SG10201404027TA - Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern - Google Patents
Polishing Pad with Concentric or Approximately Concentric Polygon Groove PatternInfo
- Publication number
- SG10201404027TA SG10201404027TA SG10201404027TA SG10201404027TA SG10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA
- Authority
- SG
- Singapore
- Prior art keywords
- concentric
- polishing pad
- groove pattern
- polygon groove
- approximately
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/014,630 US9211628B2 (en) | 2011-01-26 | 2011-01-26 | Polishing pad with concentric or approximately concentric polygon groove pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201404027TA true SG10201404027TA (en) | 2014-10-30 |
Family
ID=45562465
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012004792A SG182934A1 (en) | 2011-01-26 | 2012-01-20 | Polishing pad with concentric or approximately concentric polygon groove pattern |
| SG10201404027TA SG10201404027TA (en) | 2011-01-26 | 2012-01-20 | Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012004792A SG182934A1 (en) | 2011-01-26 | 2012-01-20 | Polishing pad with concentric or approximately concentric polygon groove pattern |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9211628B2 (en) |
| EP (1) | EP2668004B1 (en) |
| JP (3) | JP2014508048A (en) |
| KR (2) | KR101777684B1 (en) |
| CN (2) | CN105619238B (en) |
| SG (2) | SG182934A1 (en) |
| TW (3) | TWI586487B (en) |
| WO (1) | WO2012102938A1 (en) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| JP5629749B2 (en) * | 2012-12-28 | 2014-11-26 | 東洋ゴム工業株式会社 | Polishing pad manufacturing method |
| JP5620465B2 (en) * | 2012-12-28 | 2014-11-05 | 東洋ゴム工業株式会社 | Circular polishing pad |
| US20150056895A1 (en) * | 2013-08-22 | 2015-02-26 | Cabot Microelectronics Corporation | Ultra high void volume polishing pad with closed pore structure |
| TWI599447B (en) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | Cmp polishing pad having edge exclusion region of offset concentric groove pattern |
| CN103753382B (en) * | 2014-01-06 | 2016-04-27 | 成都时代立夫科技有限公司 | A kind of polishing pad and preparation method thereof |
| JP6283940B2 (en) * | 2014-03-28 | 2018-02-28 | 富士紡ホールディングス株式会社 | Polishing pad |
| US9238294B2 (en) * | 2014-06-18 | 2016-01-19 | Nexplanar Corporation | Polishing pad having porogens with liquid filler |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| TWI689406B (en) * | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | Polishing pad and method of fabricating the same |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| CN113579992A (en) | 2014-10-17 | 2021-11-02 | 应用材料公司 | CMP pad construction with composite material properties using additive manufacturing process |
| KR20180026779A (en) * | 2015-07-30 | 2018-03-13 | 제이에이치 로드스 컴퍼니, 인크 | Systems comprising polymeric lapping materials, media, polymeric lapping materials, and methods of using and forming them |
| KR20230169424A (en) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | An apparatus and method of forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10875146B2 (en) * | 2016-03-24 | 2020-12-29 | Rohm And Haas Electronic Materials Cmp Holdings | Debris-removal groove for CMP polishing pad |
| KR102698836B1 (en) * | 2016-03-25 | 2024-08-27 | 어플라이드 머티어리얼스, 인코포레이티드 | Polishing system with local area velocity control and vibration mode |
| CN109155249B (en) * | 2016-03-25 | 2023-06-23 | 应用材料公司 | Localized area polishing system and polishing pad assembly for polishing system |
| KR101799497B1 (en) | 2016-07-13 | 2017-11-20 | 주식회사 케이씨 | Chemical mechanical polishing apparatus |
| US10864612B2 (en) * | 2016-12-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad and method of using |
| US10625393B2 (en) * | 2017-06-08 | 2020-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity |
| US10861702B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Controlled residence CMP polishing method |
| US10586708B2 (en) | 2017-06-14 | 2020-03-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Uniform CMP polishing method |
