TWI561341B - Polishing pad with concentric or approximately concentric polygon groove pattern - Google Patents

Polishing pad with concentric or approximately concentric polygon groove pattern

Info

Publication number
TWI561341B
TWI561341B TW101102753A TW101102753A TWI561341B TW I561341 B TWI561341 B TW I561341B TW 101102753 A TW101102753 A TW 101102753A TW 101102753 A TW101102753 A TW 101102753A TW I561341 B TWI561341 B TW I561341B
Authority
TW
Taiwan
Prior art keywords
concentric
polishing pad
groove pattern
polygon groove
approximately
Prior art date
Application number
TW101102753A
Other languages
English (en)
Other versions
TW201235154A (en
Inventor
William C Allison
Diane Scott
Alexander William Simpson
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of TW201235154A publication Critical patent/TW201235154A/zh
Application granted granted Critical
Publication of TWI561341B publication Critical patent/TWI561341B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW101102753A 2011-01-26 2012-01-20 Polishing pad with concentric or approximately concentric polygon groove pattern TWI561341B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/014,630 US9211628B2 (en) 2011-01-26 2011-01-26 Polishing pad with concentric or approximately concentric polygon groove pattern

Publications (2)

Publication Number Publication Date
TW201235154A TW201235154A (en) 2012-09-01
TWI561341B true TWI561341B (en) 2016-12-11

Family

ID=45562465

Family Applications (3)

Application Number Title Priority Date Filing Date
TW104139487A TWI586487B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊
TW105134598A TWI623380B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊
TW101102753A TWI561341B (en) 2011-01-26 2012-01-20 Polishing pad with concentric or approximately concentric polygon groove pattern

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW104139487A TWI586487B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊
TW105134598A TWI623380B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊

Country Status (8)

Country Link
US (2) US9211628B2 (zh)
EP (1) EP2668004B1 (zh)
JP (3) JP2014508048A (zh)
KR (2) KR20130110216A (zh)
CN (2) CN103429389B (zh)
SG (2) SG10201404027TA (zh)
TW (3) TWI586487B (zh)
WO (1) WO2012102938A1 (zh)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5629749B2 (ja) * 2012-12-28 2014-11-26 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5620465B2 (ja) * 2012-12-28 2014-11-05 東洋ゴム工業株式会社 円形状研磨パッド
US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法
JP6283940B2 (ja) * 2014-03-28 2018-02-28 富士紡ホールディングス株式会社 研磨パッド
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
JP2018524193A (ja) * 2015-07-30 2018-08-30 ジェイエイチ ローデス カンパニー， インコーポレイテッド ポリマーラップ加工材料、ポリマーラップ加工材料を含む媒体およびシステム、およびそれらを形成し使用する方法
CN108290267B (zh) 2015-10-30 2021-04-20 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
WO2017165046A1 (en) * 2016-03-25 2017-09-28 Applied Materials, Inc. Polishing system with local area rate control and oscillation mode
KR102666494B1 (ko) * 2016-03-25 2024-05-17 어플라이드 머티어리얼스, 인코포레이티드 국부 영역 연마 시스템 및 연마 시스템용 연마 패드 조립체들
KR101799497B1 (ko) 2016-07-13 2017-11-20 주식회사 케이씨 화학 기계적 연마 장치
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
US10625393B2 (en) * 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US10464188B1 (en) * 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
EP3996870A4 (en) * 2019-07-12 2023-08-02 CMC Materials, Inc. POLISHING PAD WITH POLYAMINE AND CYCLOHEXANDIMETHANOL CURING AGENTS
KR20210116759A (ko) 2020-03-13 2021-09-28 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112959212B (zh) * 2021-03-22 2023-03-03 万华化学集团电子材料有限公司 一种带有优化沟槽的化学机械抛光垫及其应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI274631B (en) * 2005-08-31 2007-03-01 Iv Technologies Co Ltd Polishing pad and method of fabricating the same
TW200726573A (en) * 2005-09-16 2007-07-16 Jsr Corp Method of manufacturing chemical mechanical polishing pad
US20090094900A1 (en) * 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
TW200918243A (en) * 2007-10-18 2009-05-01 Iv Technologies Co Ltd Polishing pad and polishing method
TW201002474A (en) * 2008-07-09 2010-01-16 Iv Technologies Co Ltd Polishing pad and method of forming the same
US20100330879A1 (en) * 2009-06-30 2010-12-30 Paik Young J Leak proof pad for cmp endpoint detection

