WO2013050332A8 - Solution pour cuivrage autocatalytique exempte de formaldéhyde - Google Patents

Solution pour cuivrage autocatalytique exempte de formaldéhyde Download PDF

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Publication number
WO2013050332A8
WO2013050332A8 PCT/EP2012/069388 EP2012069388W WO2013050332A8 WO 2013050332 A8 WO2013050332 A8 WO 2013050332A8 EP 2012069388 W EP2012069388 W EP 2012069388W WO 2013050332 A8 WO2013050332 A8 WO 2013050332A8
Authority
WO
WIPO (PCT)
Prior art keywords
copper plating
formaldehyde
plating solution
electroless copper
acid
Prior art date
Application number
PCT/EP2012/069388
Other languages
English (en)
Other versions
WO2013050332A2 (fr
WO2013050332A3 (fr
Inventor
Edith STEINHÄUSER
Sandra RÖSELER
Stefanie WIESE
Tang Cam Lai NGUYEN
Lutz Stamp
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to CN201280049015.6A priority Critical patent/CN104040026B/zh
Priority to US14/350,153 priority patent/US20140242264A1/en
Priority to JP2014533846A priority patent/JP6180419B2/ja
Priority to EP12766668.3A priority patent/EP2764135A2/fr
Priority to KR1020147008668A priority patent/KR101953940B1/ko
Publication of WO2013050332A2 publication Critical patent/WO2013050332A2/fr
Publication of WO2013050332A8 publication Critical patent/WO2013050332A8/fr
Publication of WO2013050332A3 publication Critical patent/WO2013050332A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

La présente invention porte sur une solution aqueuse pour cuivrage autocatalytique, comprenant une source d'ions cuivre, une source d'acide glyoxylique servant d'agent réducteur et au moins un acide polyaminodisuccinique ou au moins un acide polyaminomonosuccinique, ou un mélange d'au moins un acide polyaminodisuccinique et d'au moins un acide polyaminomonosuccinique servant d'agent complexant, ainsi que sur un procédé pour le cuivrage autocatalytique utilisant ladite solution et sur l'utilisation de la solution pour le placage de substrats.
PCT/EP2012/069388 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde WO2013050332A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201280049015.6A CN104040026B (zh) 2011-10-05 2012-10-01 不含甲醛的化学镀镀铜溶液
US14/350,153 US20140242264A1 (en) 2011-10-05 2012-10-01 Formaldehyde-free electroless copper plating solution
JP2014533846A JP6180419B2 (ja) 2011-10-05 2012-10-01 ホルムアルデヒドのない無電解銅めっき溶液
EP12766668.3A EP2764135A2 (fr) 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde
KR1020147008668A KR101953940B1 (ko) 2011-10-05 2012-10-01 무전해 구리 도금 수용액

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11183991 2011-10-05
EP11183991.6 2011-10-05

Publications (3)

Publication Number Publication Date
WO2013050332A2 WO2013050332A2 (fr) 2013-04-11
WO2013050332A8 true WO2013050332A8 (fr) 2013-07-11
WO2013050332A3 WO2013050332A3 (fr) 2014-03-13

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/069388 WO2013050332A2 (fr) 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde

Country Status (7)

Country Link
US (1) US20140242264A1 (fr)
EP (1) EP2764135A2 (fr)
JP (1) JP6180419B2 (fr)
KR (1) KR101953940B1 (fr)
CN (1) CN104040026B (fr)
TW (1) TWI557271B (fr)
WO (1) WO2013050332A2 (fr)

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WO2015043975A1 (fr) * 2013-09-25 2015-04-02 Atotech Deutschland Gmbh Procédé de dépôt d'une couche germe de cuivre sur une couche barrière et bain de cuivrage
EP3070185B1 (fr) * 2014-01-27 2024-05-29 Okuno Chemical Industries Co., Ltd. Bain formant un film conducteur
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035122B1 (fr) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Procédé de fabrication de lignes fines
EP3035375B1 (fr) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Module de traitement d'un appareil pour traiter chimiquement et horizontalement des substrats de grande taille
US10975474B2 (en) 2016-05-04 2021-04-13 Atotech Deutschland Gmbh Process for depositing a metal or metal alloy on a surface of a substrate including its activation
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
EP3578683B1 (fr) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Bain de placage de cuivre ou d'alliage de cuivre autocatalytique et procédé de galvanoplastie
EP3670698B1 (fr) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Solution de prétraitement alcalin aqueux à utiliser avant le dépôt d'une couche d'activation de palladium, son procédé et son utilisation
JP7455859B2 (ja) 2019-04-04 2024-03-26 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法
EP3839092A1 (fr) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Procédé d'activation d'au moins une surface, composition d'activation et utilisation de la composition d'activation pour activer une surface de dépôt autocatalytique
WO2022043417A1 (fr) 2020-08-27 2022-03-03 Atotech Deutschland GmbH & Co. KG Procédé d'activation d'une surface d'un substrat non-conducteur ou contenant des fibres de carbone destiné à la métallisation
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

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Also Published As

Publication number Publication date
WO2013050332A2 (fr) 2013-04-11
EP2764135A2 (fr) 2014-08-13
TW201323654A (zh) 2013-06-16
US20140242264A1 (en) 2014-08-28
KR101953940B1 (ko) 2019-03-04
WO2013050332A3 (fr) 2014-03-13
CN104040026B (zh) 2019-01-01
JP2014528517A (ja) 2014-10-27
TWI557271B (zh) 2016-11-11
JP6180419B2 (ja) 2017-08-16
CN104040026A (zh) 2014-09-10
KR20140090145A (ko) 2014-07-16

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