TWI562248B - Semiconductor sensor device and method of packaging same - Google Patents
Semiconductor sensor device and method of packaging sameInfo
- Publication number
- TWI562248B TWI562248B TW101137519A TW101137519A TWI562248B TW I562248 B TWI562248 B TW I562248B TW 101137519 A TW101137519 A TW 101137519A TW 101137519 A TW101137519 A TW 101137519A TW I562248 B TWI562248 B TW I562248B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor device
- semiconductor sensor
- packaging same
- packaging
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0654—Protection against aggressive medium in general against moisture or humidity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0681—Protection against excessive heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0136—Growing or depositing of a covering layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/292,104 US8643169B2 (en) | 2011-11-09 | 2011-11-09 | Semiconductor sensor device with over-molded lid |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201324632A TW201324632A (zh) | 2013-06-16 |
TWI562248B true TWI562248B (en) | 2016-12-11 |
Family
ID=48223129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101137519A TWI562248B (en) | 2011-11-09 | 2012-10-11 | Semiconductor sensor device and method of packaging same |
Country Status (4)
Country | Link |
---|---|
US (1) | US8643169B2 (zh) |
KR (1) | KR20130051423A (zh) |
CN (1) | CN103107101B (zh) |
TW (1) | TWI562248B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104340946B (zh) * | 2013-08-02 | 2016-08-31 | 无锡华润安盛科技有限公司 | 一种mems电路盖子及其制作方法 |
KR20150074427A (ko) * | 2013-12-24 | 2015-07-02 | 삼성전기주식회사 | 센서 패키지 및 이를 구비하는 휴대 단말기 |
WO2015174993A1 (en) * | 2014-05-15 | 2015-11-19 | Intel Corporation | Molded composite enclosure for integrated circuit assembly |
CN105300593B (zh) * | 2014-07-28 | 2018-12-28 | 恩智浦美国有限公司 | 具有盖的封装的半导体传感器装置 |
JP6256301B2 (ja) * | 2014-10-31 | 2018-01-10 | 株式会社デンソー | 電子回路部品 |
US9598280B2 (en) * | 2014-11-10 | 2017-03-21 | Nxp Usa, Inc. | Environmental sensor structure |
US9579511B2 (en) | 2014-12-15 | 2017-02-28 | Medtronic, Inc. | Medical device with surface mounted lead connector |
US10438864B2 (en) * | 2015-08-21 | 2019-10-08 | Hewlett-Packard Development Company, L.P. | Circuit packages comprising epoxy mold compounds and methods of compression molding |
EP3327755A1 (en) * | 2016-10-10 | 2018-05-30 | Shenzhen Goodix Technology Co., Ltd. | Chip packaging structure and chip packaging method |
DE102017200162A1 (de) | 2017-01-09 | 2018-07-12 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikroelektromechanischen Bauteils und Wafer-Anordnung |
DE102017212422A1 (de) | 2017-07-20 | 2019-01-24 | Robert Bosch Gmbh | Drucksensoranordnung und Verfahren zu deren Herstellung |
US10370244B2 (en) * | 2017-11-30 | 2019-08-06 | Infineon Technologies Ag | Deposition of protective material at wafer level in front end for early stage particle and moisture protection |
DE102018203094B3 (de) * | 2018-03-01 | 2019-05-23 | Infineon Technologies Ag | MEMS-Baustein |
DE102018222781A1 (de) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Drucksensoranordnung |
US20210246015A1 (en) * | 2020-02-06 | 2021-08-12 | Advanced Semiconductor Engineering, Inc. | Sensor device package and method for manufacturing the same |
Citations (6)
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US5877093A (en) * | 1995-10-27 | 1999-03-02 | Honeywell Inc. | Process for coating an integrated circuit device with a molten spray |
US6707168B1 (en) * | 2001-05-04 | 2004-03-16 | Amkor Technology, Inc. | Shielded semiconductor package with single-sided substrate and method for making the same |
US20050189621A1 (en) * | 2002-12-02 | 2005-09-01 | Cheung Kin P. | Processes for hermetically packaging wafer level microscopic structures |
CN101241892A (zh) * | 2007-02-05 | 2008-08-13 | 力成科技股份有限公司 | 多晶片堆叠的基板及使用该基板的多晶片堆叠封装构造 |
TW201021248A (en) * | 2008-11-25 | 2010-06-01 | Visera Technologies Co Ltd | Light-emitting diode devices and method for fabricating the same |
TW201104850A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure with large air cavity |
Family Cites Families (27)
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US5639989A (en) * | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
