SG10201404027TA - Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern - Google Patents

Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern

Info

Publication number
SG10201404027TA
SG10201404027TA SG10201404027TA SG10201404027TA SG10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA SG 10201404027T A SG10201404027T A SG 10201404027TA
Authority
SG
Singapore
Prior art keywords
concentric
polishing pad
groove pattern
polygon groove
approximately
Prior art date
Application number
SG10201404027TA
Other languages
English (en)
Inventor
Wiliam C Allison
Diane Scott
Alexander William Simpson
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG10201404027TA publication Critical patent/SG10201404027TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
SG10201404027TA 2011-01-26 2012-01-20 Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern SG10201404027TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/014,630 US9211628B2 (en) 2011-01-26 2011-01-26 Polishing pad with concentric or approximately concentric polygon groove pattern

Publications (1)

Publication Number Publication Date
SG10201404027TA true SG10201404027TA (en) 2014-10-30

Family

ID=45562465

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201404027TA SG10201404027TA (en) 2011-01-26 2012-01-20 Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern
SG2012004792A SG182934A1 (en) 2011-01-26 2012-01-20 Polishing pad with concentric or approximately concentric polygon groove pattern

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012004792A SG182934A1 (en) 2011-01-26 2012-01-20 Polishing pad with concentric or approximately concentric polygon groove pattern

Country Status (8)

Country Link
US (2) US9211628B2 (zh)
EP (1) EP2668004B1 (zh)
JP (3) JP2014508048A (zh)
KR (2) KR101777684B1 (zh)
CN (2) CN103429389B (zh)
SG (2) SG10201404027TA (zh)
TW (3) TWI561341B (zh)
WO (1) WO2012102938A1 (zh)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5629749B2 (ja) * 2012-12-28 2014-11-26 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5620465B2 (ja) * 2012-12-28 2014-11-05 東洋ゴム工業株式会社 円形状研磨パッド
US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法
JP6283940B2 (ja) * 2014-03-28 2018-02-28 富士紡ホールディングス株式会社 研磨パッド
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10092991B2 (en) * 2015-07-30 2018-10-09 Jh Rhodes Company, Inc. Polymeric lapping materials, media and systems including polymeric lapping material, and methods of forming and using same
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
CN109075054B (zh) * 2016-03-25 2023-06-09 应用材料公司 具有局部区域速率控制及振荡模式的研磨系统
WO2017165068A1 (en) * 2016-03-25 2017-09-28 Applied Materials, Inc. Local area polishing system and polishing pad assemblies for a polishing system
KR101799497B1 (ko) 2016-07-13 2017-11-20 주식회사 케이씨 화학 기계적 연마 장치
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
US10625393B2 (en) * 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US10464188B1 (en) * 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
US11845156B2 (en) * 2019-07-12 2023-12-19 Cmc Materials, Inc. Polishing pad employing polyamine and cyclohexanedimethanol curatives
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112959212B (zh) * 2021-03-22 2023-03-03 万华化学集团电子材料有限公司 一种带有优化沟槽的化学机械抛光垫及其应用

