TWI570750B - 導電性粒子及含有其的導電材料 - Google Patents
導電性粒子及含有其的導電材料 Download PDFInfo
- Publication number
- TWI570750B TWI570750B TW102111798A TW102111798A TWI570750B TW I570750 B TWI570750 B TW I570750B TW 102111798 A TW102111798 A TW 102111798A TW 102111798 A TW102111798 A TW 102111798A TW I570750 B TWI570750 B TW I570750B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- nickel
- conductive
- base film
- particles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Chemically Coating (AREA)
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012089128A JP5941328B2 (ja) | 2012-04-10 | 2012-04-10 | 導電性粒子及びそれを含む導電性材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201344713A TW201344713A (zh) | 2013-11-01 |
TWI570750B true TWI570750B (zh) | 2017-02-11 |
Family
ID=49368012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102111798A TWI570750B (zh) | 2012-04-10 | 2013-04-02 | 導電性粒子及含有其的導電材料 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5941328B2 (ja) |
KR (2) | KR101995595B1 (ja) |
CN (1) | CN103366855B (ja) |
TW (1) | TWI570750B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6423687B2 (ja) * | 2013-11-01 | 2018-11-14 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6460803B2 (ja) * | 2014-01-10 | 2019-01-30 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
JP6646366B2 (ja) * | 2014-06-24 | 2020-02-14 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6507552B2 (ja) * | 2014-10-03 | 2019-05-08 | 日立化成株式会社 | 導電粒子 |
JP6668075B2 (ja) * | 2014-11-17 | 2020-03-18 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
KR101718158B1 (ko) | 2016-03-10 | 2017-03-21 | 마이크로컴퍼지트 주식회사 | 저비중 전도성 입자, 이의 제조방법, 및 이를 포함하는 복합구조체 |
JP6474860B2 (ja) * | 2017-06-28 | 2019-02-27 | 小島化学薬品株式会社 | 無電解ニッケルストライクめっき液及びニッケルめっき皮膜の成膜方法 |
KR20230012496A (ko) * | 2020-05-20 | 2023-01-26 | 니폰 가가쿠 고교 가부시키가이샤 | 도전성 입자, 그것을 사용한 도전성 재료 및 접속 구조체 |
CN114160788B (zh) * | 2021-10-28 | 2024-06-14 | 广东聚石科技研究有限公司 | 软磁复合材料用绝缘包覆铁粉及其制备方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200614271A (en) * | 2004-07-15 | 2006-05-01 | Sekisui Chemical Co Ltd | Conductive microparticle, process for producing the same, and anisotropic conductive material |
CN102089832A (zh) * | 2008-07-24 | 2011-06-08 | 索尼化学&信息部件株式会社 | 导电性粒子、各向异性导电膜、接合体以及连接方法 |
CN102222535A (zh) * | 2010-01-29 | 2011-10-19 | 日本化学工业株式会社 | 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3696429B2 (ja) * | 1999-02-22 | 2005-09-21 | 日本化学工業株式会社 | 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料 |
JP4063655B2 (ja) | 2002-12-18 | 2008-03-19 | 日本化学工業株式会社 | 導電性無電解めっき粉体及びその製造方法 |
JP2005082632A (ja) * | 2003-09-04 | 2005-03-31 | Asahi Kasei Electronics Co Ltd | 異方導電性接着剤及び接続構造体 |
JP2007324138A (ja) * | 2004-01-30 | 2007-12-13 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
JP4728665B2 (ja) * | 2004-07-15 | 2011-07-20 | 積水化学工業株式会社 | 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料 |
JP4235227B2 (ja) * | 2004-09-02 | 2009-03-11 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
JP2007075856A (ja) * | 2005-09-14 | 2007-03-29 | Nippon Steel Materials Co Ltd | Cuコアボール |
JP4638341B2 (ja) * | 2005-12-22 | 2011-02-23 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
KR100719802B1 (ko) * | 2005-12-28 | 2007-05-18 | 제일모직주식회사 | 이방 전도 접속용 고신뢰성 전도성 미립자 |
US7749300B2 (en) * | 2008-06-05 | 2010-07-06 | Xerox Corporation | Photochemical synthesis of bimetallic core-shell nanoparticles |
JP5358328B2 (ja) * | 2009-07-16 | 2013-12-04 | デクセリアルズ株式会社 | 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法 |
-
2012
- 2012-04-10 JP JP2012089128A patent/JP5941328B2/ja active Active
-
2013
- 2013-04-02 TW TW102111798A patent/TWI570750B/zh active
- 2013-04-09 KR KR1020130038509A patent/KR101995595B1/ko active IP Right Grant
- 2013-04-10 CN CN201310122720.0A patent/CN103366855B/zh active Active
-
2017
- 2017-10-10 KR KR1020170129134A patent/KR20170117983A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200614271A (en) * | 2004-07-15 | 2006-05-01 | Sekisui Chemical Co Ltd | Conductive microparticle, process for producing the same, and anisotropic conductive material |
CN102089832A (zh) * | 2008-07-24 | 2011-06-08 | 索尼化学&信息部件株式会社 | 导电性粒子、各向异性导电膜、接合体以及连接方法 |
CN102222535A (zh) * | 2010-01-29 | 2011-10-19 | 日本化学工业株式会社 | 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103366855B (zh) | 2016-09-21 |
KR101995595B1 (ko) | 2019-07-02 |
CN103366855A (zh) | 2013-10-23 |
JP2013218907A (ja) | 2013-10-24 |
KR20130115150A (ko) | 2013-10-21 |
KR20170117983A (ko) | 2017-10-24 |
TW201344713A (zh) | 2013-11-01 |
JP5941328B2 (ja) | 2016-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI570750B (zh) | 導電性粒子及含有其的導電材料 | |
TWI546822B (zh) | 導電性粉體、含有該導電性粉體的導電性材料及其製造方法 | |
TWI602201B (zh) | 導電性粒子、導電性材料及導電性粒子的製造方法 | |
TWI479508B (zh) | Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles | |
KR102001723B1 (ko) | 도전성 분체 및 상기를 포함하는 도전성 재료 및 도전성 입자의 제조 방법 | |
JP5844219B2 (ja) | 導電性粒子の製造方法 | |
WO2021095803A1 (ja) | 導電性粒子、その製造方法及びそれを含む導電性材料 | |
JP6263228B2 (ja) | 導電性粒子及びそれを含む導電性材料 | |
JP5695768B2 (ja) | 導電性粉体及びそれを含む導電性材料 | |
WO2021095804A1 (ja) | 導電性粒子、その製造方法及びそれを含む導電性材料 | |
WO2024043047A1 (ja) | 導電性粒子、その製造方法および導電性材料 |