| US10857647B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | High-rate CMP polishing method |
| US10777418B2 (en) | 2017-06-14 | 2020-09-15 | Rohm And Haas Electronic Materials Cmp Holdings, I | Biased pulse CMP groove pattern |
| US10857648B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Trapezoidal CMP groove pattern |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| US10464188B1 (en) * | 2018-11-06 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and polishing method |
| WO2021011260A1 (en) * | 2019-07-12 | 2021-01-21 | Cabot Microelectronics Corporation | Polishing pad employing polyamine and cyclohexanedimethanol curatives |
| KR20210116759A (en) | 2020-03-13 | 2021-09-28 | 삼성전자주식회사 | CMP pad and chemical mechanical polishing apparatus having the same |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN112959212B (en) * | 2021-03-22 | 2023-03-03 | 万华化学集团电子材料有限公司 | Chemical mechanical polishing pad with optimized grooves and application thereof |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1862103A (en) * | 1929-01-09 | 1932-06-07 | Stratmore Company | Surfacing apparatus |
| JPS60242975A (en) * | 1984-05-14 | 1985-12-02 | Kanebo Ltd | Surface grinding device |
| US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| JPH11216663A (en) * | 1998-02-03 | 1999-08-10 | Sony Corp | Grinding pad, grinding apparatus and grinding method |
| GB2345255B (en) * | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
| US7516536B2 (en) * | 1999-07-08 | 2009-04-14 | Toho Engineering Kabushiki Kaisha | Method of producing polishing pad |
| WO2001043920A1 (en) | 1999-12-14 | 2001-06-21 | Rodel Holdings, Inc. | Method of manufacturing a polymer or polymer composite polishing pad |
| US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
| JP4087581B2 (en) * | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | Polishing equipment |
| JP3658591B2 (en) * | 2002-04-03 | 2005-06-08 | 東邦エンジニアリング株式会社 | Polishing pad and semiconductor substrate manufacturing method using the polishing pad |
| KR100669301B1 (en) | 2002-06-03 | 2007-01-16 | 제이에스알 가부시끼가이샤 | Polishing Pad and Multi-Layer Polishing Pad |
| JP3849582B2 (en) | 2002-06-03 | 2006-11-22 | Ｊｓｒ株式会社 | Polishing pad and multilayer polishing pad |
| TWI228768B (en) | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
| JP2004146704A (en) | 2002-10-25 | 2004-05-20 | Jsr Corp | Polishing pad for semiconductor wafer and working method therefor |
| KR100465649B1 (en) * | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | Integral polishing pad and manufacturing method thereof |
| US6783436B1 (en) * | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
| US7258602B2 (en) * | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
| US7442116B2 (en) * | 2003-11-04 | 2008-10-28 | Jsr Corporation | Chemical mechanical polishing pad |
| JP4877448B2 (en) | 2003-11-04 | 2012-02-15 | Ｊｓｒ株式会社 | Chemical mechanical polishing pad |
| US7125318B2 (en) * | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
| JP2005294412A (en) * | 2004-03-31 | 2005-10-20 | Toyo Tire & Rubber Co Ltd | Polishing pad |
| JP2007081322A (en) | 2005-09-16 | 2007-03-29 | Jsr Corp | Method for manufacturing chemical-mechanical polishing pad |
| US7329174B2 (en) * | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
| JP2005340271A (en) * | 2004-05-24 | 2005-12-08 | Jsr Corp | Pad for polishing chemical machine |
| KR101149346B1 (en) * | 2004-06-28 | 2012-05-30 | 램 리써치 코포레이션 | Methods and systems for a stress-free buff |
| USD559066S1 (en) * | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
| TWI385050B (en) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
| CA2598272A1 (en) | 2005-02-18 | 2006-08-24 | Neopad Technologies Corporation | Customized polishing pads for cmp and methods of fabrication and use thereof |
| TWI274631B (en) | 2005-08-31 | 2007-03-01 | Iv Technologies Co Ltd | Polishing pad and method of fabricating the same |
| JP2007103602A (en) * | 2005-10-03 | 2007-04-19 | Toshiba Corp | Polishing pad and polishing device |