US5581226A (en) * | 1994-11-02 | 1996-12-03 | Motorola, Inc. | High pressure sensor structure and method |
US5530202A (en) * | 1995-01-09 | 1996-06-25 | At&T Corp. | Metallic RF or thermal shield for automatic vacuum placement |
EP0771023A3 (en) * | 1995-10-27 | 1999-03-24 | Honeywell Inc. | Method of applying a protective coating on a semiconductor integrated circuit |
MX9603299A (es) | 1996-08-09 | 1998-04-30 | Serivicios Condumex S A De C V | Cable conductor electrico co-extruido en tres capas aislante de baja absorcion de humedad metodo electrico, baja emision de gases toxicos y humos, retardante a la flama. |
JPH10335374A (ja) | 1997-06-04 | 1998-12-18 | Fujitsu Ltd | 半導体装置及び半導体装置モジュール |
JP3215686B2 (ja) * | 1999-08-25 | 2001-10-09 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
US6266197B1 (en) | 1999-12-08 | 2001-07-24 | Amkor Technology, Inc. | Molded window array for image sensor packages |
KR100347706B1 (ko) | 2000-08-09 | 2002-08-09 | 주식회사 코스타트반도체 | 이식성 도전패턴을 포함하는 반도체 패키지 및 그 제조방법 |
KR100717667B1 (ko) | 2000-09-18 | 2007-05-11 | 신닛뽄세이테쯔 카부시키카이샤 | 반도체용 본딩 와이어 및 그 제조 방법 |
JP3948203B2 (ja) | 2000-10-13 | 2007-07-25 | 日立電線株式会社 | 銅合金線、銅合金撚線導体、同軸ケーブル、および銅合金線の製造方法 |
JP3400427B2 (ja) * | 2000-11-28 | 2003-04-28 | 株式会社東芝 | 電子部品ユニット及び電子部品ユニットを実装した印刷配線板装置 |
US7060216B2 (en) | 2001-05-11 | 2006-06-13 | Melexis, Nv | Tire pressure sensors and methods of making the same |
US20040245320A1 (en) | 2001-10-23 | 2004-12-09 | Mesato Fukagaya | Bonding wire |
US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
US6900531B2 (en) | 2002-10-25 | 2005-05-31 | Freescale Semiconductor, Inc. | Image sensor device |
US6927482B1 (en) | 2003-10-01 | 2005-08-09 | General Electric Company | Surface mount package and method for forming multi-chip microsensor device |
JP4277079B2 (ja) | 2004-06-18 | 2009-06-10 | Okiセミコンダクタ株式会社 | 半導体加速度センサ装置及びその製造方法 |
WO2006035803A1 (ja) | 2004-09-30 | 2006-04-06 | Tanaka Denshi Kogyo K.K. | Au合金ボンディング・ワイヤ |
MY140911A (en) | 2004-11-26 | 2010-01-29 | Tanaka Electronics Ind | Au bonding wire for semiconductor device |
TWI285415B (en) | 2005-08-01 | 2007-08-11 | Advanced Semiconductor Eng | Package structure having recession portion on the surface thereof and method of making the same |
DE102006001600B3 (de) | 2006-01-11 | 2007-08-02 | Infineon Technologies Ag | Halbleiterbauelement mit Flipchipkontakten und Verfahren zur Herstellung desselben |
BRPI0806792B1 (pt) | 2007-02-15 | 2020-11-17 | Advanced Technology Holdings Ltd | condutor elétrico e núcleo para condutor elétrico |
US7607355B2 (en) * | 2007-02-16 | 2009-10-27 | Yamaha Corporation | Semiconductor device |
JP5116101B2 (ja) | 2007-06-28 | 2013-01-09 | 新日鉄住金マテリアルズ株式会社 | 半導体実装用ボンディングワイヤ及びその製造方法 |
EP2096645B1 (de) | 2008-02-26 | 2010-09-29 | Nexans | Elektrischer Leiter |
US8359927B2 (en) | 2009-08-12 | 2013-01-29 | Freescale Semiconductor, Inc. | Molded differential PRT pressure sensor |
-
2011
- 2011-11-09 US US13/292,104 patent/US8643169B2/en active Active
-
2012
- 2012-10-11 TW TW101137519A patent/TWI562248B/zh active
- 2012-11-08 KR KR1020120126062A patent/KR20130051423A/ko not_active Application Discontinuation
- 2012-11-09 CN CN201210448070.4A patent/CN103107101B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5877093A (en) * | 1995-10-27 | 1999-03-02 | Honeywell Inc. | Process for coating an integrated circuit device with a molten spray |
US6707168B1 (en) * | 2001-05-04 | 2004-03-16 | Amkor Technology, Inc. | Shielded semiconductor package with single-sided substrate and method for making the same |
US20050189621A1 (en) * | 2002-12-02 | 2005-09-01 | Cheung Kin P. | Processes for hermetically packaging wafer level microscopic structures |
CN101241892A (zh) * | 2007-02-05 | 2008-08-13 | 力成科技股份有限公司 | 多晶片堆叠的基板及使用该基板的多晶片堆叠封装构造 |
TW201021248A (en) * | 2008-11-25 | 2010-06-01 | Visera Technologies Co Ltd | Light-emitting diode devices and method for fabricating the same |
TW201104850A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure with large air cavity |
Also Published As
Publication number | Publication date |
---|---|
CN103107101B (zh) | 2016-12-21 |
TW201324632A (zh) | 2013-06-16 |
US20130113054A1 (en) | 2013-05-09 |
CN103107101A (zh) | 2013-05-15 |
US8643169B2 (en) | 2014-02-04 |
KR20130051423A (ko) | 2013-05-20 |
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