TWI560325B - - Google Patents

Info

Publication number
TWI560325B
TWI560325B TW102115693A TW102115693A TWI560325B TW I560325 B TWI560325 B TW I560325B TW 102115693 A TW102115693 A TW 102115693A TW 102115693 A TW102115693 A TW 102115693A TW I560325 B TWI560325 B TW I560325B
Authority
TW
Taiwan
Application number
TW102115693A
Other versions
TW201350625A (zh
Inventor
Yuji Araki
Masashi Shimoyama
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW201350625A publication Critical patent/TW201350625A/zh
Application granted granted Critical
Publication of TWI560325B publication Critical patent/TWI560325B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
TW102115693A 2012-05-15 2013-05-02 鍍敷裝置及鍍敷液管理方法 TW201350625A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法

Publications (2)

Publication Number Publication Date
TW201350625A TW201350625A (zh) 2013-12-16
TWI560325B true TWI560325B (zh) 2016-12-01

Family

ID=48463682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102115693A TW201350625A (zh) 2012-05-15 2013-05-02 鍍敷裝置及鍍敷液管理方法

Country Status (6)

Country Link
US (1) US20130306483A1 (zh)
EP (1) EP2664692A3 (zh)
JP (1) JP5876767B2 (zh)
KR (2) KR20130127921A (zh)
CN (1) CN103422140A (zh)
TW (1) TW201350625A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022922B2 (ja) * 2012-12-13 2016-11-09 株式会社荏原製作所 Ｓｎ合金めっき装置及び方法
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR101631484B1 (ko) 2014-12-19 2016-06-17 주식회사 포스코 니켈도금용액 관리 장치
CN105177646B (zh) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 一种用于生产无氰镀铜溶液的装置
KR102002342B1 (ko) * 2018-06-28 2019-07-23 김대범 도금액 교반 및 공급 장치
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110161306A (zh) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 多回路安培小时总计量仪表和电镀控制系统及方法
CN110318090B (zh) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 一种印刷电路板电镀装置及电镀方法
CN111663172A (zh) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 电镀化学品监控方法、系统和装置
KR102192890B1 (ko) * 2020-07-10 2020-12-18 김춘옥 유전체 세라믹 필터 디핑 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
TW200421507A (en) * 2002-12-26 2004-10-16 Ebara Corp Lead-free bump and formation method thereof
CN1928164A (zh) * 2005-08-19 2007-03-14 罗门哈斯电子材料有限公司 锡电镀液及锡电镀方法

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US3244620A (en) * 1964-11-02 1966-04-05 Dow Chemical Co Separation of acid from polymers by dialysis with anion-exchange membranes
DE2729387A1 (de) * 1977-06-27 1979-01-18 Schering Ag Verfahren zur kontinuierlichen aufbereitung eines galvanischen nickelbades sowie vorrichtung zur durchfuehrung des verfahrens
FI71573C (fi) * 1979-06-15 1987-01-19 Akzo Nv Foerfarande och anordning foer minskning av jaesta dryckers alkoholhalt genom dialys.
JPS5940239B2 (ja) * 1980-07-26 1984-09-28 住友金属工業株式会社 電気メツキ浴のｐＨ調整方法
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
JPS5928584A (ja) 1982-08-10 1984-02-15 Asahi Glass Co Ltd 電解槽又は透析槽への液の供給方法
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4816407A (en) * 1985-10-11 1989-03-28 Sepracor Inc. Production of low-ethanol beverages by membrane extraction
JPH01312099A (ja) 1988-06-10 1989-12-15 Asahi Glass Co Ltd 電気メッキ浴の管理方法
DE4106080A1 (de) * 1991-02-27 1991-06-20 Volker Dipl Ing Teuchert Verfahren zur automatischen regelung der konzentration eines stoffes in der aus einem zur reduzierung der konzentration dieses stoffes eingesetzten dialysators austretenden fluessigkeit
JP2559935B2 (ja) * 1991-12-20 1996-12-04 日本リーロナール株式会社 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置
JP2888001B2 (ja) * 1992-01-09 1999-05-10 日本電気株式会社 金属メッキ装置
JP3066675B2 (ja) * 1992-04-20 2000-07-17 富士写真フイルム株式会社 印刷版用アルミニウム板の表面処理方法
JP3213113B2 (ja) * 1993-03-15 2001-10-02 株式会社荏原製作所 はんだめっき液自動管理装置
JP3437600B2 (ja) * 1993-03-15 2003-08-18 株式会社荏原製作所 はんだめっき液自動分析方法及び装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP3241227B2 (ja) * 1995-02-14 2001-12-25 株式会社東芝 メッキ液自動管理装置
JPH08271497A (ja) * 1995-03-29 1996-10-18 C Uyemura & Co Ltd 電気銅めっき浴中の電解生成物濃度の測定方法
JPH0975681A (ja) 1995-09-13 1997-03-25 Japan Nuclear Fuel Co Ltd<Jnf> 拡散透析装置及び方法
US6562220B2 (en) * 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
JP2002241991A (ja) * 2001-02-14 2002-08-28 Canon Inc 酸化亜鉛膜の成膜方法及び成膜装置
JP4698904B2 (ja) 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
KR20060043958A (ko) * 2004-11-11 2006-05-16 주식회사 팬택 이동통신단말기를 이용한 설문조사 방법
US20090095633A1 (en) * 2005-05-25 2009-04-16 Think Laboratory Co., Ltd. Copper plating method and apparatus for a gravure cylinder
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP5458604B2 (ja) * 2009-03-04 2014-04-02 三菱マテリアル株式会社 Ｓｎ合金めっき装置及びそのＳｎ成分補給方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
TW200421507A (en) * 2002-12-26 2004-10-16 Ebara Corp Lead-free bump and formation method thereof
CN1928164A (zh) * 2005-08-19 2007-03-14 罗门哈斯电子材料有限公司 锡电镀液及锡电镀方法

Also Published As

Publication number Publication date
EP2664692A2 (en) 2013-11-20
KR20160098144A (ko) 2016-08-18
JP2013237894A (ja) 2013-11-28
US20130306483A1 (en) 2013-11-21
EP2664692A3 (en) 2017-02-15
CN103422140A (zh) 2013-12-04
JP5876767B2 (ja) 2016-03-02
KR20130127921A (ko) 2013-11-25
TW201350625A (zh) 2013-12-16

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