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1862103A (en) * 1929-01-09 1932-06-07 Stratmore Company Surfacing apparatus
JPS60242975A (ja) * 1984-05-14 1985-12-02 Kanebo Ltd 平面研磨装置
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JPH11216663A (ja) * 1998-02-03 1999-08-10 Sony Corp 研磨パッド、研磨装置および研磨方法
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
EP1268134A1 (en) 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP4087581B2 (ja) * 2001-06-06 2008-05-21 株式会社荏原製作所 研磨装置
CN100356515C (zh) * 2002-04-03 2007-12-19 东邦工程株式会社 抛光垫及使用该垫制造半导体衬底的方法
DE60308946T2 (de) 2002-06-03 2007-05-10 Jsr Corp. Polierkissen und Verfahren zur Herstellung eines Polierkissens
JP3849582B2 (ja) 2002-06-03 2006-11-22 Ｊｓｒ株式会社 研磨パッド及び複層型研磨パッド
TWI228768B (en) 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
JP2004146704A (ja) 2002-10-25 2004-05-20 Jsr Corp 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド
KR100465649B1 (ko) * 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US6783436B1 (en) * 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
JP4877448B2 (ja) 2003-11-04 2012-02-15 Ｊｓｒ株式会社 化学機械研磨パッド
US7125318B2 (en) * 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
JP2005294412A (ja) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd 研磨パッド
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
CN100479104C (zh) * 2004-06-28 2009-04-15 兰姆研究有限公司 无应力抛光的方法
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
CA2598272A1 (en) 2005-02-18 2006-08-24 Neopad Technologies Corporation Customized polishing pads for cmp and methods of fabrication and use thereof
JP2007103602A (ja) * 2005-10-03 2007-04-19 Toshiba Corp 研磨パッド及び研磨装置
TW200744786A (en) * 2005-12-28 2007-12-16 Jsr Corp Chemical mechanical polishing pad and chemical mechanical polishing method
CN100478138C (zh) * 2006-07-03 2009-04-15 三芳化学工业股份有限公司 具有表面纹路的研磨垫
US7300340B1 (en) * 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
JP2009220265A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨パッド
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN101637888B (zh) * 2008-08-01 2013-09-18 智胜科技股份有限公司 研磨垫及其制造方法
US20100035529A1 (en) 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
US8871331B2 (en) 2009-12-29 2014-10-28 Saint-Gobain Abrasives, Inc. Anti-loading abrasive article
KR20110100080A (ko) * 2010-03-03 2011-09-09 삼성전자주식회사 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비
US8657653B2 (en) * 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8439994B2 (en) * 2010-09-30 2013-05-14 Nexplanar Corporation Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
US8968058B2 (en) * 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI274631B (en) * 2005-08-31 2007-03-01 Iv Technologies Co Ltd Polishing pad and method of fabricating the same
TW200726573A (en) * 2005-09-16 2007-07-16 Jsr Corp Method of manufacturing chemical mechanical polishing pad
US20090094900A1 (en) * 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
TW200918243A (en) * 2007-10-18 2009-05-01 Iv Technologies Co Ltd Polishing pad and polishing method
TW201002474A (en) * 2008-07-09 2010-01-16 Iv Technologies Co Ltd Polishing pad and method of forming the same
US20100330879A1 (en) * 2009-06-30 2010-12-30 Paik Young J Leak proof pad for cmp endpoint detection

Also Published As

Publication number Publication date
CN105619238B (zh) 2018-12-14
TWI623380B (zh) 2018-05-11
EP2668004A1 (en) 2013-12-04
JP2015155141A (ja) 2015-08-27
SG10201404027TA (en) 2014-10-30
JP6359050B2 (ja) 2018-07-18
US20120190281A1 (en) 2012-07-26
TW201707857A (zh) 2017-03-01
JP6140749B2 (ja) 2017-05-31
US20160023322A1 (en) 2016-01-28
EP2668004B1 (en) 2021-03-24
KR20130110216A (ko) 2013-10-08
WO2012102938A1 (en) 2012-08-02
CN103429389B (zh) 2016-10-05
TWI586487B (zh) 2017-06-11
KR20150122258A (ko) 2015-10-30
SG182934A1 (en) 2012-08-30
CN103429389A (zh) 2013-12-04
US9211628B2 (en) 2015-12-15
TW201609312A (zh) 2016-03-16
TW201235154A (en) 2012-09-01
CN105619238A (zh) 2016-06-01
JP2014508048A (ja) 2014-04-03
JP2016165795A (ja) 2016-09-15
KR101777684B1 (ko) 2017-09-13

Similar Documents

Publication Publication Date Title
TWI561341B (en) Polishing pad with concentric or approximately concentric polygon groove pattern
EP2847784A4 (en) POLISHING BUFFER HAVING A STABLE LIGHT TRANSMISSION REGION WITH RESPECT TO LIGHT
SG11201400614RA (en) Polishing pad
TWI561618B (en) Polishing component
SG10201700369XA (en) Printed chemical mechanical polishing pad
SG10201602018WA (en) Polishing Pad With Polishing Surface Layer Having An Aperture Or OpeningAbove A Transparent Foundation Layer
SG11201502768UA (en) Polishing composition
EP2698809A4 (en) POLISHING CUSHIONS AND MANUFACTURING METHOD THEREFOR
EP2698811A4 (en) POLISHING CUSHIONS AND MANUFACTURING METHOD THEREFOR
EP2922085A4 (en) POLISHING COMPOSITION
EP2664261A4 (en) MILL
EP2698810A4 (en) BUFFER PAD AND METHOD OF MANUFACTURING THE SAME
SG11201502766QA (en) Polishing composition
SG11201501849RA (en) Polishing composition
GB2506095B (en) Wear pad assembly
SG11201400637XA (en) Polishing pad
EP2732917A4 (en) POLISHING CUSHION
EP2915859A4 (en) POLISHING COMPOSITION
SG11201503597PA (en) Multilayer polishing pad
GB2498182B (en) Wear pad assembly
GB201122269D0 (en) Surface
HK1205208A1 (zh) 表面
EP2714334A4 (en) GRINDING HEAD
EP2767190A4 (en) SEAT PAD
PL2736676T3 (pl) Głowica dogniatająca