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1862103A (en) * 1929-01-09 1932-06-07 Stratmore Company Surfacing apparatus
JPS60242975A (ja) * 1984-05-14 1985-12-02 Kanebo Ltd 平面研磨装置
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JPH11216663A (ja) * 1998-02-03 1999-08-10 Sony Corp 研磨パッド、研磨装置および研磨方法
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
WO2001043920A1 (en) 1999-12-14 2001-06-21 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP4087581B2 (ja) * 2001-06-06 2008-05-21 株式会社荏原製作所 研磨装置
JP3658591B2 (ja) * 2002-04-03 2005-06-08 東邦エンジニアリング株式会社 研磨パッドおよび該研磨パッドを用いた半導体基板の製造方法
JP3849582B2 (ja) 2002-06-03 2006-11-22 Ｊｓｒ株式会社 研磨パッド及び複層型研磨パッド
EP1369204B1 (en) 2002-06-03 2006-10-11 JSR Corporation Polishing pad and process for manufacturing a polishing pad
JP2004146704A (ja) 2002-10-25 2004-05-20 Jsr Corp 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド
TWI228768B (en) 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
KR100465649B1 (ko) 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US6783436B1 (en) * 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
JP4877448B2 (ja) 2003-11-04 2012-02-15 Ｊｓｒ株式会社 化学機械研磨パッド
US7125318B2 (en) * 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
JP2005294412A (ja) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2007081322A (ja) 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
TWI306276B (en) * 2004-06-28 2009-02-11 Lam Res Corp Methods and systems for a stress-free buff
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
CA2598272A1 (en) 2005-02-18 2006-08-24 Neopad Technologies Corporation Customized polishing pads for cmp and methods of fabrication and use thereof
TWI274631B (en) 2005-08-31 2007-03-01 Iv Technologies Co Ltd Polishing pad and method of fabricating the same
JP2007103602A (ja) * 2005-10-03 2007-04-19 Toshiba Corp 研磨パッド及び研磨装置
US7357703B2 (en) * 2005-12-28 2008-04-15 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
CN100478138C (zh) * 2006-07-03 2009-04-15 三芳化学工业股份有限公司 具有表面纹路的研磨垫
US7300340B1 (en) * 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
US20090094900A1 (en) 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
TWI455795B (zh) 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
JP2009220265A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨パッド
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI449597B (zh) 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
CN101637888B (zh) * 2008-08-01 2013-09-18 智胜科技股份有限公司 研磨垫及其制造方法
US20100035529A1 (en) 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
WO2011008499A2 (en) 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
CN102666021B (zh) 2009-12-29 2015-04-22 圣戈班磨料磨具有限公司 抗填塞磨料物品
KR20110100080A (ko) * 2010-03-03 2011-09-09 삼성전자주식회사 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8657653B2 (en) * 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8439994B2 (en) * 2010-09-30 2013-05-14 Nexplanar Corporation Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
US8968058B2 (en) * 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature

Also Published As

Publication number Publication date
US9211628B2 (en) 2015-12-15
TW201609312A (zh) 2016-03-16
SG182934A1 (en) 2012-08-30
JP6140749B2 (ja) 2017-05-31
CN103429389B (zh) 2016-10-05
KR20150122258A (ko) 2015-10-30
TW201707857A (zh) 2017-03-01
JP2014508048A (ja) 2014-04-03
EP2668004A1 (en) 2013-12-04
CN103429389A (zh) 2013-12-04
US20160023322A1 (en) 2016-01-28
CN105619238B (zh) 2018-12-14
KR101777684B1 (ko) 2017-09-13
TW201235154A (en) 2012-09-01
TWI586487B (zh) 2017-06-11
KR20130110216A (ko) 2013-10-08
WO2012102938A1 (en) 2012-08-02
JP2016165795A (ja) 2016-09-15
TWI623380B (zh) 2018-05-11
TWI561341B (en) 2016-12-11
JP2015155141A (ja) 2015-08-27
EP2668004B1 (en) 2021-03-24
CN105619238A (zh) 2016-06-01
US20120190281A1 (en) 2012-07-26
JP6359050B2 (ja) 2018-07-18

Similar Documents

Publication Publication Date Title
TWI561341B (en) Polishing pad with concentric or approximately concentric polygon groove pattern
EP2847784A4 (en) POLISHING BUFFER HAVING A STABLE LIGHT TRANSMISSION REGION WITH RESPECT TO LIGHT
SG11201400614RA (en) Polishing pad
TWI561618B (en) Polishing component
SG10201700369XA (en) Printed chemical mechanical polishing pad
SG10201602018WA (en) Polishing Pad With Polishing Surface Layer Having An Aperture Or OpeningAbove A Transparent Foundation Layer
SG11201502768UA (en) Polishing composition
EP2698809A4 (en) POLISHING CUSHIONS AND MANUFACTURING METHOD THEREFOR
EP2698811A4 (en) POLISHING CUSHIONS AND MANUFACTURING METHOD THEREFOR
SG11201503751TA (en) Polishing composition
EP2664261A4 (en) MILL
EP2698810A4 (en) BUFFER PAD AND METHOD OF MANUFACTURING THE SAME
SG11201501849RA (en) Polishing composition
GB2506095B (en) Wear pad assembly
SG11201502766QA (en) Polishing composition
EP2915859A4 (en) POLISHING COMPOSITION
SG11201400637XA (en) Polishing pad
EP2732917A4 (en) POLISHING CUSHION
GB201122269D0 (en) Surface
SG11201503597PA (en) Multilayer polishing pad
GB2498182B (en) Wear pad assembly
HK1205208A1 (zh) 表面
EP2714334A4 (en) GRINDING HEAD
EP2767190A4 (en) SEAT PAD
PL2736676T3 (pl) Głowica dogniatająca