TWI570156B - 聚醯胺酸樹脂組成物、聚醯亞胺樹脂組成物及聚醯亞胺唑樹脂組成物、以及含有其之可撓性基板 - Google Patents

聚醯胺酸樹脂組成物、聚醯亞胺樹脂組成物及聚醯亞胺唑樹脂組成物、以及含有其之可撓性基板 Download PDF

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Publication number
TWI570156B
TWI570156B TW101129649A TW101129649A TWI570156B TW I570156 B TWI570156 B TW I570156B TW 101129649 A TW101129649 A TW 101129649A TW 101129649 A TW101129649 A TW 101129649A TW I570156 B TWI570156 B TW I570156B
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TW
Taiwan
Prior art keywords
organic group
polyimine
carbon atoms
formula
resin composition
Prior art date
Application number
TW101129649A
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English (en)
Chinese (zh)
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TW201313781A (zh
Inventor
Junji Wakita
Daichi Miyazaki
Kazuto Miyoshi
Masao Tomikawa
Original Assignee
Toray Industries
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Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201313781A publication Critical patent/TW201313781A/zh
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Publication of TWI570156B publication Critical patent/TWI570156B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW101129649A 2011-08-18 2012-08-16 聚醯胺酸樹脂組成物、聚醯亞胺樹脂組成物及聚醯亞胺唑樹脂組成物、以及含有其之可撓性基板 TWI570156B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011178853 2011-08-18

Publications (2)

Publication Number Publication Date
TW201313781A TW201313781A (zh) 2013-04-01
TWI570156B true TWI570156B (zh) 2017-02-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101129649A TWI570156B (zh) 2011-08-18 2012-08-16 聚醯胺酸樹脂組成物、聚醯亞胺樹脂組成物及聚醯亞胺唑樹脂組成物、以及含有其之可撓性基板

Country Status (6)

Country Link
JP (1) JP5928447B2 (fr)
KR (1) KR101921919B1 (fr)
CN (1) CN103842408B (fr)
SG (1) SG2014013874A (fr)
TW (1) TWI570156B (fr)
WO (1) WO2013024849A1 (fr)

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US20140066571A1 (en) * 2011-03-11 2014-03-06 Ube Industries, Ltd. Polyimide precursor and polyimide
WO2015002273A1 (fr) 2013-07-05 2015-01-08 三菱瓦斯化学株式会社 Résine de polyimide
TWI504641B (zh) * 2013-12-16 2015-10-21 Taimide Technology Inc 白色聚醯亞胺膜
SG11201701691PA (en) * 2014-09-02 2017-04-27 Toray Industries Resin and photosensitive resin composition
CN107405907B (zh) * 2015-03-26 2019-06-18 东丽株式会社 树脂层叠膜及含有其的层叠体、tft基板、有机el元件滤色片，以及它们的制造方法
CN107406673B (zh) * 2015-03-30 2019-09-06 东丽株式会社 着色树脂组合物、着色膜、装饰基板及触摸面板
CN104830169A (zh) * 2015-05-11 2015-08-12 黄强 用于汽车发动机的耐磨涂料
KR102350804B1 (ko) * 2015-10-23 2022-01-14 도레이 카부시키가이샤 디스플레이 기판용 수지 조성물, 및 그것을 사용한 내열성 수지 필름, 유기 el 디스플레이 기판 및 유기 el 디스플레이의 제조 방법
JP6718678B2 (ja) * 2015-12-25 2020-07-08 ソマール株式会社 ポリイミド共重合体及びそれを用いた成形体
KR102503173B1 (ko) * 2016-03-31 2023-02-23 동우 화인켐 주식회사 플렉서블 컬러필터
KR102127033B1 (ko) * 2016-04-26 2020-06-25 주식회사 엘지화학 네가티브 타입 감광성 수지 조성물 및 이를 포함하는 유기 발광 소자 블랙 매트릭스
JP6950684B2 (ja) * 2016-05-06 2021-10-13 三菱瓦斯化学株式会社 ポリイミド樹脂
JP6768234B2 (ja) * 2016-05-09 2020-10-14 三菱瓦斯化学株式会社 ポリイミド及びポリイミドフィルム
CN109348718B (zh) * 2016-06-24 2021-03-12 东丽株式会社 聚酰亚胺树脂、聚酰亚胺树脂组合物及其用途
CN109311297A (zh) * 2016-07-15 2019-02-05 宇部兴产株式会社 聚酰亚胺层叠体的制造方法及柔性电路基板的制造方法
WO2018029766A1 (fr) * 2016-08-09 2018-02-15 東レ株式会社 Film multicouche en résine, stratifié contenant celui-ci, substrat tft, filtre coloré d'élément électroluminescent organique, et procédés de fabrication associés
WO2018062296A1 (fr) * 2016-09-30 2018-04-05 住友化学株式会社 Procédé de production d'un vernis polymère à base de polyimide, procédé de production d'un film polymère à base de polyimide, et film polymère transparent à base de polyimide
TWI600168B (zh) * 2016-11-02 2017-09-21 律勝科技股份有限公司 薄膜電晶體的積層體結構
WO2018106088A1 (fr) 2016-12-09 2018-06-14 주식회사 엘지화학 Composition de matériau d'étanchéité
CN109517172B (zh) * 2017-09-18 2023-08-29 嘉兴山蒲照明电器有限公司 一种有机硅改性聚酰亚胺树脂组合物及其应用
JP7248394B2 (ja) * 2017-09-29 2023-03-29 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び金属張積層体
CN111133034B (zh) * 2017-09-29 2022-08-09 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺清漆和聚酰亚胺薄膜
US11920019B2 (en) 2018-10-03 2024-03-05 Konica Minolta, Inc. Resin composition and electronic device
WO2020095693A1 (fr) 2018-11-09 2020-05-14 東レ株式会社 Précurseur de polyimide, polyimide, film en résine de polyimide et dispositif souple
TW202035527A (zh) * 2018-12-28 2020-10-01 日商住友化學股份有限公司 光學膜、可撓性顯示裝置及聚醯胺醯亞胺系樹脂
CN111621260B (zh) * 2020-06-18 2022-01-25 株洲时代新材料科技股份有限公司 一种聚酰胺酸涂层胶及其制备方法
CN112708134B (zh) * 2020-12-28 2021-08-03 深圳瑞华泰薄膜科技股份有限公司 一种无色透明共聚酰胺-酰亚胺膜及其制备方法
WO2023286955A1 (fr) * 2021-07-14 2023-01-19 코오롱인더스트리 주식회사 Film optique ayant une excellente netteté, et dispositif d'affichage le comprenant

