TWI557271B - 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 - Google Patents

不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 Download PDF

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Publication number
TWI557271B
TWI557271B TW101136996A TW101136996A TWI557271B TW I557271 B TWI557271 B TW I557271B TW 101136996 A TW101136996 A TW 101136996A TW 101136996 A TW101136996 A TW 101136996A TW I557271 B TWI557271 B TW I557271B
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TW
Taiwan
Prior art keywords
acid
electroless copper
copper
copper plating
plating solution
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Application number
TW101136996A
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English (en)
Chinese (zh)
Other versions
TW201323654A (zh
Inventor
路茲 史坦佩
艾迪斯 史坦華西爾
珊卓 羅瑟勒
史戴芬妮 衛斯
安谷元 坦 坎 賴
Original Assignee
德國艾托特克公司
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Publication of TW201323654A publication Critical patent/TW201323654A/zh
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Publication of TWI557271B publication Critical patent/TWI557271B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW101136996A 2011-10-05 2012-10-05 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 TWI557271B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11183991 2011-10-05

Publications (2)

Publication Number Publication Date
TW201323654A TW201323654A (zh) 2013-06-16
TWI557271B true TWI557271B (zh) 2016-11-11

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101136996A TWI557271B (zh) 2011-10-05 2012-10-05 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法

Country Status (7)

Country Link
US (1) US20140242264A1 (fr)
EP (1) EP2764135A2 (fr)
JP (1) JP6180419B2 (fr)
KR (1) KR101953940B1 (fr)
CN (1) CN104040026B (fr)
TW (1) TWI557271B (fr)
WO (1) WO2013050332A2 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2784181B1 (fr) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Solution de dépôt de cuivre chimique
ES2684353T3 (es) * 2013-09-25 2018-10-02 Atotech Deutschland Gmbh Método para depositar una capa de siembra de cobre sobre una capa de barrera y baño de cobreado
EP3070185B1 (fr) * 2014-01-27 2024-05-29 Okuno Chemical Industries Co., Ltd. Bain formant un film conducteur
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035122B1 (fr) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Procédé de fabrication de lignes fines
EP3035375B1 (fr) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Module de traitement d'un appareil pour traiter chimiquement et horizontalement des substrats de grande taille
WO2017191260A1 (fr) 2016-05-04 2017-11-09 Atotech Deutschland Gmbh Procédé de dépôt d'un métal ou d'un alliage métallique sur une surface d'un substrat comprenant l'activation de celle-ci
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
EP3578683B1 (fr) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Bain de placage de cuivre ou d'alliage de cuivre autocatalytique et procédé de galvanoplastie
EP3670698B1 (fr) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Solution de prétraitement alcalin aqueux à utiliser avant le dépôt d'une couche d'activation de palladium, son procédé et son utilisation
BR112021016763A2 (pt) 2019-04-04 2021-10-13 Atotech Deutschland Gmbh Método de ativação de uma superfície de um substrato contendo fibras não condutoras ou de carbono para metalização
EP3839092A1 (fr) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Procédé d'activation d'au moins une surface, composition d'activation et utilisation de la composition d'activation pour activer une surface de dépôt autocatalytique
CN116137875A (zh) 2020-08-27 2023-05-19 德国艾托特克有限两合公司 活化用于金属化的非导电或含碳纤维衬底的表面的方法
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US20020064592A1 (en) * 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
US20080223253A1 (en) * 2007-03-13 2008-09-18 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2761874A (en) 1954-09-30 1956-09-04 Dow Chemical Co Amino derivatives of n-alkyl substituted aspartic acids and their functional derivatives
US3158635A (en) 1959-03-18 1964-11-24 Stauffer Chemical Co Bis-adduction products and methods of preparing same
US3632704A (en) * 1967-12-04 1972-01-04 Stauffer Chemical Co Method for modifying electrically nonconductive surfaces for electroless plating
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
JPS57116031A (en) 1981-01-13 1982-07-19 Tokyo Organ Chem Ind Ltd N-substituted polyamine and its preparation
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
GB9422762D0 (en) * 1994-11-11 1995-01-04 Ass Octel Use of a compound
JPH11513058A (ja) * 1995-08-30 1999-11-09 ザ ダウ ケミカル カンパニー 琥珀酸誘導体分解性キレート化剤、その使用及びその組成物
US5733858A (en) * 1995-08-30 1998-03-31 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thererof
JP3444276B2 (ja) * 2000-06-19 2003-09-08 株式会社村田製作所 無電解銅めっき浴、無電解銅めっき方法および電子部品
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
EP1681372A4 (fr) * 2003-10-17 2008-07-16 Nippon Mining Co Solution de cuivrage par depot autocatalytique et procede de cuivrage par depot autocatalytique
WO2005048674A1 (fr) * 2003-11-14 2005-05-26 Bridgestone Corporation Materiau de fenetre electromagnetiquement blindant et phototransmetteur, et procede de production
US7514353B2 (en) * 2005-03-18 2009-04-07 Applied Materials, Inc. Contact metallization scheme using a barrier layer over a silicide layer
KR100702797B1 (ko) * 2005-12-09 2007-04-03 동부일렉트로닉스 주식회사 반도체소자의 구리배선막 형성방법
TW200813255A (en) * 2006-07-07 2008-03-16 Rohm & Haas Elect Mat Environmentally friendly electroless copper compositions
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
US20020064592A1 (en) * 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
US20080223253A1 (en) * 2007-03-13 2008-09-18 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

Also Published As

Publication number Publication date
CN104040026A (zh) 2014-09-10
US20140242264A1 (en) 2014-08-28
KR101953940B1 (ko) 2019-03-04
JP6180419B2 (ja) 2017-08-16
WO2013050332A3 (fr) 2014-03-13
TW201323654A (zh) 2013-06-16
KR20140090145A (ko) 2014-07-16
EP2764135A2 (fr) 2014-08-13
JP2014528517A (ja) 2014-10-27
WO2013050332A8 (fr) 2013-07-11
WO2013050332A2 (fr) 2013-04-11
CN104040026B (zh) 2019-01-01

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