TWI562694B - Metal-clad laminated board, printed wiring board, semiconductor package, semiconductor device, and process for production of metal-clad laminated board - Google Patents
Metal-clad laminated board, printed wiring board, semiconductor package, semiconductor device, and process for production of metal-clad laminated boardInfo
- Publication number
- TWI562694B TWI562694B TW101135843A TW101135843A TWI562694B TW I562694 B TWI562694 B TW I562694B TW 101135843 A TW101135843 A TW 101135843A TW 101135843 A TW101135843 A TW 101135843A TW I562694 B TWI562694 B TW I562694B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- clad laminated
- laminated board
- board
- production
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011214674 | 2011-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201322854A TW201322854A (zh) | 2013-06-01 |
TWI562694B true TWI562694B (en) | 2016-12-11 |
Family
ID=47994714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101135843A TWI562694B (en) | 2011-09-29 | 2012-09-28 | Metal-clad laminated board, printed wiring board, semiconductor package, semiconductor device, and process for production of metal-clad laminated board |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6480650B2 (ja) |
TW (1) | TWI562694B (ja) |
WO (1) | WO2013046631A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014240456A (ja) * | 2013-06-11 | 2014-12-25 | 住友ベークライト株式会社 | プライマー層付きプリプレグ、金属張積層板、プリント配線基板および半導体パッケージ |
JP6206035B2 (ja) * | 2013-09-24 | 2017-10-04 | 住友ベークライト株式会社 | 金属張積層板、プリント配線基板、および半導体装置 |
JP6221620B2 (ja) * | 2013-10-22 | 2017-11-01 | 住友ベークライト株式会社 | 金属張積層板、プリント配線基板、および半導体装置 |
JP2015225334A (ja) * | 2014-05-30 | 2015-12-14 | 住友ベークライト株式会社 | アクティブマトリックス型表示装置用基板、表示装置およびアクティブマトリックス型表示装置用基板の製造方法 |
TWI689418B (zh) * | 2014-12-01 | 2020-04-01 | 日商三菱瓦斯化學股份有限公司 | 樹脂片及印刷電路板 |
KR20190008838A (ko) * | 2016-05-25 | 2019-01-25 | 히타치가세이가부시끼가이샤 | 금속장 적층판, 프린트 배선판 및 반도체 패키지 |
CN111800950B (zh) * | 2019-04-09 | 2021-12-03 | 臻鼎科技股份有限公司 | 覆金属板的制作方法 |
CN111498491A (zh) * | 2020-04-30 | 2020-08-07 | 鼎勤科技(深圳)有限公司 | 一种线路板材料层预叠合设备及工艺 |
WO2021256798A1 (ko) * | 2020-06-18 | 2021-12-23 | 동우 화인켐 주식회사 | 연성 금속 적층체, 이의 제조방법 및 이를 이용한 프린트 배선판 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212308A (ja) * | 1999-01-26 | 2000-08-02 | Hitachi Chem Co Ltd | プリプレグ、金属はく張り積層板及び多層プリント配線板 |
TW200724583A (en) * | 2005-09-30 | 2007-07-01 | Sumitomo Bakelite Co | Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board |
JP2010238907A (ja) * | 2009-03-31 | 2010-10-21 | Sumitomo Bakelite Co Ltd | 積層板、多層プリント配線板および半導体装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0381122A (ja) * | 1989-08-24 | 1991-04-05 | Shin Kobe Electric Mach Co Ltd | 熱硬化性樹脂金属箔張り積層板の製造法 |
JP3452674B2 (ja) * | 1995-02-09 | 2003-09-29 | 日立化成工業株式会社 | 高剛性銅張積層板の製造方法 |
JP3307202B2 (ja) * | 1995-12-08 | 2002-07-24 | 新神戸電機株式会社 | プリプレグの製造装置 |
JP2002069886A (ja) * | 2000-09-06 | 2002-03-08 | Shin Kobe Electric Mach Co Ltd | 電気絶縁用不織布ならびにプリプレグ及び積層板 |
JP2003155362A (ja) * | 2001-11-19 | 2003-05-27 | Hitachi Chem Co Ltd | 熱硬化性樹脂プリプレグとその製造方法、電気配線板用積層板及び多層プリント配線板 |
JP2004307811A (ja) * | 2003-03-26 | 2004-11-04 | Sumitomo Bakelite Co Ltd | 表示素子用プラスチック基板 |
JP2006108314A (ja) * | 2004-10-04 | 2006-04-20 | Kyocera Chemical Corp | 金属めっき基板、その製造方法及びフレキシブルプリント配線板と多層プリント配線板 |
JP2007050599A (ja) * | 2005-08-18 | 2007-03-01 | Kaneka Corp | 寸法安定性に優れるフレキシブル金属張積層板およびその製造方法 |
JP2010229313A (ja) * | 2009-03-27 | 2010-10-14 | Sekisui Chem Co Ltd | エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板 |
JP2011179001A (ja) * | 2011-03-28 | 2011-09-15 | Sumitomo Bakelite Co Ltd | プリプレグ、回路基板および半導体装置 |
-
2012
- 2012-09-24 WO PCT/JP2012/006064 patent/WO2013046631A1/ja active Application Filing
- 2012-09-24 JP JP2012209964A patent/JP6480650B2/ja active Active
- 2012-09-28 TW TW101135843A patent/TWI562694B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212308A (ja) * | 1999-01-26 | 2000-08-02 | Hitachi Chem Co Ltd | プリプレグ、金属はく張り積層板及び多層プリント配線板 |
TW200724583A (en) * | 2005-09-30 | 2007-07-01 | Sumitomo Bakelite Co | Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board |
JP2010238907A (ja) * | 2009-03-31 | 2010-10-21 | Sumitomo Bakelite Co Ltd | 積層板、多層プリント配線板および半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2013046631A1 (ja) | 2013-04-04 |
JP6480650B2 (ja) | 2019-03-13 |
JP2013082213A (ja) | 2013-05-09 |
TW201322854A (zh) | 2013-06-01 |
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