성 입자, 그것을 사용한 도전성 재료 및 접속 구조체
CN114160788B (zh) * 2021-10-28 2024-06-14 广东聚石科技研究有限公司 软磁复合材料用绝缘包覆铁粉及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200614271A (en) * 2004-07-15 2006-05-01 Sekisui Chemical Co Ltd Conductive microparticle, process for producing the same, and anisotropic conductive material
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
CN102222535A (zh) * 2010-01-29 2011-10-19 日本化学工业株式会社 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP4063655B2 (ja) 2002-12-18 2008-03-19 日本化学工業株式会社 導電性無電解めっき粉体及びその製造方法
JP2005082632A (ja) * 2003-09-04 2005-03-31 Asahi Kasei Electronics Co Ltd 異方導電性接着剤及び接続構造体
JP2007324138A (ja) * 2004-01-30 2007-12-13 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP4728665B2 (ja) * 2004-07-15 2011-07-20 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料
JP4235227B2 (ja) * 2004-09-02 2009-03-11 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP2007075856A (ja) * 2005-09-14 2007-03-29 Nippon Steel Materials Co Ltd Ｃｕコアボール
JP4638341B2 (ja) * 2005-12-22 2011-02-23 積水化学工業株式会社 導電性微粒子及び異方性導電材料
KR100719802B1 (ko) * 2005-12-28 2007-05-18 제일모직주식회사 이방 전도 접속용 고신뢰성 전도성 미립자
US7749300B2 (en) * 2008-06-05 2010-07-06 Xerox Corporation Photochemical synthesis of bimetallic core-shell nanoparticles
JP5358328B2 (ja) * 2009-07-16 2013-12-04 デクセリアルズ株式会社 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200614271A (en) * 2004-07-15 2006-05-01 Sekisui Chemical Co Ltd Conductive microparticle, process for producing the same, and anisotropic conductive material
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
CN102222535A (zh) * 2010-01-29 2011-10-19 日本化学工业株式会社 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法

Also Published As

Publication number Publication date
CN103366855B (zh) 2016-09-21
KR101995595B1 (ko) 2019-07-02
CN103366855A (zh) 2013-10-23
JP2013218907A (ja) 2013-10-24
KR20130115150A (ko) 2013-10-21
KR20170117983A (ko) 2017-10-24
TW201344713A (zh) 2013-11-01
JP5941328B2 (ja) 2016-06-29

Similar Documents

Publication Publication Date Title
TWI570750B (zh) 導電性粒子及含有其的導電材料
TWI546822B (zh) 導電性粉體、含有該導電性粉體的導電性材料及其製造方法
TWI602201B (zh) 導電性粒子、導電性材料及導電性粒子的製造方法
TWI479508B (zh) Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles
KR102001723B1 (ko) 도전성 분체 및 상기를 포함하는 도전성 재료 및 도전성 입자의 제조 방법
JP5844219B2 (ja) 導電性粒子の製造方法
WO2021095803A1 (ja) 導電性粒子、その製造方法及びそれを含む導電性材料
JP6263228B2 (ja) 導電性粒子及びそれを含む導電性材料
JP5695768B2 (ja) 導電性粉体及びそれを含む導電性材料
WO2021095804A1 (ja) 導電性粒子、その製造方法及びそれを含む導電性材料
WO2024043047A1 (ja) 導電性粒子、その製造方法および導電性材料