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JP2004134487A (ja) * 2002-10-09 2004-04-30 Toray Ind Inc 半導体装置の製造方法および半導体装置
WO2010087238A1 (fr) * 2009-01-29 2010-08-05 東レ株式会社 Composition de résine et dispositif d'affichage formé à l'aide de celle-ci
CN102020995A (zh) * 2009-09-15 2011-04-20 智索株式会社 液晶配向剂、液晶配向膜以及液晶显示元件

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JP4846609B2 (ja) 2007-01-30 2011-12-28 旭化成イーマテリアルズ株式会社 エステル基及びオキサゾール構造を有するポリイミド前駆体、ポリイミド及びその製造方法
JP5370884B2 (ja) * 2008-08-29 2013-12-18 Ｊｎｃ株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
JP5310346B2 (ja) 2009-07-17 2013-10-09 東洋紡株式会社 剥離性ポリイミドフィルム積層体
WO2011030744A1 (fr) 2009-09-10 2011-03-17 東レ株式会社 Composition de résine photosensible et procédé de fabrication d'un film de résine photosensible
US20140066571A1 (en) * 2011-03-11 2014-03-06 Ube Industries, Ltd. Polyimide precursor and polyimide
JP6792358B2 (ja) * 2016-07-07 2020-11-25 サッポロビール株式会社 ビールテイスト飲料の混濁性予測方法

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JPH07316294A (ja) * 1994-05-20 1995-12-05 Shin Etsu Chem Co Ltd ポリイミド共重合体及びその製造方法
JP2004134487A (ja) * 2002-10-09 2004-04-30 Toray Ind Inc 半導体装置の製造方法および半導体装置
WO2010087238A1 (fr) * 2009-01-29 2010-08-05 東レ株式会社 Composition de résine et dispositif d'affichage formé à l'aide de celle-ci
CN102020995A (zh) * 2009-09-15 2011-04-20 智索株式会社 液晶配向剂、液晶配向膜以及液晶显示元件

Also Published As

Publication number Publication date
KR101921919B1 (ko) 2018-11-26
SG2014013874A (en) 2014-05-29
TW201313781A (zh) 2013-04-01
CN103842408B (zh) 2016-09-21
JP5928447B2 (ja) 2016-06-01
JPWO2013024849A1 (ja) 2015-03-05
KR20140051430A (ko) 2014-04-30
CN103842408A (zh) 2014-06-04
WO2013024849A1 (fr) 2013-02-21

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