| KR20070070094A (en) * | 2005-12-28 | 2007-07-03 | 제이에스알 가부시끼가이샤 | Chemical mechanical polishing pad and chemical mechanical polishing method |
| CN100478138C (en) * | 2006-07-03 | 2009-04-15 | 三芳化学工业股份有限公司 | Grinding cushion with surface texture |
| US7300340B1 (en) * | 2006-08-30 | 2007-11-27 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | CMP pad having overlaid constant area spiral grooves |
| US7234224B1 (en) * | 2006-11-03 | 2007-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Curved grooving of polishing pads |
| US20090094900A1 (en) | 2007-10-15 | 2009-04-16 | Ppg Industries Ohio, Inc. | Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad |
| TWI455795B (en) | 2007-10-18 | 2014-10-11 | Iv Technologies Co Ltd | Polishing pad and polishing method |
| JP2009220265A (en) * | 2008-02-18 | 2009-10-01 | Jsr Corp | Chemical machinery polishing pad |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| TWI449597B (en) | 2008-07-09 | 2014-08-21 | Iv Technologies Co Ltd | Polishing pad and method of forming the same |
| CN101637888B (en) * | 2008-08-01 | 2013-09-18 | 智胜科技股份有限公司 | Grinding pad and method for manufacturing same |
| US20100035529A1 (en) | 2008-08-05 | 2010-02-11 | Mary Jo Kulp | Chemical mechanical polishing pad |
| US8662957B2 (en) | 2009-06-30 | 2014-03-04 | Applied Materials, Inc. | Leak proof pad for CMP endpoint detection |
| WO2011090681A2 (en) * | 2009-12-29 | 2011-07-28 | Saint-Gobain Abrasives, Inc. | Anti-loading abrasive article |
| KR20110100080A (en) * | 2010-03-03 | 2011-09-09 | 삼성전자주식회사 | Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus having the same |
| US8439994B2 (en) * | 2010-09-30 | 2013-05-14 | Nexplanar Corporation | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection |
| US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
| US8657653B2 (en) * | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| US8968058B2 (en) * | 2011-05-05 | 2015-03-03 | Nexplanar Corporation | Polishing pad with alignment feature |
-
2011
- 2011-01-26 US US13/014,630 patent/US9211628B2/en active Active
-
2012
- 2012-01-19 EP EP12702367.9A patent/EP2668004B1/en active Active
- 2012-01-19 CN CN201610091895.3A patent/CN105619238B/en active Active
- 2012-01-19 JP JP2013552021A patent/JP2014508048A/en not_active Withdrawn
- 2012-01-19 CN CN201280013062.5A patent/CN103429389B/en active Active
- 2012-01-19 KR KR1020157029008A patent/KR101777684B1/en active IP Right Grant
- 2012-01-19 WO PCT/US2012/021899 patent/WO2012102938A1/en active Application Filing
- 2012-01-19 KR KR1020137020419A patent/KR20130110216A/en active Search and Examination
- 2012-01-20 TW TW104139487A patent/TWI586487B/en active
- 2012-01-20 TW TW105134598A patent/TWI623380B/en active
- 2012-01-20 SG SG2012004792A patent/SG182934A1/en unknown
- 2012-01-20 SG SG10201404027TA patent/SG10201404027TA/en unknown
- 2012-01-20 TW TW101102753A patent/TWI561341B/en active
-
2015
- 2015-03-23 JP JP2015059242A patent/JP6140749B2/en active Active
- 2015-10-05 US US14/875,513 patent/US20160023322A1/en not_active Abandoned
-
2016
- 2016-05-10 JP JP2016094446A patent/JP6359050B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201235154A (en) | 2012-09-01 |
| KR20130110216A (en) | 2013-10-08 |
| KR101777684B1 (en) | 2017-09-13 |
| US20120190281A1 (en) | 2012-07-26 |
| CN103429389B (en) | 2016-10-05 |
| US20160023322A1 (en) | 2016-01-28 |
| JP6140749B2 (en) | 2017-05-31 |
| JP2015155141A (en) | 2015-08-27 |
| TWI623380B (en) | 2018-05-11 |
| EP2668004B1 (en) | 2021-03-24 |
| KR20150122258A (en) | 2015-10-30 |
| TWI561341B (en) | 2016-12-11 |
| SG182934A1 (en) | 2012-08-30 |
| US9211628B2 (en) | 2015-12-15 |
| TW201609312A (en) | 2016-03-16 |
| CN105619238B (en) | 2018-12-14 |
| CN105619238A (en) | 2016-06-01 |
| TW201707857A (en) | 2017-03-01 |
| JP6359050B2 (en) | 2018-07-18 |
| JP2016165795A (en) | 2016-09-15 |
| CN103429389A (en) | 2013-12-04 |
| TWI586487B (en) | 2017-06-11 |
| JP2014508048A (en) | 2014-04-03 |
| EP2668004A1 (en) | 2013-12-04 |
| WO2012102938A1 (en) | 2012-08-02 |
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